Temperature control device for power device

Abstract

The utility model discloses a temperature control device for a power device, which comprises an objective table, a temperature sensor, a semiconductor cooler, a temperature control module and a liquid cooling plate, the semiconductor cooler is placed between the objective table and the liquid cooling module, a heat insulation plate is arranged for heat insulation, and the three-layer structure is fixed by countersunk bolts. The upper and lower surfaces of the structure are radio frequency high-power device test contact platforms. Temperature sensors are arranged on the upper and lower surfaces of the objective table and the liquid cooling module and used for monitoring and feeding back temperature, the semiconductor refrigeration temperature control module is used for achieving a high-precision low-temperature environment, and the liquid cooling module is used for achieving efficient heat dissipation and simulating the high-temperature environment. According to the utility model, the temperature control in the test and evaluation process of the device and the chip under different heat consumption levels can be realized, and the test and evaluation accuracy of the radio frequency high-power device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a temperature control device for power devices. Background Art

[0002] At present, in the field of semiconductor testing, before the research and development of high-power chips or devices and the product leaving the factory, testing and reliability evaluation are required. The DC, RF performance and reliability of devices are relatively sensitive to temperature, and the performance of devices at different ambient temperatures is one of the important contents of semiconductor testing. In addition, devices, especially high-power devices, generate a large amount of heat during operation, causing the devices to be at a high temperature. This self-heating effect will significantly affect the performance and reliability. Especially for lasers and RF high-power devices, the testing and reliability evaluation of devices or chips need to be completed at a constant temperature. In traditional testing devices, in order to perform constant-temperature testing on chips during operation, the chips need to be placed in an incubator. The low-temperature environment is simulated by low-temperature air, and it takes a long time to achieve a specific low-temperature environment. In addition, due to the size of the incubator and the airtight requirements, this method has cumbersome procedures, difficult operation, low air heat transfer efficiency, and cannot achieve high heat dissipation and high-precision temperature control testing. Content of the Utility Model

[0003] Purpose of the utility model: The purpose of the utility model is to provide a temperature control device for power devices that can meet the applications of small size, high precision, and high heat dissipation.

[0004] Technical solution: A temperature control device for power devices of the utility model includes a stage, a semiconductor refrigerator, a heat insulation plate, and a liquid cooling plate. The semiconductor refrigerator is embedded in the middle of the heat insulation plate. The stage is arranged above the heat insulation plate, and the liquid cooling plate is arranged below the heat insulation plate.

[0005] The utility model combines two temperature control methods of semiconductor refrigeration and liquid cooling to achieve two applications of high-precision temperature control under low heat consumption and stable temperature control under high heat consumption.

[0006] Further, it also includes a first temperature sensor for reflecting the temperature of the stage and a temperature control module for displaying the temperature of the stage and adjusting the refrigeration load of the semiconductor refrigerator. The first temperature sensor is connected to the temperature control module. According to the feedback temperature level, the temperature control module automatically adjusts the semiconductor refrigerator to achieve high-precision, high and low temperature control.

[0007] Further, it also includes a second temperature sensor and a temperature control module. The second temperature sensor is arranged on the upper and / or lower surface of the liquid cooling plate. The second temperature sensor is connected to the temperature control module for monitoring the temperature of the liquid cooling plate. The temperature adjustment of the liquid cooling plate is determined by the temperature and flow rate of the working medium input into the liquid cooling plate externally.

[0008] Furthermore, the leads of the temperature sensor and the thermoelectric cooler pass through the heat insulation material.

[0009] Furthermore, the stage, the heat insulation plate and the liquid cooling plate are fixedly connected by countersunk head screws arranged symmetrically, and the upper and lower surfaces of the temperature control device for the power device are flat without protruding or sunken structures.

[0010] Furthermore, the stage is made of a high thermal conductivity metal material.

