Laser with built-in direct-cooling packaging unit
By setting a built-in laser in the direct cooling packaging unit with built-in liquid-cooled channels through the center of the thermal base, the problems of poor thermal conductivity and slow heat dissipation speed in the prior art are solved, efficient heat dissipation and high-density packaging are achieved, and the output of high-power LD laser beams is promoted.
Patent Information
- Application Number
- CN202420690323.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-12
- Filing Date
- 2024-04-05
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-04-05
AI Technical Summary
The packaging mode of existing semiconductor LD lasers has problems such as poor thermal conductivity, slow heat dissipation speed, large equipment volume and short life, which limits the packaging density of high-power LD lasers per unit volume.
The laser built-in of the direct cooling packaging unit is adopted. By setting up a built-in liquid-cooled channel in the center of the thermal base, the liquid-cooled medium flows through the liquid-cooled packaging module for heat dissipation, removing the heat dissipation thermal resistance caused by physical contact between layers of traditional packaging modules.
It realizes the advantages of short heat dissipation path, fast heat dissipation speed and good heat dissipation effect, improves the density of the chip package, and allows the high-power LD laser to be formed per unit volume, realizing the output of high-power and ultra-high-power semiconductor LD laser beams.
Smart Images
Figure CN222915385U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device packaging, in particular to a laser built in a direct cooling packaging unit. Background Art
[0002] With the rapid development of new energy vehicles, solar photovoltaics, industrial equipment, material processing and other fields, the demand for laser processing is becoming more and more popular. At the same time, the requirements for the volume and output power density of laser equipment are also getting higher and higher. A high-performance laser has an important impact on the cost performance and competitiveness of the whole laser equipment.
[0003] For existing semiconductor LD lasers, the TO tube packaging mode is generally adopted. For high-power lasers, a considerable number of TO tubes are required for integration. Due to the long heat dissipation path and large thermal resistance of the chip, the power of the chip is difficult to reach the ideal state. And because of the need for layer-by-layer heat transfer, it will also lead to problems such as large equipment volume and short life, restricting the packaging density of high-power LD lasers per unit volume. Content of the Utility Model
[0004] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a laser built in a direct cooling packaging unit, which can improve the thermal conductivity and heat dissipation speed, enhance the heat dissipation effect, increase the packaging density of the chip, enable high-power LD lasers to be formed per unit volume, and realize the output of high-power semiconductor LD laser beams.
[0005] The utility model is realized by adopting the following technical solutions: A laser built in a direct cooling packaging unit includes a liquid-cooled LD packaging module; a mounting plate, and several of the liquid-cooled LD packaging modules are sequentially arranged at the upper end of the mounting plate; a liquid-cooled pipeline, and adjacent two liquid-cooled LD packaging modules are connected through the liquid-cooled pipeline; a laser base, an accommodation cavity is formed inside the laser base, and two base channels are arranged on both sides of the laser base; a liquid-cooled joint, and two liquid-cooled joints are symmetrically arranged at the rear end of the laser base; the ends of the two liquid-cooled pipelines at both ends are connected to the liquid-cooled joints after passing through the base channels, and the mounting plate is fixed inside the laser base; a cover plate, and the cover plate is detachably fixed at the top of the laser base; and an external cooling system, and cooling system inlet and outlet water ports are arranged on the external cooling system, and the cooling system inlet and outlet water ports are respectively communicated with the two liquid-cooled pipelines at both ends, and the liquid-cooled medium flowing through the liquid-cooled LD packaging module is cooled by the external cooling system.
[0006] Further, a reflecting prism and a converging lens are arranged in the middle of the upper end of the mounting plate among a plurality of liquid-cooled LD packaging modules. A fiber optic connector is also fixed in front of the converging lens at the upper end of the mounting plate. The liquid-cooled LD packaging module cooperates with the reflecting prism to shape and emit a high-power laser parallel beam, which is converged into a focal spot through the converging lens, so that the spot falls on the fiber core of the fiber optic connector and enters the fiber for output, forming an LD laser output system.
[0007] Further, the liquid-cooled LD packaging module includes an LD chip, a circuit board and a heat-conducting base. An internal liquid-cooling channel is arranged through the center of the heat-conducting base, and the internal liquid-cooling channel is connected to a liquid-cooling pipeline; the circuit board is closely arranged on the outside of the heat-conducting base; the LD chip is closely arranged on the upper end of the circuit board.
[0008] Further, the LD chip is welded to the upper end of the circuit board through a high heat-conducting solder, and the circuit board is welded to the outside of the heat-conducting base through a high heat-conducting solder.
[0009] Further, a collimating lens is also fixed on the outside of the heat-conducting base. The focus position of the LD chip corresponds to that of the collimating lens, so that the beam of the LD chip becomes parallel light output after being collimated by the collimating lens.
