Shelf structure

Abstract

The utility model provides a shelf structure, which is suitable for supporting a product during plasma cleaning and comprises a temperature control group, a temperature control group and a control group, the first isolation plate is erected below the electrode plate; the temperature adjusting element is erected below the first isolation plate; the second isolation plate is erected above the electrode plate, and the second isolation plate is used for bearing a product; the guide rail frame is erected on the outer side of the temperature control group and is provided with a plurality of caulking grooves; the fixing pieces are provided with convex parts which are embedded with the embedding grooves in shape, and the fixing pieces are arranged on the guide rail frame through the convex parts; the guide strips are arranged on the fixing part and used for clamping the product above the second isolation plate, and a plurality of distances exist between the caulking grooves and used for adjusting the distance between the guide strips according to the size change of the product. The utility model aims to provide a shelf structure so as to at least improve the process yield and efficiency.

Description

Technical Field

[0001] The utility model relates to a layer frame structure. Background Art

[0002] As substrate cleaning dimensions (line width / line spacing, L / S) become smaller and smaller [e.g., trace pitch (TP) ≤ 14μm], special materials (e.g., automotive and power supply components) are introduced, and environmental (ESG) requirements are becoming increasingly stringent, effective substrate cleaning becomes increasingly important. Wet cleaning after development and before plating cannot remove residues, and adding plasma processes (e.g. Figure 1 As shown in the physical reaction using argon plasma 1), residues are effectively removed and surface activity is increased, thereby improving the yield of subsequent processes.

[0003] The current practice is to extend the plasma cleaning time, but in addition to causing electrode overheating and poor cleaning efficiency, it will also cause the green paint surface of the substrate surface of different sizes to change color (the surface is damaged), affecting the quality of subsequent processes.

[0004] At present, glass or ceramic is added to the electrode to separate and insulate the electrode from the substrate to prevent the substrate from being affected by high temperature, which helps to reduce the impact on quality during cleaning. However, as the cleaning size decreases, the difficulty of plasma cleaning will increase. In order to achieve the effect of plasma cleaning, the cleaning time must be extended, and therefore the insulation effect of glass or ceramic becomes limited. When measured in the atmosphere using a thermometer, the temperature rises linearly (the ceramic temperature is 22-23°C when there is no operation, the temperature rises to 25.9°C after 10 seconds of operation, the temperature rises to 36.1°C after 300 seconds of operation, and the temperature rises to 50.4°C after 600 seconds of operation). Without ceramic insulation, the temperature rises more rapidly.

[0005] In addition, substrates may have different sizes in different batches of plasma cleaning. The prior art uses screws to fix the shelves, which is time-consuming and labor-intensive. If this time can be saved, the efficiency of the plasma cleaning step can be further increased. Utility Model Content

[0006] In view of the problems existing in the related art, the purpose of the present invention is to provide a shelf structure to at least improve the process yield and efficiency.

[0007] To achieve the above-mentioned purpose, the utility model provides a layer frame structure suitable for supporting products during plasma cleaning, including: a temperature control group, including: an electrode plate; a first isolation plate, mounted below the electrode plate; a temperature adjustment element, mounted below the first isolation plate; a second isolation plate, mounted above the electrode plate, the second isolation plate is used to carry the product; a guide rail frame, mounted on the outside of the temperature control group, the guide rail frame having a plurality of embedded grooves; a plurality of fixing members, having a protrusion that fits the shape of the embedded grooves, the fixing members being arranged on the guide rail frame through the protrusions; a plurality of guide bars, arranged on the fixing members and used to clamp the product above the second isolation plate, the plurality of embedded grooves having a plurality of distances between each other, for adjusting the distance between the guide bars as the size of the product changes.

[0008] In some embodiments, the first separator and the second separator are insulating materials for electrically insulating the electrode plates.

[0009] In some embodiments, a second separator is used to separate the electrode plate from the product.

[0010] In some embodiments, the shelf structure further includes: a lower shell, which is disposed below the temperature control group and the guide rail frame and supports the temperature control group and the guide rail frame.

[0011] In some embodiments, the lower shell includes a lower cavity that is recessed downward, and the temperature control group and the guide rail frame are accommodated in the lower cavity.

[0012] In some embodiments, the lower shell has an exhaust hole for extracting the gas contained in the lower cavity.

[0013] In some embodiments, a pipe containing liquid is disposed in the temperature regulating element.

