Packaging machine control panel capable of increasing heat dissipation area

Abstract

The utility model discloses a packing machine control panel capable of increasing heat dissipation area, which relates to the technical field of control panels and comprises a control panel component and a driving frame group, the periphery of the control panel component is connected with an assembly frame group, the driving frame group is mounted at the bottom of the assembly frame group, and the left end and the right end of the middle of the driving frame group are connected with heat dissipation fans. According to the packaging machine control panel capable of increasing the heat dissipation area, one side of the control panel main body is connected and provided with the heat conduction plate and the heat dissipation fins, heat generated when electronic components in the whole control panel main body operate can be transmitted and dissipated rapidly at the same time to the maximum extent, and meanwhile under the operation of the driving frame set, the heat dissipation efficiency is improved. The control panel assembly drives the driving frame assembly to drive the cooling fan connected with the driving frame assembly to horizontally move left and right in a reciprocating mode so as to achieve the maximum cooling area, meanwhile, the comprehensive cooling effect can be guaranteed, and in addition, the assembly frame assembly plays a role in connecting the control panel assembly, the driving frame assembly and the cooling fan, and meanwhile, a certain degree of structural protection effect is provided.

Description

Technical Field

[0001] The utility model relates to the technical field of control panels, in particular to a packaging machine control panel with improved heat dissipation area. Background Art

[0002] A control board is a circuit board that is more intelligent and automated than ordinary circuit boards and can play a control role. Control boards are widely used in various fields, such as industrial automation, medical equipment, automotive electronics, smart homes, etc., responsible for monitoring the operating status of equipment and providing necessary control functions. For example, in the industrial field, control boards can be used for automation control, robot control, and conveyor belt control to improve production efficiency and product quality; in smart homes, control boards can be used for remote control of lights, curtains, and air conditioners, making home life more convenient and comfortable; in the field of automotive electronics, control boards can be used to monitor the driving status of the car and provide convenient and safe services for drivers.

[0003] The control board usually includes a panel, a main control board and a driver board. Some control boards are already flashed with solidified standard control programs when they leave the factory. After installation, you only need to modify limited parameters according to project requirements to achieve the control purpose.

[0004] The heat dissipation structure of a conventional control board only dissipates heat for some components, so that the heat dissipation area of ​​the entire control board is relatively limited. At the same time, the connection structure between the entire control board and the mounting structure surface is relatively simple, making it easy to be damaged in the event of an external impact.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and a packaging machine control board with increased heat dissipation area is proposed. Utility Model Content

[0006] The utility model aims to provide a packaging machine control board with improved heat dissipation area to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a packaging machine control panel with improved heat dissipation area, comprising a control panel assembly and a drive frame group, wherein the control panel assembly is connected with an assembly frame group around it, the drive frame group is installed at the bottom of the assembly frame group, and cooling fans are connected with the left and right ends of the middle of the drive frame group, the control panel assembly comprises a heat conducting plate, a control panel body and a heat sink, a surface of one side of the heat conducting plate is connected with the control panel body, and a surface of one side of the heat conducting plate away from the control panel body is connected with a heat sink.

[0008] Furthermore, the area of ​​the heat conducting plate controls the area of ​​the plate body, and the heat sink and the heat conducting plate are closely fitted, and the heat sink adopts a hollow structure and is filled with fluorinated liquid.

[0009] Further, the assembly frame group includes an upper protection frame, a lower protection frame, a fixing groove and fastening bolts. The bottom of the upper protection frame is connected to the lower protection frame, and fixing grooves are provided on the inner walls of the docking parts of the upper protection frame and the lower protection frame, and fastening bolts are vertically threadedly connected to the four sides of the lower protection frame.

[0010] Further, the structures between the lower protection frame and the upper protection frame are the same, and the fastening bolts are all threadedly connected between the upper protection frame and the lower protection frame. The inner surface structure of the fixing groove matches the surface structure of the four peripheral edges of the heat conduction plate.

[0011] Further, the assembly frame group further includes assembly piles and fixing bolts. Assembly piles are installed on both the left and right sides of the lower protection frame, and fixing bolts are vertically threadedly installed inside the assembly piles.

[0012] Further, the assembly piles are fixedly connected to the lower protection frame, and the assembly piles are symmetrically arranged at the front and rear ends of the sides of the lower protection frame.

[0013] Further, the driving frame group includes a driving seat, a bidirectional lead screw, a moving frame and a support frame. The power output end of the driving seat is horizontally connected to the bidirectional lead screw through a coupling, and moving frames are symmetrically threadedly installed at both ends of the bidirectional lead screw, and a support frame is installed on the side of the moving frame away from the assembly frame group.

