Package structure
By setting a retaining wall structure in the packaging structure of the wearable device to prevent the overflow of the primer layer, combined with the cladding design of the silicone layer, the problem of difficulty in combining silicone with flexible substrate and high risk of overflow of the primer is solved, and product reliability and process stability are improved.
Patent Information
- Application Number
- CN202421547343.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-02
AI Technical Summary
In existing wearable devices, silicone and flexible substrates are not easy to combine, resulting in peeling and reducing product reliability. At the same time, primer overflow risk is high, affecting process stability and cost.
A package structure is designed including a flexible substrate, primer layer, pad and retaining wall structure that blocks the primer layer extending to the component setting area, reducing overflow risk, and enhancing bonding by coating the silicone layer.
It effectively avoids the primer layer overflow to the component setting area, improves product yield and process stability, reduces process waste and cost, and improves process efficiency.
Smart Images
Figure CN222914806U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and more particularly, to a packaging structure. Background Art
[0002] In recent years, with the rapid development of the Internet of Things (IoT), mobile communication devices, and micro sensors, it can be found that all electronic products pursue being thin, light, short, and small. However, this has led to an abrupt increase in risks in certain manufacturing processes. In addition, with the rise of wearable devices, in addition to the increasing demand for various biometric detection and sensing devices, the size also needs to be thin, light, short, and small to meet market expectations. Therefore, integrating biometric detection elements (Bio sensors) into a single packaging structure to meet this requirement. Coupled with the fact that most current products are processed in irregular forms, the manufacturing technology has increased.
[0003] For example, referring to Figure 1A , in order to conform to ergonomics, wearable products need to use a flexible substrate 10 as the bottom plate, and supplemented with conductive silicone 20 as the encapsulation material to make contact with the human body. The silicone 20 has a contact surface for contacting the human body, and transmits the biological signal back to the detection element near the flexible substrate 10 side. For example, one of the electronic components 30 can be a detection element. The problem of such a device in practical applications is that the combination of the silicone 20 and the flexible substrate 10 is not easy, and there is often a peeling phenomenon, resulting in a reduction in the reliability of the product. Therefore, a primer 25 is provided in the product to increase the bonding force between the conductive silicone 20 and the flexible substrate 10. However, such a setting needs to avoid the primer 25 from contaminating the upper part of the pad 32, otherwise it will be difficult to form the wire bonding 34, and electrical problems are likely to occur. If processes such as spray coating or underfill are used to form the primer 25, there is a risk of overflow, etc. Therefore, it is hoped that selective spraying or selective underfill processes can be carried out in a limited space, and the technical limits and manufacturing costs of current manufacturers must be overcome in the manufacturing process.
[0004] As Figure 1B shown, a tape 50 is usually used for physical isolation so that the pad 32 does not contact the primer. However, the method of using the tape 50 has several disadvantages. For example, it generates manufacturing waste, that is, the waste tape; the manufacturing process requires a high-temperature process, so the tape needs to have high heat resistance. However, the cost of tapes that are not heat-resistant is high; the step of tearing and pasting the tape needs to be added, and then single-piece spraying is carried out, resulting in a long manufacturing station and time. Therefore, there is still room for improvement in the above problems in the prior art. Summary of the Utility Model
[0005] In view of the above problems, the present application proposes a packaging structure, which can reduce the risk of primer layer overflow and cost, thereby improving the product yield and the stability of the product manufacturing process.
[0006] The technical solution of the present application is implemented as follows:
[0007] According to one aspect of the present application, there is provided a packaging structure, which includes: a flexible substrate, which is divided into a signal receiving area and a component setting area; a primer layer, which is disposed on the signal receiving area of the flexible substrate; a solder pad, which is disposed in the component setting area of the flexible substrate; a dam structure, which is disposed at the edge of the signal receiving area and is used to block the primer layer from extending to the component setting area; and a silicone layer, which covers the flexible substrate, the primer layer and the dam structure.
[0008] In some embodiments, the height of the dam structure is greater than the height of the solder pad.
[0009] In some embodiments, the height of the dam structure is greater than the height of the primer layer.
