Diamond grinding device structure in chemical mechanical polishing process

Abstract

The utility model belongs to the technical field of chemical mechanical polishing process, and particularly relates to a diamond grinding device structure in chemical mechanical polishing process, which comprises a turntable and a transmission connecting cylinder, the transmission connecting cylinder is welded on the upper surface of the turntable, the lower surface of the turntable is provided with embedding grooves, the embedding grooves are annularly distributed, and the transmission connecting cylinder is connected with the turntable. Positioning holes are formed in inner cavities of the embedding grooves in a penetrating mode, fixing frames are movably arranged in the inner cavities of the embedding grooves, polishing pieces are fixedly connected to the lower surfaces of the fixing frames, positioning rods are fixedly connected to the upper surfaces of the fixing frames, the positioning rods are connected with the positioning holes in an inserted mode, and limiting grooves are formed in the surfaces of the positioning rods; a pressing disc is movably arranged on the upper surface of the rotating disc, and round inserting holes are formed in the positions, corresponding to the positioning rods, of the surface of the pressing disc in a penetrating mode. By rotating the pressing disc, the limiting clamping groove can be clamped into the limiting groove, the grinding piece can be rapidly fixed through the pressing disc, the grinding piece can be rapidly replaced after being abraded, and the use cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical mechanical polishing process, in particular to the structure of a diamond abrasive disc in the chemical mechanical polishing process. Background Art

[0002] In chemical mechanical polishing, in wafer manufacturing, with the upgrading of the manufacturing process technology and the reduction of the wire and gate sizes, the lithography technology has higher and higher requirements for the flatness of the wafer surface. Chemical mechanical polishing is also called chemical mechanical planarization. Its principle is a processing technology that combines chemical corrosion and mechanical removal. It is the only technology in mechanical processing that can achieve global surface planarization. Through patent retrieval, it is found that the publication number: CN2726801Y discloses a structure of a diamond abrasive disc, which is mainly applied in the chemical mechanical polishing process. The diamond abrasive disc is arranged above the polishing pad. Its structure includes a circular base, and a plurality of diamond particles are arranged around the lower surface thereof to contact the polishing pad for removing impurities remaining in the polishing pad. There is also an actuating rod connected above the circular base to support the circular base and provide the acting force for the circular base to rotate and move. Through the acting force provided by the actuating rod, the utility model can perform self-rotation and radial movement to form a planar movement coverage track, not only achieving the same effect of cleaning the polishing pad as usual, but also only using a smaller number of diamond particles, and being more capable of reducing the situation of diamond breakage or falling off, and prolonging the service life of the polishing pad.

[0003] In the existing chemical mechanical polishing disc, the wafer surface is polished by a polishing sheet during use. After the polishing sheet is used, wear will occur, resulting in a reduction in the flatness of the polishing disc. There are a large number of polishing sheets on the polishing disc, which is inconvenient for quick replacement. Therefore, the entire polishing disc needs to be replaced, increasing the use cost. To solve the above problems, the structure of a diamond abrasive disc in the chemical mechanical polishing process is proposed in this application. Summary of the Utility Model

[0004] (1) Purpose of the Utility Model

[0005] To solve the technical problems in the background art, the utility model proposes a structure of a diamond abrasive disc in the chemical mechanical polishing process. The fixing frame is inserted into the embedding groove, the positioning rod is inserted into the positioning hole, and the surface of the pressing disc is inserted into the positioning rod through the circular insertion hole. By rotating the pressing disc, the limiting card slot can be engaged into the limiting groove, and the abrasive disc can be quickly fixed by the pressing disc. After the abrasive disc is worn, it can be quickly replaced, reducing the use cost to solve the problems proposed in the background art.