[0014] Further, the cooling fans are symmetrically installed at both ends of the side of the support frame away from the moving frame, and the driving seat and the bidirectional lead screw are symmetrically arranged and connected to the left and right sides of the moving frame, and the moving frame and the support frame are fixedly connected.

[0015] The utility model provides a control board of a packaging machine for increasing the heat dissipation area, which has the following beneficial effects:

[0016] 1. In the utility model, a heat conduction plate is attached to the back side of the control board main body. At the same time, the area of the side of the heat conduction plate in contact with the control board main body is larger than the contact area of the control board main body. When the whole control board main body is in use, the heat generated by a number of electronic devices installed on the other side surface will be completely transferred to the heat conduction plate, thus providing the most effective heat dissipation area for the control board main body to the greatest extent. At the same time, heat dissipation fins in a continuous "S" shape are connected to the other side. By adopting a hollow structure and injecting fluorinated liquid into it, the whole heat dissipation fin can have the functions of effective heat absorption and heat conduction, so that the heat generated by the operation of the control board main body can be quickly absorbed and transferred to the external environment. By using the above structure, it is possible to avoid structural interference with each component to the greatest extent while not affecting the installation of electronic components on one side of the control board main body, and at the same time, it can provide an effective structural heat dissipation function to avoid the situation of overload of the control board main body caused by heat concentration.

[0017] 2. In this utility model, an assembly frame group is provided around the periphery of the control board assembly. By using the upper protection frame and the lower protection frame with an up-and-down splicing structure, the control board assembly is clamped from the four edges of the heat conducting plate, so that a certain degree of anti-collision protection can be effectively provided for the entire control board assembly from the edges, avoiding structural damage caused by bumps. At the same time, fixing grooves matching the edge structure of the heat conducting plate are provided on the upper protection frame and the lower protection frame, so as to realize the stability when clamping and fixing the control board assembly. With the use of the fastening bolts around, while ensuring the structural stability when the upper protection frame and the lower protection frame are connected, the disassembly and assembly operations can be simplified as much as possible to ensure the convenience of operation. In addition, the use of the assembly posts and the fixing bolts can fix the entire device inside the installation structure and play a role in structural support to ensure the structural stability of the entire device.

[0018] 3. In this utility model, a drive frame group and a heat dissipation fan are installed at the bottom of the assembly frame group. The heat dissipation fans are symmetrically installed at both ends of the support frame. When the drive seat operates and drives the bidirectional lead screw connected to its power output end to rotate axially in the horizontal direction, at this time, the moving frames symmetrically thread-connected to both ends of the bidirectional lead screw will translate in the horizontal direction along the surface of the bidirectional lead screw. At this time, the heat dissipation fans connected to the support frame will translate synchronously in the horizontal direction, and the heat dissipation fans themselves will operate synchronously. The wind generated by their operation will directly act on one side surface of the control board main body and the heat sink, and quickly blow the heat on its surface to the external environment. At the same time, under the operation of the entire drive frame group, the heat dissipation fans will reciprocate left and right at the bottom of the control board assembly to ensure that the heat on the bottom surface of the entire control board assembly can be effectively and quickly dissipated, ensuring the heat dissipation effect. Description of the Drawings

[0019] Figure 1 It is a three-dimensional structure diagram of the main body of a packaging machine control board with increased heat dissipation area according to this utility model;

[0020] Figure 2 It is a bottom three-dimensional structure diagram of the main body of a packaging machine control board with increased heat dissipation area according to this utility model;

[0021] Figure 3 It is a three-dimensional structure diagram of the control board assembly of a packaging machine control board with increased heat dissipation area according to this utility model;

[0022] Figure 4 It is a three-dimensional structure diagram of the assembly frame group of a packaging machine control board with increased heat dissipation area according to this utility model;

[0023] Figure 5 It is a three-dimensional structure diagram of the drive frame group of a packaging machine control board with increased heat dissipation area according to this utility model.

[0024] In the figure: 1. Control board assembly; 101. Heat conduction plate; 102. Control board main body; 103. Heat sink; 2. Assembly frame group; 201. Upper protection frame; 202. Lower protection frame; 203. Fixed groove; 204. Fastening bolt; 205. Assembly pile; 206. Fixed bolt; 3. Driving frame group; 301. Driving seat; 302. Bidirectional lead screw; 303. Moving frame; 304. Support frame; 4. Heat dissipation fan. Specific implementation mode