[0010] In some embodiments, the dam structure is a solder mask layer.
[0011] In some embodiments, the primer layer is a conductive material, and the silicone layer is a conductive material.
[0012] In some embodiments, the top surface of the silicone layer contacts the human body.
[0013] In some embodiments, the component setting area is disposed between the signal receiving areas.
[0014] In some embodiments, the projections of the solder pad and the primer layer in the vertical direction do not overlap.
[0015] In some embodiments, the packaging structure further includes an electronic component, and the electronic component is electrically connected to the solder pad.
[0016] In some embodiments, the dam structure laterally surrounds the component setting area.
[0017] In the above technical solution, by setting the dam structure, the primer layer can be blocked outside the dam structure, avoiding the problem that the primer layer extends into the component setting area due to overflow, and ensuring that the primer layer is blocked outside the component setting area, thereby improving the product yield and the stability of the product manufacturing process. In addition, compared with the method of using tape in the prior art, the present application can: reduce process waste by setting the dam structure, achieving the effect of sustainable development; reduce costs, and the dam structure can be reused; and also reduce the stations for tearing and pasting tape, greatly reducing the process time and increasing the process efficiency. Description of the Drawings
[0018] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0019] Figure 1A is a schematic cross-sectional structure diagram of a packaging structure in the prior art.
[0020] Figure 1B is a schematic cross-sectional structure diagram of using a tape to isolate pads in the prior art.
[0021] Figure 2 is a schematic cross-sectional view at an intermediate stage of forming a packaging structure using a dam structure according to an embodiment of the present application.
[0022] Figure 3 is a schematic cross-sectional view of a packaging structure according to an embodiment of the present application formed using a dam structure.
[0023] Figure 4 is a top view schematic diagram of a packaging structure according to an embodiment of the present application.
[0024] Figure 5 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present application.
[0025] Figure 6A and Figure 6B is a schematic cross-sectional view at an intermediate stage of forming a packaging structure using a dam structure according to another embodiment of the present application.
[0026] Figure 7 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present application formed using a dam structure. Detailed implementation manners
[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.
[0028] The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present utility model. Of course, these are only examples and are not intended to limit the present utility model. For example, in the following description, forming the first component above or on the second component may include embodiments where the first component and the second component are in direct contact, and may also include embodiments where additional components are formed between the first component and the second component such that the first component and the second component may not be in direct contact. Moreover, the present utility model may repeat reference numerals and / or letters in various examples. Such repetition is only for the sake of brevity and clarity and does not itself indicate a relationship between the various embodiments and / or configurations discussed.
[0029] In addition, without conflict, the embodiments in this application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.
[0030] From the problems in the prior art, a method for forming a packaging structure to avoid primer overflow is needed. Figure 2 is a cross-sectional schematic view at an intermediate stage of forming a packaging structure using a dam structure according to an embodiment of the present application. Figure 3 is a cross-sectional schematic view of a packaging structure according to an embodiment of the present application formed using a dam structure.
[0031] First, refer to Figure 2 As shown, a flexible substrate 110 is provided. The flexible substrate 110 may include a component setting area 112, and the component setting area 112 may include at least one pad 104, and the pad 104 can be used to electrically connect to electronic components in the component setting area 112 in a subsequent stage.
[0032] A dam structure 130 is provided at the edge 112e of the component setting area 112 and outside the component setting area 112. After the dam structure 130 is provided, a primer layer 150 is formed outside the component setting area 112 of the flexible substrate 110, specifically, the primer layer 150 is formed on the outer side of the dam structure 130 facing away from the component setting area 112. In some embodiments, the primer layer 150 can be formed through the following steps: printing a flowable primer on the flexible substrate 110 outside the component setting area 112; curing the primer through a high-temperature process to form the primer layer 150.
[0033] By providing the dam structure 130, the primer layer 150 can be blocked outside the dam structure 130. By providing the dam structure 130 for shielding, it is possible to avoid the primer layer 150 from overflowing into the component setting area 112 and block the primer layer 150 outside the component setting area 112.