[0014] In some embodiments, the temperature control group further includes: a water inlet channel and a water outlet channel, and a pipe connected to the temperature regulating element.

[0015] In some embodiments, the water inlet channel and the water outlet channel pass through the lower shell.

[0016] In some embodiments, the water inlet channel and the water outlet channel are sealed and connected to the lower shell.

[0017] In some embodiments, the fixing member has a groove for accommodating the guide bar.

[0018] In some embodiments, the opening of the groove of the fixing member is tapered.

[0019] In some embodiments, the temperature regulating element is used to cool the electrode plate.

[0020] In some embodiments, the lateral dimension of the protrusion of the fixing member decreases in a direction from top to bottom.

[0021] An embodiment of the present application provides a layered structure suitable for supporting products, including: a temperature control group, including: an electrode plate; a first isolation plate, mounted below the electrode plate; a temperature regulating element, mounted below the first isolation plate, with a pipe for containing liquid arranged in the temperature regulating element; a second isolation plate, mounted above the electrode plate, and the second isolation plate is used to support the product.

[0022] In some embodiments, the shelf structure further includes: a water inlet channel and a water outlet channel, a pipeline connected to the temperature regulating element, and the liquid enters the pipeline from the water inlet channel and then leaves the pipeline from the water outlet channel.

[0023] In some embodiments, the temperature of the liquid contained in the thermostatic element is lower than the temperature of the electrode plates.

[0024] In some embodiments, the shelf structure is adapted to support the product during plasma cleaning.

[0025] In some embodiments, the shelf structure is adapted to support the product during an etching process.

[0026] The beneficial technical effects of the utility model are:

[0027] The embodiments of the present application provide a temperature regulating element to exchange heat with the electrode plate to control the temperature of the product during the plasma cleaning process and improve the process yield. At the same time, a fixing member with a protrusion that engages with the embedding groove is used to adjust the distance between the guide bars, thereby improving the process efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A cleaning reaction using argon plasma 1 is shown.

[0029] Figure 2 An exploded view of a shelf structure according to an embodiment of the present application is shown.

[0030] Figure 3 A three-dimensional diagram of a shelf structure according to an embodiment of the present application is shown.

[0031] Figure 4 A front view of a temperature control group of a shelf structure according to an embodiment of the present application is shown.

[0032] Figure 5 A top view of a guide rail frame of a shelf structure according to an embodiment of the present application is shown.

[0033] Figure 6 and Figure 7 The three-dimensional diagrams of the guide rail racks of the shelf structure in different embodiments and at different angles of the present application are shown.

[0034] Figure 8 Shows Figure 7 Magnified view of area A.

[0035] Fig. 9 and Fig.10 The three-dimensional views of the fixing member of the present application at different angles are shown.

[0036] Fig.11 A conceptual diagram of a thermostat element is shown. DETAILED DESCRIPTION

[0037] In order to better understand the spirit of the embodiments of the present application, some preferred embodiments of the present application are further described below.

[0038] The embodiments of the present application will be described in detail below. In the full text of the present application specification, the same or similar components and components with the same or similar functions are represented by similar reference numerals. The embodiments of the accompanying drawings described herein are illustrative, graphical, and are used to provide a basic understanding of the present application. The embodiments of the present application should not be interpreted as limiting the present application.

[0039] As used herein, the terms "substantially," "substantially," "essentially," and "about" are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance occurred precisely as well as instances where the event or circumstance occurred very approximately.

[0040] In this specification, unless otherwise specified or limited, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivative terms (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or depicted in the drawings. These relative terms are only used for convenience of description and do not require that the present application be constructed or operated in a specific direction.

[0041] For convenience of description, “first”, “second”, “third”, etc. may be used herein to distinguish different components in one figure or a series of figures. “First”, “second”, “third”, etc. are not intended to describe the corresponding components.

