Wafer alignment detection device for nanoimprint

Abstract

The utility model discloses a wafer alignment detection device for nanoimprint, which comprises a supporting and fixing assembly, a servo alignment detection assembly is mounted on the supporting and fixing assembly, a clamping and aligning assembly is fixed on the servo alignment detection assembly, and the supporting and fixing assembly comprises an operation table. The servo alignment detection assembly comprises two groups of moving plates and a double-shaft motor, and a screw sleeve is embedded in one side of each moving plate; according to the utility model, by adding the design of the servo alignment detection assembly and the clamping and aligning assembly, through the operation of the double-shaft motor and the rotation of the transmission screw rod, the two groups of moving plates drive the clamping and aligning assembly to move relatively, and the position of the wafer is corrected after the wafer is clamped, so that the wafer can be accurately placed on the wafer vacuum adsorption assembly; therefore, the pattern on the mold can be accurately imprinted on the wafer, the deviation of the nano-imprinting result is prevented, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of nanoimprinting, and particularly relates to a wafer alignment detection device for nanoimprinting. Background Technique

[0002] In nanoimprinting, it is necessary to regularly imprint the patterns on the mold onto the wafer, that is, the patterns on the wafer and the soft template must be kept consistent.

[0003] After retrieval, the application number of the Chinese patent document is CN202122205516.8. This utility model relates to a wafer positioning device and a nanoimprinting device. The wafer positioning device includes: a wafer positioning platform, including an annular transfer table and a positioning clamping mechanism. The annular transfer table is used to place the wafer to be positioned, and the positioning clamping mechanism is used to position the center of the wafer to a predetermined position; a wafer adsorption device, arranged below the hollow position of the annular transfer table, used to adsorb and fix the wafer placed in the annular transfer table; a rotation driving device, connected to the wafer adsorption device, used to drive the wafer adsorption device to drive the wafer to rotate clockwise or counterclockwise; an optical fiber sensor, arranged on the outer periphery of the annular transfer table, used to identify the positioning notch on the wafer; and a main control device, respectively signal-connected to the positioning clamping mechanism, the wafer adsorption device, the rotation driving device, and the optical fiber sensor. Through the above settings, the problem that each wafer with different positions and angles cannot be quickly positioned and adjusted during the current nanoimprinting process can be solved.

[0004] Before vacuum-adsorbing the wafer, it is necessary to perform alignment detection on the wafer to prevent the wafer from deviating from the adsorption device, so that the patterns on the mold cannot be accurately imprinted on the wafer, which may lead to deviations in the results of nanoimprinting. Therefore, we need to propose a wafer alignment detection device for nanoimprinting to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a wafer alignment detection device for nanoimprinting, which adds a servo alignment detection component and a clamping and guiding component. Through the operation of a biaxial motor and the rotation of a transmission screw, the two moving plates drive the clamping and guiding component to move, accurately place the wafer on the adsorption device, so as to ensure that the patterns on the mold can be accurately imprinted on the wafer, prevent deviations in the results of nanoimprinting, and thus improve the practicability of the device, so as to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A wafer alignment detection device for nanoimprinting, including a support and fixing component, a servo alignment detection component is installed on the support and fixing component, and a clamping and guiding component is fixed on the servo alignment detection component;

[0007] The support and fixing component includes an operating table. The servo alignment and detection component includes two moving plates and a biaxial motor. Both of the two moving plates are fixed on the lower surface of the operating table. A screw sleeve is embedded on one side of the moving plate. The base of the biaxial motor is fixed on the lower surface of the operating table. One screw is connected to each of the two output shafts of the biaxial motor. The two screws are respectively in threaded connection with the two screw sleeves.

[0008] Preferably, a limit plate is fixed at each end of the lower surface of the operating table. A set of bearings are embedded at both ends of the limit plate. The two screws are respectively rotatably connected to the two bearings.

[0009] Preferably, a sliding sleeve is embedded at one end of the moving plate away from the screw sleeve. A sliding rod is slidably connected between the two moving plates through the sliding sleeve. Both ends of the sliding rod are rotatably connected to the limit plate through another set of bearings.

