LED support structure with separated base islands

Abstract

The utility model relates to the technical field of LED supports, in particular to an LED support structure with separated base islands, which comprises a support body, support frame bodies are fixedly connected to the upper side and the lower side of the support body, and a plurality of placing frame bodies are arranged on the support body and located in support areas of the support frame bodies. Each placing frame body comprises a colloid layer located on the outer side of the placing frame body, a condensation bowl cup is arranged in the middle of the frame body, a metal layer is arranged in the condensation bowl cup, an IC placing area is arranged on the metal layer, and a chip is placed on the IC placing area; by adjusting the structure, a single chip can be placed on a single bonding pad, the separation and independent circuit control of a solid chip and a base island are achieved, the problem of silver ion migration is solved, and the structure is very practical.

Description

Technical Field

[0001] The utility model relates to the technical field of LED brackets, and specifically provides an LED bracket structure with a separated base island. Background Art

[0002] An LED bracket is a key component used to fix and support an LED chip during LED chip packaging. It is usually made of metal or plastic materials and has electrical conductivity to transmit current to the LED chip to make it emit light.

[0003] The main functions of the LED bracket include:

[0004] Fixing and supporting: The LED bracket provides stable support for the LED chip to ensure its correct position and angle during the packaging process.

[0005] Electrical connection: The conductive part of the bracket is connected to the positive and negative electrodes of the LED chip to ensure that current can pass through the chip smoothly, thereby making it emit light.

[0006] Heat dissipation: The LED generates heat during operation, and the design of the bracket also takes into account the heat dissipation performance, which helps to effectively dissipate the heat, maintain the stability of the LED and extend its service life.

[0007] Protecting the chip: The bracket can also protect the LED chip from damage by the external environment to a certain extent, such as dust, moisture, etc. According to the type and application scenario of the LED, the shape, size and material of the bracket will also be different. With the continuous development of LED technology, the design and manufacture of LED brackets are also constantly improving to meet higher performance requirements and a wider range of application scenarios.

[0008] As Figure 4 shown, the existing LED bracket products in the prior art are all a large solder pad, and the chips are all placed on one solder pad, which cannot achieve the purpose of placing a single chip on a single solder pad, and thus cannot achieve independent circuit control, affecting the migration of silver ions; moreover, the existing LED bracket products are not conducive to the light output efficiency of the light source, which will increase energy consumption.

[0009] Therefore, it is necessary to design an LED bracket structure with a separated base island to solve the above-mentioned problems. Summary of the Utility Model

[0010] The purpose of the utility model is to provide an LED bracket structure with a separated base island to solve the problems raised in the above background art.

[0011] To achieve the above purpose, the utility model provides the following technical solutions:

[0012] An LED bracket structure with a separated base island, including a bracket body, bracket frames are fixedly connected to the upper and lower sides of the bracket body, and a number of placement frames are arranged on the bracket body in the area of the bracket frames;

[0013] Each of the number of placement frames respectively includes a colloid layer on its outer side, a condenser bowl is arranged in the middle position of the placement frame, a metal layer is arranged inside the condenser bowl, an IC placement area is arranged on the metal layer, and chips, chip R, chip G, and chip B are placed on the IC placement area on different pads.

[0014] As a preferred solution of the present utility model, the colloid layer adopts PPA glue.

[0015] As a preferred solution of the present utility model, the condenser bowl is designed in an elliptical cup shape.

[0016] As a preferred solution of the present utility model, solder pins are arranged at the bottom of the condenser bowl.

[0017] As a preferred solution of the present utility model, a patch board identification chamfer is arranged at one of the corners of the colloid layer, and the patch board identification chamfer adopts a triangular structure.

[0018] As a preferred solution of the present utility model, the metal layer is made of iron material.

