Heat dissipation processing device for small-power ACDC module

Abstract

The utility model relates to the technical field of ACDC module heat dissipation, in particular to a small-power ACDC module heat dissipation processing device which comprises an ACDC module power supply, the top of the ACDC module power supply is fixedly connected with heat-conducting insulating elastic rubber, the top of the heat-conducting insulating elastic rubber is fixedly connected with first heat dissipation fins, the two sides of the ACDC module power supply are fixedly connected with flexible heat-conducting pads, and the flexible heat-conducting pads are fixedly connected with second heat dissipation fins. A flexible heat conduction pad is fixedly connected to the outer side of the heat conduction insulation elastic rubber, a heat conduction silica gel sheet is fixedly connected to the outer side of the flexible heat conduction pad, and second heat dissipation fins are fixedly connected to the outer side of the heat conduction silica gel sheet. Heat gathered on the inner side of the ACDC module power supply is conducted out through the heat-conducting insulating elastic rubber and the flexible heat-conducting pad, the heat-conducting silica gel sheet further conducts out the heat gathered in the flexible heat-conducting pad, heat dissipation is conducted through the first heat dissipation fins, heat dissipation is conducted through the second heat dissipation fins, and therefore heat dissipation of the ACDC module power supply is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of ACDC module heat dissipation, in particular to a low-power ACDC module heat dissipation processing device. Background Art

[0002] The low-power ACDC module is an AC-to-DC module power supply from Onding that can replace traditional transformers and adapters. It is a miniaturized switching power supply that can avoid the trouble of using an external power adapter with many and troublesome accessories.

[0003] A low-power ACDC module generates heat when in use. If the heat cannot be discharged, the heat will accumulate inside the low-power ACDC module for a long time, which may damage the internal parts of the ACDC module and thus affect the use of the ACDC module. Therefore, a low-power ACDC module heat dissipation processing device is proposed to address the above problem. Utility Model Content

[0004] The purpose of the utility model is to provide a low-power ACDC module heat dissipation processing device to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A low-power ACDC module heat dissipation processing device comprises an ACDC module power supply, the top of the ACDC module power supply is fixedly connected with a heat-conducting insulating elastic rubber, the top of the heat-conducting insulating elastic rubber is fixedly connected with a plurality of first heat dissipation fins of equal size, both sides of the ACDC module power supply are fixedly connected with flexible heat-conducting pads, the outer side of the flexible heat-conducting pad is fixedly connected with a heat-conducting silicone sheet, and the outer side of the heat-conducting silicone sheet is fixedly connected with a plurality of second heat dissipation fins of equal size.

[0007] Preferably, a plurality of first heat dissipation holes with equal apertures are formed on the inner side of the first heat dissipation fins, and the first heat dissipation holes are evenly arranged.

[0008] Preferably, a plurality of second heat dissipation holes with equal apertures are formed on the inner side of the second heat dissipation fins, and the second heat dissipation holes are evenly arranged.

[0009] Preferably, an installation groove is provided on the inner side of the thermally conductive insulating elastic rubber, a positioning groove with an equal groove diameter is provided on the inner side of the thermally conductive insulating elastic rubber, the positioning groove is connected to the installation groove, a copper plate is fixedly connected to the inner side of the installation groove, a copper positioning block is fixedly connected to the inner side of the positioning groove, and the copper positioning block is fixedly connected to the copper plate.

[0010] Preferably, through grooves with equal diameters are formed inside the flexible heat-conducting pad, and a connecting copper block is fixedly connected inside the through grooves, and the connecting copper block is fixedly connected with the heat-conducting silica gel sheet.