[0010] Further, the heat-conducting base is made of a high heat-conducting material.
[0011] Further, the collimating lens is an integrated fast and slow axis collimating lens or a split fast and slow axis collimating lens.
[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0013] 1. For the laser built in the direct-cooling packaging unit of the present utility model, by arranging an internal liquid-cooling channel through the center of the heat-conducting base and using a liquid-cooling medium to flow through the liquid-cooled packaging module for heat dissipation, the heat dissipation thermal resistance generated by the layer-by-layer physical contact in the traditional packaging module is removed, and it has the advantages of a short heat dissipation path, a fast heat dissipation speed, and a good heat dissipation effect.
[0014] 2. For the laser built in the direct-cooling packaging unit of the present utility model, the packaging with a high chip density is realized at the same time, so that the high-power LD laser in a unit volume is formed, and the output of high-power and ultra-high-power semiconductor LD laser beams is realized. Description of the Drawings
[0015] Figure 1 is the structural exploded view of the laser built in the direct-cooling packaging unit of the present utility model;
[0016] Figure 2It is a schematic structural diagram after removing the cover plate of the laser built in the direct cooling packaging unit of the present utility model;
[0017] Figure 3 It is a top view after removing the cover plate of the laser built in the direct cooling packaging unit of the present utility model;
[0018] Figure 4 It is a schematic structural diagram of the external cooling system 8 in the present utility model.
[0019] In the figure: 1, liquid-cooled LD packaging module; 2, reflecting prism; 3, converging lens; 4, fiber optic connector; 5, laser base; 6, liquid-cooled pipe; 7, cover plate; 8, external cooling system; 9, mounting plate; 10, liquid-cooled joint; 11, LD chip; 12, circuit board; 14, heat-conducting base; 15, collimating lens; 51, base channel; 81, inlet and outlet of the cooling system. Specific embodiments
[0020] The following uses specific specific examples to illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0021] The purpose of the present utility model is to provide a laser built in a direct cooling packaging unit for the defects of the prior art.
[0022] Embodiment 1
[0023] This embodiment provides a laser built in a direct cooling packaging unit. Referring to Figures 1 - 3 as shown, it includes a liquid-cooled LD packaging module 1, a laser base 5, a liquid-cooled pipe 6, a cover plate 7, a mounting plate 9, a liquid-cooled joint 10, and an external cooling system 8. Five liquid-cooled LD packaging modules 1 are sequentially arranged at the upper end of the mounting plate 9; adjacent two liquid-cooled LD packaging modules 1 are connected by a liquid-cooled pipe 6; a receiving cavity is formed inside the laser base 5, two base channels 51 are arranged on both sides of the laser base 5, and two liquid-cooled joints 10 are symmetrically arranged at the rear end of the laser base 5; the ends of the two liquid-cooled pipes 6 at both ends are connected to the liquid-cooled joints 10 after passing through the base channels 51. The mounting plate 9 is fixed inside the laser base 5; the cover plate 7 is detachably fixed at the top of the laser base 5, and the laser base 5 and the cover plate 7 form a sealed cavity to provide a sealed protection for the liquid-cooled LD packaging module 1.
[0024] Referring to Figure 4As shown, the external cooling system 8 is a traditional liquid cooling system on the existing market, which can be an air-cooled liquid cooling system or a refrigeration system with a compressor. The external cooling system 8 is provided with cooling system inlet and outlet ports 81, and the cooling system inlet and outlet ports 81 are respectively communicated with two liquid cooling connectors 10. The liquid cooling medium flowing through the liquid cooling LD packaging module 1 is dissipated by the external cooling system 8.
[0025] At the upper end of the mounting plate 9, a reflecting prism 2 and a converging lens 3 are arranged in the middle of the five liquid cooling LD packaging modules 1. At the front of the converging lens 3 on the upper end of the mounting plate 9, an optical fiber connector 4 is also fixed. The liquid cooling LD packaging module 1 cooperates with the reflecting prism 2 to shape and emit a high-power laser parallel beam, and the beam is converged into a focal spot through the converging lens 3, so that the spot falls on the optical fiber core of the optical fiber connector 4 and enters the optical fiber for output, forming an LD laser output system.