[0019] Beneficial effects: In view of the problem that in the prior art, LED bracket products all have a large pad, and chips are all placed on one pad, the purpose of placing a single chip on a single pad cannot be achieved, and thus independent circuit control cannot be achieved, which affects the migration of silver ions; and the existing LED bracket products are not convenient for the light output efficiency of the light source, which will increase energy consumption. In the present utility model, by improving the structure of the existing LED bracket, the placement of a single chip on a single pad is achieved, the separation of the chip base island is achieved, independent circuit control is achieved, and the problem of silver ion migration is solved; the shape of the condenser bowl is made into an elliptical cup shape, which is beneficial to increasing the light output efficiency of the light source and thus reducing energy consumption, and is very practical. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of the LED bracket structure of the present utility model;

[0021] Figure 2 It is a schematic diagram of the structure of the placement frame of the present utility model;

[0022] Figure 3 It is a side view of the placement frame of the present utility model;

[0023] Figure 4 It is a schematic diagram of the installation structure of the existing product;

[0024] Figure 5 , Figure 6 , Figure 7 is a schematic diagram of the improved product installation structure.

[0025] In the figure: 1. Bracket body; 2. Bracket frame; 3. Placing rack; 31. Colloid layer; 32. Condensing bowl cup; 33. Metal layer; 34. IC placement area; 35. Chip; 36. PPA adhesive; 4. Solder pin; 5. Board-attaching identification chamfer; 6. Positioning hole. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant. Several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0030] Please refer to Figures 1-7 , the present invention provides a technical solution:

[0031] An LED bracket structure with a separated base island, including a bracket body 1, bracket frames 2 fixedly connected to both the upper and lower sides of the bracket body 1, and a plurality of placement frames 3 arranged on the bracket body 1 in the area of the bracket frames 2, made of a black, highly fluid, easy-to-mold, UV-resistant, and high-temperature-resistant material.

[0032] Specifically, each of the plurality of placement frames 3 includes a colloid layer 31 on its outer side, and a condenser bowl 32 is arranged in the middle position of the placement frame 3 for the chip fixing method and arrangement. A metal layer 33 is arranged inside the condenser bowl 32, and an IC placement area 34 is arranged on the metal layer 33. Chips 35, chip R, chip G, and chip B are placed on different pads.

[0033] Among them, the colloid layer 31 uses a PPA adhesive 36 for light condensation.

[0034] Among them, the condenser bowl 32 is designed as an elliptical cup shape, which is used to increase the light output efficiency of the light source, thereby reducing energy consumption.

[0035] Among them, solder pins 4 are arranged at the bottom of the condenser bowl 32 for assembly connection through the solder pins 4.

[0036] Among them, a board-attaching recognition chamfer 5 is arranged at one corner of the colloid layer 31. The board-attaching recognition chamfer 5 adopts a triangular structure to provide an anti-fooling design to avoid incorrect placement of the chip 35 during installation.

[0037] Among them, the metal layer 33 is made of iron material, thus improving the existing copper material design and greatly reducing the material cost of the product.

[0038] Among them, a plurality of positioning holes 6 are opened on the bracket frame 2.

[0039] In summary, by adjusting the structure, the present utility model places a single chip on a single pad, achieving separation of the chip base island and independent circuit control, and solving the problem of silver ion migration, which is very practical.

[0040] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An LED support structure with a separated base island, comprising a support body (1), characterized in that: The upper and lower sides of the bracket body (1) are fixedly connected to a bracket frame (2), a plurality of positioning holes (6) are provided on the bracket frame (2), and a plurality of placement frames (3) are provided on the bracket body (1) and in the area of ​​the bracket of the bracket frame (2); The plurality of placement frames (3) respectively include a colloid layer (31) located on the outside thereof, a focusing bowl cup (32) is arranged in the middle of the placement frame (3), a metal layer (33) is arranged inside the focusing bowl cup (32), an IC placement area (34) is arranged on the metal layer (33), and a chip (35) is placed on the IC placement area (34), wherein the chip R, the chip G and the chip B are placed on different pads.

2. The LED support structure with separated base island according to claim 1, characterized in that: The colloid layer (31) is made of PPA rubber (36).

3. The LED support structure with separated base island according to claim 1, characterized in that: The light-collecting bowl cup (32) is designed as an elliptical cup.

4. The LED support structure with separated base island according to claim 1, characterized in that: A solder pin (4) is provided at the bottom of the focusing bowl cup (32).

5. The LED support structure with separated base island according to claim 1, characterized in that: A board identification chamfer (5) is provided at one of the corners of the colloid layer (31), and the board identification chamfer (5) has a triangular structure.

6. The LED support structure with separated base island according to claim 1, characterized in that: The metal layer (33) is made of iron material.

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