Wafer cleaning brush device and chemical mechanical polishing equipment

Abstract

The utility model provides a wafer cleaning brush device and chemical mechanical polishing equipment. The wafer cleaning brush device comprises a cleaning brush body; the brush bars are arranged on the surface of the cleaning brush body at intervals, and the ends, away from the cleaning brush body, of the brush bars are brush heads; the limiting part is arranged on the brush head and partially covers the brush head, and the limiting part is used for limiting particles on the surface of the wafer. According to the cleaning brush, the limiting part is arranged on the brush head of the brush rod, particles on the surface of the wafer are limited through the limiting part, when the cleaning brush body rotates, the limiting part plays a role in pushing the particles limited by the limiting part, and the limiting part can easily strip the particles from the surface of the wafer under the cooperation of the chemical solution. The cleaning effect on the surface of the wafer is improved, and the product yield is prevented from being affected by particle residues.

Claims

1. A wafer cleaning brush device, characterized in that: Comprising: A cleaning brush body; A plurality of brush rods, which are arranged on the surface of the cleaning brush body at intervals, and one end of the brush rod far away from the cleaning brush body is a brush head; A limiting part, which is arranged on the brush head and partially covers the brush head, and the limiting part is used for limiting particles on the surface of the wafer.

2. The wafer cleaning brush device according to claim 1, characterized in that: The limiting part is in a crescent shape, a bent shape, a U shape, a C shape, a strip shape or a wave shape, and the end surface of the limiting part far away from the brush head is a plane.

3. The wafer cleaning brush device according to claim 1, characterized in that: There are at least two limiting parts, and a gap is formed between two adjacent limiting parts.

4. The wafer cleaning brush device according to claim 1, characterized in that: It further includes a cleaning component connected to the liquid supply system, and the cleaning component is used to spray cleaning liquid onto the brush head to clean the brush head.

5. The wafer cleaning brush device according to claim 4, characterized in that: The cleaning component includes a main pipeline and a plurality of branch pipelines. The main pipeline extends into the cleaning brush body and is connected to the liquid supply system. A plurality of the branch pipelines are arranged on the main pipeline at intervals, and the branch pipelines are arranged in one-to-one correspondence with the brush rods; The brush head is provided with through holes arranged错开 with the limiting part. The branch pipelines extend out of the cleaning brush body, pass through the corresponding brush rods and are connected to the corresponding through holes; or, A channel is arranged through the brush rod along the extension direction of the brush rod, and the channel is arranged错开 with the limiting part. The branch pipelines extend out of the cleaning brush body and are connected to the corresponding channels.

6. The wafer cleaning brush device according to claim 4, characterized in that: It further includes a bracket and a driving member; The cleaning brush body is rotatably installed on the bracket; The driving member is drivingly connected to the cleaning brush body to drive the cleaning brush body to rotate.

7. The wafer cleaning brush device according to claim 6, characterized in that: The cleaning component includes a delivery pipe and a plurality of spray heads; The delivery pipe is arranged on the bracket and is connected to the liquid supply system; A plurality of the spray heads are arranged on the delivery pipe and are spaced apart along the extension direction of the delivery pipe, and the spray heads are arranged facing the brush head.

8. The wafer cleaning brush device according to claim 7, characterized in that: The brush rods are arranged in a plurality of rows at intervals, and each row of brush rods is arranged at intervals along the extension direction of the cleaning brush body. The spray heads on the delivery pipe are arranged in one-to-one correspondence with each row of brush rods; and / or, There are a pair of delivery pipes, which are respectively located on both sides of the bracket and respectively correspond to both sides of the cleaning brush body.

9. The wafer cleaning brush device according to any one of claims 1 to 8, characterized in that: The limiting part is integrally formed with the brush rod.

10. A chemical mechanical polishing device, characterized in that: Comprising: The wafer cleaning brush device according to any one of claims 1-9.

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