Fiber laser

Abstract

The utility model discloses an optical fiber laser, which comprises a mounting plate and a pumping module, and because a water channel is directly arranged in a bottom shell of the pumping module and is communicated with a water pipe in the mounting plate, heat of the bottom shell can be directly taken away by water flow so as to directly dissipate heat of a semiconductor chip. Compared with an indirect water cooling mode, the heat dissipation efficiency is greatly improved, and the problem of interface heat accumulation between the pumping module and the mounting plate is solved.

Description

Technical Field

[0001] The utility model relates to an optical fiber laser. Background Art

[0002] In recent years, with the development of laser technology and the characteristics of flexible transmission, the different application scenarios of fiber lasers have been greatly expanded. The application of fiber lasers and the field of handheld laser welding have rapidly developed and popularized. At the same time, new and higher requirements have been put forward for the portability and higher cost performance of fiber lasers. At present, fiber lasers are composed of several major parts, such as optical gain cavity, multiple pump source beam combination, power supply, main control board, driver board, etc. The number of devices is large and the volume is also large. The size and cost of the whole machine after arrangement are high. How to reduce the number of devices more and better, improve integration and cost performance, and put forward new requirements and directions for technology. In addition, the usual pump module includes multiple semiconductor modules, which have huge heat generation, and its heat dissipation is particularly important. Usually, water cooling is adopted. In the past, the water cooling heat dissipation of the pump module is indirect heat dissipation, that is, the mounting plate used to support the pump module is cooled by water cooling, and then the pump module is cooled by the water-cooled mounting plate. This indirect heat dissipation method not only has low heat dissipation efficiency, but also easily forms heat accumulation between the mounting plate and the pump module. This heat accumulation is often easy to damage the semiconductor chip.

[0003] In view of the above problems, the technical solution of the present invention is to adopt a more integrated design, reduce the number of devices, and further reduce the volume through reasonable layout design, improve efficiency, and improve cost performance. Utility Model Content

[0004] The utility model aims to provide a fiber laser, which is used to solve the problems of low heat dissipation efficiency and heat accumulation on the interface of a pump module in the prior art indirect water cooling.

[0005] To solve the above problems, the utility model provides a fiber laser, including a mounting plate, the mounting plate including a pump module placement area, the pump module placement area is used to install the pump module, and is characterized in that: the mounting plate includes an upper surface, a lower surface and four side surfaces, a pipe for circulating water is arranged in the mounting plate, the pipe extends inside the mounting plate, includes a first water inlet and a first water outlet, the first water inlet is used to introduce external water into the mounting plate, and the first water outlet is used to discharge the water in the mounting plate to the outside; the mounting plate includes an upper water inlet and an outlet, the upper water inlet and an outlet include a second water inlet and a second water outlet, the first water inlet is connected to the second water outlet through a water pipe in the mounting plate, and the first water outlet is connected to the second water inlet through a water pipe in the mounting plate; the second water outlet is used to introduce water in the water pipe in the mounting plate into the waterway in the pump module; the second water inlet is used to introduce water in the waterway in the pump module into the water pipe in the mounting plate; the pump module includes a packaging The encapsulation shell comprises a water channel, the encapsulation shell comprises a third water inlet and a third water outlet, the water channel in the encapsulation shell connects the third water inlet and the third water outlet; the third water inlet is connected to the second water outlet, so that the pump module receives the water flowing out of the second water outlet; the third water outlet is connected to the second water inlet, so that the water flowing out of the pump module is input into the water pipe of the mounting plate; the encapsulation shell of the pump module comprises a bottom shell, the third water inlet and the third water outlet are arranged on the bottom shell of the encapsulation shell; the water channel in the pump module is buried inside the encapsulation shell, and the bottom shell comprises the water channel; the pump module is mounted on the mounting plate, the lower surface of the bottom shell of the encapsulation shell is in direct contact with the upper surface of the mounting plate, the second water outlet of the mounting plate corresponds to and is connected with the third water inlet on the bottom shell, and the second water inlet of the mounting plate corresponds to and is connected with the third water outlet on the bottom shell; a semiconductor chip is mounted in the encapsulation shell, and the bottom shell of the encapsulation shell is in thermal contact with the semiconductor chip.