[0025] The following further describes the implementation mode of the present utility model in detail with reference to the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0026] As Figures 1 to 5 shown, a packaging machine control board for increasing the heat dissipation area includes a control board assembly 1 and a driving frame group 3. The periphery of the control board assembly 1 is connected with an assembly frame group 2. The driving frame group 3 is installed at the bottom of the assembly frame group 2, and heat dissipation fans 4 are connected to the left and right ends of the middle part of the driving frame group 3. The control board assembly 1 includes a heat conduction plate 101, a control board main body 102 and a heat sink 103. One side surface of the heat conduction plate 101 is connected with the control board main body 102, and the other side surface of the heat conduction plate 101 far from the control board main body 102 is connected with the heat sink 103. The area of the heat conduction plate 101 is larger than the area of the control board main body 102, and the heat sink 103 is closely attached to the heat conduction plate 101. Moreover, the heat sink 103 adopts a hollow structure and is filled with fluorinated liquid inside. The area of the side of the heat conduction plate 101 in contact with the control board main body 102 is larger than the contact area of the control board main body 102, so that when the entire control board main body 102 is in use, the heat generated by a plurality of electronic devices installed on the other side surface thereof will be completely transferred to the heat conduction plate 101, thereby providing the most effective heat dissipation area for the control board main body 102 to the greatest extent. At the same time, a heat sink 103 in the shape of a continuous "S" is connected to the other side. By adopting a hollow structure and filling it with fluorinated liquid, the entire heat sink 103 can have the functions of effective heat absorption and heat conduction, so that the heat generated by the operation of the control board main body 102 can be quickly absorbed and transferred to the external environment.

[0027] As Figures 1 to 5As shown in the figure, the assembly frame group 2 includes an upper protection frame 201, a lower protection frame 202, a fixing groove 203 and fastening bolts 204. The bottom of the upper protection frame 201 is connected to the lower protection frame 202. The inner walls of the docking parts of the upper protection frame 201 and the lower protection frame 202 are provided with fixing grooves 203. The four sides of the lower protection frame 202 are vertically threadedly connected with fastening bolts 204. The structures between the lower protection frame 202 and the upper protection frame 201 are the same, and the fastening bolts 204 are all threadedly connected between the upper protection frame 201 and the lower protection frame 202. The inner surface structure of the fixing groove 203 matches the surface structure of the four edges of the heat conducting plate 101. The assembly frame group 2 further includes assembly piles 205 and fixing bolts 206. Assembly piles 205 are installed on both the left and right sides of the lower protection frame 202, and fixing bolts 206 are vertically threadedly installed inside the assembly piles 205. The assembly piles 205 are fixedly connected to the lower protection frame 202, and the assembly piles 205 are symmetrically arranged at the front and rear ends of the sides of the lower protection frame 202. By using the upper protection frame 201 and the lower protection frame 202 with an up-and-down splicing structure, the heat conducting plate 101 is clamped from the four edges up and down, so that a certain degree of anti-collision protection can be effectively provided for the entire control board assembly 1 from the edges. With the use of the fastening bolts 204 around, while ensuring the structural stability when the upper protection frame 201 and the lower protection frame 202 are connected, the disassembly and assembly operations can be simplified as much as possible.

[0028] As Figures 1 to 5 shown in the figure, the drive frame group 3 includes a drive seat 301, a bidirectional lead screw 302, a moving frame 303 and a support frame 304. The power output end of the drive seat 301 is horizontally connected to the bidirectional lead screw 302 through a coupling. The two ends of the bidirectional lead screw 302 are symmetrically threadedly installed with moving frames 303. A support frame 304 is installed on the side of the moving frame 303 away from the assembly frame group 2. The heat dissipation fans 4 are symmetrically installed at both ends of the side of the support frame 304 away from the moving frame 303. The drive seat 301 and the bidirectional lead screw 302 are symmetrically arranged and connected to the left and right sides of the moving frame 303, and the moving frame 303 and the support frame 304 are fixedly connected. When the drive seat 301 operates and drives the bidirectional lead screw 302 connected to its power output end to rotate axially in the horizontal direction, at this time, the moving frames 303 symmetrically threadedly connected to both ends of the bidirectional lead screw 302 will translate in the horizontal direction along the surface of the bidirectional lead screw 302. At this time, the heat dissipation fans 4 connected thereto through the support frame 304 will translate synchronously in the horizontal direction, and the heat dissipation fans 4 themselves will operate synchronously. The wind generated by their operation will directly act on one side surface of the control board main body 102 and the heat sink 103, and quickly blow the heat on their surfaces to the external environment.