[0011] Furthermore, heat-conducting grease or heat-conducting gaskets are evenly coated on the upper and lower surfaces of the thermoelectric cooler.

[0012] Furthermore, the heat insulation plate is one or more of heat insulation cotton, electrical bakelite, polytetrafluoroethylene plate, and polyurethane.

[0013] Furthermore, the first temperature sensor is a patch-type thermocouple or a thermal resistor.

[0014] Furthermore, the second temperature sensor is a patch-type thermocouple or a thermal resistor.

[0015] Furthermore, the types of the power devices are lasers, GaN HEMTs, GaAs PHEMTs, FETs, MOSFETs, etc.

[0016] Working principle: A thermoelectric cooler (TEC) uses the Peltier effect of semiconductor materials. Two different semiconductor materials (P-type and N-type) are used to form a PN junction. When direct current passes through the PN junction, electrons and holes in the two materials will have heat absorption and heat dissipation effects during the process of crossing the PN junction. Therefore, the PN junction will exhibit cooling and heating effects. By controlling the direction and magnitude of the current, the transfer of temperature can be controlled to complete the cooling, heating, and constant temperature processes of the chip. It has the advantages of small size and high temperature control accuracy. Liquid cooling uses a liquid working medium for heat dissipation, with high heat dissipation efficiency and high heat dissipation load characteristics. A composite cooling device can be prepared by combining a liquid cooling plate with a thermoelectric cooler to meet the applications of small size, high precision, and high heat dissipation.

[0017] Beneficial effects: Compared with the prior art, the present utility model has the following advantages: The present utility model combines two temperature control technologies of TEC and liquid cooling to construct a high-precision and high-heat dissipation temperature control device for power devices with a small size, which meets the temperature control requirements of power devices during testing and evaluation, and improves the efficiency and accuracy of testing and evaluation. The testing device of the present invention is convenient to install, simple to operate, and has versatility, and can meet the testing requirements of different specifications and types of chips. Description of the Drawings

[0018] Figure 1Schematic diagram of the overall structure of the present utility model Figure 1 ;

[0019] Figure 2 Schematic diagram of the overall structure of the present utility model Figure 2 ;

[0020] Figure 3 Schematic diagram of the fixing structure of the present utility model;

[0021] Figure 4 Schematic diagram of the layout position of the thermoelectric cooler of the present utility model;

[0022] Figure 5 Schematic diagram of the connection of the power-on and temperature acquisition system of the present utility model. Detailed implementation manners

[0023] The technical solutions of the present utility model will be further described below in conjunction with the accompanying drawings. A temperature control device for a power device of the present utility model is as Figure 1-2 shown, and includes a carrier table 1, a thermoelectric cooler 2, a heat insulation plate 3, a temperature sensor, a temperature control module, and a liquid cooling plate 4. Its overall shape can be square, circular or other shapes, and the structural dimensions can be flexibly adjusted according to the planar dimensions of the semiconductor device and the actual processing ability.

[0024] As Figure 3 shown, the device is symmetrically distributed with 4 screw holes and is fixed by countersunk head screws or other means. It is required that the upper and lower surfaces of the device are flat without protruding or sunken structures.

[0025] The material of the carrier table 1 can be a highly thermally conductive metal material such as aluminum alloy or red copper, and the structural dimensions can be customized according to requirements. In this implementation case, the structural dimensions of the carrier table are 120mm * 120mm * 10mm, and the material is hard aluminum alloy.

[0026] The power device can be a gallium nitride radio frequency device, a gallium arsenide radio frequency device, an LDMOS, a gallium nitride power electronic device, a SiC-based power electronic device, a semiconductor laser, etc.

[0027] As Figure 4 shown, the thermoelectric cooler 2 is embedded in the heat insulation plate 3. The number and specifications of the thermoelectric coolers 2 can be flexibly arranged in combination with the thermal power consumption level of the device. In this implementation case, 1 thermoelectric cooler 2 is adopted, and its planar dimensions are 40mm * 40mm. Thermal grease or a thermal pad is evenly coated on the upper and lower surfaces of the thermoelectric cooler 2 to reduce the contact thermal resistance.