[0006] Preferably, the first water inlet and the first water outlet are side water inlets and outlets, and the side water inlet and outlet are arranged on the side of the mounting plate.

[0007] Preferably, the area around the location where the second water outlet is connected to the third water inlet is sealed to prevent water leakage, and the area around the location where the third water outlet is connected to the second water inlet is sealed to prevent water leakage; the external shell of the laser is provided with an external water inlet and an external water outlet that cooperate with the first water inlet and the first water outlet of the mounting plate, the external water inlet is connected to an external water source for introducing external water into the first water inlet, and the external water outlet is connected to an external drain pipe for draining water flowing out of the first water outlet into the external drain pipe.

[0008] Preferably, the mounting board also includes a power driver module placement area, which is used to install an integrated power driver module. The path along which the water pipe in the mounting board extends passes through the power driver module placement area. There is a water pipe in the mounting board area below the power driver module, so that the heat of the power driver module can be taken away by water flow.

[0009] Preferably, the bottom shell of the pump module packaging shell includes multiple water channels arranged side by side, thereby forming multiple parallel water flow channels, the third water inlet is connected to the multiple water channels arranged side by side, the water entering from the third water inlet enters the multiple water channels arranged side by side respectively, the multiple water channels arranged side by side are arranged below the semiconductor chip, the multiple water channels arranged side by side are connected to the third water outlet at the same time, the water entering from the third water inlet enters the multiple water channels arranged side by side respectively, the water flowing through the multiple water channels arranged side by side enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate.

[0010] Preferably, the water channel in the bottom shell of the pump module packaging shell is arranged in an S-shaped bend form, thereby forming a series of bend water channels, which are arranged on the bottom shell. Water entering from the third water inlet enters the S-shaped bend water channel, and water flowing through the S-shaped bend water channel enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate.

[0011] Preferably, multiple S-shaped bent water channels are connected in parallel, each of which is individually connected to the third water inlet and the third water outlet. Multiple bent water channels are arranged on the bottom shell. Water entering from the third water inlet enters the multiple S-shaped bent water channels. Water flowing through the multiple S-shaped bent water channels enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate.

[0012] Preferably, the area of ​​the water channel projected on the bottom shell is P1, the area of ​​the upper surface of the bottom shell is P2, the bottom shell is used for direct thermal contact with the semiconductor chip, and P2<3*P1.

[0013] Preferably, the packaging shell of the pump module includes a bottom shell, surrounding side shells, and an upper top shell, and the water channels in the pump module are also distributed in the surrounding side shells and / or the upper top shell.

[0014] Preferably, an integrated power drive module, a pump module, and a main control board are installed on the upper surface of the mounting plate. The pump module is hard-linked to the mounting plate, and the water channel in the pump module is directly connected to the water pipe in the mounting plate. Water flows from the first water inlet through the water pipe in the mounting plate and then enters the water channel in the pump module, then flows into the water pipe in the mounting plate again, and then flows out from the first water outlet of the mounting plate, wherein the water flows through the pump module to directly dissipate heat; the indicator optical chip is integrated in the pump module and outputted from the same optical fiber as the pump module; a single pump module adopts single-wavelength or multi-wavelength beam combining, and the pump optical fiber is directly fused with the high-reflection grating HR after output.

[0015] The beneficial effect of the utility model is that the high-power pump module is directly water-cooled, and the heat dissipation effect is good. The pump module is directly water-cooled and hard-connected to the mounting plate. Since a water channel is directly arranged in the bottom shell of the pump module and connected to the water pipe in the mounting plate, the heat of the bottom shell can be directly taken away by water flow, and then the semiconductor chip is directly dissipated. Compared with the usual indirect water cooling method of cooling the mounting plate used to support the pump module by water cooling, and then contacting the pump module with the water-cooled mounting plate to dissipate heat, the heat dissipation efficiency is greatly improved and the problem of interface heat accumulation between the pump module and the mounting plate is solved.