[0029] In summary, as Figures 1 to 5As shown, for the control board of the packaging machine that increases the heat dissipation area, during use, first, the drive frame group 3 and the heat dissipation fan 4 connected to the bottom can be fixedly installed through the assembly piles 205 on the side of the lower protection frame 202 and the fixing bolts 206 therein. Subsequently, the side of the control board main body 102 in the control board assembly 1 where the heat conduction plate 101 is connected is placed downward, and the edge of the heat conduction plate 101 is fitted into the interior of the fixing groove 203. Then, the upper protection frame 201 can be used to conduct structural docking with the lower protection frame 202 from above the control board assembly 1, and four fastening bolts 204 are respectively screwed in sequentially around the upper protection frame 201 and the lower protection frame 202, so as to connect the upper protection frame 201 and the lower protection frame 202, and at the same time clamp and fix the control board assembly 1 therein;

[0030] After the control board main body 102 is electrically connected to external devices, with the operation of the control board main body 102, with the cooperation of the heat conduction plate 101 and the heat sink 103, the heat generated will be quickly absorbed and transferred. At the same time, under the operation of the drive seat 301, the bidirectional lead screw 302 connected to it through the coupling will rotate horizontally in the axial direction simultaneously, and drive the moving frames 303 threadedly connected at both ends to perform left-right reciprocating translation in the horizontal direction. As the moving frames 303 translate, the heat dissipation fans 4 connected to them by the support frames 304 will translate synchronously. During the movement of the heat dissipation fans 4, the heat dissipation fans 4 will rotate at high speed synchronously and generate a strong wind force acting on the surfaces of the heat conduction plate 101 and the heat sink 103 to achieve the effect of quickly dissipating heat and cooling down.

[0031] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and enable those of ordinary skill in the art to understand the present invention and thus design various embodiments with various modifications suitable for specific purposes.

Claims

1. A packaging machine control board with improved heat dissipation area, comprising a control board assembly (1) and a drive frame assembly (3), characterized in that: The control panel assembly (1) is connected to an assembly frame assembly (2) on all sides, the drive frame assembly (3) is installed at the bottom of the assembly frame assembly (2), and the left and right ends of the middle of the drive frame assembly (3) are connected to cooling fans (4), the control panel assembly (1) comprises a heat conduction plate (101), a control panel body (102) and a heat sink (103), one side surface of the heat conduction plate (101) is connected to the control panel body (102), and the side surface of the heat conduction plate (101) away from the control panel body (102) is connected to the heat sink (103).

2. A packaging machine control board with increased heat dissipation area according to claim 1, characterized in that: The area of ​​the heat conducting plate (101) controls the area of ​​the plate body (102), and the heat sink (103) is tightly fitted to the heat conducting plate (101). The heat sink (103) has a hollow structure and is filled with fluorinated liquid.

3. A packaging machine control board with increased heat dissipation area according to claim 1, characterized in that: The assembly frame group (2) comprises an upper protection frame (201), a lower protection frame (202), a fixing groove (203) and a fastening bolt (204); the bottom of the upper protection frame (201) is connected to the lower protection frame (202); the inner wall of the joint between the upper protection frame (201) and the lower protection frame (202) is provided with a fixing groove (203); and the four sides of the lower protection frame (202) are vertically threadedly connected with the fastening bolts (204).

4. A packaging machine control board with increased heat dissipation area according to claim 3, characterized in that: The lower protection frame (202) and the upper protection frame (201) have the same structure, and the fastening bolts (204) are threadedly connected to the upper protection frame (201) and the lower protection frame (202), and the inner surface structure of the fixing groove (203) matches the peripheral edge surface structure of the heat conducting plate (101).

5. A packaging machine control board with increased heat dissipation area according to claim 4, characterized in that: The assembly frame assembly (2) further comprises an assembly pile (205) and a fixing bolt (206); the assembly piles (205) are installed on both the left and right sides of the lower protection frame (202), and the fixing bolts (206) are installed on the internal vertical threads of the assembly piles (205).

6. A packaging machine control board with increased heat dissipation area according to claim 5, characterized in that: The assembly pile (205) is fixedly connected to the lower protection frame (202), and the assembly pile (205) is symmetrically arranged at the front and rear ends of the side of the lower protection frame (202).

7. A packaging machine control board with increased heat dissipation area according to claim 1, characterized in that: The driving frame assembly (3) comprises a driving seat (301), a bidirectional lead screw (302), a moving frame (303) and a supporting frame (304); the power output end of the driving seat (301) is horizontally connected to the bidirectional lead screw (302) via a coupling, and the moving frame (303) is symmetrically threadedly mounted on both ends of the bidirectional lead screw (302), and the supporting frame (304) is mounted on a side of the moving frame (303) away from the assembly frame assembly (2).

8. A packaging machine control board with increased heat dissipation area according to claim 7, characterized in that: The cooling fan (4) is symmetrically mounted on both ends of one side of the support frame (304) away from the movable frame (303), and the drive seat (301) and the bidirectional lead screw (302) are symmetrically arranged and connected to the left and right sides of the movable frame (303), and the movable frame (303) and the support frame (304) are fixedly connected.

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