[0042] Figure 2 An exploded view of a shelf structure 100 according to an embodiment of the present application is shown. Figure 3 A three-dimensional diagram of a shelf structure 100 according to an embodiment of the present application is shown, wherein the water inlet channel 80 and the water outlet channel 82 are not shown. Figure 4 1 shows a front view of a temperature control group 102 of a shelf structure 100 according to an embodiment of the present application, Figure 5 A top view of the guide rail frame 40 of the shelf structure 100 according to an embodiment of the present application is shown, wherein the lateral dimension of the guide rail frame 40 is, for example, 374 mm, and the longitudinal dimension is, for example, 368 mm. The distance between the first guide bar 61 and the second guide bar 62 can be adjusted to 63 mm, 76.3 mm, or 95 mm through the cooperation of the embedding groove 42 and the fixing member 50. Figure 6 and Figure 7 The three-dimensional diagram of the guide rail frame 40 of the shelf structure 100 of different embodiments and different angles of the present application is shown, wherein the guide bar 60 is arranged on different embedding grooves 42 through the fixing member 50, Figure 8 Shows Figure 7 A magnified image of area A. Fig. 9 and Fig.10 The three-dimensional views of the fixing member 50 at different angles of the present application are shown.

[0043] The embodiment of the present application provides a layer frame structure 100, which is suitable for supporting products during plasma cleaning, including: a temperature control group 102, including: an electrode plate 10; a first isolation plate 21, which is mounted below the electrode plate 10; a temperature adjustment element 30, which is mounted below the first isolation plate 21; a second isolation plate 22, which is mounted above the electrode plate 10, and the second isolation plate 22 is used to carry products; the layer frame structure 100 also includes a guide rail frame 40, which is mounted on the outside of the temperature control group 102, and the guide rail frame 40 has a plurality of embedded grooves 42; a plurality of fixing members 50, which have a protrusion 52 that is embedded in the shape of the embedded groove 42, and the fixing members 50 are arranged on the guide rail frame 40 through the protrusion 52; a plurality of guide bars 60, which are arranged on the fixing members 50 and are used to clamp the product above the second isolation plate 22, and the plurality of embedded grooves 42 have a plurality of distances between each other, which are used to adjust the distance between the guide bars 60 as the size of the product changes. The embodiment of the present application sets a temperature regulating element 30 to exchange heat with the electrode plate 10 to control the temperature of the product during the plasma cleaning process and improve the process yield. At the same time, a fixing member 50 having a protrusion 52 that engages with the embedding groove 42 is used to adjust the distance between the guide bars 60, thereby improving the process yield.

[0044] In some embodiments, the first isolation plate 21 and the second isolation plate 22 are insulating materials for electrically insulating the electrode plate 10. In some embodiments, the thickness of the first isolation plate 21 and the second isolation plate 22 is about 2 μm, which has little effect on the temperature of the temperature regulating element 30.

[0045] In some embodiments, the second separator 22 is used to separate the electrode plate 10 from the product.

[0046] In some embodiments, the shelf structure 100 further includes: a lower shell 70 , which is disposed below the temperature control group 102 and the guide rail frame 40 and supports the temperature control group 102 and the guide rail frame 40 .

[0047] In some embodiments, the lower shell 70 includes a lower cavity 74 that is recessed downward, and the temperature control group and the guide rail frame are accommodated in the lower cavity 74. The shelf structure 100 also includes an upper shell (not shown), which is arranged above the lower shell 70, and the lower cavity 74 is sealed when the upper shell covers the lower shell 70, and the temperature control group 102, the guide rail frame 40, the fixing member 50 and the guide bar 60 are accommodated between the upper shell and the lower shell 70.

[0048] In some embodiments, the lower shell 70 has a gas extraction hole 76 for extracting the gas contained in the lower cavity 74, so the lower shell 70 can also be called a gas extraction plate. The gas extraction hole 76 recovers the plasma gas (such as chlorine gas).

