Thin film power divider

Abstract

A thin-film power divider relates to the technical field of communication elements and comprises a shell, a bottom plate, transmission lines and connectors, a cavity is arranged in the shell, and the bottom plate is mounted in the cavity; a plurality of transmission lines are arranged on the plate surface of the bottom plate, the connecting ends of the plurality of transmission lines are electrically connected with the thin-film resistor, and the conversion ends of the plurality of transmission lines are respectively located at different edges of the bottom plate; a mounting hole is formed in the position, corresponding to the transmission line conversion end, of the shell, and a connector electrically connected with the corresponding transmission line is mounted in the mounting hole; and the extra loss of the power divider is small.

Description

Technical Field

[0001] The utility model relates to the technical field of communication elements, in particular to a thin film power divider. Background Art

[0002] As a passive device, the ultra-wideband power divider mainly realizes power distribution or synthesis functions, and can evenly or unevenly distribute RF signals to two or more port outputs. It is widely used in 5G / 6G communications, satellites, radars, test equipment and other fields;

[0003] At present, the ultra-wideband power dividers on the market are mainly designed based on the principle of resistor-type power dividers. The resistance value is 16.67 ohms, and the three ports are fully matched. Half of the input power is consumed by the resistor. Since the three ports are completely symmetrical, the isolation between the ports is 6dB. In addition, in order to achieve ultra-wideband low loss, the power dividers produced on the market mainly use suspended microstrip lines. Due to the symmetrical structure and the propagation of quasi-TEM mode, the suspended microstrip line has a very high cutoff frequency, and there will be no high-order modes in the passband. It has the characteristics of lower loss than the microstrip line. At the same time, thick film resistors are used to design the circuit, and the printed circuit board uses ceramic materials and adopts edge metallization.

[0004] During assembly, the printed circuit board is usually suspended and fixed in the center of the cavity and fixed in the vertical direction, and then the three coaxial connectors are screwed into the cavity. The center pin is supported by the conductive silicone rubber to fix the printed circuit board horizontally. Therefore, the performance of the ultra-wideband thin-film power divider currently depends on the assembly completion of the connector and the cavity, and the specific indicators of the thin-film power divider can only be tested after assembly. If the indicators do not meet the requirements, reassembly and adjustment are required;

[0005] However, due to the thickness of thick film resistors, conventional debugging methods such as adding or removing copper foil cannot be used. In addition, thick film resistors generally use screen printing technology, which has poor precision and it is difficult to ensure the consistency of product suites. In addition, the installation form makes the environmental adaptability poor and it is easy to cause disconnection problems.

[0006] A Chinese patent (CN108511867A) discloses a terahertz waveguide power divider, which has the advantages of simple structure, easy processing, high coupling strength and low conductor loss. However, the thin film resistor in the power divider is only connected to two of the waveguide metal strip G lines, resulting in a large additional loss of the power divider.

[0007] Therefore, we propose a power divider with small additional loss. Utility Model Content

[0008] In order to overcome the deficiencies in the background technology, the utility model discloses a thin film power divider.

[0009] In order to achieve the above-mentioned invention object, the utility model adopts the following technical solutions:

[0010] A thin film power divider comprises a housing, a bottom plate, a transmission line and a connector, wherein a cavity is provided in the housing and the bottom plate is installed in the cavity;

[0011] The bottom plate is provided with a plurality of transmission lines, the connection ends of the plurality of transmission lines are electrically connected to the thin film resistor, and the conversion ends of the plurality of transmission lines are respectively located at different edges of the bottom plate;

[0012] The housing is provided with a mounting hole at a position corresponding to the conversion end of the transmission line, and a connector electrically connected to the corresponding transmission line is installed in the mounting hole.

[0013] Preferably, the bottom plate is a ceramic bottom plate.

[0014] Preferably, the ceramic base plate is fixed in the cavity by bonding with conductive adhesive.

[0015] Preferably, the transmission line is configured as a grounded coplanar waveguide.

[0016] Preferably, the number of the transmission lines is set to three, and the thin film resistor is set to be a three-way shape.

[0017] Preferably, the conversion end of the transmission line is perpendicular to the edge of the bottom plate, and the transmission line is provided with a cut angle.

[0018] Preferably, the connector is threadedly connected to the mounting hole.

