Automatic grain-separating and pin-arranging device of semiconductor device sorting machine
By designing the automatic particle-partitioning and pin-piece assembly device of semiconductor device sorting machine, the combination of the booster and lowering blocks and floating blocks is used to achieve stamping and shaping of the semiconductor device pins, solving the problem of pin deformation, improving the reliability of detection and welding, and achieving efficient and convenient shaping operations.
Patent Information
- Application Number
- CN202421587783.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-06
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-06
AI Technical Summary
Semiconductor devices are prone to pin deformation during processing, resulting in poor contact and errors in subsequent detection and welding installation.
Design a semiconductor device sorting machine automatic pelletizing and foot-complete device, including an oblique feeding track and foot-complete mechanism. The whole foot mechanism consists of a lifting and lowering block, a support block, a floating block and a particle division mechanism. Through the cooperation of the lifting and lowering block and a floating block, the stamping and shaping of the pins of the semiconductor device is achieved to ensure the regularity of the pins.
It effectively solves the problem of pin deformation of semiconductor devices, ensures pin regularity, improves the reliability of subsequent detection and welding installation, and can shape multiple semiconductor devices at the same time, which is efficient and easy to use.
Smart Images
Figure CN222919530U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device processing, in particular to an automatic particle sorting and pin straightening device for a semiconductor device sorter. Background Art
[0002] During the processing of semiconductor devices, the problem of pin deformation is likely to occur. The deformed pins are prone to poor contact problems during subsequent detection, resulting in detection errors, and will also affect the subsequent welding and installation of semiconductor devices. Summary of the Utility Model
[0003] In view of this, the purpose of the utility model is to provide an automatic particle sorting and pin straightening device for a semiconductor device sorter, which is convenient to use, has a good shaping effect, and ensures regular pin shapes.
[0004] The utility model is implemented as follows: an automatic particle sorting and pin straightening device for a semiconductor device sorter, including an inclined feeding track, a feeding channel is arranged on the feeding track, and a pin straightening mechanism is arranged at the front end of the feeding track; the pin straightening mechanism includes a lifting pressure block and a supporting block embedded in the feeding track, a device pressing part is arranged in the middle of the lower end of the lifting pressure block, pin shaping parts are arranged on both sides, pin supporting parts are arranged on both sides of the upper end of the supporting block, and a floating block for supporting the semiconductor device and capable of sliding up and down relative to the supporting block is arranged in the middle of the supporting block.
[0005] Further, a particle sorting mechanism is arranged behind the pin straightening mechanism, the particle sorting mechanism includes a limiting baffle and a limiting pressure rod located behind the limiting baffle, and both the limiting baffle and the limiting pressure rod can be lifted and lowered and their moving directions are opposite.
[0006] Further, the limiting baffle and the limiting pressure rod are driven to lift and lower by the same finger cylinder; the limiting baffle is connected to one finger of the finger cylinder through a first connecting arm, the limiting pressure rod is fixedly connected to a connecting block, the connecting block is connected to the other finger of the finger cylinder through a second connecting arm, a long hole running in the front-back direction is arranged on the second connecting arm, and the connecting block is connected to the second connecting arm through a screw passing through the long hole.
[0007] Further, a gantry is arranged around the lifting pressure block, the lifting pressure block is connected to the lower end of a connecting seat, the connecting seat is slidably connected to the gantry through a slider guide rail, a pushing cylinder for pushing the connecting seat downward is arranged above the gantry, and a tension spring for pulling the connecting seat to move upward is also connected between the connecting seat and the gantry.
[0008] Further, a material blocking plate driven by a cylinder to lift is provided at the front end of the floating block. In the middle of the upper end of the support block, there is a receiving groove for installing the floating block. A pair of guide rods that are slidably matched with the support block are connected to the bottom of the floating block. A compression spring is provided below the floating block to push the floating block upward.
[0009] Compared with the prior art, the present utility model has the following beneficial effects: The automatic particle sorting and pin straightening device of the semiconductor device sorting machine of the present utility model has a novel structure and reasonable design. It is used for pin shaping operations on semiconductor devices, ensuring regular pin shapes, which is beneficial for subsequent detection and welding installation. Moreover, it can shape multiple semiconductor devices simultaneously, with high efficiency, convenient use, and good shaping effect.
