Electronic component and electronic equipment

Abstract

The utility model discloses an electronic component and electronic equipment, and relates to the technical field of electronic devices, and the electronic component comprises a housing which is provided with a containing part and a target outer surface; the capacitor is located in the containing part and provided with at least one capacitor dielectric layer, and the plane where the capacitor dielectric layer is located is perpendicular to the target outer surface; a plurality of pins arranged on the outer surface of the target, wherein the pins are electrically connected with the capacitor; wherein the target outer surface is fixedly arranged relative to the circuit board, and is electrically connected with the circuit board based on the pins; under the condition that the capacitor is electrified, the capacitor dielectric layer can vibrate.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to an electronic component and an electronic device. Background Art

[0002] A capacitor is a basic electronic component widely used in electronic devices, and has many functions such as energy storage, energy release, filtering, smoothing, coupling, and bypass. The main structure of a capacitor includes two layers of electrodes and a capacitive dielectric layer located between the electrodes.

[0003] If there is a piezoelectric effect in the capacitive dielectric layer of the capacitor, when the capacitor is powered on, the capacitive dielectric layer will vibrate. If this vibration acts on the circuit board, it will drive the circuit board to vibrate, resulting in a howling problem caused by the vibration of the circuit board. Utility Model Content

[0004] In view of the above problems, this application provides an electronic component and an electronic device to solve the howling problem caused by the vibration of the circuit board due to the capacitor. The specific solutions are as follows:

[0005] In the first aspect of this application, an electronic component is provided, including:

[0006] A housing, which has a receiving portion and a target outer surface;

[0007] A capacitor located in the receiving portion, the capacitor having at least one capacitive dielectric layer, and the plane where the capacitive dielectric layer is located is perpendicular to the target outer surface;

[0008] A plurality of pins disposed on the target outer surface, the pins being electrically connected to the capacitor;

[0009] Wherein, the target outer surface is used for being fixedly arranged opposite to the circuit board and is electrically connected to the circuit board based on the pins; when the capacitor is charged, the capacitive dielectric layer can vibrate.

[0010] Optionally, in the above electronic component, the vibration direction of the capacitive dielectric layer is parallel to the target outer surface.

[0011] Optionally, in the above electronic component, an elastic buffer layer is further included between the capacitor and the target outer surface.

[0012] Optionally, in the above electronic component, it further includes:

[0013] An inductance coil disposed in the receiving portion;

[0014] The pins are electrically connected to the inductance coil.

[0015] Optionally, in the above electronic component, the receiving portion has opposite first and second side surfaces;

[0016] At least one capacitor is provided between the first side surface and the inductance coil; and / or, at least one capacitor is provided between the second side surface and the inductance coil.

[0017] Optionally, in the above-mentioned electronic component, the multiple pins at least include a first pin and a second pin;

[0018] A plurality of capacitors are provided in the accommodating portion;

[0019] The capacitor has a first terminal and a second terminal, the first terminal of each capacitor is electrically connected to the first pin, and the second terminal of each capacitor is electrically connected to the second pin.

[0020] Optionally, in the above-mentioned electronic component, a first electrode electrically connected to the first pin and a second electrode electrically connected to the first pin are provided in the accommodating portion; the first electrode and the second electrode are oppositely arranged in a direction perpendicular to the target outer surface;

[0021] The capacitor is located between the first electrode and the second electrode, the first terminal of each capacitor is electrically connected to the first pin through the first electrode, and the second terminal of each capacitor is electrically connected to the second pin through the second electrode.

[0022] Optionally, in the above-mentioned electronic component, the capacitor has alternately stacked first inner electrodes and second inner electrodes, and a capacitive dielectric layer is provided between the first inner electrode and the second inner electrode;

[0023] The capacitor has opposite first and second terminals on the outside, the first inner electrode is electrically connected to the first terminal, and the second inner electrode is electrically connected to the second terminal; the first terminal and the second terminal are respectively connected to different pins.

[0024] A second aspect of the present application provides an electronic device, including:

[0025] A circuit board;

[0026] An electronic component, the electronic component includes: a housing having an accommodating portion and a target outer surface; a capacitor located in the accommodating portion, the capacitor having at least one capacitive dielectric layer, and the plane where the capacitive dielectric layer is located is perpendicular to the target outer surface; a plurality of pins provided on the target outer surface, and the pins are electrically connected to the capacitor;

[0027] Wherein, the target outer surface is arranged parallel and opposite to the circuit board, and the target outer surface is relatively fixedly electrically connected to the circuit board based on the pins; when the capacitor is charged, the capacitive dielectric layer can vibrate.