[0049] In some embodiments, pipes for containing liquid are disposed in the temperature regulating element 30 , the temperature regulating element 30 is a temperature regulating plate, and the pipes are evenly disposed in the interlayer of the temperature regulating plate. Fig.11 The conceptual diagram of the temperature regulating element 30 is shown. The pipeline is set in the middle interlayer 110. The law of heat conduction can describe the heat transfer process in the solid. Its mathematical form is q=kA(T1-T2)L, where q represents the heat transferred per unit time, k represents the thermal conductivity of the material, A represents the cross-sectional area of ​​the pipeline, T1 and T2 represent the temperatures of the two contact surfaces respectively, and L represents the distance between the surfaces. Through this formula, we can calculate the heat transferred between the surfaces per unit time. The greater the heat conduction capacity, the better the cooling effect. The larger the cross-sectional area of ​​the pipeline, the greater the water flow rate. The larger the water flow rate, the faster the cooling speed of the cooling water at the same temperature. The thermal conductivity coefficients of different materials (in W / mK) are: stainless steel 16, natural convection air 12, aluminum 180, flowing water 300, stagnant water 1, ceramic 39. The plate 10 is made of stainless steel, which has poor heat transfer effect. The first isolation plate 21 (thin ceramic) and the temperature control element 30 (aluminum plus flowing water with a thermal conductivity about 25 times higher than air) below it have better heat transfer effect, which can quickly take away the heat generated during the operation to effectively control the electrode temperature. The temperature control ability of the temperature control element 30 is tested using a flow meter and a thermometer. When the flowing water temperature is the same, the greater the water flow rate, the faster the temperature control speed (the temperature control element 30 can be maintained at 26 degrees). When the first isolation plate 21 below the electrode plate 10 that contacts the temperature control element 30 is made of glass material, the temperature resistance is insufficient and cracks occur during the test. If a ceramic material with good heat resistance is used instead, there will be no cracking problem.

[0050] In some embodiments, the temperature control group 102 further includes: a water inlet channel 80 and a water outlet channel 82 , which are pipes connected to the temperature regulating element 30 .

[0051] In some embodiments, the water inlet channel 80 and the water outlet channel 82 pass through the lower shell 70. The water inlet channel 80 and the water outlet channel 82 are, for example, accommodated in Figure 2 within hole 72 shown.

[0052] In some embodiments, the water inlet channel 80 and the water outlet channel 82 are sealed and connected to the lower shell 70 .

[0053] See also Figures 9 and 10 In some embodiments, the fixing member 50 has a groove 54 for accommodating the guide bar 60, that is, the shape of the guide bar 60 fits into the groove 54. In some embodiments, the opening 56 of the groove 54 of the fixing member 50 is conical to facilitate the installation of the guide bar 60 into the groove 54. Figure 8 In other embodiments, the guide bar 60 includes a second groove 64 connected to the groove 54 of the fixing member 50, and an additional connecting bar is used to engage in the groove 54 and the second groove 64 at the same time to fix the guide bar 60 and the fixing member 50. The conical opening 56 can make the engagement of the connecting bar in the groove 54 and the second groove 64 more convenient and quick.

[0054] In some embodiments, the temperature regulating element 30 is used to cool the electrode plate 10 .

[0055] See also Fig. 9 and Fig.10 In some embodiments, the lateral dimension of the protrusion 52 of the fixing member 50 decreases along the direction from top to bottom.

[0056] In some embodiments, the product is a device such as a semiconductor substrate, a semiconductor die, a wafer or a lead frame that needs to be plasma cleaned.

[0057] The embodiment of the present application provides a layer frame structure 100, which is suitable for supporting products, including: a temperature control group 102, including: an electrode plate 10; a first isolation plate 21, which is set below the electrode plate 10; a temperature regulating element 30, which is set below the first isolation plate 21, and a pipe for containing liquid is set in the temperature regulating element 30; a second isolation plate 22, which is set above the electrode plate 10, and the second isolation plate 22 is used to carry the product. The embodiment of the present application adjusts the temperature of the product by setting a pipe in the temperature regulating element 30 to contain liquid, thereby improving the process yield.

[0058] In some embodiments, the shelf structure 100 further includes: a water inlet channel 80 and a water outlet channel 82 , which are pipes connected to the temperature regulating element 30 , and the liquid enters the pipe from the water inlet channel 80 and then leaves the pipe from the water outlet channel 82 .

[0059] In some embodiments, the temperature of the liquid contained in the temperature regulating element 30 is lower than the temperature of the electrode plate 10. In some embodiments, the shelf structure 100 is suitable for supporting products during plasma cleaning.

[0060] In some embodiments, the liquid contained in the temperature regulating element 30 is hot water above room temperature. In some embodiments, the shelf structure 100 is suitable for supporting the product during the etching process. The temperature regulating element 30 can be added with different high temperature water to obtain a hot plate device for use in processes that require heating of the substrate or wafer.

