Solder ball heating and flattening mechanism

Abstract

The utility model discloses a solder ball heating and flattening mechanism which comprises a hot pressing mold frame, a hot pressing driving device, a lifting middle plate, an upper heat insulation plate, an upper heating plate, an upper pressing head, a gyroscope, a lower heat insulation plate, a lower heating plate and a lower pressing head. An output shaft of the hot-pressing driving device penetrates through a mold frame top plate of the hot-pressing mold frame to be in transmission connection with the lifting middle plate and can drive the lifting middle plate to move up and down, the upper heat insulation plate, the upper heating plate and the upper pressing head are sequentially installed at the bottom of the lifting middle plate, and the gyroscope, the lower heat insulation plate, the lower heating plate and the lower pressing head are sequentially installed on a mold frame bottom plate of the hot-pressing mold frame. According to the utility model, the solder balls on the IC carrier plate can be subjected to automatic hot-pressing leveling operation, the production efficiency is high, and the hot-pressing driving device can be matched with a high-precision gyroscope to work, so that the leveling precision is ensured, the yield is improved, and the production cost is reduced. In addition, a high-power four-column type servo electric cylinder is adopted, the action is stable, and the pressure is constant and adjustable.

Description

Technical Field

[0001] The utility model relates to the technical field of IC carrier plate processing equipment, and more specifically, to a tin ball heating and flattening mechanism. Background Art

[0002] IC carrier plates are a technology developed with the continuous progress of semiconductor packaging technology. In the field of high-end packaging, IC carrier plates not only provide support, heat dissipation, and protection for chips, but also provide electrical connections between chips and PCB motherboards, playing a "linking" role. They can even embed passive and active devices to achieve certain system functions. With the rapid development of new packaging technologies such as BGA, CSP, and FC, higher requirements have been put forward for aspects such as line width, line pitch, and through holes of packaging substrates. The previous mid- to low-end wire bonding type carrier plates have gradually been replaced by high-end flip chip type substrates, and thus the development has changed from wire bonding to the direct-through tin ball method. The diameter of tin balls has also developed from more than 100 microns to the current 40 - 60 microns, with a high-precision development of ball pitch of 60 - 80 microns. In order to ensure reliable conduction of each IO between the chip and the carrier plate during packaging and prevent communication between adjacent IOs, higher requirements are placed on the overall flatness and height of the tin balls on the chip and the carrier plate after ball implantation. However, the existing tin ball leveling methods, such as the Chinese Taiwan patent number I223373, usually involve the flip chip carrier plate first passing through a reflow oven process to form tin ball bumps, and then using a metal weight to apply a pressure of nearly 1500 kilograms on the flip chip carrier plate to flatten the tin ball bumps. However, this method is prone to damaging the flip chip carrier plate during the pressure application process, and cannot guarantee the precision requirements, resulting in a high production process scrap rate, low yield, and high cost. Summary of the Utility Model

[0003] The purpose of the utility model is to overcome the above-mentioned defects in the prior art and provide a tin ball heating and flattening mechanism that can perform automatic thermal pressing and leveling operations on the tin balls on the IC carrier plate, ensure the flattening precision, improve production efficiency and product yield, and reduce production costs.

[0004] To achieve the above purpose, the utility model provides a tin ball heating and flattening mechanism, which includes a hot pressing die carrier, a hot pressing driving device, a lifting middle plate, an upper heat insulation plate, an upper heating plate, an upper pressing head, a gyroscope, a lower heat insulation plate, a lower heating plate, and a lower pressing head. The hot pressing driving device is installed on the die carrier top plate of the hot pressing die carrier. The output shaft of the hot pressing driving device passes through the die carrier top plate of the hot pressing die carrier and is in transmission connection with the lifting middle plate and can drive it to move up and down. The upper heat insulation plate is installed at the bottom of the lifting middle plate. The upper heating plate is installed at the bottom of the upper heat insulation plate. The upper pressing head is installed at the bottom of the upper heating plate. The gyroscope is installed on the die carrier bottom plate of the hot pressing die carrier. The lower heat insulation plate is installed on the top of the gyroscope. The lower heating plate is installed on the top of the lower heat insulation plate. The lower pressing head is installed on the top of the lower heating plate and is located below the upper pressing head.

[0005] Preferably, the hot pressing driving device is arranged as a hot pressing driving electric cylinder.

[0006] Preferably, four bushings are provided on the top plate of the hot pressing die holder. Guide columns are respectively provided on each bushing. The lower ends of each guide column are respectively connected to the lifting middle plate. The upper ends of each guide column respectively pass through the bushings upward, and the upper ends of each guide column are respectively connected to a square guide column linkage bracket.