[0016] The output power of a single pump module can be increased by increasing the power of a single chip, increasing the number of chips, and combining multiple wavelengths. After the pump fiber is output, it is directly fused with the high-reflection grating HR to pump the gain cavity. This solution eliminates the multiple pump LDs and the required combiner devices in the multiple pump combining solution, and simplifies the integration into a high-power pump module fiber output. The indicator light chip is integrated in the high-power pump module and output from the same optical fiber, with high integration and no coupling device required for injection into the laser cavity. The single high-power pump module solution integrates the indicator light chip, thereby achieving high integration of fiber lasers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the mounting plate and the pump module of the utility model.

[0018] Figure 2 It is a schematic diagram of the lower surface of the bottom shell of the pump module of the utility model.

[0019] Figure 3 It is a distribution diagram of various areas on the upper surface of the installation plate of the utility model.

[0020] Figure 4 It is a schematic diagram of the bottom of the shell of the laser of the utility model. DETAILED DESCRIPTION

[0021] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0022] like Figure 1 , 3As shown, the utility model relates to a fiber laser, which includes an integral mounting plate 1, which includes a pump module placement area and a power drive module placement area. Preferably, it may also include a main control module placement area and a pump output fiber placement area. The pump module placement area is used to install a pump module 3, and the power drive module placement area is used to install an integrated power drive module. The mounting plate 1 is a flat plate-shaped structure with a certain thickness. A pipe for circulating water is arranged inside the mounting plate. The mounting plate includes an upper surface, a lower surface and four side surfaces. The pipe extends inside the mounting plate and includes a side water inlet and outlet 11 and an upper water inlet and outlet 12. See Figure 1 The side water inlet and outlet 11 is arranged on the side of the mounting plate, and includes a first water inlet 111 and a first water outlet 112. The first water inlet is used to introduce external water into the mounting plate, and the first water outlet 112 is used to discharge the water in the mounting plate to the outside. The upper water inlet and outlet 12 includes a second water inlet 121 and a second water outlet 122. The first water inlet is connected to the second water outlet through the water pipe in the mounting plate, and the first water outlet is connected to the second water inlet through the water pipe in the mounting plate. The second water outlet is used to introduce the water in the water pipe in the mounting plate into the water channel in the pump module; the second water inlet is used to introduce the water in the water channel in the pump module into the water pipe in the mounting plate. The pump module includes a packaging shell 21, and the packaging shell 21 is provided with a water channel. At the same time, the packaging shell 21 also includes a third water inlet and a third water outlet. The water channel in the packaging shell connects the third water inlet and the third water outlet. The third water inlet is connected to the second water outlet, so that the pump module receives the water flow transmitted from the second water outlet. The third water outlet is connected to the second water inlet, and is used to input the water flowing out of the pump module into the water pipe of the mounting plate. The packaging shell of the pump module includes at least a bottom shell, preferably also includes side shells around it, and preferably also includes a top shell on the top. Figure 2 It can be seen that the third water inlet and the third water outlet are arranged on the bottom shell of the packaging shell.

[0023] Preferably, the water channel in the pump module is buried inside the packaging shell. Preferably, the bottom shell of the pump module packaging shell may include a large area of ​​water channels. A semiconductor chip is installed in the packaging shell. Preferably, the pump module is installed on the mounting plate 1, the packaging shell 21 is in direct contact with the mounting plate 1, the lower surface of the bottom shell of the packaging shell is in direct contact with the upper surface of the mounting plate, the second water outlet of the mounting plate 1 corresponds to and is connected to the third water inlet position on the bottom shell, and the second water inlet of the mounting plate 1 corresponds to and is connected to the third water outlet position on the bottom shell. The bottom shell of the packaging shell is in thermal contact with the semiconductor chip, including direct contact or connection through thermal grease. The area around the location where the second water outlet is connected to the third water inlet should be sealed to prevent water leakage, and the area around the location where the third water outlet is connected to the second water inlet should be sealed to prevent water leakage.