[0026] Refer to Figure 3 As shown, the liquid cooling LD packaging module 1 includes an LD chip 11, a circuit board 12 and a heat conducting base 14. An internal liquid cooling channel is arranged through the center of the heat conducting base 14, and the internal liquid cooling channel is connected with the liquid cooling pipeline 6; the circuit board 12 is closely arranged on the outside of the heat conducting base 14, and the heat conducting base 14 is made of a high heat conducting material, and high heat conducting base materials such as copper and oxygen-free copper in the prior art can be used. The LD chip 11 is closely arranged on the upper end of the circuit board 12. Specifically, the LD chip 11 is welded to the upper end of the circuit board 12 by a high heat conducting solder, and the circuit board 12 is welded to the outside of the heat conducting base 14 by a high heat conducting solder. The baking welding method in the prior art can be used, or welding methods such as pressure welding and brazing can be used to improve the heat conduction performance therebetween. A collimating lens 15 is also fixed on the outside of the heat conducting base 14, and the focal position of the LD chip 11 corresponds to that of the collimating lens 15, so that the beam of the LD chip 11 becomes parallel light output after being collimated by the collimating lens 15. The collimating lens 15 is an integrated fast and slow axis collimating lens or a split fast and slow axis collimating lens.
[0027] When the laser in the direct cooling packaging unit of the present utility model works, the cooling system inlet and outlet ports 81 on the external cooling system 8 are respectively communicated with the two liquid cooling pipelines 6 at both ends, and the liquid cooling medium is used to flow through the liquid cooling LD packaging module 1 for heat dissipation. Since an internal liquid cooling channel is arranged through the center of the heat conducting base 14, the heat dissipation thermal resistance generated by the layer-by-layer physical contact in the traditional packaging module is removed, and the heat dissipation path is short, the heat dissipation speed is fast, and the heat dissipation effect is good. At the same time, the packaging with high chip density is realized, so that the high-power LD laser is formed in a unit volume, and the output of high-power and ultra-high-power semiconductor LD laser beams is realized.
[0028] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment contains only an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A laser with a built-in direct cooling packaging unit, characterized in that: include Liquid-cooled LD packaging module (1); A mounting plate (9), wherein a plurality of the liquid-cooled LD packaging modules (1) are sequentially arranged on an upper end of the mounting plate (9); A liquid cooling pipe (6), wherein two adjacent liquid-cooled LD packaging modules (1) are connected via the liquid cooling pipe (6); A laser base (5), wherein a receiving cavity is formed inside the laser base (5), and two base channels (51) are arranged on two sides of the laser base (5); Liquid cooling joints (10), wherein the rear end of the laser base (5) is symmetrically provided with two liquid cooling joints (10); the ends of the two liquid cooling pipes (6) located at the two ends are connected to the liquid cooling joints (10) after passing through the base channel (51), and the mounting plate (9) is fixed inside the laser base (5); A cover plate (7), wherein the cover plate (7) is detachably fixed to the top of the laser base (5); and An external cooling system (8), wherein the external cooling system (8) is provided with a cooling system water inlet and outlet (81), the cooling system water inlet and outlet (81) are respectively connected to two liquid cooling joints (10), and the liquid cooling medium flowing through the liquid-cooled LD packaging module (1) is cooled by the external cooling system (8).
2. The laser built into the direct cooling packaging unit according to claim 1, characterized in that: The upper end of the mounting plate (9) is located in the middle of a plurality of liquid-cooled LD packaging modules (1) and is provided with a reflecting prism (2) and a converging lens (3). The upper end of the mounting plate (9) is located in front of the converging lens (3) and is also fixed with an optical fiber connector (4). The liquid-cooled LD packaging module (1) and the reflecting prism (2) cooperate to shape the emitted laser parallel beam, and the beam is converged into a focal spot through the converging lens (3), so that the beam falls on the optical fiber core of the optical fiber connector (4) and enters the optical fiber output, thereby forming an LD laser output system.
3. The laser built into the direct cooling packaging unit according to claim 2, characterized in that: The liquid-cooled LD packaging module (1) comprises an LD chip (11), a circuit substrate (12) and a heat-conducting base (14). A built-in liquid cooling channel is provided through the center of the heat-conducting base (14), and the built-in liquid cooling channel is connected to the liquid cooling pipeline (6); The circuit substrate (12) is arranged closely on the outer side of the heat-conducting base (14); The LD chip (11) is arranged in close contact with the upper end of the circuit substrate (12).
4. The laser built into the direct cooling packaging unit according to claim 3, characterized in that: The LD chip (11) is welded to the upper end of the circuit substrate (12) via high thermal conductivity solder, and the circuit substrate (12) is welded to the outer side of the thermal conductive base (14) via high thermal conductivity solder.
5. The laser built into the direct cooling packaging unit according to claim 4, characterized in that: A collimating lens (15) is also fixed on the outer side of the heat-conducting base (14), and the focal positions of the LD chip (11) and the collimating lens (15) correspond, so that the light beam of the LD chip (11) is collimated by the collimating lens (15) and becomes parallel light output.
6. The laser built into the direct cooling packaging unit according to claim 5, characterized in that: The thermally conductive base (14) is made of a high thermally conductive material.
7. The laser built into the direct cooling packaging unit according to claim 5, characterized in that: The collimating lens (15) is an integrated fast-slow axis collimating lens or a split fast-slow axis collimating lens.