[0006] (2) Technical Solution

[0007] In order to solve the above technical problems, the utility model provides a diamond grinding device structure in a chemical mechanical polishing process, comprising a turntable and a transmission connecting cylinder, wherein the transmission connecting cylinder is welded to the upper surface of the turntable, an embedding groove is provided on the lower surface of the turntable, the embedding groove is distributed in a ring shape, the inner cavity of the embedding groove is penetrated by positioning holes, the inner cavity of the embedding groove is movably provided with a fixing frame, a grinding sheet is fixedly connected to the lower surface of the fixing frame, a positioning rod is fixedly connected to the upper surface of the fixing frame, and the positioning rod is plugged into the positioning hole;

[0008] A limiting groove is provided on the surface of the positioning rod, a pressure plate is movably provided on the upper surface of the turntable, circular plug holes are penetrated through the surface of the pressure plate corresponding to the position of the positioning rod, and a limiting slot is provided on one side of the circular plug hole. After the pressure plate is rotated, the limiting slot is engaged with the limiting groove.

[0009] Preferably, corresponding holes are opened through the surface of the pressure plate, and the corresponding holes are symmetrically distributed.

[0010] Preferably, a threaded fixing hole is opened on the upper surface of the turntable at a position corresponding to the corresponding hole position, and the corresponding hole and the threaded fixing hole coincide with each other after the pressure plate is rotated.

[0011] Preferably, a fixing bolt is inserted through the inner cavity of the corresponding hole, and the fixing bolt is threadedly connected to the threaded fixing hole.

[0012] Preferably, a liquid-conducting connecting column is provided in the inner cavity of the transmission connecting cylinder, and a liquid-draining hole is opened at the center of the lower surface of the turntable, and the liquid-draining hole is connected to the liquid-conducting connecting column.

[0013] Preferably, sealing rings are provided on the surface of the liquid-conducting connecting column, and the sealing rings are equidistantly distributed.

[0014] Preferably, a clearance hole is provided through the center of the pressure plate, and the transmission connecting tube is plugged into the clearance hole.

[0015] The above technical solution of the utility model has the following beneficial technical effects:

[0016] 1. In the utility model, the fixing frame is plugged into the embedded groove, the positioning rod is plugged into the positioning hole, and the surface of the pressure plate is plugged into the positioning rod through the circular plug hole. By rotating the pressure plate, the limit slot can be inserted into the limit slot, and the grinding disc can be quickly fixed by the pressure plate. The grinding disc can be quickly replaced after being worn, thereby reducing the use cost.

[0017] 2. In the present utility model, the liquid guiding connection column is located inside the transmission connection cylinder. The liquid supply end is inserted into the liquid guiding connection column, and the connection is sealed by squeezing the sealing ring, enabling the chemical polishing liquid to be injected into the turntable and discharged through the liquid discharge holes. The liquid guiding connection column is located at the center of the turntable, which can improve the stability of the turntable during rotation, avoid swinging, and improve the polishing accuracy. Brief Description of the Drawings

[0018] Figure 1 is the overall structural schematic diagram of the diamond grinding disc device in the chemical mechanical polishing process of the present utility model;

[0019] Figure 2 is the sectional structural schematic diagram of the diamond grinding disc device in the chemical mechanical polishing process of the present utility model;

[0020] Figure 3 is the structural schematic diagram of the pressure plate of the diamond grinding disc device in the chemical mechanical polishing process of the present utility model;

[0021] Figure 4 is the exploded structural schematic diagram of the turntable of the diamond grinding disc device in the chemical mechanical polishing process of the present utility model;

[0022] Figure 5 is the structural schematic diagram of the embedding groove of the diamond grinding disc device in the chemical mechanical polishing process of the present utility model.

[0023] Reference Signs:

[0024] 1. Turntable; 2. Transmission connection cylinder; 3. Embedding groove; 4. Positioning hole; 5. Fixed frame; 6. Grinding sheet; 7. Positioning rod; 8. Limiting groove; 9. Pressure plate; 10. Circular insertion hole; 11. Limiting card slot; 12. Corresponding hole; 13. Thread fixing hole; 14. Clearance hole; 15. Liquid guiding connection column; 16. Sealing ring; 17. Liquid discharge hole. Detailed Embodiment

[0025] To make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary and are not intended to limit the scope of the present utility model. In addition, in the following description, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.