[0028] Optionally, in the above-mentioned electronic device, the target outer surface and the circuit board are adhesively fixed based on an elastic adhesive layer. Description of the Drawings

[0029] To more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0030] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions under which the present application can be implemented. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present application.

[0031] Figure 1 It is a top view of an electronic component provided in an embodiment of the present application on a target outer surface;

[0032] Figure 2 It is Figure 1 a sectional view of the shown electronic component in the A - A' direction;

[0033] Figure 3 It is a sectional view of another electronic component in the A - A' direction;

[0034] Figure 4 It is a top view of another electronic component provided in an embodiment of the present application on a target outer surface;

[0035] Figure 5 It is Figure 4 a sectional view of the shown electronic component in the A - A' direction;

[0036] Figure 6 It is Figure 4 a sectional view of the shown electronic component in the B - B' direction;

[0037] Figure 7 It is a three - dimensional view of an electronic component provided in an embodiment of the present application;

[0038] Figure 8 It is a three - dimensional view of another electronic component provided in an embodiment of the present application;

[0039] Figure 9 It is a sectional view of a capacitor provided in an embodiment of the present application;

[0040] Figure 10 It is a top view of yet another electronic component provided in an embodiment of the present application on a target outer surface;

[0041] Figure 11A side view of an electronic device provided by an embodiment of the present application.

[0042] Reference numerals:

[0043] 11 - housing; 111 - accommodating portion; 112 - target outer surface; 113 - first side surface; 114 - second side surface; 12 - capacitor; 121 - capacitive dielectric layer; 122 - first terminal; 123 - second terminal; 124 - first internal electrode; 125 - second internal electrode; 13 - pin; 131 - first pin; 132 - second pin; 14 - elastic buffer layer; 15 - inductance coil; 16 - first electrode; 17 - second electrode; 18 - heat conducting member; 19 - circuit board; 20 - electronic component; 21 - elastic adhesive layer. Detailed implementation manners

[0044] Next, the embodiments in the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Those of ordinary skill in the art can know that with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0045] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application. The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, rather than to limit the present application.

[0046] As described in the background art, if there is a piezoelectric effect in the capacitive dielectric layer of the capacitor, when the capacitor is charged, the capacitive dielectric layer will vibrate. If this vibration acts on the circuit board, it will drive the circuit board to vibrate, resulting in a howling problem caused by the vibration of the circuit board.

[0047] Taking a ceramic capacitor as an example, the capacitive dielectric layer in the ceramic capacitor is a ceramic material. When the ceramic capacitor is charged, due to the piezoelectric effect, the capacitive dielectric layer will vibrate, and the vibration direction is perpendicular to the plane where the capacitive dielectric layer is located. In a conventional ceramic capacitor, the capacitive dielectric layer is disposed opposite to the mounting surface, that is, the capacitive dielectric layer is parallel to the mounting surface. Among them, the mounting surface is the outer surface of the ceramic capacitor used for fixedly connecting to the circuit board of the electronic device.

[0048] The inventors of the present application found that since the capacitive dielectric layer is disposed opposite to the mounting surface, if the capacitive dielectric layer vibrates, the vibration direction is perpendicular to the mounting surface, which will apply a vibration perpendicular to the circuit board, resulting in the circuit board vibrating and causing a howling problem due to the vibration.

[0049] To solve the problem of circuit board whistling caused by the vibration of the capacitor dielectric layer, one implementation method is to prevent the frequent switching of the capacitor voltage through a software control method, thereby preventing the vibration of the capacitor dielectric layer. This method requires complex software algorithms and increases the power consumption of the device.

[0050] In another implementation, a polymer organic semiconductor capacitor (POSCAP) can be used to solve the problem of circuit board whistling caused by the vibration of the capacitor dielectric layer. Based on the material characteristics of its capacitor dielectric layer, the POSCAP does not have a piezoelectric effect. When the capacitor is charged, the capacitor dielectric layer will not vibrate and deform, thus eliminating the problem of circuit board vibration caused by the vibration of the capacitor dielectric layer, and avoiding the whistling problem of the circuit board caused by vibration.