[0034] Refer toFigure 3 As shown, the electronic component 170 is disposed in the component setting area 112 of the flexible substrate 110. In this embodiment, the active surface 170a of the electronic component 170 faces away from the flexible substrate 110, and the active surface 170a can be connected to the corresponding pad 104 via wire bonding 172. Then, a silicone layer 180 is formed above the flexible substrate 110, and the silicone layer 180 can cover the flexible substrate 110, the primer layer 150, and the dam structure 130, and can also cover each electronic component 170. Thus, the packaging structure 100 provided by the present application is formed.
[0035] In the design process of the packaging structure 100, the following steps can be included: reserving an area for setting the dam structure 130 in the design of the flexible substrate 110, for example, an area for setting the dam structure 130 can be set by the flexible substrate manufacturer when manufacturing the flexible substrate 110; performing a printed copper board design for the position to be sprayed.
[0036] Continue to refer to Figure 3 As shown, the packaging structure 100 provided by the present application can include: a flexible substrate 110, a dam structure 130, a primer layer 150, and a silicone layer 180. The flexible substrate 110 has a component setting area 112. Figure 3 The structure on the component setting area 112 shown is only an example. The component setting area 112 can be an area with any appropriate structure that does not require the primer layer 150 to be set. The dam structure 130 is disposed at the edge 112e of the component setting area 112 to block the primer layer 150 from entering the component setting area 112. The primer layer 150 is adjacent to the dam structure 130 and extends on the flexible substrate 110 outside the component setting area 112. The silicone layer 180 is located above the component setting area 112 of the flexible substrate 110 and on the primer layer 150 and the dam structure 130 to cover the flexible substrate 110, the primer layer 150, and the dam structure 130.
[0037] In the above packaging structure 100, by providing the dam structure 130, the primer layer 150 can be blocked outside the dam structure 130, avoiding the problem that the primer layer 150 extends into the component setting area 112 due to overflow. It can ensure that the primer layer 150 is blocked outside the component setting area 112, thereby improving the product yield and the stability of the product manufacturing process. In addition, compared with the method of using tape in the prior art, the present application can reduce the use of tape and reduce process waste by providing the dam structure 130, achieving the effect of sustainable development; changing the tape to the dam structure 130 can reduce costs, and the dam structure 130 can be reused, which can further reduce costs; after changing the tape to the dam structure 130, it can perform full-surface material printing like SMT (Surface Mounted Technology), and can also reduce the stations for tearing and pasting the tape, which will greatly reduce the process time and increase the process efficiency.
[0038] The solder pad 104 is disposed in the component setting area 112 of the flexible substrate 110. In this embodiment, the solder pad 104 is connected to the electronic component 170 in the component setting area 112 through a wire bond 172. Since the dam structure 130 is provided, the primer layer 150 is blocked outside the component setting area 112, so that the primer layer 150 will not contaminate the solder pad 104. That is to say, the projections of the solder pad 104 and the primer layer 150 in the vertical direction Z do not overlap. This avoids the problem that the primer layer 150 contaminates the solder pad 104, resulting in difficult or poor bonding of the solder pad 104 (such as bonding with the wire bond 172).
[0039] The flexible substrate 110 of the packaging structure 100 may further include a signal receiving area 114 other than the component setting area 112. The signal receiving area 114 and the component setting area 112 may have a common edge 112e. The component setting area 112 may be disposed between the signal receiving areas 114. The dam structure 130 may be provided at the edge 112e and is used to block the primer layer 150 from extending into the component setting area 112. The primer layer 150 is disposed on the signal receiving area 114 of the flexible substrate 110.
[0040] In this embodiment, the side wall 130S1 of the dam structure 130 faces the component setting area 112, and the side wall 130S1 is adjacent to the edge 112e of the component setting area 112. In other words, the side wall 130S1 of the dam structure 130 is vertically aligned with the edge 112e of the component setting area 112 in the vertical direction Z, and the dam structure 130 is located outside the component setting area 112. However, in other embodiments, the side wall 130S2 of the dam structure 130 facing away from the component setting area 112 may be adjacent to the edge 112e of the component setting area 112, and the dam structure 130 is located inside the component setting area 112. Alternatively, the dam structure 130 may cover the edge 112e of the component setting area 112.