[0010] Preferably, the servo alignment and detection component further includes an alignment and detection sliding plate. An alignment and detection slider is fixed at the lower end of the alignment and detection sliding plate. The alignment and detection sliding plate is fixed on the moving plate through the alignment and detection slider. An electric telescopic rod is installed on the alignment and detection sliding plate.

[0011] Preferably, a first limit sliding groove and a second limit sliding groove are formed on the operating table. The first limit sliding groove and the second limit sliding groove are communicated with each other. The alignment and detection sliding plate is slidably connected to the second limit sliding groove. The alignment and detection slider is slidably connected to the first limit sliding groove.

[0012] Preferably, the clamping and guiding component includes two arc-shaped clamping plates. Rubber anti-slip layers are attached to the opposite sides of the two arc-shaped clamping plates. The arc-shaped clamping plates are fixed on the piston rod of the electric telescopic rod. A sliding ring is fixed at the lower end of the arc-shaped clamping plate. A connecting rod is slidably connected between the two sliding rings. Limit rings are arranged at both ends of the connecting rod. A wafer placement seat is installed on the connecting rod.

[0013] Preferably, a wafer vacuum adsorption component is further included. The wafer vacuum adsorption component includes a vacuum pump. A column is fixed at each of the four corners of the lower surface of the operating table. A railing is fixed between the four columns. The vacuum pump is located between the four columns. The output end of the vacuum pump is communicated with a vacuum adsorption pipe. The upper end of the vacuum adsorption pipe extends out of the operating table and is provided with an adsorption rubber nozzle.

[0014] Compared with the prior art, the beneficial effects of the present utility model are:

[0015] The utility model designs a servo alignment detection component and a clamping and guiding component. Through the operation of a biaxial motor and the rotation of a transmission screw, the two moving plates drive the clamping and guiding component to move relatively. After clamping the wafer, the position of the wafer is corrected, so that the wafer can be accurately placed on the wafer vacuum adsorption component, ensuring that the pattern on the mold can be accurately imprinted on the wafer, preventing deviation in the results of nanoimprinting, and thus improving the practicability of the device. Brief Description of the Drawings

[0016] Figure 1 is a schematic structural diagram of the utility model;

[0017] Figure 2 is a schematic structural diagram of the clamping and guiding component and the servo alignment detection component of the utility model;

[0018] Figure 3 is a schematic structural diagram of the wafer vacuum adsorption component of the utility model.

[0019] In the figure: 100, support and fixing component; 101, operating table; 102, limiting plate; 103, bearing; 104, first limiting chute; 105, second limiting chute; 111, column; 112, railing; 200, clamping and guiding component; 201, arc-shaped clamping plate; 202, rubber anti-slip layer; 203, connecting rod; 204, wafer placement seat; 205, limiting ring; 300, servo alignment detection component; 301, moving plate; 302, screw sleeve; 303, biaxial motor; 304, screw; 305, sliding sleeve; 306, sliding rod; 311, alignment detection slider; 312, alignment detection slide plate; 313, electric telescopic rod; 400, wafer vacuum adsorption component; 401, vacuum pump; 402, vacuum adsorption tube; 403, adsorption rubber nozzle. Detailed Embodiments

[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figures 1-3 , the present utility model provides a technical solution: a wafer alignment detection device for nanoimprinting, including a support and fixing component 100, a servo alignment detection component 300 is installed on the support and fixing component 100, and a clamping and guiding component 200 is fixed on the servo alignment detection component 300;

[0022] The support and fixation component 100 includes an operation table 101. The servo alignment and detection component 300 includes two sets of moving plates 301 and a biaxial motor 303. Both sets of moving plates 301 are fixed on the lower surface of the operation table 101. A screw sleeve 302 is embedded on one side of the moving plate 301. The base of the biaxial motor 303 is fixed on the lower surface of the operation table 101. A screw rod 304 is connected to each of the two output shafts of the biaxial motor 303. The two screw rods 304 are respectively threadedly connected to the two sets of screw sleeves 302;

[0023] By operating the biaxial motor 303, the driving screw rod 304 rotates, causing the two sets of moving plates 301 to drive the clamping and alignment component 200 to move relatively, correcting the position of the wafer after clamping the wafer, so that the wafer can be accurately placed on the wafer vacuum adsorption component 400, thereby ensuring that the pattern on the mold can be accurately imprinted on the wafer, preventing deviation in the results of nanoimprinting, and thus improving the practicability of the device.