[0010] In order to make the purpose, technical solution and advantages of the present utility model clearer, the following will further elaborate on the present utility model through specific embodiments and related drawings. Description of the Drawings
[0011] Figure 1 is a side view of an embodiment of the present utility model;
[0012] Figure 2 is a front perspective view of an embodiment of the present utility model;
[0013] Figure 3 is Figure 2 a partial structure schematic diagram in
[0014] Figure 4 is Figure 3 a schematic diagram of the lower track omitted in
[0015] Figure 5 is a side perspective view of an embodiment of the present utility model;
[0016] Explanation of the reference numerals in the drawings: 100 - feeding track, 200 - pin straightening mechanism, 210 - lifting and pressing block, 211 - device pressing part, 212 - pin shaping part, 220 - support block, 221 - pin supporting part, 230 - floating block, 240 - gantry, 250 - connecting seat, 260 - pushing cylinder, 270 - tension spring, 280 - material blocking plate, 300 - particle sorting mechanism, 310 - limiting baffle, 320 - limiting pressure rod, 330 - finger cylinder, 340 - first connecting arm, 350 - connecting block, 360 - second connecting arm, 361 - long hole, 400 - semiconductor device. Detailed Embodiment
[0017] It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.
[0018] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular forms are also intended to include the plural forms. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0019] As Figures 1 - 5 shown, an automatic grain sorting and lead straightening device for a semiconductor device sorter includes an inclined feeding track 100. A feeding channel is provided on the feeding track. The feeding track 100 is composed of an upper track and a lower track. The feeding channel is formed between the upper and lower tracks. A lead straightening mechanism 200 is provided at the front end of the feeding track. The lead straightening mechanism 200 includes a lifting pressure block 210 and a support block 220 embedded in the feeding track. In the middle of the lower end of the lifting pressure block, there is a device pressing part 211, and on both sides, there are lead shaping parts 212. On both sides of the upper end of the support block 220, there are lead supporting parts 221. In the middle of the support block, there is a floating block 230 that can support the semiconductor device and slide up and down relative to the support block. When the semiconductor device is transported to the lead straightening mechanism, the operation of lead shaping is carried out, and the deformed leads of the semiconductor device are stamped to ensure that the lead shapes are regular, which is beneficial for subsequent detection and welding installation. The specific shaping process is as follows: the lifting pressure block 210 descends, and the device pressing part 211 and the floating block 230 cooperate to clamp the semiconductor device for positioning. The lead shaping parts 212 on both sides and the lead supporting parts 221 cooperate to clamp the leads of the semiconductor device, and the deformed leads are corrected. This lead straightening device can simultaneously perform lead shaping operations on multiple semiconductor devices, with high efficiency, convenient use, and good shaping effect.
[0020] In this embodiment, a grain sorting mechanism 300 is provided behind the lead straightening mechanism. The grain sorting mechanism 300 includes a limit baffle 310 and a limit pressure rod 320 located behind the limit baffle. Both the limit baffle and the limit pressure rod can be lifted and lowered, and their moving directions are opposite. The grain sorting mechanism 300 is used to control the number of semiconductor devices entering the lead straightening mechanism 200 at one time, that is, to control how many semiconductor devices the lead straightening mechanism 200 simultaneously performs lead straightening operations on at one time. The limit baffle first descends to block the foremost semiconductor device. At this time, the limit pressure rod is in the lifted state. Then the limit pressure rod descends to press the semiconductor device below it, and the limit baffle lifts and releases. The semiconductor devices in front of the limit pressure rod all slide down to the lower part of the lead straightening mechanism, generally controlled at about 5.
[0021] In this embodiment, the limit baffle and the limit pressure rod are driven to move up and down by the same finger cylinder 330; the limit baffle is connected to one finger of the finger cylinder through a first connecting arm 340, the limit pressure rod is fixedly connected to a connecting block 350, and the connecting block is connected to the other finger of the finger cylinder through a second connecting arm 360. A long hole 361 extending in the front-rear direction is formed in the second connecting arm, and the connecting block is connected to the second connecting arm through a screw passing through the long hole. The finger cylinder 330 is installed in a prone position, that is, the moving direction of the fingers of the finger cylinder 330 is perpendicular to the length direction of the feeding track 100 (or the semiconductor device conveying direction). The limit baffle and the limit pressure rod are controlled by the same finger cylinder 330, which can simplify the structure and is beneficial to realizing the synchronous operation of the two. Moreover, due to the arrangement of the long hole 361 in the second connecting arm, the front-rear position of the limit pressure rod (i.e., the distance between the limit baffle and the limit pressure rod) can be adjusted, so as to realize the control of the single feeding amount of the semiconductor device. The longer the distance between the limit baffle and the limit pressure rod, the more the single feeding amount, and vice versa.