[0024] Preferably, the bottom shell of the pump module packaging shell includes a plurality of water channels arranged side by side, thereby forming a plurality of parallel water flow channels, the third water inlet is connected to the plurality of water channels arranged side by side, the water entering from the water inlet enters the plurality of water channels arranged side by side respectively, the plurality of water channels arranged side by side are arranged below the semiconductor chip, the plurality of water channels arranged side by side are simultaneously connected to the third water outlet, the water entering from the third water inlet enters the plurality of water channels arranged side by side respectively, the water flowing through the plurality of water channels arranged side by side enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate. Compared with a single water channel, a plurality of parallel water channels can increase the flow rate of water, thereby improving the direct heat dissipation efficiency of the water flow. Since the water channel is directly arranged in the bottom shell of the pump module and is connected to the water pipe in the mounting plate, the water flow can be directly used to take away the heat of the bottom shell, thereby directly dissipating the heat of the semiconductor chip, which greatly improves the heat dissipation efficiency compared with the indirect water cooling method and solves the problem of heat accumulation at the interface between the pump module and the mounting plate.

[0025] Preferably, the water channel in the bottom shell of the pump module packaging shell can also be arranged in an S-shaped bending form, thereby forming a series of bending water channels, which are arranged as evenly as possible on the bottom shell, and the water entering from the third water inlet enters the S-shaped bending water channel, and the water flowing through the S-shaped bending water channel enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate. Of course, multiple S-shaped bending water channels can also be connected in parallel, each of which is individually connected to the third water inlet and the third water outlet, and the multiple bending water channels are arranged as evenly as possible on the bottom shell, and the water entering from the third water inlet enters the multiple S-shaped bending water channels, and the water flowing through the multiple S-shaped bending water channels enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate. Preferably, the area projected by the multiple water channels on the bottom shell is P1, and the area of ​​the upper surface of the bottom shell is P2. The bottom shell is used for thermal contact with the semiconductor chip (including direct contact or connection through thermal grease, etc.), and its heat generation is huge. Engineers realized that when the projected area of ​​the water channel is small, it cannot cover most of the bottom shell. Since the bottom shell is very hot everywhere, it is difficult to efficiently take away the heat of the entire bottom shell, which will reduce the heat dissipation efficiency. In order to ensure that the water flow quickly and directly takes away the heat from most positions on the bottom shell, preferably, P2<3*P1.

[0026] In order to improve the heat dissipation capacity of the high-power pump, the indirect water cooling method is cancelled and a direct water cooling solution is adopted. The high-power pump is designed with a water inlet and outlet, which is hard-connected to the water channel of the water cooling plate in series to improve the integration and heat dissipation capacity.

[0027] Preferably, the packaging shell of the pump module includes a bottom shell, surrounding side shells, and an upper top shell. The water channels in the pump module are not only distributed in the bottom shell, but also in the surrounding side shells, and even in the upper top shell. The water channels in the surrounding side shells and / or the upper top shell can be connected in parallel with the water channels in the bottom shell to increase the flow rate of cooling water flowing through the packaging shell; the water channels in the surrounding side shells and / or the upper top shell can be connected in series with the water channels in the bottom shell, so that the surrounding side shells and the upper top shell can receive the heat transmitted by the bottom shell and use the heat dissipation surfaces of the surrounding side shells and the upper top shell for air cooling, thereby reducing the flow rate and improving the heat dissipation efficiency to save water. On this basis, part of the heat source, such as a semiconductor chip, can also be installed on the surface of the side shell or even the surface of the top shell to effectively use the water channel for direct water cooling and heat dissipation.

[0028] Preferably, the path of the water pipe in the mounting plate passes through the power drive module placement area, so that the heat of the power drive module can be taken away by the water flow, and the pump module and the power drive module can be cooled simultaneously by a single water path. That is, there is a water pipe in the mounting plate area below the integrated power drive module. In addition, the water pipe and the water inlet and outlet are opened from the mounting plate to introduce external water into the pump module because the pump module is small and unstable, which is not conducive to directly introducing water into the pump module from the outside.