[0041] In some embodiments, the retaining wall structure 130 is a solder mask. The solder mask is the most suitable material for the retaining wall structure 130 in the production line. By using the solder mask as the retaining wall structure 130 and designing a retaining wall structure 130 to shield the component setting area 112 in the manufacturing process, in this way, the primer layer 150 can be uniformly disposed on the flexible substrate 110 by means of a squeegee or coating. This method is applicable to a large area and has high efficiency. In some embodiments, further, the retaining wall structure 130 can be a reusable and heat-resistant material such as metal.
[0042] In some embodiments, the height of the retaining wall structure 130 can be greater than the height of the pad 104 to effectively block the primer layer 150. It should be understood that the height in this specification refers to the dimension in the vertical direction Z. In Figure 3 In the illustrated embodiment, the height of the retaining wall structure 130 is the same as the height of the primer layer 150, and the top surface of the retaining wall structure 130 is coplanar with the top surface of the primer layer 150. In some other embodiments, the height of the retaining wall structure 130 can be greater than the height of the primer layer 150, that is, the top surface of the retaining wall structure 130 can be higher than the top surface of the primer layer 150. The side wall 130S1 of the retaining wall structure 130 facing the component setting area 112 and the top surface of the retaining wall structure 130 can be coated with a silicone layer 180. That is to say, when the primer layer 150 is formed, the primer layer 150 will not overflow to the top surface or the side wall 130S1 of the retaining wall structure 130.
[0043] In some embodiments, the packaging structure 100 can be a wearable IoT product with biosensing function. The top surface of the silicone layer 180 contacts the human body. In some embodiments, the primer layer 150 is a conductive material. For example, the primer layer 150 can be a conductive gel. In some embodiments, the silicone layer 180 is a conductive material, that is, conductive silicone. The conductive primer layer 150 and the silicone layer 180 can be used to transmit signals to the signal receiving area 114. The electronic component 170 can include at least one of a detection component and an arithmetic component. The signals received by the signal receiving area 114 can be transmitted to the electronic component 170 via the flexible substrate 110, and the electronic component 170 (such as the detection component and the arithmetic component) can further process the signals.
[0044] Figure 4 is a top view schematic diagram of the packaging structure 100 according to an embodiment of the present application. For clarity of illustration, Figure 4 the silicone layer 180 is not shown. Referring to Figure 4 as shown, the retaining wall structure 130 can surround the component setting area 112 laterally (i.e., in the X-Y plane), so that no part of the primer layer 150 will overflow into the component setting area 112 during formation. In Figure 4In [the figure], the retaining wall structure 130 has a rectangular shape. In other embodiments, the retaining wall structure 130 may also have other suitable closed shapes to surround the component setting area 112.
[0045] Figure 5 FIG. [is] a cross-sectional schematic view of a packaging structure 100' according to another embodiment of the present application. Figure 5 Multiple aspects of the illustrated packaging structure 100' may be similar to those described above with reference to Figures 2 to 4 The following only describes Figure 5 the differences of the packaging structure 100' in [the figure]. Referring to Figure 5 as shown, the electronic component 170 is directly bonded on the pad 104. The active surface 170a of the electronic component 170 faces the flexible substrate 110, and the active surface 170a is directly bonded to the pad 104.
[0046] Figure 6A and Figure 6B FIG. [is] a cross-sectional schematic view at an intermediate stage of forming a packaging structure using a retaining wall structure according to another embodiment of the present application. Figure 7 FIG. [is] a cross-sectional schematic view of a packaging structure formed using a retaining wall structure according to another embodiment of the present application. It should be understood that for Figure 6A , Figure 6B and Figure 7 the components that are the same or similar to those described above, the same reference numerals are used, and the same or similar components will not be described repeatedly.