[0051] Although the POSCAP can better solve the problem of circuit board whistling caused by the capacitor, compared with ceramic capacitors, due to the use of polymer conductive materials in the POSCAP, the manufacturing cost of the POSCAP is relatively high. In addition, compared with the POSCAP, the ceramic capacitor can effectively reduce the equivalent resistance through the stacked structure of multiple capacitor dielectric layers.

[0052] Therefore, in the application scenarios of low cost and low equivalent resistance, the use of ceramic capacitors still has a large application demand. At this time, how to avoid the problem of circuit board whistling caused by capacitor vibration is an urgent problem to be solved.

[0053] To solve the above problems, an embodiment of the present application provides an electronic component, including:

[0054] A housing having a receiving portion and a target outer surface;

[0055] A capacitor located in the receiving portion, the capacitor having at least one layer of capacitor dielectric layer, and the plane where the capacitor dielectric layer is located is perpendicular to the target outer surface;

[0056] A plurality of pins disposed on the target outer surface, the pins being electrically connected to the capacitor;

[0057] Wherein, the target outer surface is used to be relatively fixedly arranged with the circuit board based on the pins and electrically connected to the circuit board based on the pins; when the capacitor is charged, the capacitor dielectric layer can vibrate.

[0058] In the embodiments of the present application, an electronic component has a housing, and the housing has a receiving portion and a target outer surface. A capacitor can be disposed within the receiving portion, and the capacitive dielectric layer of the capacitor can be perpendicular to the target outer surface. Since the capacitive dielectric layer of the capacitor is perpendicular to the target outer surface, when the capacitive dielectric layer is powered through pins in the capacitor, the vibration direction of the capacitive dielectric layer can be parallel to the target outer surface. Therefore, when the capacitor is fixedly disposed on the circuit board through the target outer surface, the vibration direction of the capacitive dielectric layer can be parallel to the plane where the circuit board is located, avoiding the problem of circuit board vibration caused by the vibration direction of the capacitive dielectric layer acting perpendicularly on the circuit board, and further avoiding the howling problem caused by the vibration of the circuit board.

[0059] The above is the core inventive concept of the technical solution of the present application. To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0060] Reference Figure 1 and Figure 2 , Figure 1 is a top view of an electronic component provided in an embodiment of the present application on a target outer surface, Figure 2 is Figure 1 a sectional view of the electronic component shown in the A-A' direction. The electronic component shown includes:

[0061] A housing 11, the housing 11 can have a receiving portion 111 and a target outer surface 112;

[0062] A capacitor 12 located in the receiving portion 111, the capacitor 12 can have at least one capacitive dielectric layer 121, and the plane where the capacitive dielectric layer 121 is located can be perpendicular to the target outer surface 112;

[0063] A plurality of pins 13 that can be disposed on the target outer surface, and the pins 13 can be electrically connected to the capacitor 12;

[0064] Among them, the target outer surface 112 is used to be relatively fixedly disposed with the circuit board based on the pins 13 and electrically connected to the circuit board based on the pins 13; when the capacitor 12 is charged, the capacitive dielectric layer 121 can vibrate. In the drawings of the embodiments of the present application, a two-way dashed arrow is used to represent the vibration direction of the capacitive dielectric layer 121.

[0065] Optionally, the electronic component can be fixedly connected to the circuit board by soldering through pin 13, or fixedly connected to the circuit board through anisotropic conductive adhesive. Since the capacitive dielectric layer 121 of the capacitor 12 is perpendicular to the target outer surface 112, when the capacitor 12 is powered on through pin 13 and vibrates, the vibration direction of the capacitive dielectric layer 121 can be parallel to the target outer surface 112. Therefore, when the capacitor 12 is fixedly arranged on the circuit board through the target outer surface 112, the vibration direction of the capacitive dielectric layer 121 can be parallel to the plane where the circuit board is located, avoiding the problem of circuit board vibration caused by the vibration direction of the capacitive dielectric layer 121 acting vertically on the circuit board, and further avoiding the howling problem caused by the vibration of the circuit board.

[0066] It should be noted that in the embodiments of the present application, two objects being parallel means that the two objects are parallel, or parallel within the error operation range. Two objects being perpendicular means that the two objects are perpendicular, or perpendicular within the error operation range. The target outer surface 112 can be a surface for relatively fixing with the circuit board, such as the bottom surface, side surface, top surface, etc. of the housing 11, which is not limited in the embodiments of the present application.