[0024] A limiting plate 102 is fixed at each end of the lower surface of the operation table 101. A set of bearings 103 are embedded at both ends of the limiting plate 102. The two screw rods 304 are respectively rotatably connected to the two sets of bearings 103, facilitating providing a fulcrum for the screw rods 304 and preventing the screw rods 304 from shifting during rotation.

[0025] A sliding sleeve 305 is embedded at one end of the moving plate 301 away from the screw sleeve 302. A sliding rod 306 is slidably connected between the two sets of moving plates 301 through the sliding sleeve 305. Both ends of the sliding rod 306 are rotatably connected to the limiting plate 102 through another set of bearings 103. When the screw rod 304 and the screw sleeve 302 are threadedly engaged and move, the moving plate 301 can only move in a fixed direction by the sliding of the sliding rod 306 on the sliding sleeve 305, preventing the movement path of the moving plate 301 from shifting.

[0026] The servo alignment and detection component further includes an alignment and detection sliding plate 312. An alignment and detection slider 311 is fixed at the lower end of the alignment and detection sliding plate 312. The alignment and detection sliding plate 312 is fixed on the moving plate 301 through the alignment and detection slider 311. An electric telescopic rod 313 is installed on the alignment and detection sliding plate 312;

[0027] A first limiting sliding groove 104 and a second limiting sliding groove 105 are formed on the operation table 101. The first limiting sliding groove 104 and the second limiting sliding groove 105 are communicated. The alignment and detection sliding plate 312 is slidably connected to the second limiting sliding groove 105, and the alignment and detection slider 311 is slidably connected to the first limiting sliding groove 104. By operating the biaxial motor 303, the moving plate 301 can drive the alignment and detection sliding plate 312 to move through the alignment and detection slider 311. At the same time, the movement paths of the alignment and detection slider 311 and the alignment and detection sliding plate 312 are directionally restricted by the first limiting sliding groove 104 and the second limiting sliding groove 105 respectively.

[0028] The clamping and guiding assembly 200 includes two groups of arc-shaped clamping plates 201. The opposite sides of the two groups of arc-shaped clamping plates 201 are both attached with rubber anti-skid layers 202 to prevent the arc-shaped clamping plates 201 from damaging the wafers during the process of clamping the wafers. The arc-shaped clamping plates 201 are fixed to the piston rod of the electric telescopic rod 313. The lower end of the arc-shaped clamping plates 201 is fixed with a slip ring. A connecting rod 203 is slidably connected between the two groups of slip rings, so that the connecting rod 203 and the wafer placement seat 204 can be slidably connected between the slip rings. The wafer placement seat 204 is connected so that it can carry the wafer and move it to a precise position under the resistance and clamping of the two sets of arc-shaped clamping plates 201. Limiting rings 205 are set at both ends of the connecting rod 203. The wafer placement seat 204 is installed on the connecting rod 203. When in use, the wafer is prevented from being on the wafer placement seat 204. The wafer is clamped by the relative movement of the two sets of arc-shaped clamping plates 201 so that the wafer is located directly above the adsorption rubber nozzle 403, thereby accurately positioning the wafer.

