Power conversion module and uninterruptible power supply

Abstract

The utility model provides a power conversion module and an uninterruptible power supply, and relates to the technical field of uninterruptible power supplies. The power conversion module comprises a first power conversion plate, a second power conversion plate and a liquid cooling plate. The first power conversion plate, the liquid cooling plate and the second power conversion plate are stacked in the thickness direction of the liquid cooling plate, the liquid cooling plate is located between the first power conversion plate and the second power conversion plate, and the two side surfaces of the liquid cooling plate in the thickness direction are connected with the first power conversion plate and the second power conversion plate respectively. In this way, the heat dissipation efficiency of the power conversion module is high.

Description

Technical Field

[0001] The present application relates to the technical field of uninterruptible power supplies, and particularly to a power conversion module and an uninterruptible power supply. Background Art

[0002] A data center can be used to transfer, accelerate, display, calculate, and store data information on a network infrastructure. The data center can include an uninterruptible power supply (UPS), and the uninterruptible power supply can be used to provide uninterrupted power supply to load devices such as servers and computers.

[0003] To improve the power of the uninterruptible power supply, the uninterruptible power supply can include a cabinet and a plurality of power conversion modules disposed in the cabinet. The power conversion modules generate a relatively large amount of heat during operation.

[0004] In the related art, air cooling is often used to dissipate heat from the power conversion module. However, when the device layout density in the cabinet is relatively high, the heat flux density in the cabinet is relatively large, and the heat dissipation efficiency of air cooling for the power conversion module is relatively low.

[0005] Therefore, how to improve the heat dissipation efficiency of the power conversion module of the uninterruptible power supply has become an urgent problem to be solved in the technical field of uninterruptible power supplies. Summary of the Utility Model

[0006] The present application aims to provide a power conversion module and an uninterruptible power supply to solve the problem of relatively low heat dissipation efficiency of the power conversion module of the uninterruptible power supply in the prior art.

[0007] On the one hand, the present application provides a power conversion module, which includes a first power conversion board, a second power conversion board, and a liquid cooling plate. The first power conversion board, the liquid cooling plate, and the second power conversion board are stacked along the thickness direction of the liquid cooling plate. The liquid cooling plate is located between the first power conversion board and the second power conversion board, and the two surfaces on both sides of the thickness direction of the liquid cooling plate are respectively connected to the first power conversion board and the second power conversion board.

[0008] For the power conversion module provided by the present application, both the first power conversion board and the second power conversion board are liquid-cooled through the liquid cooling plate, and the heat dissipation efficiency for the first power conversion board and the second power conversion board is relatively high, which can meet the heat dissipation requirements of the power conversion module when the device layout density in the cabinet is relatively high.

[0009] In addition, by using the liquid cooling plate to dissipate heat from the first power conversion board and the second power conversion board, the generated noise is relatively small, making the noise of the uninterruptible power supply during operation relatively small.

[0010] In addition, there is no need to provide a ventilation structure on the housing, which is beneficial to improving the dust-proof and waterproof grades of the uninterruptible power supply.

[0011] Furthermore, the first power conversion board, the liquid cooling plate, and the second power conversion board are stacked along the thickness direction of the liquid cooling plate. The integration degree of the first power conversion board, the liquid cooling plate, and the second power conversion board is relatively high, which is beneficial to reducing the size of the liquid cooling plate and the uninterruptible power supply. The liquid cooling plate is located between the first power conversion board and the second power conversion board, which can make the heat conduction paths between the first power conversion board and the second power conversion board and the liquid cooling plate relatively short, and the heat dissipation effect of the liquid cooling plate on the first power conversion board and the second power conversion board is relatively good.

[0012] Optionally, the first power conversion board includes a first substrate and a first power board heating element provided on the first substrate. The liquid cooling plate is located on the side of the first power board heating element facing away from the first substrate, and the first power board heating element is in contact with one surface of the liquid cooling plate in the thickness direction.

[0013] In this way, the heat conduction path between the first power board heating element and the liquid cooling plate is relatively short, and the heat dissipation efficiency of the liquid cooling plate on the first power board heating element is relatively high.

[0014] Optionally, the second power conversion board includes a second substrate and a second power board heating element provided on the second substrate. The liquid cooling plate is located on the side of the second power board heating element facing away from the second substrate, and the second power board heating element is in contact with the other surface of the liquid cooling plate in the thickness direction.

[0015] In this way, the heat conduction path between the second power board heating element and the liquid cooling plate is relatively short, and the heat dissipation efficiency of the liquid cooling plate on the second power board heating element is relatively high.

[0016] Optionally, the first substrate includes a first region and a second region, and the first power board heating element is provided in the first region. The second substrate includes a third region and a fourth region, and the second power board heating element is provided in the third region. The orthographic projection of the first region on the reference plane and the orthographic projection of the third region on the reference plane at least partially overlap. The orthographic projection of the first region on the reference plane and the orthographic projection of the third region on the reference plane are both located within the orthographic projection of the liquid cooling plate on the reference plane. The orthographic projection of the second region on the reference plane and the orthographic projection of the fourth region on the reference plane are both located outside the orthographic projection of the liquid cooling plate on the reference plane. Among them, the reference plane is perpendicular to the thickness direction of the liquid cooling plate.

[0017] In this way, the first power board heating elements are concentrated in the first region, the second power board heating elements are concentrated in the third region, and the first power board heating elements and the second power board heating elements are arranged relatively concentratedly, which is beneficial to reducing the size of the liquid cooling plate.

[0018] Optionally, the liquid cooling plate includes a first surface structure, and the first surface structure is located on one side of the liquid cooling plate in the thickness direction. The first surface structure includes a first reference plane, the first power conversion plate includes a plurality of first power plate heating elements, the plurality of first power plate heating elements include a first heating element and a second heating element, the size of the first heating element in the thickness direction of the liquid cooling plate is greater than the size of the second heating element in the thickness direction of the liquid cooling plate, the first heating element is connected to the first reference plane, a first thermal pad is provided between the second heating element and the first reference plane, and the second heating element is connected to the first reference plane through the first thermal pad.

[0019] In this way, when the first heat generating element is connected to the first reference plane, the first thermal pad can fill the gap between the second heat generating element and the first reference plane, so that the first heat generating element and the second heat generating element having a smaller size difference in the thickness direction of the liquid cooling plate can both dissipate heat through the liquid cooling plate.

