Testing device for high-speed optical module

Abstract

The utility model relates to the field of testing devices of optical modules, and particularly discloses a testing device of a high-speed optical module, which comprises a testing board and a temperature sensor used for detecting the optical module in real time. The test board is provided with a temperature control clamp, the temperature control clamp comprises a temperature control cavity, a plugging port and a power connection port, the plugging port and the power connection port are communicated with the temperature control cavity, the optical module is embedded and matched with the temperature control cavity through the plugging port, the temperature control clamp is detachably connected with an air inlet pipe, and the air inlet pipe is communicated with the temperature control cavity; the temperature control clamp is detachably connected with a fixing assembly used for fixing the temperature sensor so that the temperature sensor can penetrate through the temperature control clamp to reach the optical module. According to the device, under the cooperation of the temperature control clamp and the air inlet pipe, the airflow path can be effectively shortened, the temperature of the optical module in the temperature control cavity can be increased and decreased more quickly, the test period can be effectively shortened, and the test efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the field of test devices for optical modules, and particularly relates to a test device for high-speed optical modules. Background Art

[0002] A high-speed optical module is an optical module used for high-speed data transmission, and its transmission rate is usually 100 gigabits or higher. The test of the optical module is a prerequisite for ensuring the product performance and quality. Whether a complete and accurate test can be carried out directly determines the quality and cost of the product. The test process of the optical module is relatively complex, including initial test at room temperature, final test, high-temperature test, and low-temperature test.

[0003] Existing, a high and low temperature test device for an optical module with the patent application number CN202022888161.2, the test machine body includes a test chamber, the upper surface of the bottom plate is fixedly connected to the bottom of the test chamber. During operation, the test machine body tests the optical module located on the upper surface of the placement table. After a certain period of testing is completed, the hydraulic cylinder drives the fixed block and the rubber pad to move, pushing the optical module located on the surface of the placement table. The optical module falls into the discharge pipe through the discharge port and is located on the upper surface of the intercepting plate. An operator rotates the fixed cover through the handle, driving the sealing cover to rotate. The operator quickly places the next group of optical modules to be tested on the surface of the placement table through the feed port, rotates the fixed cover, and continues to test through the test machine body.

[0004] As described in the above patent document, the existing test devices for high-speed optical modules are usually large in volume, the test chamber is designed in a cumbersome manner, the air flow path is long, which easily leads to low test efficiency, long test cycle, is not conducive to the plugging and unplugging and maintenance of test cables, and at the same time, it is easy to bring the test board into the high and low temperature test, which is likely to cause damage to the test machine. Summary of the Utility Model

[0005] The utility model provides a test device for high-speed optical modules to solve the technical problems of low test efficiency, inconvenience for plugging and unplugging test cables, and easy damage to the test machine in the prior art.

[0006] To solve the above problems, a test device for high-speed optical modules provided by the utility model adopts the following technical solutions: including a test board and a temperature sensor for real-time detection of the optical module;

[0007] A temperature control fixture is arranged on the test board. The temperature control fixture includes a temperature control cavity, an insertion interface, and a power connection interface. The insertion interface and the power connection interface are both in communication with the temperature control cavity. The optical module is in interference fit with the temperature control cavity through the insertion interface. The temperature control fixture is detachably connected with an intake pipe, and the intake pipe is in communication with the temperature control cavity;

[0008] A fixing component for fixing a temperature sensor is detachably connected to the temperature control fixture, so that the temperature sensor penetrates through the temperature control fixture to reach the optical module.

[0009] Further, a first guiding hole corresponding to the optical module is provided on the temperature control fixture, and the fixing component includes a mounting member which penetrates through the first guiding hole to reach the optical module.

[0010] Further, the fixing component further includes a fixing base and a guiding member. An installation part is provided on the fixing base, and the guiding member is fixed to the installation part by a bolt. The guiding member is provided with a second guiding hole corresponding to the first guiding hole, and the mounting member sequentially penetrates through the second guiding hole, the fixing base, and the first guiding hole to reach the optical module.