[0007] Preferably, the upper punch is installed at the bottom of the upper heating plate through upper punch fixing devices located on both sides thereof. The upper punch fixing devices include an upper punch fixing driving cylinder, a cylinder heat insulation seat, a connecting rod, a connecting rod mounting bracket and an upper punch fixing positioning block. The upper punch fixing driving cylinder and the connecting rod mounting bracket are respectively installed at the bottom of the lifting middle plate. The upper punch fixing driving cylinder is connected to one end of the connecting rod through the cylinder heat insulation seat. The other end of the connecting rod passes through the through hole of the connecting rod mounting bracket and is connected to the upper punch fixing positioning block. The upper punch fixing positioning block can contact the bottom side part of the upper punch, so as to position the upper punch.

[0008] Preferably, lower punch limiting seats are provided on the top of the lower heating plate on both sides of the lower punch. Lower punch convex columns are respectively provided on both side surfaces of the lower punch. The two lower punch convex columns are respectively inserted into the limiting grooves of the lower punch limiting seats. Bead screws arranged longitudinally are respectively provided on each lower punch limiting seat. The lower end of the bead screw can extend into the limiting groove of the lower punch limiting seat and limit the corresponding lower punch convex column.

[0009] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0010] 1. The structure of the present utility model is reasonably designed, and is provided with a hot pressing die holder, a hot pressing driving device, a lifting middle plate, an upper heat insulation plate, an upper heating plate, an upper punch, a gyroscope, a lower heat insulation plate, a lower heating plate and a lower punch. It can perform automatic hot pressing and leveling operations on the solder balls on the IC carrier board, with high production efficiency. And the hot pressing driving device can cooperate with the high-precision gyroscope to work, ensuring the pressing flatness accuracy, improving the qualified rate and reducing the production cost.

[0011] 2. The present utility model adopts a high-power four-column type servo electric cylinder, with stable action and adjustable and uniform pressure.

[0012] 3. The punch die of the present utility model adopts high-strength special die steel, with extremely small deformation amount under high temperature conditions. Description of the Drawings

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 is a schematic structural diagram of a solder ball heating and flattening mechanism;

[0015] Figure 2 is a schematic structural diagram of the mold base part of the solder ball heating and flattening mechanism;

[0016] Figure 3 is a schematic structural diagram of the upper mold part of the solder ball heating and flattening mechanism;

[0017] Figure 4 is a schematic structural diagram of the lower mold part of the solder ball heating and flattening mechanism. Specific Embodiments

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0019] Please refer to Figure 1 , an embodiment of the present invention provides a solder ball heating and flattening mechanism, including a hot pressing mold base 71, a hot pressing driving device 72, a lifting middle plate 73, an upper heat insulation plate 74, an upper heating plate 75, an upper pressing head 76, a gyroscope 77, a lower heat insulation plate 78, a lower heating plate 79, and a lower pressing head 710. The hot pressing driving device 72 is installed on the mold base top plate 711 of the hot pressing mold base 71. The output shaft of the hot pressing driving device 72 passes through the mold base top plate 711 of the hot pressing mold base 71 and is in transmission connection with the lifting middle plate 73 and can drive it to move up and down. The upper heat insulation plate 74 is installed at the bottom of the lifting middle plate 73. The upper heating plate 75 is installed at the bottom of the upper heat insulation plate 74. The upper pressing head 76 is installed at the bottom of the upper heating plate 75. The gyroscope 77 is installed on the mold base bottom plate 712 of the hot pressing mold base 71. The lower heat insulation plate 78 is installed on the top of the gyroscope 77. The lower heating plate 79 is installed on the top of the lower heat insulation plate 78. The lower pressing head 710 is installed on the top of the lower heating plate 79 and is located below the upper pressing head 76.

[0020] The following will detail each component of this embodiment with reference to the drawings.

[0021] In this embodiment, the hot pressing driving device 72 can preferably be set as a hot pressing driving electric cylinder with a stroke. The gyroscope 77 can preferably be set as an air gyro calibrator.

[0022] As Figure 1 and Figure 2 shown, four bushings 713 can be provided on the die holder top plate 711 of the hot pressing die holder 71. Guide posts 714 are respectively provided on each bushing 713. The lower ends of each guide post 714 are respectively connected to the lifting middle plate 73. The upper ends of each guide post 714 respectively pass through the bushing 713 upward, and the upper ends of each guide post 714 are respectively connected to a square guide post linkage bracket 715.

[0023] As Figure 3 shown, the upper punch 76 can be installed at the bottom of the upper heating plate 75 through the upper punch fixing devices 715 located on both sides thereof. The upper punch fixing device 715 can include an upper punch fixing driving cylinder 7151, a cylinder heat insulation seat 7152, a connecting rod 7153, a connecting rod mounting bracket 7154, and an upper punch positioning and fixing block 7155. The upper punch fixing driving cylinder 7151 and the connecting rod mounting bracket 7154 are respectively installed at the bottom of the lifting middle plate 73. The upper punch fixing driving cylinder 7151 is connected to one end of the connecting rod 7153 through the cylinder heat insulation seat 7152. The other end of the connecting rod 7153 passes through the through hole of the connecting rod mounting bracket 7154 and is connected to the upper punch positioning and fixing block 7155. The upper punch positioning and fixing block 7155 can be in contact with the bottom side part of the upper punch 76, so as to position the upper punch 76.