[0020] Optionally, the liquid cooling plate includes a first surface structure, and the first surface structure is located on one side of the thickness direction of the liquid cooling plate. The first surface structure includes a first reference plane and a first boss structure protruding from the first reference plane in the direction of the first substrate. The first power conversion plate includes a plurality of first power plate heating elements, and the plurality of first power plate heating elements include a first heating element and a third heating element. The size of the first heating element in the thickness direction of the liquid cooling plate is greater than the size of the third heating element in the thickness direction of the liquid cooling plate. The orthographic projection of the first heating element on the reference plane is located within the orthographic projection of the first reference plane on the reference plane, and the first heating element is connected to the first reference plane. At least part of the orthographic projection of the third heating element on the reference plane is located within the orthographic projection of the end face of the first boss structure away from the first reference plane on the reference plane, and the third heating element is connected to the end face of the first boss structure away from the first reference plane.

[0021] In this way, when the first heating element is connected to the first reference plane, the first boss structure can fill the gap between the third heating element and the first reference plane, so that the first heating element and the third heating element with a large size difference in the thickness direction of the liquid cooling plate can both dissipate heat through the liquid cooling plate.

[0022] Optionally, the third heating element includes a first heating element and a first heat sink. The first heating element is disposed on the first substrate, the first heat sink is disposed between the first heating element and the first boss structure, one side of the first heat sink is connected to the first heating element, and the other side of the first heat sink is connected to the end face of the first boss structure that is away from the first reference plane.

[0023] In this way, the heat exchange surface between the first heat sink and the liquid cooling plate is larger, which is beneficial to improving the heat dissipation effect of the liquid cooling plate on the first heating element.

[0024] Optionally, the third heating element includes a plurality of first heating elements, and one side of the first heat dissipation plate is connected to the plurality of first heating elements.

[0025] In this way, multiple first heating elements all perform heat exchange with the liquid cooling plate through the first heat dissipation plate. The structure is relatively compact, and the arrangement of the first heat dissipation plate is relatively easy. In addition, the difficulty of setting the first boss structure connected to the first heat dissipation plate can also be reduced.

[0026] Optionally, the first heating element includes a first element body and a first pin. The first element body is arranged on the first substrate through the first pin. The planes where the length direction and the width direction of the first element body are located are parallel to the first heat dissipation plate. The side of the first element body facing away from the first substrate is in contact with the first heat dissipation plate. Among them, both the length and the width of the first element body are greater than the thickness of the first element body.

[0027] In this way, the heat exchange surface between the first element body and the first heat dissipation plate is large, and the heat exchange efficiency is high, which is beneficial to improving the heat dissipation efficiency of the liquid cooling plate for the first heating element.

[0028] Optionally, the power conversion module further includes a first cover and a second cover. The first cover and the second cover are arranged opposite to each other along the thickness direction of the liquid cooling plate. The first power conversion board, the liquid cooling plate, and the second power conversion board are located between the first cover and the second cover. The first power conversion board is located between the second power conversion board and the first cover. The first power conversion board is fixedly connected to the first cover. The first cover is fixedly connected to the liquid cooling plate. The first cover presses the first power conversion board against the liquid cooling plate. The second power conversion board is located between the first power conversion board and the second cover. The second power conversion board is fixedly connected to the second cover. The second cover is fixedly connected to the liquid cooling plate. The second cover presses the second power conversion board against the liquid cooling plate.

[0029] In this way, the liquid cooling plate can be closely attached to both the first power conversion board and the second power conversion board, so that the heat dissipation effect of the liquid cooling plate on the first power conversion board and the second power conversion board is better.

[0030] On the other hand, the present application provides an uninterruptible power supply, including a cabinet and the power conversion module in any of the above embodiments, and the power conversion module is arranged in the cabinet. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1Schematic diagram of a perspective of a power conversion module provided by an embodiment of the present application;

[0033] Figure 2 is Figure 1 Schematic diagram of another perspective of the power conversion module provided in

[0034] Figure 3 is Figure 1 Exploded view of the power conversion module provided in

[0035] Figure 4 Schematic diagram of another power conversion module provided by an embodiment of the present application;

[0036] Figure 5 Exploded view of the first power conversion board of a power conversion module provided by an embodiment of the present application.

[0037] Explanation of reference numerals:

[0038] 100, first power conversion board; 110, first substrate; 111, first region; 112, second region; 120, first power board heating element; 120a, first heating element; 120b, second heating element; 120c, third heating element; 121c, first heating element; 1211c, first element body; 1212c, first pin; 122c, first heat sink.

[0039] 200, second power conversion board; 210, second substrate; 211, third region; 212, fourth region; 220, second power board heating element; 220a, fourth heating element; 220b, fifth heating element; 220c, sixth heating element; 221c, second heating element; 2211c, second element body; 222c, second heat sink.

[0040] 300, liquid cooling plate; 310, first surface structure; 311, first reference plane; 312, first boss structure; 320, second surface structure; 321, second reference plane; 322, second boss structure.

[0041] 410, first thermal conductive pad; 420, second thermal conductive pad;

[0042] 510, first thermal interface material; 520, second thermal interface material; 530, third thermal interface material; 540, fourth thermal interface material; 550, fifth thermal interface material; 560, sixth thermal interface material. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the scope of protection of this application.

[0044] It should be noted that the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of these features. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0045] In this application, unless otherwise clearly defined and limited, terms such as "installed", "connected", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected or indirectly connected through an intermediate medium, and it may be the connection inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] In this application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below", and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0047] In the above description, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0048] An embodiment of the present application provides a data center, which includes an uninterruptible power supply. The uninterruptible power supply is a device for providing uninterrupted power supply to electrically connected load devices.

[0049] Exemplarily, the load devices may include, but are not limited to, servers, computers, etc.

[0050] Exemplarily, the data center may further include a server, and the uninterruptible power supply is electrically connected to the server.

[0051] In the embodiment of the present application, the uninterruptible power supply may include a cabinet and a power conversion module disposed in the cabinet. The power conversion module may be used to convert a certain type of current into other types of current.