[0019] Due to the adoption of the above-mentioned technical solution, the utility model has the following beneficial effects:

[0020] The utility model discloses a thin film power divider.

[0021] By integrating all components in one housing, the entire power divider structure is more compact, which is conducive to miniaturization design;

[0022] In addition, using a ceramic baseplate can improve the overall thermal stability of the device, as ceramic has good insulation and high temperature resistance properties, which helps reduce signal distortion and improve long-term reliability;

[0023] In addition, the ceramic base plate is fixed by bonding with conductive adhesive, which simplifies the manufacturing process and reduces production costs;

[0024] The use of grounded coplanar waveguide transmission lines can reduce the transmission loss of the power divider while optimizing the port standing wave; the thin film resistor adopts a three-way design, which can reduce the overall size of the thin film resistor while being evenly connected to the transmission line, and can further reduce the additional loss caused by the resistor, thereby reducing the overall insertion loss of the power divider;

[0025] In addition, the angled design of the transmission line helps reduce signal reflection, while the vertical arrangement can reduce insertion loss and improve signal transmission quality;

[0026] In addition, the threaded connection design between the connector and the mounting hole facilitates disassembly and replacement, which is beneficial for on-site maintenance and troubleshooting. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A structural schematic diagram of the utility model;

[0028] Figure 2 This is a schematic diagram of the connection structure of the transmission line on the bottom plate.

[0029] In the figure: 1. housing; 11. cavity; 12. mounting hole; 2. base plate; 3. transmission line; 4. thin film resistor; 5. connector. DETAILED DESCRIPTION

[0030] The technical solution of the present invention will be described below in conjunction with the drawings in the embodiments of the present invention. In the description, it should be understood that if there are terms such as "upper", "lower", "front", "rear", "left", "right" and the like indicating directions or positional relationships, they are only corresponding to the drawings of the present invention, for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction:

[0031] Embodiment 1 is:

[0032] Combined with Figure 1 The thin film power divider comprises a housing 1, a bottom plate 2, a transmission line 3 and a connector 5. A cavity 11 is provided in the housing 1, and the bottom plate 2 is installed in the cavity 11.

[0033] In addition, the housing 1 is used to encapsulate the overall structure and protect the internal components from the external environment. As required, the top surface of the housing 1 is provided with a cover that matches the cavity 11. Since the thickness of the bottom plate 2 is limited and the bottom plate 2 needs to be located at the bottom surface of the cavity 11, a filling block that fills the upper half of the cavity 11 is provided on the cover, and the bottom surface of the filling block is close to the plate surface of the bottom plate 2.

[0034] Thus, the connection between the cover and the housing 1 is completed. After the bottom plate 2 is encapsulated in the housing 1, the volume of the remaining cavity 11 in the housing 1 will be consistent with the overall volume of the bottom plate 2, so that the bottom plate 2 can be just placed in the cavity 11, so that the high-frequency resonance of the power divider as a whole can be effectively suppressed;

[0035] In addition, a suitable material is selected to manufacture the housing 1, such as aluminum alloy or stainless steel, to ensure sufficient mechanical strength and electromagnetic shielding performance;

[0036] In particular, the base plate 2 is set as a ceramic base plate 2. By using the ceramic base plate 2, the overall thermal stability of the device can be improved, because ceramic has good insulation and high temperature resistance, which helps to reduce signal distortion and improve long-term reliability;

[0037] In addition, the ceramic base plate 2 is fixed in the cavity 11 by bonding with conductive adhesive, which simplifies the manufacturing process and reduces the production cost.

[0038] The surface of the bottom plate 2 is provided with a plurality of transmission lines 3, the connection ends of the plurality of transmission lines 3 are electrically connected to the thin film resistor 4, and the conversion ends of the plurality of transmission lines 3 are respectively located at different edges of the bottom plate 2;

[0039] It should be noted that the cross-sectional dimensions of the electrical connection between the connection end of the transmission line 3 and the thin film resistor 4 are kept consistent, thereby effectively improving the speed and efficiency of signal transmission and reducing the loss of signal transmission;

[0040] In addition, the conversion end of the transmission line 3 is used for signal input or output, and the connection ends of the transmission line 3 are connected to the thin film resistor 4, so that multiple transmission lines 3 can be integrated, and this connection method also allows the conversion end of any transmission line 3 to be used as an input end, and the conversion ends of other transmission lines 3 are output ends, and the output of the signal can also maintain uniformity;

[0041] In particular, the transmission line 3 is set as a grounded coplanar waveguide, which can effectively reduce radiation interference and improve the electromagnetic compatibility of the system;

[0042] In addition, the conversion ends of the transmission lines 3 are located at different edges of the base plate 2, which can also simplify external wiring and avoid interference problems caused by line crossing.