[0011] Further, the intake pipe is flange-connected to the temperature control fixture, and the intake pipe is located directly above the optical module.

[0012] Further, the test board includes a chip, and a heat dissipation component is provided above the chip. The heat dissipation component includes a thermal conductive gasket, a heat dissipation copper sheet, and a radiator which are sequentially distributed along the direction away from the chip.

[0013] Further, a functional interface and a patch cord are provided on the test board, and the temperature control fixture is arranged to avoid the functional interface and the patch cord.

[0014] Further, the material of the temperature control fixture is FR4.

[0015] The beneficial effects of a test device for a high-speed optical module provided by the present utility model are as follows: The temperature sensor can detect the temperature change of the optical module in real time and accurately. The temperature control fixture places the optical module in a controllable temperature control cavity. By introducing a constant temperature or variable temperature gas into the temperature control cavity through the intake pipe, precise control of the temperature of the optical module can be achieved, which helps to simulate various temperature environments that the optical module may encounter in actual use, thereby improving the comprehensiveness and accuracy of the test. Moreover, it is convenient for cable plugging and unplugging. At the same time, with the cooperation of the temperature control fixture and the intake pipe, the air flow path can be effectively shortened, and the temperature of the optical module in the temperature control cavity can rise and fall faster, which can effectively shorten the test cycle and improve the test efficiency. Description of the Drawings

[0016] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present utility model will become readily understandable. In the drawings, several embodiments of the present utility model are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 is a schematic structural diagram of a test device for a high-speed optical module of the present utility model;

[0018] Figure 2 Partial structural schematic diagram of a test device for a high-speed optical module of the present utility model Figure 1 ;

[0019] Figure 3 Partial structural schematic diagram of a test device for a high-speed optical module of the present utility model Figure 2 ;

[0020] Figure 4 Schematic diagram of the mating structure between the temperature control fixture and the optical module of a test device for a high-speed optical module of the present utility model;

[0021] Figure 5 Schematic diagram of the structure of the fixing component of a test device for a high-speed optical module of the present utility model.

[0022] Explanation of reference numerals in the drawings:

[0023] 1, test board; 11, carrier fixture; 12, functional interface; 13, patch cord;

[0024] 2, temperature control fixture; 21, temperature control cavity; 22, jack; 23, intake pipe; 24, first guide hole; 25, power connection port;

[0025] 3, fixing component; 31, mounting member; 311, through hole; 312, fastener; 32, fixed seat; 321, mounting portion; 33, guiding member;

[0026] 4, heat dissipation component; 41, thermal conductive gasket; 42, heat dissipation copper sheet; 43, radiator. Specific embodiments

[0027] Next, in combination with the drawings in the embodiments of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described. Those skilled in the art should know that the following described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present utility model.

[0028] Any number of elements in the drawings is for illustration rather than limitation, and any naming is only for distinction and does not have any limiting meaning.

[0029] Next, with reference to several representative embodiments of the present utility model, the principles and spirits of the present utility model will be elaborated in detail.

[0030] A test device for a high-speed optical module provided by the present utility model, as Figures 1 to 5As shown in the figure, it includes a test board 1 and a temperature sensor for real-time detection of the optical module. A temperature control fixture 2 is arranged on the test board 1. The temperature control fixture 2 includes a temperature control cavity 21, an insertion interface 22, and a power connection port 25. The insertion interface 22 and the power connection port 25 are both in communication with the temperature control cavity 21. The optical module is fitted with the temperature control cavity 21 through the insertion interface 22. The temperature control fixture 2 is detachably connected with an air inlet pipe 23, and the air inlet pipe 23 is in communication with the temperature control cavity 21.

[0031] In this embodiment, when the optical module is inserted into the temperature control cavity 21, it is electrically connected to the test board 1 through the power connection port 25, and the power connection port 25 is located below the temperature control fixture 2.