[0052] For example, the power conversion module may be used to convert mains power into current for charging a battery, the power conversion module may be used to convert mains power into the current required by the load device, and the power conversion module may also be used to convert the current output by the battery into the current required by the load device.

[0053] Exemplarily, the uninterruptible power supply may include a plurality of power conversion modules disposed in the cabinet. The plurality of power conversion modules may be arranged in parallel so that the uninterruptible power supply can have a higher power.

[0054] In the embodiment of the present application, the power conversion module includes a housing and a power conversion board. The power conversion board is disposed in the housing, and the housing is disposed in the cabinet.

[0055] When the uninterruptible power supply is working, the power conversion board generates relatively serious heat, and the power conversion board has a high heat dissipation requirement.

[0056] To improve the heat dissipation efficiency of the power conversion board, in the related art, the power conversion module may further include a fan. The fan is disposed in the housing, and the power conversion board can be cooled by air through the fan.

[0057] However, when the device layout density in the cabinet is relatively high (for example, when the density of the power conversion modules disposed in the cabinet is relatively high), the heat flux density in the cabinet is often relatively large, and the air-cooling heat dissipation efficiency for the power conversion board is relatively low. In addition, the air-cooling heat dissipation will generate relatively large noise, resulting in relatively large noise when the uninterruptible power supply is working. Moreover, the air-cooling heat dissipation requires ventilation structures to be opened on the housing, so that the dust-proof and waterproof levels of the uninterruptible power supply are relatively low.

[0058] Figure 1 A schematic diagram of a perspective of a power conversion module provided by an embodiment of the present application Figure 2 For Figure 1 A schematic diagram of another perspective of the power conversion module provided inFigure 3 is Figure 1 the exploded view of the power conversion module provided in

[0059] As Figure 1 - Figure 3 shown, based on this, in the embodiment of the present application, the power conversion module includes a housing (not shown), a first power conversion board 100, a second power conversion board 200, and a liquid cooling plate 300. The first power conversion board 100, the liquid cooling plate 300, and the second power conversion board 200 are all arranged in the housing. The first power conversion board 100, the liquid cooling plate 300, and the second power conversion board 200 are stacked along the thickness direction of the liquid cooling plate 300. The liquid cooling plate 300 is located between the first power conversion board 100 and the second power conversion board 200. The two side surfaces in the thickness direction of the liquid cooling plate 300 are respectively in contact with the first power conversion board 100 and the second power conversion board 200.

[0060] In this way, both the first power conversion board 100 and the second power conversion board 200 are cooled by liquid through the liquid cooling plate 300, and the heat dissipation efficiency of the first power conversion board 100 and the second power conversion board 200 is relatively high, which can meet the heat dissipation requirements of the power conversion module when the device layout density in the cabinet is relatively high (for example, when the density of the power conversion modules arranged in the cabinet is relatively high). In addition, by using the liquid cooling plate 300 to dissipate heat from the first power conversion board 100 and the second power conversion board 200, the generated noise is relatively small, making the noise of the uninterruptible power supply during operation relatively small. Moreover, there is no need to provide a ventilation structure on the housing, which is beneficial to improving the dust-proof and waterproof levels of the uninterruptible power supply. Furthermore, the first power conversion board 100, the liquid cooling plate 300, and the second power conversion board 200 are stacked along the thickness direction of the liquid cooling plate 300, and the integration degree of the first power conversion board 100, the liquid cooling plate 300, and the second power conversion board 200 is relatively high, which is beneficial to reducing the size of the liquid cooling plate 300 and the uninterruptible power supply. The liquid cooling plate 300 is located between the first power conversion board 100 and the second power conversion board 200, which can make the heat conduction paths between the first power conversion board 100 and the second power conversion board 200 and the liquid cooling plate 300 relatively short, and the heat dissipation effect of the liquid cooling plate 300 on the first power conversion board 100 and the second power conversion board 200 is relatively good.

[0061] The liquid cooling plate 300 includes a first surface structure 310 and a second surface structure 320. The first surface structure 310 and the second surface structure 320 are respectively located on both sides in the thickness direction of the liquid cooling plate 300. The first surface structure 310 is in contact with the first power conversion board 100, and the second surface structure 320 is in contact with the second power conversion board 200.

[0062] Exemplarily, one of the first power conversion board 100 and the second power conversion board 200 may include a power factor correction (PFC) circuit and a charge and discharge circuit, and the other of the first power conversion board 100 and the second power conversion board 200 may include an inverter circuit. The power factor correction circuit is electrically connected to the charge and discharge circuit and the inverter circuit, and the charge and discharge circuit is electrically connected to the inverter circuit. In the embodiment of the present application, an example is given in which the first power conversion board 100 includes a power factor correction circuit and a charge and discharge circuit, and the second power conversion board 200 includes an inverter circuit.

[0063] The power factor correction circuit and the inverter circuit cooperate to convert the mains power into the current required by the load device. The power factor correction circuit and the charge and discharge circuit cooperate to convert the mains power into the current for charging the battery. The charge and discharge circuit and the inverter circuit cooperate to convert the current output by the battery into the current required by the load device.

[0064] When the mains power is normal: the mains power can supply power to the load device through the power factor correction circuit and the inverter circuit, and the mains power can also supply power to the battery through the power factor correction circuit and the charge and discharge circuit. When the mains power is abnormal: the battery can supply power to the load device through the charge and discharge circuit and the inverter circuit.

[0065] Exemplarily, the data center further includes a pump, an evaporator, a compressor, a condenser, and an expansion valve. The evaporator has a first flow channel and a second flow channel. One end of the liquid cooling plate 300 is connected to one end of the first flow channel through the pump, and the other end of the liquid cooling plate 300 is connected to the other end of the first flow channel. The liquid cooling plate 300, the pump, and the first flow channel form a first circulation flow channel, and a first refrigerant is accommodated in the first circulation flow channel. The pump drives the first refrigerant to circulate in the first circulation flow channel. The output end of the compressor is connected to one end of the condenser, the other end of the condenser is connected to one end of the second flow channel through the expansion valve, and the other end of the second flow channel is connected to the input end of the compressor. The compressor, the condenser, the expansion valve, and the second flow channel form a second circulation flow channel, and a second refrigerant is accommodated in the second circulation flow channel. The evaporator is used to exchange heat between the first refrigerant in the first flow channel and the second refrigerant in the second flow channel.

