Special labeling device for wafer production and processing

Abstract

The utility model discloses a special labeling device for wafer production and processing, which comprises a base, a stepping motor fixedly mounted in the center of the top of the base, a turntable fixedly connected to the end of an output shaft of the stepping motor, a plurality of placement grooves formed in the edge of the top of the turntable, and an anti-drop component movably arranged in the middle of one side, far away from the center of the turntable, of each placement groove. The bottom end of the anti-disengaging assembly abuts against the machine base and the arc-shaped strip in a sliding mode. The arc-shaped strip is fixedly connected with the top of the machine base and arranged between the rotating disc and the machine base. The two sides of the top of the machine base are fixedly connected with a conveying rail and one end of a supporting column correspondingly, the conveying rail communicates with one containing groove, the other end of the supporting column is fixedly connected with a supporting ring, the supporting ring is fixedly sleeved with an L-shaped pipe, the L-shaped pipe is fixedly connected with a negative pressure pump, and the other two sides of the top of the machine base are fixedly connected with a transferring rail and a mechanical arm correspondingly. The transfer rail communicates with the other containing groove, and a marking laser head is fixedly installed on the mechanical arm.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer labeling, in particular to a labeling device special for wafer production and processing. Background Technique

[0002] A wafer is the basic material for manufacturing semiconductor chips. The most important raw material for semiconductor integrated circuits is silicon, so correspondingly it is a silicon wafer. Silicon exists widely in rocks and gravels in the form of silicate or silicon dioxide in nature.

[0003] With the continuous development and progress of technology, the semiconductor industry has higher and higher requirements for the quality of wafers and stricter quality control. To meet the requirements of quality control and process improvement, and to facilitate the management and tracking of wafers in subsequent manufacturing, testing and other process steps, and to ensure the stable traceability of wafers, clear characters, one-dimensional codes or two-dimensional codes and other specific identifiers can be marked on the surface of wafers or chips. The existing traditional solution is to directly achieve an etching mark with a depth of 5um - 150um on the silicon surface through laser ablation. This marking solution will generate a certain amount of debris. In the existing solutions, additional equipment is required to clean the debris, and the debris will affect the quality of the wafers during the wafer transfer process. For this reason, we propose a labeling device special for wafer production and processing to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a labeling device special for wafer production and processing to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A labeling device special for wafer production and processing, including a machine base. A stepping motor is fixedly installed at the center of the top of the machine base. The end of the output shaft of the stepping motor is fixedly connected to a turntable. A plurality of placement grooves are opened at the top edge of the turntable. Anti - detachment components are movably arranged in the middle of one side of the placement grooves away from the center of the turntable. The bottom ends of the anti - detachment components respectively slide and abut against the machine base and an arc - shaped strip. The arc - shaped strip is fixedly connected to the top of the machine base and is arranged between the turntable and the machine base;

[0006] One end of a conveying track and a support column are respectively fixedly connected to both sides of the top of the machine base. The conveying track is communicated with one placement groove. The other end of the support column is fixedly connected to a support ring. The support ring is fixedly sleeved with an L - shaped pipe. The L - shaped pipe is fixedly connected to a negative pressure pump. The other two sides of the top of the machine base are respectively fixedly connected to a transfer track and a manipulator. The transfer track is communicated with another placement groove. A marking laser head is fixedly installed on the manipulator.

[0007] Preferably, four placement grooves are evenly distributed in a circle.

[0008] Preferably, the length direction of the transfer track is perpendicular to the length direction of the conveying track.

[0009] Preferably, both ends of the arc-shaped strip are respectively provided with inclined planes, one end of the arc-shaped strip is flush with the edge of the conveying track, and the other end is flush with the edge of the transfer track.

[0010] Preferably, a movable opening is formed at the bottom of one side of the placement groove.

[0011] Preferably, the anti-disengagement assembly includes a limit block, a movable rod, a spring, and a limit ring. The limit block is slidably arranged in the movable opening. One end of the limit block is fixedly connected to one end of the movable rod. The other end of the movable rod slides through the turntable and then slidably abuts against the top wall of the machine base. A limit ring is fixedly sleeved on the side of the movable rod away from the limit block. One end of the spring is fixedly connected to one side of the limit ring, and the other end of the spring is fixedly connected to the bottom wall of the turntable.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows: A wafer tray with wafers is placed in the placement groove. The stepping motor drives the turntable to rotate, thereby switching the position of the placement groove. The anti-disengagement assembly cooperates with the arc-shaped strip to block the wafer tray, preventing the wafer tray from disengaging from the placement groove due to centrifugal force. The marking laser head cooperates with the manipulator to perform marking operations on the wafers. The negative pressure pump cooperates with the L-shaped pipe to suck away the debris on the surface of the wafers, ensuring the cleanliness of the wafers during subsequent transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural diagram of the present utility model;

[0014] Figure 2 is a schematic structural diagram of another perspective of the present utility model;

[0015] Figure 3 is a schematic cross-sectional structural diagram of the present utility model;

[0016] Figure 4 is the present utility model Figure 3 The enlarged schematic diagram of the structure at A in.