[0011] Compared with the prior art, the beneficial effects of the present utility model are:

[0012] In the present utility model, the structure composed of the heat-conducting insulating elastic rubber, the first heat-dissipating fin, the flexible heat-conducting pad, the heat-conducting silica gel sheet and the second heat-dissipating fin is provided. The heat-conducting insulating elastic rubber and the flexible heat-conducting pad conduct out the heat gathered inside the ACDC module power supply. The heat-conducting silica gel sheet further conducts out the heat gathered in the flexible heat-conducting pad. The heat-conducting insulating elastic rubber acts the heat on the first heat-dissipating fin, and the heat is dissipated through the first heat-dissipating fin. The heat-conducting silica gel sheet acts the heat on the second heat-dissipating fin, and the heat is dissipated through the second heat-dissipating fin, so as to realize the heat dissipation of the ACDC module power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0014] Figure 2 is of Figure 1 the structure at A of the present utility model;

[0015] Figure 3 is a schematic diagram of the structure of the heat-conducting insulating elastic rubber of the present utility model;

[0016] Figure 4 is a schematic diagram of the copper plate installation structure of the present utility model;

[0017] Figure 5 is a schematic diagram of the connection copper block installation structure of the present utility model;

[0018] Figure 6 is a schematic diagram of the structure of the heat-conducting silica gel sheet of the present utility model.

[0019] In the figure: 1, ACDC module power supply; 2, heat-conducting insulating elastic rubber; 3, first heat-dissipating fin; 4, first heat-dissipating hole; 5, flexible heat-conducting pad; 6, heat-conducting silica gel sheet; 7, second heat-dissipating fin; 8, second heat-dissipating hole; 9, installation groove; 10, positioning groove; 11, copper plate; 12, copper material positioning block; 13, through groove; 14, connecting copper block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or their combinations.

[0022] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the said technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed herein, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0023] In the description of the present invention, it should be understood that the orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. generally refer to the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present invention; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0024] For ease of description, spatial relative terms, such as "above", "over", "on the upper surface", "upper", etc., may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations are made for the spatial relative descriptions used herein.

[0025] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the protection scope of the present utility model.

[0026] Please refer to Figures 1-6 , the present utility model provides a technical solution:

[0027] A heat dissipation treatment device for a low-power ACDC module, comprising an ACDC module power supply 1, a thermally conductive insulating elastic rubber 2 fixedly connected to the top of the ACDC module power supply 1, a plurality of first heat dissipation fins 3 of equal size fixedly connected to the top of the thermally conductive insulating elastic rubber 2, flexible thermally conductive pads 5 fixedly connected to both sides of the ACDC module power supply 1, a thermally conductive silica gel sheet 6 fixedly connected to the outside of the flexible thermally conductive pad 5, and a plurality of second heat dissipation fins 7 of equal size fixedly connected to the outside of the thermally conductive silica gel sheet 6.

[0028] A plurality of first heat dissipation holes 4 with equal aperture sizes are formed in the inner side of the first heat dissipation fin 3, and the first heat dissipation holes 4 are evenly arranged. This arrangement enables the first heat dissipation holes 4 to increase the contact area between the first heat dissipation fin 3 and air, thereby enhancing the heat dissipation effect of the first heat dissipation fin 3; a plurality of second heat dissipation holes 8 with equal aperture sizes are formed in the inner side of the second heat dissipation fin 7, and the second heat dissipation holes 8 are evenly arranged. This arrangement enables the second heat dissipation holes 8 to increase the contact area between the second heat dissipation fin 7 and air, thereby enhancing the heat dissipation effect of the second heat dissipation fin 7; an installation groove 9 is formed in the inner side of the heat-conducting insulating elastic rubber 2, and positioning grooves 10 with equal groove diameters are formed in the inner side of the heat-conducting insulating elastic rubber 2. The positioning grooves 10 communicate with the installation groove 9. A copper plate 11 is fixedly connected to the inner side of the installation groove 9, and a copper material positioning block 12 is fixedly connected to the inner side of the positioning groove 10. The copper material positioning block 12 is fixedly connected to the copper plate 11. This arrangement enables the copper plate 11 and the copper material positioning block 12 respectively fixed through the installation groove 9 and the positioning groove 10 on the inner side of the heat-conducting insulating elastic rubber 2 to also conduct the heat accumulated inside the ACDC module power supply 1. The copper material positioning block 12 enables the copper plate 11 to be stably connected to the heat-conducting insulating elastic rubber 2, enhancing the heat conduction effect of the heat-conducting insulating elastic rubber 2; a through groove 13 with equal groove diameters is formed in the inner side of the flexible heat-conducting pad 5, and a connecting copper block 14 is fixedly connected to the inner side of the through groove 13. The connecting copper block 14 is fixedly connected to the heat-conducting silica gel sheet 6. This arrangement enables the connecting copper block 14 fixed through the through groove 13 on the inner side of the flexible heat-conducting pad 5 to also conduct the heat accumulated inside the ACDC module power supply 1. The connecting copper block 14 enhances the heat conduction effect of the flexible heat-conducting pad 5 and enables the heat-conducting silica gel sheet 6 to be stably fixed to the flexible heat-conducting pad 5.