[0066] Exemplarily, the first refrigerant may include but is not limited to cooling water, coolant, ethylene glycol solution, etc.

[0067] Exemplarily, the second refrigerant may include but is not limited to cooling water, coolant, ethylene glycol solution, etc.

[0068] The first power conversion board 100 includes a first substrate 110 and a first power board heating element 120 disposed on the first substrate 110. Among them, the first power board heating element 120 is a device or component with a relatively large heat generation during operation. For example, the temperature of the first power board heating element 120 during operation is higher than the first temperature threshold.

[0069] Exemplarily, the first substrate 110 is perpendicular to the thickness direction of the liquid cooling plate 300.

[0070] Exemplarily, the first power conversion board 100 may include one or more first power board heating elements 120.

[0071] Exemplarily, any one of the first power board heating elements 120 may include, but is not limited to, an inductor, a capacitor, a power transistor assembly, etc.

[0072] Exemplarily, the first substrate 110 may be a circuit board, and the first power board heating element 120 may be electrically connected to the first substrate 110.

[0073] Exemplarily, the first power conversion board 100 may further include a first power board low-temperature component (not shown) disposed on the first substrate 110. Among them, the first power board low-temperature component is a device or component with a relatively small heat generation during operation. For example, the temperature of the first power board low-temperature component during operation is lower than the first temperature threshold.

[0074] In some possible implementation manners, the liquid cooling plate 300 is located on a side of the first power board heating element 120 away from the first substrate 110, and the first power board heating element 120 is in contact with a side surface in the thickness direction of the liquid cooling plate 300. That is to say, the first power board heating element 120 is in contact with the first surface structure 310.

[0075] In this way, the heat conduction path between the first power board heating element 120 and the liquid cooling plate 300 is shorter, and the heat dissipation efficiency of the liquid cooling plate 300 for the first power board heating element 120 is higher.

[0076] In some other examples, the first power board heating element 120 is located on a side of the first substrate 110 away from the liquid cooling plate 300, and the first substrate 110 is in contact with a side surface in the thickness direction of the liquid cooling plate 300. That is to say, the first substrate 110 is in contact with the first surface structure 310.

[0077] The second power conversion board 200 includes a second substrate 210 and a second power board heating element 220 disposed on the second substrate 210. Among them, the second power board heating element 220 is a device or component with a relatively large heat generation during operation. For example, the temperature of the second power board heating element 220 during operation is higher than the second temperature threshold.

[0078] Exemplarily, the second substrate 210 is perpendicular to the thickness direction of the liquid cooling plate 300.

[0079] Exemplarily, the first temperature threshold and the second temperature threshold may be the same or different.

[0080] Exemplarily, the second power conversion board 200 may include one or more second power board heating elements 220.

[0081] Exemplarily, any one of the second power board heating elements 220 may include, but is not limited to, an inductor, a capacitor, a power transistor assembly, etc.

[0082] Exemplarily, the second substrate 210 may be a circuit board, and the second power board heating element 220 may be electrically connected to the second substrate 210.

[0083] Exemplarily, the second power conversion board 200 may further include a second power board low-temperature component (not shown) disposed on the second substrate 210. Herein, the second power board low-temperature component is a device or component with a relatively small heat generation during operation. For example, the temperature of the second power board low-temperature component during operation is lower than the second temperature threshold.

[0084] In some possible implementation manners, the liquid cooling plate 300 is located on a side of the second power board heating element 220 away from the second substrate 210, and one side surface of the second power board heating element 220 in the thickness direction is in contact with the liquid cooling plate 300. That is to say, the second power board heating element 220 is in contact with the second surface structure 320.

[0085] In this way, the heat conduction path between the second power board heating element 220 and the liquid cooling plate 300 is relatively short, and the heat dissipation efficiency of the liquid cooling plate 300 for the second power board heating element 220 is relatively high.

[0086] In some other examples, the second power board heating element 220 is located on a side of the second substrate 210 away from the liquid cooling plate 300, and one side surface of the second substrate 210 in the thickness direction is in contact with the liquid cooling plate 300. That is to say, the second substrate 210 is in contact with the second surface structure 320.

[0087] In some possible embodiments, the first substrate 110 includes a first region 111 and a second region 112, and the first power board heating element 120 is disposed in the first region 111. The second substrate 210 includes a third region 211 and a fourth region 212, and the second power board heating element 220 is disposed in the third region 211. The orthographic projection of the first region 111 on the reference plane coincides at least partially with the orthographic projection of the third region 211 on the reference plane. The orthographic projections of both the first region 111 and the third region 211 on the reference plane are located within the orthographic projection of the liquid cooling plate 300 on the reference plane. The orthographic projections of both the second region 112 and the fourth region 212 on the reference plane are located outside the orthographic projection of the liquid cooling plate 300 on the reference plane. Herein, the reference plane is perpendicular to the thickness direction of the liquid cooling plate 300.

[0088] In this way, the first power board heating element 120 is centrally disposed in the first region 111, and the second power board heating element 220 is centrally disposed in the third region 211. The first power board heating element 120 and the second power board heating element 220 are disposed relatively concentratedly, which is conducive to reducing the size of the liquid cooling plate 300.

[0089] Exemplarily, at least part of the first power board low-temperature components are disposed in the second region 112, and at least part of the second power board low-temperature components are disposed in the fourth region 212.

[0090] In some examples, the orthographic projection of the first region 111 on the reference plane is located within the orthographic projection of the third region 211 on the reference plane.

[0091] In this way, the first power board heating element 120 and the second power board heating element 220 can be disposed relatively concentratedly, which is conducive to reducing the size of the liquid cooling plate 300.

[0092] In some examples, the orthographic projection of the third region 211 on the reference plane is located within the orthographic projection of the first region 111 on the reference plane.

[0093] In this way, the first power board heating element 120 and the second power board heating element 220 can be disposed relatively concentratedly, which is conducive to reducing the size of the liquid cooling plate 300.

[0094] Exemplarily, the orthographic projection of the second region 112 on the reference plane coincides at least partially with the orthographic projection of the fourth region 212 on the reference plane.