[0061] The embodiments of the present application relate to process equipment and tools. A temperature regulating plate is designed under the electrode to conduct the heat generated by the electrode plate 10 out of the system, and a quick-detachable adjustable guide rail frame 40 is provided. During the cleaning operation, there are products of different sizes. The existing guide rail frame is designed as a single size. When different-sized substrates are to be cleaned, different guide rail frames need to be replaced, causing the machine to be shut down for replacement. Therefore, in response to this problem, the embodiments of the present application design an embedded groove 42 to cooperate with the guide bar 60 and the quick-detachable cone-head fixing parts 50 on both sides of the guide bar 60, providing a guide rail frame 40 that can be changed into 3 to 4 sizes, so as to save downtime for replacement and avoid machine shutdown. The design of the present application can extend the operation time without worrying about the impact of temperature on the product, and provides a design of a guide rail frame 40 that is easy to disassemble and replace.

[0062] When using the shelf structure 100 of the present application, in the first step (pre-operation), the guide bar 60 on the guide rail rack 40 in the chamber is adjusted by the equipment engineer (EE) according to the size of the product (e.g., substrate) in the box body (MAG.); in the second step (actual operation), the product in the box body (MAG.) is pushed out from the loading area and then sent into the lower chamber 74 through the sweeper; in the third step, the product is confined in the guide bar 60 and pushed to the electrode operation area; in the fourth step, the lower chamber 74 in the electrode operation area is closed and evacuated to a preset bottom pressure (e.g., 100 Mtorr) by a pump; in the fifth step, the reaction gas flows into the lower chamber 74 through the upper shell diffusion plate and is automatically controlled by a butterfly valve (automatic power control). power control, APC) mode of pressure control; Step 6, when the preset working pressure (for example, 102-300mTorr) is reached, the power is started, and the plasma cleans the product. During the process, the temperature regulating element 30 adjusts the temperature of the electrode plate 10; Step 7, after the product cleaning is completed, the power is turned off, the gas flow is turned off, and clean N2 is introduced into the vacuum lower chamber 74 until the pressure returns to atmospheric pressure; Step 8, the product is pushed out from the electrode area through the sweeper and sent to the box body (MAG.) connected in the unloader area to complete the cleaning operation; Step 9, repeat the operations from Step 2 to Step 8 until all the products in the box body are completely plasma cleaned; Step 10, after the operation, the box body is sent to the subsequent station for related process operations. The plasma cleaning capability of the present application is tested, and the water drop angle after the product is cleaned is effectively reduced. In some embodiments, atmospheric plasma (AP) can be used to clean the substrate.

[0063] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A shelf structure suitable for supporting products during plasma cleaning, characterized in that: include: Temperature control group, including: Electrode plates; A first isolation plate, mounted below the electrode plate; A temperature regulating element is mounted below the first isolation plate; A second isolation plate, mounted above the electrode plate, the second isolation plate being used to carry the product; A guide rail frame, mounted on the outside of the temperature control group, the guide rail frame having a plurality of embedded grooves; A plurality of fixing members, each having a convex portion that fits in the shape of the embedding groove, wherein the fixing members are arranged on the guide rail frame through the convex portion; A plurality of guide bars are arranged on the fixing member and used for clamping the product above the second isolation plate. The plurality of embedding grooves have a plurality of distances between each other, which are used for adjusting the distance between the guide bars as the size of the product changes.

2. The shelf structure according to claim 1, characterized in that: The first isolation plate and the second isolation plate are made of insulating materials and are used to electrically insulate the electrode plates.

3. The shelf structure according to claim 2, characterized in that: The second separator is used to separate the electrode plate from the product.

4. The shelf structure according to claim 1, characterized in that: Also includes: The lower shell is arranged below the temperature control group and the guide rail frame and supports the temperature control group and the guide rail frame.

5. The shelf structure according to claim 4, characterized in that: The lower shell includes a lower cavity that is recessed downward, and the temperature control group and the guide rail frame are accommodated in the lower cavity.

6. The shelf structure according to claim 5, characterized in that: The lower shell has an exhaust hole for extracting the gas contained in the lower cavity.

7. The shelf structure according to claim 4, characterized in that: A pipeline for containing liquid is arranged in the temperature regulating element.

8. The shelf structure according to claim 7, characterized in that: The temperature control group also includes: A water inlet channel and a water outlet channel are connected to the pipeline of the temperature regulating element, and the water inlet channel and the water outlet channel pass through the lower shell.

9. The shelf structure according to claim 1, characterized in that: The fixing member has a groove for accommodating the guide bar.

10. The shelf structure according to claim 9, characterized in that: The opening of the groove of the fixing member is cone-shaped.

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