[0022] In this embodiment, a gantry 240 is arranged around the lifting and pressing block. The lifting and pressing block is connected to the lower end of a connecting seat 250. The connecting seat is slidably connected to the gantry through a slider guide rail. A push cylinder 260 for pushing the connecting seat downward is arranged above the gantry. A tension spring 270 for pulling the connecting seat to move upward is also connected between the connecting seat and the gantry. When the telescopic rod of the push cylinder 260 extends, the connecting seat is pushed downward, and when the telescopic rod of the push cylinder 260 retracts, the connecting seat is pulled upward to reset by the pulling force of the tension spring 270.
[0023] In this embodiment, a baffle 280 driven to move up and down by a cylinder is arranged at the front end of the floating block. A receiving groove for installing the floating block is arranged in the middle of the upper end of the support block. A pair of guide rods (not shown in the figure) that are slidably matched with the support block are connected to the bottom of the floating block. A compression spring (not shown in the figure) for pushing the floating block upward is arranged below the floating block. The floating design of the floating block 230 is realized by using the compression spring, which ensures the effective support for the semiconductor device and at the same time has a certain buffering effect, avoiding the semiconductor device being damaged due to excessive downward pressure of the lifting and pressing block 210.
[0024] For any of the technical solutions disclosed in the present invention as described above, unless otherwise stated, if it discloses a numerical range, the disclosed numerical range is a preferred numerical range. Any person skilled in the art should understand that the preferred numerical range is only the numerical values with obvious technical effects or representativeness among many feasible numerical values. Since there are too many numerical values to enumerate, the present invention only discloses some numerical values to illustrate the technical solutions of the present invention. Moreover, the numerical values listed above should not constitute a limitation to the protection scope of the present invention.
[0025] If the present utility model discloses or involves components or structural members that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, using bolts or screws for connection), or it can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integral structure (for example, manufactured integrally by casting process) (except when it is obviously impossible to adopt the integral forming process).
[0026] In addition, unless otherwise stated, the terms used to represent the positional relationship or shape in any of the technical solutions disclosed in the present utility model include states or shapes that are approximate, similar, or close to it.
[0027] Any component provided by the present utility model can either be assembled from a plurality of separate components or be a single component manufactured by an integral forming process.
[0028] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model in other forms. Any person skilled in the art may use the technical content disclosed above to make changes or modifications into equivalent embodiments with equivalent changes. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model still fall within the protection scope of the technical solution of the present utility model.
Claims
1. An automatic grain sorting and foot sorting device for a semiconductor device sorting machine, characterized in that: It includes an inclined feeding track, a feeding trough is provided on the feeding track, and a pin adjustment mechanism is provided at the front end of the feeding track; the pin adjustment mechanism includes a lifting and pressing block and a supporting block embedded in the feeding track, a device pressing part is provided in the middle of the lower end of the lifting and pressing block, and pin shaping parts are provided on both sides, pin supporting parts are provided on both sides of the upper end of the supporting block, and a floating block is provided in the middle of the supporting block for supporting the semiconductor device and can slide up and down relative to the supporting block.
2. The automatic grain sorting and foot sorting device for semiconductor device sorting machine according to claim 1, characterized in that: A particle separation mechanism is arranged behind the leg adjustment mechanism, and the particle separation mechanism comprises a limit baffle and a limit pressure rod located behind the limit baffle, and both the limit baffle and the limit pressure rod can be raised and lowered and move in opposite directions.
3. The automatic grain sorting and foot sorting device for semiconductor device sorting machine according to claim 2, characterized in that: The limit baffle and the limit pressure rod are driven to rise and fall by the same finger cylinder; the limit baffle is connected to one of the fingers of the finger cylinder through a first connecting arm, the limit pressure rod is fixedly connected to a connecting block, the connecting block is connected to another finger of the finger cylinder through a second connecting arm, a long hole running forward and backward is provided on the second connecting arm, and the connecting block is connected to the second connecting arm via a screw passing through the long hole.
4. The automatic grain sorting and foot sorting device for semiconductor device sorting machine according to claim 1, characterized in that: A gantry is provided around the lifting and lowering pressure block, and the lifting and lowering pressure block is connected to the lower end of a connecting seat. The connecting seat and the gantry are slidably connected through a slider guide rail. A pushing cylinder for pushing the connecting seat downward is provided above the gantry, and a tension spring for pulling the connecting seat to move upward is also connected between the connecting seat and the gantry.
5. The automatic grain sorting and foot sorting device for semiconductor device sorting machine according to claim 1, characterized in that: A material baffle plate driven to rise and fall by a cylinder is provided at the front end of the floating block, a receiving groove for installing the floating block is provided in the middle of the upper end of the support block, a pair of guide rods slidingly matched with the support block are connected to the bottom of the floating block, and a compression spring for pushing the floating block upward is provided under the floating block.