[0095] In this way, the overlapping degree of the first substrate 110 and the second substrate 210 can be relatively high, the space utilization rate is relatively high, and the size of the uninterruptible power supply can be made smaller.

[0096] In some examples, the orthographic projection of the second region 112 on the reference plane is located within the orthographic projection of the fourth region 212 on the reference plane.

[0097] In this way, the overlapping degree of the first substrate 110 and the second substrate 210 can be relatively high, the space utilization rate can be relatively high, and the size of the uninterruptible power supply can be made smaller.

[0098] In some examples, the positive projection of the fourth region 212 on the reference plane is located within the positive projection of the second region 112 on the reference plane.

[0099] In this way, the overlapping degree of the first substrate 110 and the second substrate 210 can be relatively high, the space utilization rate can be relatively high, and the size of the uninterruptible power supply can be made smaller.

[0100] Figure 4 It is a schematic diagram of another power conversion module provided by an embodiment of the present application.

[0101] As Figure 4 shown, and referring to Figure 3 , the first surface structure 310 includes a first reference plane 311.

[0102] Exemplarily, the first reference plane 311 is perpendicular to the thickness direction of the liquid cooling plate 300.

[0103] In some examples where the first power conversion board 100 includes a plurality of first power board heating elements 120 and the first power board heating elements 120 are connected to the first surface structure 310, the plurality of first power board heating elements 120 include a first heating element 120a, and the first heating element 120a is connected to the first reference plane 311.

[0104] In this way, the heat conduction path between the first heating element 120a and the liquid cooling plate 300 is relatively short, and the heat dissipation effect of the liquid cooling plate 300 on the first heating element 120a is relatively good.

[0105] Exemplarily, a first thermal interface material 510 is provided between the first heating element 120a and the first reference plane 311, and the first heating element 120a is connected to the first reference plane 311 through the first thermal interface material 510.

[0106] In this way, the first thermal interface material 510 fills the gap between the first heating element 120a and the first reference plane 311, and the heat exchange efficiency between the first heating element 120a and the liquid cooling plate 300 can be relatively high, and the heat dissipation effect of the liquid cooling plate 300 on the first heating element 120a is relatively good.

[0107] Exemplarily, the first heating element 120a can be a first inductor.

[0108] Exemplarily, the power factor correction circuit includes a power factor correction inductor, the charge and discharge circuit includes a charge and discharge inductor, and both the power factor correction inductor and the charge and discharge inductor can be the first inductor.

[0109] In some examples where the first power conversion board 100 includes a plurality of first power board heating elements 120 and the first power board heating elements 120 are in contact with the first surface structure 310, the plurality of first power board heating elements 120 further include a second heating element 120b. The size of the first heating element 120a in the thickness direction of the liquid cooling plate 300 is larger than the size of the second heating element 120b in the thickness direction of the liquid cooling plate 300. A first heat conducting pad 410 is provided between the second heating element 120b and the first reference surface 311, and the second heating element 120b is in contact with the first reference surface 311 through the first heat conducting pad 410.

[0110] In this way, when the first heating element 120a is in contact with the first reference surface 311, the first heat conducting pad 410 can fill the gap between the second heating element 120b and the first reference surface 311, so that both the first heating element 120a and the second heating element 120b with a relatively small size difference in the thickness direction of the liquid cooling plate 300 can dissipate heat through the liquid cooling plate 300.

[0111] Exemplarily, the first heat conducting pad 410 is elastic, that is to say, the first heat conducting pad 410 is an elastic pad, so that both sides of the first heat conducting pad 410 are closely attached to the first reference surface 311 and the second heating element 120b, making the heat exchange efficiency of the second heating element 120b with the liquid cooling plate 300 through the first heat conducting pad 410 relatively high, and the heat dissipation effect of the liquid cooling plate 300 on the second heating element 120b is good.

[0112] Exemplarily, the second heating element 120b can be a first capacitor.

[0113] Exemplarily, the power factor correction circuit includes a power factor correction phase A capacitor, a power factor correction phase B capacitor, and a power factor correction phase C capacitor, and the power factor correction phase A capacitor, the power factor correction phase B capacitor, and the power factor correction phase C capacitor can all be the first capacitor.

[0114] In some examples where the first power conversion board 100 includes a plurality of first power board heating elements 120 and some of the first power board heating elements 120 are in contact with the first surface structure 310, the first surface structure 310 further includes a first boss structure 312 protruding from the first reference plane 311 in the direction of the first substrate 110. The plurality of first power board heating elements 120 further includes a third heating element 120c. The dimension of the first heating element 120a in the thickness direction of the liquid cooling plate 300 is greater than the dimension of the third heating element 120c in the thickness direction of the liquid cooling plate 300. The orthographic projection of the first heating element 120a on the reference plane is located within the orthographic projection of the first reference plane 311 on the reference plane, and the first heating element 120a is in contact with the first reference plane 311. At least a part of the orthographic projection of the third heating element 120c on the reference plane is located within the orthographic projection of the end face of the first boss structure 312 facing away from the first reference plane 311 on the reference plane, and the third heating element 120c is in contact with the end face of the first boss structure 312 facing away from the first reference plane 311.

[0115] In this way, when the first heating element 120a is in contact with the first reference plane 311, the first boss structure 312 can fill the gap between the third heating element 120c and the first reference plane 311, enabling both the first heating element 120a and the third heating element 120c with a relatively large dimension difference in the thickness direction of the liquid cooling plate 300 to dissipate heat through the liquid cooling plate 300.

[0116] Exemplarily, the end face of the first boss structure 312 facing away from the first reference plane 311 is perpendicular to the thickness direction of the liquid cooling plate 300.

[0117] Exemplarily, a second thermal interface material 520 is provided between the third heating element 120c and the end face of the first boss structure 312 facing away from the first reference plane 311, and the third heating element 120c is in contact with the end face of the first boss structure 312 facing away from the first reference plane 311 through the second thermal interface material 520.

[0118] In this way, the second thermal interface material 520 fills the gap between the third heating element 120c and the end face of the first boss structure 312 facing away from the first reference plane 311, enabling a relatively high heat exchange efficiency between the third heating element 120c and the liquid cooling plate 300, and a better heat dissipation effect of the liquid cooling plate 300 on the third heating element 120c.