[0067] Optionally, one or more capacitors 12 can be arranged in the accommodating portion 111 of the housing 11, and the number of capacitors 12 in the housing 11 is not limited in the embodiments of the present application.

[0068] Among them, the housing 11 is used to encapsulate and protect the internal structural components, and can integrate multiple different structural components into one body, facilitating the circuit connection between the electronic component and the external circuit. Optionally, the housing 11 with the accommodating portion 111 can be pre-formed by processes such as injection molding, and then after the capacitor 12 is placed in the accommodating portion 111, the accommodating portion 111 is sealed. Or, simultaneously with the injection molding of the housing 11, the capacitor 12 and the pin 13 are integrally injection molded and embedded in the housing.

[0069] In the embodiments of the present application, the number of pins 13 is at least 2, so that the electronic component has a first pin 131 and a second pin 132, so that the two connection terminals of the two capacitors 12 of the electronic component can be respectively connected to the external circuit through a first pin 131 and a second pin 132 to form a current loop.

[0070] The number of pins 13 can be set based on requirements, and the number of pins 13 can be any positive integer not less than 2. If the number of pins 13 is greater than 2, all the pins 13 can be divided into two groups, each group having at least one pin, and the pins 13 in the same group are connected to the same wiring position of the external circuit, and a current loop can also be formed.

[0071] In the embodiment of the present application, when the area for pin layout on the surface of the housing 11 permits, the number of pins 13 can be increased to reduce the contact resistance between the pins 13 and the circuit board, and at the same time increase the heat dissipation area of the electronic component.

[0072] The number of pins 13 can be set according to requirements, and the embodiment of the present application does not limit the number of pins 13.

[0073] In the embodiment of the present application, the vibration direction of the capacitive dielectric layer 121 is parallel to the target outer surface 112. If the capacitive dielectric layer 121 vibrates, the vibration direction is perpendicular to the plane where the capacitive dielectric layer 121 is located. Since the capacitive dielectric layer 121 of the capacitor 12 is perpendicular to the target outer surface 112, if the capacitive dielectric layer 121 vibrates, the vibration direction is parallel to the target outer surface 112. Thus, it is possible to avoid the component of the vibration of the capacitive dielectric layer 121 perpendicular to the target outer surface 112, and thereby avoid the circuit board vibrating due to the vibration of the capacitive dielectric layer 121, and prevent the circuit board from generating a whistling problem due to vibration.

[0074] Optionally, the capacitor 12 can be a capacitor with piezoelectric effect. Taking a ceramic capacitor as an example, the capacitive dielectric layer 121 of the ceramic capacitor can be a ceramic dielectric layer. When the capacitor 12 is powered on, due to the piezoelectric effect of the ceramic material, the ceramic dielectric layer will vibrate. Based on the technical solution of the embodiment of the present application, the ceramic dielectric layer in the ceramic capacitor can be set perpendicular to the target outer surface 112, so as to prevent the vibration of the ceramic dielectric layer from acting vertically on the circuit board, and further prevent the circuit board from vibrating due to the vibration of the ceramic dielectric layer, and thus prevent the circuit board from generating a whistling problem due to vibration.

[0075] It should be noted that the capacitor 12 provided in the embodiment of the present application includes but is not limited to ceramic capacitors. Capacitors with a vibration property of the capacitive dielectric layer are within the scope of the capacitors in the embodiment of the present application, and the embodiment of the present application does not limit the type of the capacitor.

[0076] Reference Figure 3 , Figure 3 is a sectional view of another electronic component in the A-A' direction. On the basis of any of the above embodiments, Figure 3In the manner shown, the electronic component may further include: an elastic buffer layer 14 located between the capacitor 12 and the target outer surface 112. Theoretically, if the capacitive dielectric layer 121 is completely perpendicular to the target outer surface 112, the vibration direction of the capacitive dielectric layer 121 can be completely parallel to the target outer surface 112, thereby avoiding the vibration component of the capacitive dielectric layer 121 perpendicular to the target outer surface 112, and further completely avoiding the influence of the vibration of the capacitive dielectric layer 121 on the circuit board. However, in actual products, due to process errors, it is impossible to strictly ensure that the capacitive dielectric layer 121 is completely perpendicular to the target outer surface 112, and the capacitive dielectric layer 121 is perpendicular or approximately perpendicular to the target outer surface 112. Therefore, the capacitive dielectric layer 121 may have a vibration component perpendicular to the target outer surface 112.