[0029] It also includes a wafer vacuum adsorption component 400, which includes a vacuum pump 401. A column 111 is fixed at each of the four corners of the lower surface of the operating table 101. A railing 112 is fixed between the four columns 111. The vacuum pump 401 is located between the four columns 111. The output end of the vacuum pump 401 is connected to a vacuum adsorption tube 402. The upper end of the vacuum adsorption tube 402 extends out of the operating table 101 and is equipped with an adsorption rubber nozzle 403. After aligning the position of the wafer, the electric telescopic rod 313 is operated to make the wafer placement seat 204 and the wafer descend until the wafer contacts the adsorption rubber nozzle 403. Then the vacuum pump 401 is operated to generate suction on the vacuum adsorption tube 402, so that the wafer is firmly adsorbed on the adsorption rubber nozzle 403.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer alignment detection device for nanoimprinting, comprising a support and fixing assembly (100), characterized in that: A servo alignment detection component (300) is installed on the supporting and fixing component (100), and a clamping and guiding component (200) is fixed on the servo alignment detection component (300); The support and fixing component (100) comprises an operating table (101); the servo alignment detection component (300) comprises two groups of movable plates (301) and a dual-axis motor (303); the two groups of movable plates (301) are both fixed on the lower surface of the operating table (101); a screw sleeve (302) is embedded on one side of the movable plate (301); the base of the dual-axis motor (303) is fixed on the lower surface of the operating table (101); two output shafts of the dual-axis motor (303) are both connected to a screw rod (304); and the two screw rods (304) are respectively threadedly connected to the two groups of screw sleeves (302).

2. The wafer alignment detection device for nanoimprinting according to claim 1, characterized in that: A limiting plate (102) is fixed at both ends of the lower surface of the operating table (101), a group of bearings (103) are embedded at both ends of the limiting plate (102), and the two screw rods (304) are rotatably connected to the two groups of bearings (103) respectively.

3. The wafer alignment detection device for nanoimprinting according to claim 2, characterized in that: A sliding sleeve (305) is embedded in one end of the movable plate (301) away from the screw sleeve (302), and a sliding rod (306) is slidably connected between the two groups of movable plates (301) through the sliding sleeve (305), and both ends of the sliding rod (306) are rotatably connected to the limit plate (102) through another group of bearings (103).

4. The wafer alignment detection device for nanoimprinting according to claim 3, characterized in that: The servo alignment detection assembly also includes an alignment detection slide plate (312), an alignment detection slider (311) is fixed to the lower end of the alignment detection slide plate (312), the alignment detection slide plate (312) is fixed to the movable plate (301) via the alignment detection slider (311), and an electric telescopic rod (313) is installed on the alignment detection slide plate (312).

5. The wafer alignment detection device for nanoimprinting according to claim 4, characterized in that: The operating table (101) is provided with a first limiting slide groove (104) and a second limiting slide groove (105), the first limiting slide groove (104) and the second limiting slide groove (105) are connected, the alignment detection slide plate (312) is slidably connected to the second limiting slide groove (105), and the alignment detection slider (311) is slidably connected to the first limiting slide groove (104).

6. The wafer alignment detection device for nanoimprinting according to claim 5, characterized in that: The clamping and guiding assembly (200) comprises two groups of arc-shaped clamping plates (201), and rubber anti-slip layers (202) are bonded on opposite sides of the two groups of arc-shaped clamping plates (201). The arc-shaped clamping plates (201) are fixed on the piston rod of the electric telescopic rod (313), and a slip ring is fixed at the lower end of the arc-shaped clamping plates (201). A connecting rod (203) is slidably connected between the two groups of slip rings, and limit rings (205) are arranged at both ends of the connecting rod (203). A wafer placement seat (204) is installed on the connecting rod (203).

7. The wafer alignment detection device for nanoimprinting according to claim 6, characterized in that: It also includes a wafer vacuum adsorption assembly (400), the wafer vacuum adsorption assembly (400) includes a vacuum pump (401), a column (111) is fixed at each of the four corners of the lower surface of the operating table (101), a railing (112) is fixed between the four columns (111), the vacuum pump (401) is located between the four columns (111), the output end of the vacuum pump (401) is connected to a vacuum adsorption tube (402), and the upper end of the vacuum adsorption tube (402) extends out of the operating table (101) and is equipped with an adsorption rubber nozzle (403).

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