[0119] In some examples, the dimension of the second heating element 120b in the thickness direction of the liquid cooling plate 300 is greater than the dimension of the third heating element 120c in the thickness direction of the liquid cooling plate 300.

[0120] Exemplarily, the third heating element 120c can be a first power tube assembly.

[0121] Exemplarily, the power factor correction circuit includes a power factor correction A-phase power tube assembly, a power factor correction B-phase power tube assembly and a power factor correction C-phase power tube assembly, the charge and discharge circuit includes a charge and discharge power tube assembly, and the power factor correction A-phase power tube assembly, the power factor correction B-phase power tube assembly, the power factor correction C-phase power tube assembly and the charge and discharge power tube assembly can all be first power tube assemblies.

[0122] Figure 5 An exploded view of a first power conversion board of a power conversion module provided in an embodiment of the present application.

[0123] like Figure 5 As shown, and see Figure 4 In some possible implementations, the third heating element 120c includes a first heating element 121c and a first heat sink 122c. The first heating element 121c is disposed on the first substrate 110, the first heat sink 122c is disposed between the first heating element 121c and the first boss structure 312, one side of the first heat sink 122c is connected to the first heating element 121c, and the other side of the first heat sink 122c is connected to the end surface of the first boss structure 312 away from the first reference surface 311.

[0124] In this way, the heat exchange surface between the first heat sink 122 c and the liquid cooling plate 300 is larger, which is beneficial to improving the heat dissipation effect of the liquid cooling plate 300 on the first heating element 121 c.

[0125] Exemplarily, a third thermal interface material 530 is disposed between the first heating element 121 c and the first heat dissipation plate 122 c , and the first heating element 121 c is connected to the first heat dissipation plate 122 c through the third thermal interface material 530 .

[0126] Exemplarily, the first heat sink 122c may include but is not limited to a metal heat sink, a ceramic heat sink, etc.

[0127] Exemplarily, the first heat sink 122 c is perpendicular to the thickness direction of the liquid cooling plate 300 .

[0128] In some examples where the third heating element 120c is a first power tube assembly, the first heating element 121c may be a first power tube.

[0129] In some possible implementations, the third heating element 120c includes a plurality of first heating elements 121c, and one side of the first heat dissipation plate 122c is connected to the plurality of first heating elements 121c.

[0130] In this way, multiple first heating elements 121c all perform heat exchange with the liquid cooling plate 300 through the first heat dissipation plate 122c, the structure is relatively compact, and the arrangement of the first heat dissipation plate 122c is relatively easy. In addition, the difficulty of setting the first boss structure 312 connected to the first heat dissipation plate 122c can also be reduced.

[0131] In some possible implementation manners, the first heating element 121c includes a first element main body 1211c and a first pin 1212c. The first element main body 1211c is disposed on the first substrate 110 through the first pin 1212c. The plane where the length direction and the width direction of the first element main body 1211c are located is parallel to the first heat dissipation plate 122c. One side of the first element main body 1211c facing away from the first substrate 110 is in contact with the first heat dissipation plate 122c. Among them, both the length and the width of the first element main body 1211c are greater than the thickness of the first element main body 1211c.

[0132] In this way, the heat exchange surface between the first element main body 1211c and the first heat dissipation plate 122c is large, the heat exchange efficiency is high, which is conducive to improving the heat dissipation efficiency of the liquid cooling plate 300 for the first heating element 121c.

[0133] Exemplarily, a third thermal interface material 530 is disposed between the first element main body 1211c and the first heat dissipation plate 122c, and the first element main body 1211c is in contact with the first heat dissipation plate 122c through the third thermal interface material 530.

[0134] As Figure 4 shown, the second surface structure 320 includes a second reference surface 321.

[0135] Exemplarily, the second reference surface 321 is perpendicular to the thickness direction of the liquid cooling plate 300.

[0136] In some examples where the second power conversion board 200 includes multiple second power board heating elements 220 and the second power board heating elements 220 are in contact with the second surface structure 320, the multiple second power board heating elements 220 include a fourth heating element 220a, and the fourth heating element 220a is in contact with the second reference surface 321.

[0137] In this way, the heat conduction path between the fourth heating element 220a and the liquid cooling plate 300 is short, and the heat dissipation effect of the liquid cooling plate 300 on the fourth heating element 220a is good.

[0138] Exemplarily, a fourth thermal interface material 540 is provided between the fourth heating element 220a and the second reference surface 321, and the fourth heating element 220a is in contact with the second reference surface 321 through the fourth thermal interface material 540.

[0139] In this way, the fourth thermal interface material 540 fills the gap between the fourth heat generating component 220a and the second reference plane 321, which can enable a relatively high heat exchange efficiency between the fourth heat generating component 220a and the liquid cooling plate 300, and the liquid cooling plate 300 has a good heat dissipation effect on the fourth heat generating component 220a.

[0140] Exemplarily, the fourth heat generating component 220a can be the second inductor.

[0141] Exemplarily, the inverter circuit includes an inverter inductor, and the inverter inductor can be the second inductor.

[0142] In some examples where the second power conversion board 200 includes a plurality of second power board heat generating components 220 and the second power board heat generating components 220 are in contact with the second surface structure 320, the plurality of second power board heat generating components 220 further include a fifth heat generating component 220b. The dimension of the fourth heat generating component 220a in the thickness direction of the liquid cooling plate 300 is larger than the dimension of the fifth heat generating component 220b in the thickness direction of the liquid cooling plate 300. A second thermal pad 420 is provided between the fifth heat generating component 220b and the second reference plane 321, and the fifth heat generating component 220b is in contact with the second reference plane 321 through the second thermal pad 420.

[0143] In this way, when the fourth heat generating component 220a is in contact with the second reference plane 321, the second thermal pad 420 can fill the gap between the fifth heat generating component 220b and the second reference plane 321, so that both the fourth heat generating component 220a and the fifth heat generating component 220b with a relatively small dimension difference in the thickness direction of the liquid cooling plate 300 can dissipate heat through the liquid cooling plate 300.

[0144] Exemplarily, the second thermal pad 420 has elasticity, that is to say, the second thermal pad 420 is an elastic pad, so that both sides of the second thermal pad 420 are closely attached to the second reference plane 321 and the fifth heat generating component 220b, enabling a relatively high heat exchange efficiency between the fifth heat generating component 220b and the liquid cooling plate 300 through the second thermal pad 420, and the liquid cooling plate 300 has a good heat dissipation effect on the fifth heat generating component 220b.