[0077] In Figure 3 the manner shown, by providing an elastic buffer layer 14 between the capacitor 12 and the target outer surface 112, the downward force generated by the vibration of the capacitive dielectric layer 121 can be buffered, thereby reducing or preventing the circuit board vibration problem caused by the vibration component of the capacitive dielectric layer 121 perpendicular to the target outer surface 112. Optionally, the elastic buffer layer 14 may be an elastic glue layer. Further, in order to improve the thermal conductivity of the elastic buffer layer 14 so that heat can be conducted to the target outer surface 112 more quickly, the elastic buffer layer 14 may be provided as a thermally conductive silica gel.

[0078] In order to better buffer the vibration component perpendicular to the target outer surface 112, the elastic buffer layer 14 may be provided to completely fill the space between the capacitor 12 and the bottom of the accommodating portion 111. In the direction perpendicular to the target outer surface 112, the edge of the elastic buffer layer 14 may coincide with the edge of the capacitor 12, or the edge of the elastic buffer layer 14 may be set to extend beyond the edge of the capacitor 12.

[0079] Reference Figures 4 - 6 , Figure 4 is a top view of another electronic component provided by an embodiment of the present application on the target outer surface, Figure 5 is Figure 4 a sectional view of the electronic component shown in the A-A' direction, Figure 6 is Figure 4 a sectional view of the electronic component shown in the B-B' direction. In any of the above embodiments, Figure 3 the electronic component shown further includes: an inductance coil 15 disposed in the accommodating portion 111; the pin 13 is electrically connected to the inductance coil 15. Figure 4 In, the capacitor 12 located in the housing 11 is schematically shown by a dotted-line square, and the inductance coil 15 located in the housing 11 is schematically shown by a dotted-line circle.

[0080] Figure 4 and Figure 5In the shown manner, the capacitor 12 and the inductor coil 15 are integrated in the electronic component at the same time, which can realize the integrated integration of the capacitor 12 and the inductor coil 15, improve the integration degree, and further reduce the installation space of the inductor coil 15 and the capacitor 12 on the circuit board, facilitating the miniaturization design of the electronic device.

[0081] In an implementation manner of the embodiment of the present application, the accommodating part 111 has opposite first side surface 113 and second side surface 114; at least one capacitor 12 is provided between the first side surface 113 and the inductor coil 15; and / or, at least one capacitor 12 is arranged between the second side surface 114 and the inductor coil 15. In this way, the capacitor 12 can be arranged by using the space between the inductor coil 15 and the side surface of the housing 11, which can improve the integration degree.

[0082] Optionally, n capacitors 12 are provided between the first side surface 113 and the inductor coil 15, and n capacitors are arranged between the second side surface 114 and the inductor coil 15, where n is a positive integer; the n capacitors 12 of the inductor coil 15 facing the first side surface 113 and the n capacitors 12 of the inductor coil 15 facing the second side surface 114 are symmetrically arranged. In this implementation manner, n capacitors 12 are symmetrically arranged on both opposite sides of the inductor coil 15, which can cancel the vibration of the capacitor dielectric layer 121 in the capacitors 12 on both sides. When the electronic component is fixed on the circuit board, the electronic component can have better stability.

[0083] Reference Figure 7 , Figure 7 is a three-dimensional view of an electronic component provided by an embodiment of the present application. Combining the above-mentioned accompanying drawings of any implementation manner and Figure 7 as shown, in the electronic component in the manner shown in Figure 7 in order to clearly show the electrical connection relationship of the devices in the accommodating part 111, the housing 11 is subjected to a perspective treatment. In this way, the plurality of pins 13 at least include a first pin 131 and a second pin 132; a plurality of capacitors 12 are arranged in the accommodating part 111; the capacitor 12 has a first connection terminal 122 and a second connection terminal 123, and the first connection terminal 122 of each capacitor 12 is electrically connected to the first pin 131, and the second connection terminal 123 of each capacitor 12 is electrically connected to the second pin 132.