[0026] As Figures 1-5As shown in the figure, the structure of the diamond grinding disc in the chemical mechanical polishing process proposed by the present utility model includes a turntable 1 and a transmission connecting cylinder 2. The transmission connecting cylinder 2 is welded on the upper surface of the turntable 1. An embedding groove 3 is opened on the lower surface of the turntable 1. The embedding grooves 3 are distributed in a ring shape. Positioning holes 4 are respectively and vertically opened in the inner cavities of the embedding grooves 3. Fixing frames 5 are respectively and movably arranged in the inner cavities of the embedding grooves 3. A grinding disc 6 is fixedly connected to the lower surface of the fixing frame 5. A positioning rod 7 is fixedly connected to the upper surface of the fixing frame 5. The positioning rod 7 is inserted into the positioning hole 4.

[0027] A limiting groove 8 is opened on the surface of the positioning rod 7. A pressing disc 9 is movably arranged on the upper surface of the turntable 1. Circular insertion holes 10 are respectively and vertically opened on the surface of the pressing disc 9 at positions corresponding to the positioning rod 7. Limiting card slots 11 are respectively opened on one side of the circular insertion holes 10. After the pressing disc 9 rotates, the limiting card slot 11 is clamped with the limiting groove 8.

[0028] It should be noted that when the turntable 1 rotates, polishing is carried out through the grinding disc 6. The fixing frame 5 is inserted into the embedding groove 3, the positioning rod 7 is inserted into the positioning hole 4, and the surface of the pressing disc 9 is inserted into the positioning rod 7 through the circular insertion hole 10. By rotating the pressing disc 9, the limiting card slot 11 can be clamped into the limiting groove 8, and the grinding disc 6 can be quickly fixed by the pressing disc 9. After the grinding disc 6 is worn, it can be quickly replaced.

[0029] In this embodiment, as Figure 3 and Figure 4 shown, corresponding holes 12 are vertically opened on the surface of the pressing disc 9. The corresponding holes 12 are symmetrically distributed. Threaded fixing holes 13 are opened on the upper surface of the turntable 1 at positions corresponding to the corresponding holes 12. After the pressing disc 9 rotates, the corresponding holes 12 coincide with the threaded fixing holes 13. A fixing bolt is inserted through the inner cavity of the corresponding hole 12, and the fixing bolt is threadedly connected to the threaded fixing hole 13.

[0030] It should be noted that after the pressing disc 9 rotates, the corresponding holes 12 coincide with the threaded fixing holes 13. The fixing bolt is inserted into the corresponding hole 12 and threadedly connected to the threaded fixing hole 13, so as to quickly fix the pressing disc 9.

[0031] In this embodiment, as Figure 2 and Figure 4 shown, a liquid guiding connecting column 15 is arranged in the inner cavity of the transmission connecting cylinder 2. A liquid discharge hole 17 is opened at the center of the lower surface of the turntable 1. The liquid discharge hole 17 is connected to the liquid guiding connecting column 15. Sealing rings 16 are arranged on the surface of the liquid guiding connecting column 15. The sealing rings 16 are distributed at equal intervals.

[0032] It should be noted that the liquid guiding connection column 15 is located inside the transmission connection cylinder 2. The liquid supply end is inserted into the liquid guiding connection column 15, and the connection is sealed by squeezing the sealing ring 16, so that the chemical polishing liquid can be injected into the turntable 1 and discharged through the liquid discharge hole 17. When the turntable 1 rotates, polishing is carried out through the polishing sheet 6. The liquid guiding connection column 15 is located at the center of the turntable 1, which can improve the stability of the turntable 1 during rotation, avoid swinging, and improve the polishing accuracy.

[0033] In this embodiment, as Figure 3 shown, a clearance hole 14 is penetrated through the center of the pressure plate 9, and the transmission connection cylinder 2 is inserted into the clearance hole 14.

[0034] It should be noted that the transmission connection cylinder 2 is inserted into the clearance hole 14, which can facilitate the installation of the pressure plate 9.