[0032] In this embodiment, the air inlet pipe 23 is flange-connected to the temperature control fixture 2. The air inlet pipe 23 is located directly above the optical module. The detachable connection of the air inlet pipe 23 to the temperature control fixture 2 through flange connection enables the device to replace the corresponding air inlet pipe 23 according to the air outlet of high and low temperature equipment with different diameters. In this embodiment, the normal insertion and extraction of the optical module are realized through the insertion interface 22 on the temperature control fixture 2. The middle of the optical module is designed with an opening corresponding to the direct upper part of the temperature control fixture 2, and a columnar air inlet pipe 23 is provided as the air inlet. At the same time, the air inlet is docked with the air outlet of the high and low temperature equipment, which can effectively shorten the air flow path and quickly change the temperature of the optical module to the specified temperature.

[0033] It should be noted that only the front-end part of the optical module is used as the temperature control area, and the optical port jumper is inserted and removed in normal temperature air, which is convenient to replace and more matches the actual use environment of the optical module in the switch.

[0034] In this embodiment, the temperature control cavity 21 is processed and formed based on the width dimension of the optical module, ensuring smooth air flow without generating extra space and maximizing the utilization of space. In this embodiment, the insertion interface 22 is 0.1 - 0.2 mm larger than the outer shape of the optical module, facilitating the quick and accurate insertion and extraction of the optical module.

[0035] In this embodiment, the material of the temperature control fixture 2 is FR4. The FR4 material is anti-static and relatively soft, which can effectively avoid scratching the appearance of the optical module. In other embodiments, FR4 can also be made of various soft and anti-static materials such as carbon fiber and polyether ketone.

[0036] In this embodiment, a fixing component 3 for fixing the temperature sensor is detachably connected to the temperature control fixture 2, enabling the temperature sensor to penetrate the temperature control fixture 2 to reach the optical module. In this embodiment, the temperature sensor is a temperature sensing wire, and based on the resistance characteristics of the temperature sensing wire, the temperature is determined by measuring the resistance value of the temperature sensing wire.

[0037] In this embodiment, the temperature control cavity 21 tightly surrounds the optical module. The intake pipe 23 is located directly above the optical module. The fixing component 3 is in the same horizontal direction as the intake pipe 23, minimizing the temperature activity range of the optical module, quickly reaching the specified temperature, and feeding back the real-time temperature to the device test end.

[0038] In this embodiment, the temperature control fixture 2 is provided with a first guiding hole 24 corresponding to the optical module. The fixing component 3 includes a mounting member 31, and the mounting member 31 passes through the first guiding hole 24 to reach the optical module.

[0039] In this embodiment, the fixing component 3 further includes a fixing base 32 and a guiding member 33. The fixing base 32 is provided with a mounting portion 321. The guiding member 33 is fixed to the mounting portion by a pin bolt. The guiding member 33 is provided with a second guiding hole corresponding to the first guiding hole 24. The mounting member 31 sequentially passes through the second guiding hole, the fixing base 32, and the first guiding hole 24 to reach the optical module. In this embodiment, the mounting member 31 is provided with a through hole 311, and the wire of the temperature sensor passes through the through hole 311 to reach the optical module.

[0040] In this embodiment, the outer wall of the mounting member 31 is provided with an external thread, and a fastening member 312 is sleeved on the outer wall of the mounting member 31. The fastening member 312 is in threaded cooperation with the mounting member 31 to ensure the stability of the mounting member 31.

[0041] It should be noted that the test board 1 includes a chip. During the airtight test, since the chip on the test board 1 will have a higher temperature during the high-temperature airtight test and is prone to damage the test board 1. In this embodiment, a heat dissipation component 4 is provided above the chip. The heat dissipation component 4 includes a heat conduction gasket 41, a heat dissipation copper sheet 42, and a radiator 43 arranged in sequence along the direction away from the chip. The radiator 43 includes heat dissipation fins, using air heat conduction as the medium to ensure the heat dissipation of the chip during the high-temperature test and ensure the normal operation and lifespan of the test board 1.