[0029] The mounting plate is designed with two sides, and the lower surface has fiber grooves, grating pairs (HR, OC), strippers (CPS), and output optical cables. The fiber grooves can be runway-shaped, figure-8-shaped, double figure-8-shaped, etc. The grating pairs are coated after femtosecond writing or hydrogen-loaded writing. The processed grating pairs are not packaged but directly placed in the fiber groove for fixation and heat dissipation. The fixing or installation position of the grating pairs on the mounting plate can be adjusted at any time. The upper surface of the mounting plate is installed with an integrated power drive module, a high-power pump module, and a main control board. The high-power pump module is hard-linked to the mounting plate, and the water channel in the pump module is directly connected to the water pipe in the mounting plate. The water flows through the water pipe in the mounting plate and enters the water channel in the pump module, and then flows into the water pipe in the mounting plate again, and then flows out from the first water outlet of the mounting plate, wherein the water flows through the pump module to directly dissipate heat.

[0030] See also Figure 3 , 4 The external shell of the laser is provided with an external water inlet and an external water outlet which cooperate with the first water inlet and the first water outlet of the mounting plate. The external water inlet is connected to an external water source for introducing external water into the first water inlet. The external water outlet is connected to an external drain pipe for draining water flowing out of the first water outlet into the external drain pipe.

[0031] The main control board is fixed vertically on the rear panel and has DB25 and DB15 interfaces to the outside.

[0032] Preferably, since the pump module has an integral packaging shell, in order to reduce the number of parts and simplify the packaging, the indicator light chip is integrated into the high-power pump module and output through the same optical fiber as the pump module, with high integration and no coupling device required for injection into the laser cavity.

[0033] Preferably, in order to reduce the number of modules to simplify the assembly and the device, preferably, only one pump module is used, and the single high-power pump module fiber is directly welded to the high-reflection grating (HR) after output, so that the beam combiner can be eliminated. The output power of a single pump module is increased by increasing the power of a single chip, the number of chips, and multi-wavelength beam combining. After the pump fiber is output, it is directly welded to the high-reflection grating HR to pump the gain cavity; this solution eliminates multiple pump LDs and the required beam combiner devices in the multiple pump beam combining solution, and simplifies the integration into a high-power pump module fiber output.

[0034] At the same time, the high-power pump has an internal integrated package of an indicator light chip (such as red light), and the indicator light is also output through the output optical fiber of the pump, reducing the coupling devices with the laser.

[0035] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A fiber laser, comprising a mounting plate, the mounting plate comprising a pump module placement area, the pump module placement area being used to install a pump module, characterized in that: The mounting plate includes an upper surface, a lower surface and four side surfaces. A pipe for circulating water is arranged inside the mounting plate. The pipe extends inside the mounting plate and includes a first water inlet and a first water outlet. The first water inlet is used to introduce external water into the mounting plate, and the first water outlet is used to discharge the water in the mounting plate to the outside. The mounting plate includes an upper water inlet and outlet, and the upper water inlet and outlet include a second water inlet and a second water outlet. The first water inlet is connected to the second water outlet through a water pipe in the mounting plate, and the first water outlet is connected to the second water inlet through a water pipe in the mounting plate. The second water outlet is used to introduce water from the water pipe in the mounting plate into the waterway in the pump module. The second water inlet is used to introduce water from the waterway in the pump module into the water pipe in the mounting plate. The pump module comprises a packaging shell, a water channel is arranged in the packaging shell, the packaging shell comprises a third water inlet and a third water outlet, the water channel in the packaging shell communicates with the third water inlet and the third water outlet; the third water inlet is connected to the second water outlet, so that the pump module receives water flowing out of the second water outlet; The third water outlet is connected to the second water inlet, and is used to input the water flowing out of the pump module into the water pipe of the mounting plate; the packaging shell of the pump module includes a bottom shell, and the third water inlet and the third water outlet are arranged on the bottom shell of the packaging shell; The water channel in the pump module is buried inside the packaging shell, and the bottom shell includes the water channel; the pump module is installed on the mounting plate, the lower surface of the bottom shell of the packaging shell is in direct contact with the upper surface of the mounting plate, the second water outlet of the mounting plate corresponds to and is connected with the third water inlet on the bottom shell, and the second water inlet of the mounting plate corresponds to and is connected with the third water outlet on the bottom shell; a semiconductor chip is installed in the packaging shell, and the bottom shell of the packaging shell is in thermal contact with the semiconductor chip.