[0043] The housing 1 is provided with a mounting hole 12 at a position corresponding to the conversion end of the transmission line 3, and a connector 5 electrically connected to the corresponding transmission line 3 is installed in the mounting hole 12. It should be noted that the center pin of the connector 5 is soldered to the transmission line 3;

[0044] The connector 5 is used to connect to an input or output device so as to receive or output a signal. In particular, the connector 5 adopts a threaded 1.85mm connector 5 which is screwed into the mounting hole 12, which not only ensures the firmness of the connection between the connector 5 and the housing 1, ensures that the housing 1 has good sealing properties, prevents the external environment from affecting the internal circuit, but also facilitates on-site maintenance and troubleshooting. The pins of the connector 5 are in a customized integrated form, and the pins protrude from the cavity of the connector 5 by only 0.3mm. On the basis of ensuring that the pins of the connector 5 can be welded to the transmission line 3, the volume of the cavity 11 inside the power divider is also taken into account.

[0045] Embodiment 2 is:

[0046] Based on Example 1, Figure 2 , the number of the transmission lines 3 is further limited, that is, the number of the transmission lines 3 is set to three, and the thin film resistor 4 is set to a three-way shape; wherein the number of the transmission lines 3 is set to three, that is, the conversion end of one of the transmission lines 3 is the input end, and the conversion ends of the other two transmission lines 3 are output ends. Due to the setting of the thin film resistor 4, any one of the three transmission lines 3 can be used as an input, making the use process of the power divider more flexible;

[0047] The shape of the thin film resistor 4 not only ensures that the connection cross-section between the thin film resistor 4 and the connection end of the transmission line 3 is consistent in size, but also can achieve the purpose of reducing the size of the thin film resistor 4 itself; in addition, the thin film resistor 4 is deposited on the bottom plate 2 by sputtering, and the resistance of the thin film resistor 4 is 20 ohms / square, which can further reduce the additional loss caused by the resistor and reduce the overall insertion loss of the power divider;

[0048] In addition, the conversion end of the transmission line 3 is perpendicular to the edge of the base plate 2, and the transmission line 3 is provided with a cut angle, which helps to reduce signal reflection. At the same time, the vertical arrangement can reduce insertion loss and improve signal transmission quality.

[0049] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description. Therefore, it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention, and any figure marks in the claims should not be regarded as limiting the claims involved.

Claims

1. A thin film power divider, characterized in that: It comprises a housing (1), a base plate (2), a transmission line (3) and a connector (5); a cavity (11) is provided in the housing (1), and the base plate (2) is installed in the cavity (11); The surface of the bottom plate (2) is provided with a plurality of transmission lines (3), the connection ends of the plurality of transmission lines (3) are all electrically connected to the thin film resistor (4), and the conversion ends of the plurality of transmission lines (3) are respectively located at different edges of the bottom plate (2); The housing (1) is provided with a mounting hole (12) at a position corresponding to the conversion end of the transmission line (3), and a connector (5) electrically connected to the corresponding transmission line (3) is installed in the mounting hole (12).

2. The thin film power divider according to claim 1, characterized in that: The bottom plate (2) is configured as a ceramic bottom plate (2).

3. The thin film power divider according to claim 2, characterized in that: The ceramic base plate (2) is fixed in the cavity (11) by bonding with conductive adhesive.

4. The thin film power divider according to claim 1, characterized in that: The transmission line (3) is configured as a grounded coplanar waveguide.

5. The thin film power divider according to claim 1, characterized in that: The number of the transmission lines (3) is set to three, and the thin film resistor (4) is set to be a three-way shape.

6. The thin film power divider according to claim 1, characterized in that: The conversion end of the transmission line (3) is perpendicular to the edge of the bottom plate (2), and the transmission line (3) is provided with a cut corner.

7. The thin film power divider according to claim 1, characterized in that: The connector (5) and the mounting hole (12) are threadedly connected.

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