[0084] The capacitor 12 is a two-terminal electronic component with two connection terminals, which are the first connection terminal 122 and the second connection terminal 123 respectively. If the electronic component has a plurality of capacitors 12, the first connection terminal 122 of each capacitor 12 can be electrically connected to the first pin 131, and the second connection terminal 123 of each capacitor 12 can be electrically connected to the second pin 132, so that the capacitors 12 in the electronic component are in parallel, thereby increasing the capacitance value of the electronic component.

[0085] Optionally, as Figure 7 shown, a first electrode 16 electrically connected to the first pin 131 and a second electrode 17 electrically connected to the first pin 131 are provided in the accommodating portion 111; the first electrode 16 and the second electrode 17 are oppositely arranged in a direction perpendicular to the target outer surface 112; the capacitor 12 is located between the first electrode 16 and the second electrode 17, and the first connection terminals 122 of the capacitors 12 are electrically connected to the first pin 131 through the first electrode 16, and the second connection terminals 123 of the capacitors 12 are electrically connected to the second pin 132 through the second electrode 17.

[0086] The first electrode 16 and the second electrode 17 are relatively fixedly arranged in the accommodating portion 111. The first electrode 16 can be fixed to the bottom of the accommodating portion 111, and the second electrode 17 can be fixed to one side surface or the top surface of the accommodating portion 111 so that the second electrode 17 is located above the first electrode 16, and the capacitors 12 are fixed between the first electrode 16 and the second electrode 17. In this way, the first connection terminals 122 of the multiple capacitors 12 can be electrically connected to the first pin 131 through the same first electrode 16, and the second connection terminals 123 of the multiple capacitors 12 can be electrically connected to the second pin 132 through the same second electrode 17.

[0087] Referring to Figure 8 , Figure 8 a three-dimensional view of another electronic component provided by an embodiment of the present application, in combination with any one of the above-mentioned embodiment drawings and Figure 8 as shown, in the electronic component in the manner shown in Figure 8 , if the electronic component has an inductor coil 15, the inductor coil is located in the accommodating portion 111, and the capacitor 12 is located in the space between the inductor coil 15 and the side surface of the housing 11.

[0088] The connection direction of the first pin 131 and the second pin in the target outer surface 112 can be set as a first direction, and the first direction is the above-mentioned A-A' direction. The housing 11 has a first side surface 113 and a second side surface 114 opposite to each other in a second direction, the second direction is parallel to the target outer surface 112 and perpendicular to the first direction. In Figure 8 the manner shown, if the electronic component has multiple capacitors 12, the multiple capacitors 12 can be divided into two groups and respectively arranged on both sides of the inductor coil 15 in the second direction, so as to facilitate the electrical connection between the inductor coil 15 and the capacitors 12 and the pins 13, and facilitate the circuit interconnection of the internal devices of the electronic component.

[0089] In Figure 8In the manner shown, multiple capacitors 12 inside the housing 11 can be evenly divided into two groups and symmetrically arranged in the accommodating portion 111 of the housing 11. The two groups of capacitors 12 respectively correspond to a pair of first electrodes 16 and second electrodes 17, which can make the vibrations of the capacitance dielectric layers 121 in the capacitors 12 on both sides of the inductor coil 15 cancel each other out. When the electronic component is fixed on the circuit board, the electronic component can have better stability.

[0090] Based on any of the above embodiments, in another embodiment of the present application, the housing 11 has a third side surface and a fourth side surface opposite to each other in the first direction. It can be set that the first pin 131 has a first part located on the target outer surface 112 and a second part located on the third side surface. The first part and the second part of the first pin 131 are of an integral structure. In this way, the area of the first pin 131 can be increased, its impedance can be reduced, and the heat dissipation area can be increased. It can be set that the second pin 132 has a first part located on the target outer surface 112 and a second part located on the fourth side surface. The first part and the second part of the second pin 132 are of an integral structure. In this way, the area of the second pin 132 can be increased, its impedance can be reduced, and the heat dissipation area can be increased.

[0091] Reference Figure 9 , Figure 9 is a sectional view of a capacitor provided by an embodiment of the present application. The shown capacitor 12 includes: The capacitor 12 has alternately stacked first inner electrodes 124 and second inner electrodes 125, and there is a capacitance dielectric layer 121 between the first inner electrode 124 and the second inner electrode 125; there are opposite first connection terminals 122 and second connection terminals 123 outside the capacitor 12. The first inner electrode 124 is electrically connected to the first connection terminal 122, and the second inner electrode 125 is electrically connected to the second connection terminal 123; the first connection terminal 122 and the second connection terminal 123 are respectively connected to different pins 13. In the same capacitor 12, it can be set that the first connection terminal 122 is electrically connected to the first pin 131, and the second connection terminal 123 is electrically connected to the second pin 132.