[0035] The working principle and usage process of the present utility model: The power output end of the mechanical polishing equipment is inserted into the transmission connection cylinder 2 to drive the turntable 1. The liquid guiding connection column 15 is located inside the transmission connection cylinder 2, and the liquid supply end is inserted into the liquid guiding connection column 15. The connection is sealed by squeezing the sealing ring 16, so that the chemical polishing liquid can be injected into the turntable 1 and discharged through the liquid discharge hole 17. When the turntable 1 rotates, polishing is carried out through the polishing sheet 6. The liquid guiding connection column 15 is located at the center of the turntable 1, which can improve the stability of the turntable 1 during rotation, avoid swinging, and improve the polishing accuracy. The fixing frame 5 is inserted into the embedding groove 3, the positioning rod 7 is inserted into the positioning hole 4, and the surface of the pressure plate 9 is inserted into the positioning rod 7 through the circular insertion hole 10. By rotating the pressure plate 9, the limit card slot 11 can be snapped into the limit slot 8. After the pressure plate 9 rotates, the corresponding hole 12 coincides with the threaded fixing hole 13. The fixing bolt is inserted into the corresponding hole 12 and threadedly connected to the threaded fixing hole 13, so that the polishing sheet 6 can be quickly fixed by the pressure plate 9, and the polishing sheet 6 can be quickly replaced after being worn.

[0036] It should be understood that the above specific embodiments of the present utility model are only used for exemplary illustration or explanation of the principle of the present utility model, and do not constitute a limitation to the present utility model. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present utility model shall be included within the protection scope of the present utility model. In addition, the appended claims of the present utility model are intended to cover all changes and modification examples falling within the scope and boundary of the appended claims or equivalent forms of such scope and boundary.

Claims

1. A diamond grinding device structure in a chemical mechanical polishing process, comprising a turntable (1) and a transmission connecting cylinder (2), wherein the transmission connecting cylinder (2) is welded to the upper surface of the turntable (1), characterized in that: The lower surface of the turntable (1) is provided with an embedding groove (3), the embedding groove (3) is distributed in a ring shape, the inner cavity of the embedding groove (3) is penetrated by a positioning hole (4), the inner cavity of the embedding groove (3) is movably provided with a fixing frame (5), the lower surface of the fixing frame (5) is fixedly connected with a grinding sheet (6), the upper surface of the fixing frame (5) is fixedly connected with a positioning rod (7), and the positioning rod (7) is plugged into the positioning hole (4); A limiting groove (8) is provided on the surface of the positioning rod (7); a pressure plate (9) is movably provided on the upper surface of the rotating disk (1); a circular plug hole (10) is provided through the surface of the pressure plate (9) at a position corresponding to the position of the positioning rod (7); a limiting slot (11) is provided on one side of the circular plug hole (10); and after the pressure plate (9) is rotated, the limiting slot (11) is engaged with the limiting groove (8).

2. The diamond grinding device structure in the chemical mechanical polishing process according to claim 1, characterized in that: The surface of the pressure plate (9) is penetrated by corresponding holes (12), and the corresponding holes (12) are symmetrically distributed.

3. The diamond grinding device structure in the chemical mechanical polishing process according to claim 2, characterized in that: A threaded fixing hole (13) is provided on the upper surface of the rotating disk (1) at a position corresponding to the corresponding hole (12); after the pressure plate (9) rotates, the corresponding hole (12) and the threaded fixing hole (13) coincide with each other.

4. The diamond grinding device structure in the chemical mechanical polishing process according to claim 3, characterized in that: A fixing bolt is inserted through the inner cavity of the corresponding hole (12), and the fixing bolt is threadedly connected to the threaded fixing hole (13).

5. The diamond grinding device structure in the chemical mechanical polishing process according to claim 4, characterized in that: The inner cavity of the transmission connection cylinder (2) is provided with a liquid-conducting connection column (15), and the center of the lower surface of the rotating disk (1) is provided with a liquid-discharging hole (17), and the liquid-discharging hole (17) is connected to the liquid-conducting connection column (15).

6. The diamond grinding device structure in the chemical mechanical polishing process according to claim 5, characterized in that: The surface of the liquid-conducting connecting column (15) is provided with a sealing ring (16), and the sealing rings (16) are distributed in an equidistant manner.

7. The diamond grinding device structure in the chemical mechanical polishing process according to claim 6, characterized in that: A clearance hole (14) is provided through the center of the pressure plate (9), and the transmission connection cylinder (2) is plugged into the clearance hole (14).

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