[0029] Workflow: The heat-insulating elastic rubber 2 and the flexible heat-conducting pad 5 conduct the heat accumulated inside the ACDC module power supply 1. The copper plate 11 and the copper material positioning block 12 fixed respectively through the installation groove 9 and the positioning groove 10 inside the heat-insulating elastic rubber 2 can also conduct the heat accumulated inside the ACDC module power supply 1. The copper material positioning block 12 enables the copper plate 11 to be stably connected to the heat-insulating elastic rubber 2, enhancing the heat conduction effect of the heat-insulating elastic rubber 2. The heat-insulating elastic rubber 2 acts the heat on the first heat sink fin 3 and dissipates the heat through the first heat sink fin 3. The first heat dissipation hole 4 increases the contact area between the first heat sink fin 3 and the air, thereby enhancing the heat dissipation effect of the first heat sink fin 3. The heat-conducting silica gel sheet 6 further conducts the heat accumulated in the flexible heat-conducting pad 5. The connecting copper block 14 fixed through the through groove 13 inside the flexible heat-conducting pad 5 can also conduct the heat accumulated inside the ACDC module power supply 1. The connecting copper block 14 enhances the heat conduction effect of the flexible heat-conducting pad 5 and enables the heat-conducting silica gel sheet 6 to be stably fixedly connected to the flexible heat-conducting pad 5. The heat-conducting silica gel sheet 6 acts the heat on the second heat sink fin 7 and dissipates the heat through the second heat sink fin 7. The second heat dissipation hole 8 increases the contact area between the second heat sink fin 7 and the air, thereby enhancing the heat dissipation effect of the second heat sink fin 7, thus realizing the heat dissipation of the ACDC module power supply 1.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A low-power ACDC module heat dissipation processing device, comprising an ACDC module power supply (1), characterized in that: The top of the ACDC module power supply (1) is fixedly connected to a heat-conducting insulating elastic rubber (2), the top of the heat-conducting insulating elastic rubber (2) is fixedly connected to a plurality of first heat dissipation fins (3) of equal size, both sides of the ACDC module power supply (1) are fixedly connected to flexible heat-conducting pads (5), the outer side of the flexible heat-conducting pad (5) is fixedly connected to a heat-conducting silicone sheet (6), and the outer side of the heat-conducting silicone sheet (6) is fixedly connected to a plurality of second heat dissipation fins (7) of equal size.

2. A low-power ACDC module heat dissipation treatment device according to claim 1, characterized in that: A plurality of first heat dissipation holes (4) of equal diameter are provided on the inner side of the first heat dissipation fin (3), and the first heat dissipation holes (4) are evenly arranged.

3. A low-power ACDC module heat dissipation processing device according to claim 1, characterized in that: A plurality of second heat dissipation holes (8) of equal diameter are provided on the inner side of the second heat dissipation fin (7), and the second heat dissipation holes (8) are evenly arranged.

4. The low-power ACDC module heat dissipation processing device according to claim 1, characterized in that: A mounting groove (9) is provided on the inner side of the heat-conducting insulating elastic rubber (2), a positioning groove (10) with an equal groove diameter is provided on the inner side of the heat-conducting insulating elastic rubber (2), the positioning groove (10) is connected to the mounting groove (9), a copper plate (11) is fixedly connected to the inner side of the mounting groove (9), a copper material positioning block (12) is fixedly connected to the inner side of the positioning groove (10), and the copper material positioning block (12) is fixedly connected to the copper plate (11).

5. The low-power ACDC module heat dissipation processing device according to claim 1, characterized in that: A through groove (13) with an equal groove diameter is provided on the inner side of the flexible thermal pad (5), a connecting copper block (14) is fixedly connected to the inner side of the through groove (13), and the connecting copper block (14) is fixedly connected to the thermal conductive silicone sheet (6).

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