[0042] In this embodiment, the test board 1 is provided with a functional interface 12 and a patch cord 13. The temperature control fixture 2 is arranged to avoid the functional interface 12 and the patch cord 13. In this embodiment, the functional interface 12 includes an electrical signal interface, a high-speed test cable interface, and a high-speed optical signal cable interface. All the electronic components on the front and back of the test board 1 are placed outside the temperature control fixture 2, do not participate in the high and low temperature changes, and are not affected by the temperature changes. In this embodiment, there is also a carrier fixture 11 for carrying the test board 1.

[0043] A test device for a high-speed optical module provided by the present utility model controls the temperature of the optical module through a temperature control fixture 2. The optical module is fitted and cooperated with a temperature control cavity 21 through an insertion interface 22 to achieve the sealing and temperature control of the optical module. An intake pipe 23 is communicated with the temperature control cavity 21, and high and low temperature gases are introduced into the temperature control cavity 21 to achieve rapid adjustment of the temperature of the optical module. The device fixes a temperature sensor on the temperature control fixture 2 through a fixing component 3 and enables it to penetrate through the temperature control fixture 2 to reach the optical module to detect the temperature of the optical module in real time. The chip on the test board 1 is cooled through a heat dissipation component 4 to ensure that it will not be damaged by overheating during high-temperature tests.

[0044] Based on the above description of this specification, those skilled in the art can also understand the following terms used, such as the terms indicating orientation or positional relationship, such as "upper", "lower", "front", "rear", "left", "right", "width", "horizontal", "top", "bottom", "inner", "outer", etc., are based on the orientation or positional relationship shown in the drawings of this specification. It is only for the purpose of facilitating the description of the solution of the present utility model and simplifying the description, rather than explicitly or implicitly indicating that the device or component involved must have the specific orientation, be constructed and operated in the specific orientation. Therefore, the above terms of orientation or positional relationship cannot be understood or interpreted as a limitation to the solution of the present utility model.

[0045] In addition, in the description of this specification, the meaning of "a plurality of" is at least two, such as two, three or more, etc., unless otherwise specifically and clearly defined.

Claims

1. A high-speed optical module testing device, characterized in that: It includes a test board and a temperature sensor for real-time detection of the optical module; The test board is provided with a temperature control fixture, which includes a temperature control cavity, a plug interface, and an electrical connection port. The plug interface and the electrical connection port are interconnected with the temperature control cavity. The optical module is engaged with the temperature control cavity through the plug interface. The temperature control fixture is detachably connected with an air intake pipe, and the air intake pipe is interconnected with the temperature control cavity. A fixing component for fixing the temperature sensor is detachably connected to the temperature control fixture, so that the temperature sensor passes through the temperature control fixture and reaches the optical module.

2. A high-speed optical module testing device according to claim 1, characterized in that: A first guide hole corresponding to the optical module is arranged on the temperature control fixture, and the fixing assembly comprises a mounting piece, and the mounting piece passes through the first guide hole to reach the optical module.

3. A high-speed optical module testing device according to claim 2, characterized in that: The fixing assembly also includes a fixing seat and a guide member. The fixing seat is provided with an installation portion. The guide member is fixed to the installation portion by a pin. The guide member is provided with a second guide hole corresponding to the first guide hole. The installation member passes through the second guide hole, the fixing seat, and the first guide hole in sequence to reach the optical module.

4. A high-speed optical module testing device according to any one of claims 1 to 3, characterized in that: The air inlet pipe is connected to the temperature control fixture flange, and the air inlet pipe is located directly above the optical module.

5. A high-speed optical module testing device according to any one of claims 1 to 3, characterized in that: The test board includes a chip. A heat dissipation component is arranged above the chip. The heat dissipation component includes a thermal conductive pad, a heat dissipation copper sheet, and a radiator which are sequentially distributed in a direction away from the chip.

6. A high-speed optical module testing device according to any one of claims 1 to 3, characterized in that: The test board is provided with functional interfaces and plug-in wires, and the temperature control fixture is provided away from the functional interfaces and plug-in wires.

7. A high-speed optical module testing device according to any one of claims 1 to 3, characterized in that: The material of the temperature control fixture is FR4.

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