[0092] In the capacitor 12, there are multiple capacitance dielectric layers 121, and there are first inner electrodes 124 and second inner electrodes 125 on both sides of any capacitance dielectric layer 121. In this way, the adjacent first inner electrode 124, second inner electrode 125 and the capacitance dielectric layer 121 therebetween can be constructed as a sub-capacitor, so that there are multiple sub-capacitors in the capacitor 12, and the number of sub-capacitors is the same as the number of capacitance dielectric layers 121. Since the first inner electrode 124 is electrically connected to the first connection terminal 122 and the second inner electrode 125 is electrically connected to the second connection terminal 123, the sub-capacitors in the same capacitor 12 can be connected in parallel, thereby increasing the capacitance value of the capacitor 12.

[0093] In other embodiments, the capacitor 12 may also have a first inner electrode 124, a second inner electrode 125, and a layer of capacitive dielectric layer 121 located therebetween.

[0094] Reference Figure 10 , Figure 10 is a top view of another electronic component provided by an embodiment of the present application on the target outer surface. Based on any of the above embodiments, Figure 10 the electronic component shown further includes: a heat conducting member 18 located on the target outer surface 112. On the target outer surface 112, the heat conducting member 18 is located between two opposite pins 13. The heat conducting member 18 can enable the heat inside the electronic component to be transferred to the outside of the housing 11 faster. After the electronic component is fixed on the circuit board, the heat inside the electronic component can be conducted downward faster through the heat conducting member 18, and can be quickly dissipated through the circuit board, improving the heat dissipation efficiency of the electronic component.

[0095] Optionally, the heat conducting member 18 is a metal member. The metal member not only has good heat conduction efficiency, improving the heat dissipation efficiency of the electronic component, but also can achieve electromagnetic isolation between the electronic component and the circuit board, preventing electromagnetic interference problems between the electronic component and the circuit board.

[0096] Based on the electronic component provided by the above embodiment, in another embodiment of the present application, an electronic device is further provided. The structure of the electronic device may be as Figure 11 shown.

[0097] Reference Figure 11 , Figure 11 is a side view of an electronic device provided by an embodiment of the present application. Combining the drawings shown in any of the above embodiments and Figure 11 shown, the electronic device includes: a circuit board 19; an electronic component 20, and the electronic component 20 may be the electronic component provided by any of the above embodiments. The electronic component 20 includes: a housing 11, the housing 11 having a receiving portion 111 and a target outer surface 112; a capacitor 12 located in the receiving portion 111, the capacitor 12 having at least one layer of capacitive dielectric layer 121, and the plane where the capacitive dielectric layer 121 is located is perpendicular to the target outer surface 112; a plurality of pins 13 provided on the target outer surface 112, and the pins 13 are electrically connected to the capacitor 12; wherein, the target outer surface 112 is disposed parallel and opposite to the circuit board 19, and the target outer surface 112 is relatively fixedly electrically connected to the circuit board 19 based on the pins 13.

[0098] The electronic device provided by the embodiment of the present application adopts the electronic component 20 provided by the above embodiment, which can make the plane where the capacitive dielectric layer 121 in the capacitor 12 is perpendicular to the plane shown by the circuit board 19, so as to avoid the vibration component of the capacitive dielectric layer 121 perpendicular to the circuit board 19, or reduce the vibration component applied by the capacitive dielectric layer 121 to the circuit board 19, thereby reducing or avoiding the vibration of the circuit board 19 caused by the vibration of the capacitive dielectric layer 121, and thus preventing the circuit board 19 from generating a whistling problem due to vibration.

[0099] Optionally, the electronic component 20 can be fixedly welded to the circuit board 19 through the pins 13. As Figure 11 shown, the target outer surface 112 and the circuit board 19 can be adhesively fixed based on the elastic adhesive layer 21. Through the elastic adhesive layer 21, not only can the fixing stability of the electronic component 20 on the surface of the circuit board 19 be improved, but also based on the elastic buffering characteristics of the elastic adhesive layer 21, the acting force caused by the vertical vibration component applied by the capacitive dielectric layer 121 on the circuit board 19 can be buffered, preventing the circuit board 19 from vibrating due to this acting force.