[0024] In this embodiment, the upper punch 76 is fixed by the upper punch fixing device 715, which can facilitate the installation, fixing, replacement and maintenance of the upper punch.

[0025] As Figure 4 shown, lower punch limit seats 716 located on both sides of the lower punch 710 are provided on the top of the lower heating plate 79. Lower punch convex columns 7101 are respectively provided on both side surfaces of the lower punch 710. The two lower punch convex columns 7101 are respectively inserted into the limit grooves of the lower punch limit seats 716. Longitudinal ball screws 717 are respectively provided on each lower punch limit seat 716. The lower end of the ball screw 717 can extend into the limit groove of the lower punch limit seat 716 and limit the corresponding lower punch convex column 7101.

[0026] The working principle of the present utility model is as follows:

[0027] After the IC carrier is transferred, the hot pressing driving device 72 can drive the upper punch 76 to move downward, and the upper punch 76 can cooperate with the lower punch 710 to perform a hot pressing and leveling operation on the solder balls at the target position.

[0028] The utility model has the following advantages:

[0029] 1. The solder ball heating and flattening mechanism can automatically perform hot pressing and leveling operations on the solder balls on the IC carrier board, with high production efficiency. Moreover, the hot pressing drive device can cooperate with a high-precision gyroscope to ensure the flattening accuracy, improve the yield rate, and reduce the production cost.

[0030] 2. The solder ball heating and flattening mechanism adopts a high-power four-column servo electric cylinder, with stable operation and adjustable and uniform pressure.

[0031] 3. The indenter die is made of high-strength special die steel, with extremely small deformation at high temperatures.

[0032] 4. Controlled by a servo system, it realizes accurate opening and closing width and smooth operation.

[0033] 5. The flattening pressure is constantly controlled, and the flattening work is completed by the synchronous heating of the upper and lower temperature zones.

[0034] The above embodiments are the preferred embodiments of the utility model, but the embodiments of the utility model are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the utility model shall be equivalent replacement methods and are all included in the protection scope of the utility model.

Claims

1. A solder ball heating and flattening mechanism, characterized in that: It includes a hot pressing mold frame, a hot pressing drive device, a lifting middle plate, an upper heat insulation plate, an upper heating plate, an upper pressure head, a gyroscope, a lower heat insulation plate, a lower heating plate and a lower pressure head. The hot pressing drive device is installed on the mold frame top plate of the hot pressing mold frame, and the output shaft of the hot pressing drive device passes through the mold frame top plate of the hot pressing mold frame and is transmission-connected with the lifting middle plate and can drive it to move up and down. The upper heat insulation plate is installed at the bottom of the lifting middle plate, the upper heating plate is installed at the bottom of the upper heat insulation plate, the upper pressure head is installed at the bottom of the upper heating plate, the gyroscope is installed on the mold frame bottom plate of the hot pressing mold frame, the lower heat insulation plate is installed on the top of the gyroscope, the lower heating plate is installed on the top of the lower heat insulation plate, and the lower pressure head is installed on the top of the lower heating plate and is located below the upper pressure head.

2. The solder ball heating and flattening mechanism according to claim 1, characterized in that: The hot pressing driving device is configured as a hot pressing driving electric cylinder.

3. The solder ball heating and flattening mechanism according to claim 1, characterized in that: Four bushings are arranged on the mold frame top plate of the hot pressing mold frame, each bushing is provided with a guide column, the lower end of each guide column is connected to the lifting middle plate, the upper end of each guide column passes through the bushing upward, and the upper end of each guide column is connected to the square guide column linkage bracket.

4. The solder ball heating and flattening mechanism according to claim 1, characterized in that: The upper pressure head is installed on the bottom of the upper heating plate through the upper pressure head fixing devices located on both sides thereof, and the upper pressure head fixing device includes an upper pressure head fixing driving cylinder, a cylinder insulation seat, a connecting rod, a connecting rod mounting bracket and an upper pressure head fixing positioning block. The upper pressure head fixing driving cylinder and the connecting rod mounting bracket are respectively installed on the bottom of the lifting middle plate, and the upper pressure head fixing driving cylinder is connected to one end of the connecting rod through the cylinder insulation seat, and the other end of the connecting rod is connected to the upper pressure head fixing positioning block after passing through the through hole of the connecting rod mounting bracket, and the upper pressure head fixing positioning block can contact the bottom side of the upper pressure head, thereby positioning the upper pressure head.

5. The solder ball heating and flattening mechanism according to claim 1, characterized in that: A lower pressure head limit seat located on both sides of the lower pressure head is provided on the top of the lower heating plate, and lower pressure head bosses are respectively provided on the two side surfaces of the lower pressure head, and the two lower pressure head bosses are respectively inserted into the limit grooves of the lower pressure head limit seat, and each lower pressure head limit seat is respectively provided with a longitudinally arranged ball screw, and the lower end of the ball screw can extend into the limit groove of the lower pressure head limit seat and limit the corresponding lower pressure head boss.

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