[0145] Exemplarily, the fifth heat generating component 220b can be the second capacitor.

[0146] Exemplarily, the inverter circuit includes an inverter phase A capacitor, an inverter phase B capacitor, and an inverter phase C capacitor, and the inverter phase A capacitor, the inverter phase B capacitor, and the inverter phase C capacitor can all be the second capacitor.

[0147] In some examples where the second power conversion board 200 includes a plurality of second power board heating elements 220 and some of the second power board heating elements 220 are in contact with the second surface structure 320, the second surface structure 320 further includes a second boss structure 322 protruding from the second reference plane 321 towards the second substrate 210. The plurality of second power board heating elements 220 further includes a sixth heating element 220c. The dimension of the fourth heating element 220a in the thickness direction of the liquid cooling plate 300 is greater than the dimension of the sixth heating element 220c in the thickness direction of the liquid cooling plate 300. The orthographic projection of the fourth heating element 220a on the reference plane is located within the orthographic projection of the second reference plane 321 on the reference plane, and the fourth heating element 220a is in contact with the second reference plane 321. At least part of the orthographic projection of the sixth heating element 220c on the reference plane is located within the orthographic projection of the end face of the second boss structure 322 facing away from the second reference plane 321 on the reference plane, and the sixth heating element 220c is in contact with the end face of the second boss structure 322 facing away from the second reference plane 321.

[0148] In this way, when the fourth heating element 220a is in contact with the second reference plane 321, the second boss structure 322 can fill the gap between the sixth heating element 220c and the second reference plane 321, enabling both the fourth heating element 220a and the sixth heating element 220c with a relatively large dimension difference in the thickness direction of the liquid cooling plate 300 to dissipate heat through the liquid cooling plate 300.

[0149] Exemplarily, the end face of the second boss structure 322 facing away from the second reference plane 321 is perpendicular to the thickness direction of the liquid cooling plate 300.

[0150] Exemplarily, a fifth thermal interface material 550 is provided between the sixth heating element 220c and the end face of the second boss structure 322 facing away from the second reference plane 321, and the sixth heating element 220c is in contact with the end face of the second boss structure 322 facing away from the second reference plane 321 through the fifth thermal interface material 550.

[0151] In this way, the fifth thermal interface material 550 fills the gap between the sixth heating element 220c and the end face of the second boss structure 322 facing away from the second reference plane 321, enabling a relatively high heat exchange efficiency between the sixth heating element 220c and the liquid cooling plate 300, and the liquid cooling plate 300 has a better heat dissipation effect on the sixth heating element 220c.

[0152] In some examples, the dimension of the fifth heating element 220b in the thickness direction of the liquid cooling plate 300 is greater than the dimension of the sixth heating element 220c in the thickness direction of the liquid cooling plate 300.

[0153] Exemplarily, the sixth heating element 220c can be a second power tube assembly.

[0154] Exemplarily, the inverter circuit includes an inverter A-phase power tube assembly, an inverter B-phase power tube assembly and an inverter C-phase power tube assembly, and the inverter A-phase power tube assembly, the inverter B-phase power tube assembly and the inverter C-phase power tube assembly can be the second power tube assembly.

[0155] In some possible implementations, the sixth heating element 220c includes a second heating element 221c and a second heat sink 222c. The second heating element 221c is disposed on the second substrate 210, the second heat sink 222c is disposed between the second heating element 221c and the second boss structure 322, one side of the second heat sink 222c is connected to the second heating element 221c, and the other side of the second heat sink 222c is connected to the end face of the second boss structure 322 away from the second reference surface 321.

[0156] In this way, the heat exchange surface between the second heat sink 222c and the liquid cooling plate 300 is larger, which is beneficial to improving the heat dissipation effect of the liquid cooling plate 300 on the second heating element 221c.

[0157] Exemplarily, a sixth thermal interface material 560 is disposed between the second heating element 221 c and the second heat dissipation plate 222 c , and the second heating element 221 c is connected to the second heat dissipation plate 222 c through the sixth thermal interface material 560 .

[0158] Exemplarily, the second heat sink 222c may include but is not limited to a metal heat sink, a ceramic heat sink, etc.

[0159] Exemplarily, the second heat sink 222 c is perpendicular to the thickness direction of the liquid cooling plate 300 .

[0160] In some examples where the sixth heating element 220c is a second power tube assembly, the second heating element 221c may be a second power tube.

[0161] In some possible implementations, the sixth heating element 220c includes a plurality of second heating elements 221c, and one side of the second heat dissipation plate 222c is connected to the plurality of second heating elements 221c.

[0162] In this way, the plurality of second heating elements 221c are heat exchanged with the liquid cooling plate 300 through the second heat sink 222c, the structure is relatively compact, and the second heat sink 222c is relatively easy to arrange. In addition, the difficulty of setting the second boss structure 322 connected to the second heat sink 222c can also be reduced.

[0163] In some possible embodiments, the second heating element 221c includes a second element body 2211c and second pins. The second element body 2211c is disposed on the second substrate 210 through the second pins. The plane where the length direction and the width direction of the second element body 2211c are located is parallel to the second heat dissipation plate 222c. One side of the second element body 2211c facing away from the second substrate 210 is in contact with the second heat dissipation plate 222c. Wherein, both the length and the width of the second element body 2211c are greater than the thickness of the second element body 2211c.

[0164] In this way, the heat exchange surface between the second element body 2211c and the second heat dissipation plate 222c is large, and the heat exchange efficiency is high, which is beneficial to improving the heat dissipation efficiency of the liquid cooling plate 300 for the second heating element 221c.

[0165] Exemplarily, a sixth thermal interface material 560 is disposed between the second element body 2211c and the second heat dissipation plate 222c. The second element body 2211c is in contact with the second heat dissipation plate 222c through the sixth thermal interface material 560.