[0047] First, referring to Figure 6A as shown, a flexible substrate 110 is provided. The flexible substrate 110 may include a component setting area 112, and the component setting area 112 may include pads 104. The flexible substrate 110 may also include a signal receiving area 114. A retaining wall structure 130 is provided at the common edge 112e of the component setting area 112 and the signal receiving area 114.
[0048] In this embodiment, after the retaining wall structure 130 is provided, a mask 230 may also be provided above the retaining wall structure 130. In Figure 6A FIG. [the side wall 230S of the mask 230 is perpendicular and coplanar with the side wall 130S2 of the retaining wall structure 130. In other embodiments, the side wall 230S of the mask 230 may also not be perpendicular and coplanar with the side wall 130S2 of the retaining wall structure 130.
[0049] Then, referring to Figure 6BAs shown, a primer layer 150 is formed in the signal receiving area 114 of the flexible substrate 110. Due to the use of the dam structure 130 and the mask 230, the primer layer 150 extends up to the dam structure 130 and the mask 230. In some embodiments, the height of the formed primer layer 150 can be greater than the height of the dam structure 130, and the top surface of the primer layer 150 is higher than the top surface of the dam structure 130. In some embodiments, the sidewall 150S of the primer layer 150 and the sidewall 130S2 of the dam structure 130 can be in physical contact and coplanar vertically.
[0050] Refer to Figure 7 As shown, the electronic component 170 is disposed in the component setting area 112 of the flexible substrate 110. In this embodiment, the electronic component 170 is connected to the corresponding pad 104 via a wire bond 172. In other embodiments, the electronic component 170 can also be directly bonded to the pad 104 (as Figure 5 shown). Then, a silicone layer 180 can be formed above the flexible substrate 110, and the silicone layer 180 can cover above the flexible substrate 110, the primer layer 150, the dam structure 130, and each electronic component 170. Thus, the encapsulation structure 200 is formed.
[0051] In the encapsulation structure 200, by providing the dam structure 130 and the mask 230, when forming the primer layer 150, the primer layer 150 can be more effectively blocked outside the component setting area 112, preventing the primer layer 150 from overflowing into the component setting area 112, and improving the product yield and the product process stability.
[0052] In summary, in the encapsulation structures 100, 100', 200 of the embodiments of the present application, by providing the dam structure 130, the primer layer 150 can be blocked outside the component setting area 112, preventing the primer layer 150 from overflowing into the component setting area 112. Thus, the primer layer 150 will not contaminate, for example, the pad 104 in the component setting area 112, avoiding the problem that the primer layer 150 contaminates the pad 104, resulting in difficult or poor bonding of the pad 104 (such as bonding with the wire bond 172).
[0053] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included within the protection scope of the present application.
Claims
1. A packaging structure, characterized in that: include: The flexible substrate is divided into a signal receiving area and a component setting area; A primer layer is disposed on the signal receiving area of the flexible substrate; A pad is arranged in the component arrangement area of the flexible substrate; A retaining wall structure is disposed at the edge of the signal receiving area and is used to prevent the primer layer from extending to the component setting area; The silicone layer is coated on the flexible substrate, the primer layer and the retaining wall structure.
2. The packaging structure according to claim 1, characterized in that: The height of the retaining wall structure is greater than the height of the pad.
3. The packaging structure according to claim 1, characterized in that: The height of the retaining wall structure is greater than the height of the primer layer.
4. The packaging structure according to claim 1, characterized in that: The retaining wall structure is a solder resist layer.
5. The packaging structure according to claim 1, characterized in that: The primer layer is a conductive material, and the silicone layer is a conductive material.
6. The packaging structure according to claim 1, characterized in that: The top surface of the silica gel layer contacts the human body.
7. The packaging structure according to claim 1, characterized in that: The component setting area is set between the signal receiving areas.
8. The packaging structure according to claim 1, characterized in that: The projections of the solder pad and the primer layer in the vertical direction do not overlap.
9. The packaging structure according to claim 1, characterized in that: Also includes: An electronic component is electrically connected to the pad.
10. The packaging structure according to claim 1, characterized in that: The retaining wall structure laterally surrounds the element setting area.