[0028] The structure of the liquid cooling plate 4 can be customized in combination with the thermal power consumption level of the power device, and it is used to reduce the cold end temperature of the thermoelectric cooler 2 or to achieve efficient heat dissipation and stable temperature control of the device. In this implementation case, the structural dimensions of the liquid cooling plate 4 are 120mm * 120mm * 15mm.

[0029] As Figure 5 shown, a temperature sensor is arranged at the center position on the surface or inside of the stage 1. The type of the sensor can be a thermocouple or a thermal resistance, and there is a continuous temperature control module for the temperature sensor. The temperature control module displays the temperature of the stage 1 and is also used to adjust the refrigeration load of the semiconductor cooler 2. The number of temperature sensors for reflecting the temperature of the stage 1 can be one or more, and the positions can be arranged flexibly.

[0030] As Figure 5 shown, temperature sensors are arranged at the center positions on the upper and lower surfaces of the liquid cooling plate 4. The temperature sensors are connected to a temperature control instrument for displaying the temperature level of a specific area. The number of temperature sensors can be multiple, and the positions can be arranged flexibly.

[0031] The embodiments described above are for easy understanding of the present disclosure and are not used to limitatively interpret the present disclosure. The present disclosure can be changed or improved without departing from its gist, and its equivalents are also included in the present disclosure. That is, as long as the ways obtained by appropriately designing and changing the embodiments by those skilled in the art have the features of the present disclosure, they are also included in the scope of the present disclosure. The elements and their configurations, etc. possessed by the embodiments are not limited to the illustrated cases and can be changed appropriately.

Claims

1. A temperature control device for a power device, comprising a stage (1), characterized in that: It also comprises a semiconductor refrigerator (2), a heat insulation plate (3) and a liquid cooling plate (4), wherein the semiconductor refrigerator (2) is embedded in the middle of the heat insulation plate (3), the loading platform (1) is arranged above the heat insulation plate (3), and the liquid cooling plate (4) is arranged below the heat insulation plate (3).

2. A temperature control device for a power device according to claim 1, characterized in that: It also includes a first temperature sensor for reflecting the temperature of the loading platform and a temperature control module (5) for displaying the temperature of the loading platform and adjusting the cooling load of the semiconductor refrigerator. The first temperature sensor is connected to the temperature control module (5).

3. A temperature control device for a power device according to claim 1, characterized in that: It also includes a second temperature sensor and a temperature control module, wherein the second temperature sensor is arranged on the upper and / or lower surface of the liquid cooling plate (4), and the second temperature sensor is connected to the temperature control module for monitoring the temperature of the liquid cooling plate.

4. A temperature control device for a power device according to claim 1, characterized in that: The loading platform (1), the heat insulation plate (3) and the liquid cooling plate (4) are fixedly connected by countersunk screws arranged symmetrically, and the upper and lower surfaces of the temperature control device for the power device are flat and have no protruding or recessed structures.

5. The temperature control device for a power device according to claim 1, characterized in that: The object carrier (1) is made of a high thermal conductivity metal material.

6. A temperature control device for a power device according to claim 1, characterized in that: The upper and lower surfaces of the semiconductor refrigerator (2) are evenly coated with thermal grease or thermal gaskets.

7. The temperature control device for a power device according to claim 1, characterized in that: The heat insulation board (3) is one or more of heat insulation cotton, electrical bakelite, polytetrafluoroethylene board, and polyurethane.

8. A temperature control device for a power device according to claim 2, characterized in that: The first temperature sensor is a patch type thermocouple or a thermal resistor.

9. A temperature control device for a power device according to claim 3, characterized in that: The second temperature sensor is a patch type thermocouple or a thermal resistor.

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