[0166] In some possible embodiments, the housing includes a first cover shell and a second cover shell. The first cover shell and the second cover shell are oppositely disposed along the thickness direction of the liquid cooling plate 300. The first power conversion board 100, the liquid cooling plate 300, and the second power conversion board 200 are located between the first cover shell and the second cover shell. The first power conversion board 100 is located between the second power conversion board 200 and the first cover shell. The first power conversion board 100 is fixedly connected to the first cover shell. The first cover shell is fixedly connected to the liquid cooling plate 300. The first cover shell presses the first power conversion board 100 against the liquid cooling plate 300. The second power conversion board 200 is located between the first power conversion board 100 and the second cover shell. The second power conversion board 200 is fixedly connected to the second cover shell. The second cover shell is fixedly connected to the liquid cooling plate 300. The second cover shell presses the second power conversion board 200 against the liquid cooling plate 300.

[0167] In this way, the liquid cooling plate 300 can be closely attached to both the first power conversion board 100 and the second power conversion board 200, so that the heat dissipation effect of the liquid cooling plate 300 on the first power conversion board 100 and the second power conversion board 200 is better.

[0168] Exemplarily, the first cover shell and the second cover shell are connected by covering to enclose the inner cavity of the housing.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power conversion module, characterized in that: It includes a first power conversion board, a second power conversion board and a liquid cooling board; The first power conversion plate, the liquid cooling plate and the second power conversion plate are stacked along the thickness direction of the liquid cooling plate, the liquid cooling plate is located between the first power conversion plate and the second power conversion plate, and the two side surfaces in the thickness direction of the liquid cooling plate are respectively connected to the first power conversion plate and the second power conversion plate.

2. The power conversion module according to claim 1, characterized in that: The first power conversion board includes a first substrate and a first power board heating element disposed on the first substrate, the liquid cooling plate is located on a side of the first power board heating element away from the first substrate, and the first power board heating element is connected to a side surface of the liquid cooling plate in a thickness direction; And / or, the second power conversion board includes a second substrate and a second power board heating element arranged on the second substrate, the liquid cooling plate is located on the side of the second power board heating element away from the second substrate, and the second power board heating element is connected to the other side surface of the liquid cooling plate in the thickness direction.

3. The power conversion module according to claim 2, characterized in that: The first substrate includes a first area and a second area, and the first power board heating element is arranged in the first area; The second substrate includes a third area and a fourth area, and the second power board heating element is arranged in the third area; The orthographic projection of the first region on the reference plane at least partially overlaps with the orthographic projection of the third region on the reference plane; The orthographic projection of the first area on the reference plane and the orthographic projection of the third area on the reference plane are both located within the orthographic projection of the liquid cooling plate on the reference plane; The orthographic projection of the second area on the reference plane and the orthographic projection of the fourth area on the reference plane are both located outside the orthographic projection of the liquid cooling plate on the reference plane; Wherein, the reference plane is perpendicular to the thickness direction of the liquid cooling plate.

4. The power conversion module according to claim 2, characterized in that: The liquid cooling plate comprises a first surface structure, and the first surface structure is located on one side of the liquid cooling plate in a thickness direction; The first surface structure includes a first reference plane, the first power conversion board includes a plurality of the first power board heating elements, the plurality of the first power board heating elements include a first heating element and a second heating element, a size of the first heating element in the thickness direction of the liquid cooling plate is larger than a size of the second heating element in the thickness direction of the liquid cooling plate, the first heating element is connected to the first reference plane, a first thermal conductive pad is provided between the second heating element and the first reference plane, and the second heating element is connected to the first reference plane through the first thermal conductive pad.

5. The power conversion module according to claim 2, characterized in that: The liquid cooling plate comprises a first surface structure, and the first surface structure is located on one side of the liquid cooling plate in a thickness direction; The first surface structure includes a first reference plane and a first boss structure protruding from the first reference plane in the direction of the first substrate, the first power conversion board includes a plurality of first power board heating elements, the plurality of first power board heating elements include a first heating element and a third heating element, and the size of the first heating element in the thickness direction of the liquid cooling plate is greater than the size of the third heating element in the thickness direction of the liquid cooling plate; The orthographic projection of the first heating element on the reference plane is located within the orthographic projection of the first reference plane on the reference plane, and the first heating element is in contact with the first reference plane; At least part of the orthographic projection of the third heating element on the reference plane is located within the orthographic projection of the end surface of the first boss structure away from the first reference plane on the reference plane, and the third heating element is connected to the end surface of the first boss structure away from the first reference plane; Wherein, the reference plane is perpendicular to the thickness direction of the liquid cooling plate.

6. The power conversion module according to claim 5, characterized in that: The third heating element includes a first heating element and a first heat dissipation plate; The first heating element is arranged on the first substrate, the first heat sink is arranged between the first heating element and the first boss structure, one side of the first heat sink is connected to the first heating element, and the other side of the first heat sink is connected to the end surface of the first boss structure away from the first reference plane.

7. The power conversion module according to claim 6, characterized in that: The third heating element includes a plurality of the first heating elements, and one side of the first heat dissipation plate is connected to the plurality of the first heating elements.

8. The power conversion module according to claim 6, characterized in that: The first heating element comprises a first element body and a first pin, the first element body is arranged on the first substrate through the first pin, the plane where the length direction of the first element body and the width direction of the first element body are located is parallel to the first heat sink, and the side of the first element body facing away from the first substrate is connected to the first heat sink; Wherein, the length of the first component body and the width of the first component body are both greater than the thickness of the first component body.

9. The power conversion module according to any one of claims 1 to 8, characterized in that: Also includes a first cover shell and a second cover shell; The first cover shell and the second cover shell are arranged opposite to each other along the thickness direction of the liquid cooling plate, and the first power conversion board, the liquid cooling plate and the second power conversion board are located between the first cover shell and the second cover shell; The first power conversion board is located between the second power conversion board and the first cover shell, the first power conversion board is fixedly connected to the first cover shell, the first cover shell is fixedly connected to the liquid cooling plate, and the first cover shell presses the first power conversion board onto the liquid cooling plate; The second power conversion board is located between the first power conversion board and the second cover shell, the second power conversion board is fixedly connected to the second cover shell, the second cover shell is fixedly connected to the liquid cooling plate, and the second cover shell presses the second power conversion board onto the liquid cooling plate.

10. An uninterruptible power supply, characterized in that: It comprises a cabinet and a power conversion module as described in any one of claims 1 to 9, wherein the power conversion module is arranged in the cabinet.

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