[0100] In addition, in the embodiment of the present application, the electronic component 20 can integrally integrate the capacitor 12 and the inductor coil 15, which can improve the integration degree, reduce the installation area of the electronic component 20, and also shorten the distance between the inductor coil 15 and the CPU / GPU on the circuit board 19, making the power supply path shorter and optimizing the power supply for the CPU / GPU.

[0101] The various embodiments in the specification of the present application are described in a progressive, or parallel, or a combination of progressive and parallel manners. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. The embodiments provided by the embodiments of the present application can be combined with each other without conflict.

[0102] It should be noted that in the description of the present application, it should be understood that the descriptions of the drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structures. Additionally, for the sake of understanding and easy description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. At the same time, it can be understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element can be directly on the other element or there can be intermediate elements. Additionally, "on..." means positioning the element on or below another element, but essentially does not mean positioning on the upper side of another element according to the direction of gravity.

[0103] The orientation or positional relationship indicated by terms such as "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present at the same time.

[0104] It should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the article or device comprising the above elements.

[0105] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic component, characterized in that: include: a housing having a receiving portion and a target outer surface; A capacitor located in the receiving portion, the capacitor having at least one capacitor dielectric layer, and a plane where the capacitor dielectric layer is located is perpendicular to the outer surface of the target; a plurality of pins disposed on the outer surface of the target, the pins being electrically connected to the capacitor; The target outer surface is used to be fixedly arranged relative to the circuit board, and is electrically connected to the circuit board based on the pins; when the capacitor is charged, the capacitor dielectric layer can vibrate.

2. The electronic component according to claim 1, characterized in that The vibration direction of the capacitor dielectric layer is parallel to the outer surface of the target.

3. The electronic component according to claim 1, characterized in that Also included is an elastic buffer layer located between the capacitor and the target outer surface.

4. The electronic component according to claim 1, characterized in that Also includes: an inductor coil disposed in the housing; The pin is electrically connected to the inductor.

5. The electronic component according to claim 4, characterized in that: The receiving portion has a first side surface and a second side surface opposite to each other; At least one capacitor is disposed between the first side surface and the inductor coil; and / or at least one capacitor is disposed between the second side surface and the inductor coil.

6. The electronic component according to any one of claims 1 to 5, characterized in that: The plurality of pins include at least a first pin and a second pin; A plurality of capacitors are arranged in the accommodation portion; The capacitor has a first terminal and a second terminal. The first terminal of each capacitor is electrically connected to the first pin, and the second terminal of each capacitor is electrically connected to the second pin.

7. The electronic component according to claim 6, characterized in that: A first electrode electrically connected to the first pin and a second electrode electrically connected to the first pin are arranged in the accommodation portion; the first electrode and the second electrode are arranged opposite to each other in a direction perpendicular to the outer surface of the target; The capacitor is located between the first electrode and the second electrode, the first terminal of each capacitor is electrically connected to the first pin through the first electrode, and the second terminal of each capacitor is electrically connected to the second pin through the second electrode.

8. The electronic component according to claim 1, characterized in that: The capacitor comprises first inner electrodes and second inner electrodes which are alternately stacked, and the capacitor dielectric layer is disposed between the first inner electrodes and the second inner electrodes; The capacitor has a first terminal and a second terminal opposite to each other on the outside, the first inner electrode is electrically connected to the first terminal, and the second inner electrode is electrically connected to the second terminal; the first terminal and the second terminal are respectively connected to different pins.

9. An electronic device, characterized in that: include: Circuit boards; An electronic component, the electronic component comprising: a housing, the housing having a receiving portion and a target outer surface; a capacitor located in the receiving portion, the capacitor having at least one capacitor dielectric layer, the plane where the capacitor dielectric layer is located is perpendicular to the target outer surface; a plurality of pins arranged on the target outer surface, the pins being electrically connected to the capacitor; The target outer surface is arranged parallel to and opposite to the circuit board, and the target outer surface is relatively fixedly electrically connected to the circuit board based on the pins; when the capacitor is charged, the capacitor dielectric layer can vibrate.

10. The electronic device according to claim 9, characterized in that: The target outer surface and the circuit board are bonded and fixed based on an elastic adhesive layer.

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