2. According to the optical fiber laser of claim 1, the first water inlet and the first water outlet are side water inlets and outlets, and the side water inlets and outlets are arranged on the side of the mounting plate.

3. According to claim 1, the optical fiber laser, the area around the connection position of the second water outlet and the third water inlet is sealed to prevent water leakage, and the area around the connection position of the third water outlet and the second water inlet is sealed to prevent water leakage; the external shell of the laser is provided with an external water inlet and an external water outlet that cooperate with the first water inlet and the first water outlet of the mounting plate, the external water inlet is connected to an external water source for introducing external water into the first water inlet, and the external water outlet is connected to an external drain pipe for draining water flowing out of the first water outlet into the external drain pipe.

4. According to the optical fiber laser of claim 1, the mounting board further comprises a power driving module placement area, the power driving module placement area is used to install an integrated power driving module, the path along which the water pipe in the mounting board extends passes through the power driving module placement area, and a water pipe is provided in the mounting board area below the power driving module, thereby taking away the heat of the power driving module through the water flow.

5. According to the optical fiber laser of claim 1, the bottom shell of the pump module packaging shell includes a plurality of water channels arranged side by side, thereby forming a plurality of parallel water flow channels, the third water inlet is connected to the plurality of water channels arranged side by side, the water entering from the third water inlet enters the plurality of water channels arranged side by side respectively, the plurality of water channels arranged side by side are arranged below the semiconductor chip, the plurality of water channels arranged side by side are connected to the third water outlet at the same time, the water entering from the third water inlet enters the plurality of water channels arranged side by side respectively, the water flowing through the plurality of water channels arranged side by side enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate.

6. According to the optical fiber laser of claim 1, the water channel in the bottom shell of the pump module packaging shell is arranged in an S-shaped bending form, thereby forming a series of bending water channels, which are arranged on the bottom shell, and the water entering from the third water inlet enters the S-shaped bending water channel, and the water flowing through the S-shaped bending water channel enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate.

7. According to claim 6, the optical fiber laser adopts multiple S-shaped bent water channels in parallel, each of which is individually connected to the third water inlet and the third water outlet, and multiple bent water channels are arranged on the bottom shell. Water entering from the third water inlet enters the multiple S-shaped bent water channels, and the water flowing through the multiple S-shaped bent water channels enters the third water outlet and flows out of the pump module, and then enters the water pipe of the mounting plate.

8. The fiber laser according to claim 5 or 6, the area of ​​the water channel projected on the bottom shell is P1, the area of ​​the upper surface of the bottom shell is P2, the bottom shell is used for direct thermal contact with the semiconductor chip, and P2<3*P1.

9. The optical fiber laser according to claim 1, wherein the packaging shell of the pump module comprises a bottom shell, surrounding side shells, and an upper top shell, and the water channels in the pump module are also distributed in the surrounding side shells and / or the upper top shell.

10. According to the fiber laser of claim 1, an integrated power drive module, a pump module, and a main control board are installed on the upper surface of the mounting plate, the pump module is hard-linked to the mounting plate, the water channel in the pump module is directly connected to the water pipe in the mounting plate, water flows from the first water inlet through the water pipe in the mounting plate and then enters the water channel in the pump module, then flows into the water pipe in the mounting plate again, and then flows out from the first water outlet of the mounting plate, wherein the water flows through the pump module to directly dissipate heat; the indicator light chip is integrated in the pump module and outputted from the same optical fiber as the pump module; a single pump module adopts single wavelength or multi-wavelength beam combining, and the pump optical fiber is directly fused with the high-reflection grating HR after output.

Images