[0017] In the figure: machine base 1, turntable 2, arc-shaped strip 3, placement groove 4, movable opening 41, anti-disengagement assembly 5, limit block 51, movable rod 52, spring 53, limit ring 54, transfer track 6, conveying track 7, manipulator 8, marking laser head 9, L-shaped pipe 10, support ring 11, support column 12, stepping motor 13. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0019] Embodiment 1

[0020] Referring to Figure 1 、 2 This is the first embodiment of the present utility model. This embodiment provides a special labeling device for wafer production and processing, including a machine base 1. A stepping motor 13 is fixedly installed at the center of the top of the machine base 1. The end of the output shaft of the stepping motor 13 is fixedly connected to a turntable 2. A plurality of placement grooves 4 are provided at the top edge of the turntable 2. Anti-disengagement components 5 are movably provided in the middle of one side of the placement grooves 4 away from the center of the turntable 2. The bottom ends of the anti-disengagement components 5 respectively slide and abut against the machine base 1 and the arc-shaped strip 3. The arc-shaped strip 3 is fixedly connected to the top of the machine base 1 and is arranged between the turntable 2 and the machine base 1;

[0021] Both sides of the top of the machine base 1 are respectively fixedly connected to one end of a conveying track 7 and a support column 12. The conveying track 7 is communicated with one placement groove 4. The other end of the support column 12 is fixedly connected to a support ring 11. The support ring 11 is fixedly sleeved with an L-shaped pipe 10. The L-shaped pipe 10 is fixedly connected to a negative pressure pump. The other two sides of the top of the machine base 1 are respectively fixedly connected to a transfer track 6 and a manipulator 8. The transfer track 6 is communicated with another placement groove 4. A marking laser head 9 is fixedly installed on the manipulator 8.

[0022] The wafer to be labeled is placed in the wafer tray, which is transferred to the placement slot 4 through the conveying track 7. Then the stepper motor 13 works to drive the turntable 2 to rotate, and the turntable 2 drives the placement slot 4 to rotate synchronously in a circle. The placement slot 4 with the wafer tray rotates toward the marking laser head 9. At the same time, the anti-slip component 5 rotates synchronously in a circle. The anti-slip component 5 cooperates with the arc bar 3 to limit the edge of the wafer tray to prevent the centrifugal force generated by the rotation of the turntable 2 from causing the wafer tray to detach from the placement slot 4. The wafer tray stops after it rotates to the position of the marking laser head 9, and the manipulator 8 works to cooperate with the marking laser head 9 to mark the wafer. After the marking is completed, the stepper motor 13 works again to rotate the placement slot 4 again, thereby driving the marking to be completed. The wafer is transferred to the position of the L-shaped tube 10, and the negative pressure pump works, cooperating with the L-shaped tube 10 to suck away the debris on the surface of the wafer, thereby ensuring the cleanliness of the wafer during subsequent transportation. At the same time, the marking laser head 9 can mark the newly transferred wafer, thereby realizing the simultaneous marking and cleaning. When the stepper motor 13 works again, it drives the placement slot 4 to change its position again, and the placement slot 4 rotates toward the transfer track 6. At the same time, the anti-detachment component 5 disengages from the arc strip 3, and the anti-detachment component 5 retracts to the bottom wall of the placement slot 4. Then, a fixed installation push rod embedded in the inner wall of the placement slot 4 can be used, and the driving end of the push rod pushes the wafer tray inside the placement slot 4, thereby realizing the function of moving the wafer tray in the placement slot 4 to the transfer track 6, which is convenient for the next process.

[0023] Example 2

[0024] Reference Figures 1-4 , which is the second embodiment of the utility model, is based on the previous embodiment. Specifically, four placement slots 4 are evenly distributed around the circumference, and four are set to achieve synchronous work of conveying wafers, marking, cleaning, and transferring wafers.

[0025] Specifically, the length direction of the transfer track 6 and the length direction of the conveying track 7 are arranged perpendicular to each other.

[0026] Specifically, both ends of the arc strip 3 are provided with slope surfaces respectively, one end of the arc strip 3 is flush with the edge of the conveying track 7, and the other end is flush with the edge of the transfer track 6. Therefore, when the placement slot 4 at the position of the conveying track 7 is transferred, the arc strip 3 can slide against the internal anti-slip component 5, and at the same time, the anti-slip component 5 in the placement slot 4 after suction and cleaning by the negative pressure pump can gradually break away from the sliding friction of the arc strip 3.

[0027] Specifically, a movable opening 41 is opened at the bottom of one side of the placement slot 4 .

[0028] Specifically, the anti-slip assembly 5 includes a limit block 51, a movable rod 52, a spring 53, and a limit ring 54. The limit block 51 is slidably arranged in the movable opening 41, one end of the limit block 51 is fixedly connected to one end of the movable rod 52, the other end of the movable rod 52 slides through the turntable 2 and then slides against the top wall of the base 1, the side of the movable rod 52 away from the limit block 51 is fixedly sleeved with the limit ring 54, one side of the limit ring 54 is fixedly connected to one end of the spring 53, and the other end of the spring 53 is fixedly connected to the bottom wall of the turntable 2. The stepper motor 13 works to drive the turntable 2 to rotate, and the turntable 2 drives the placement slot 4 to rotate synchronously in a circle. The placement slot 4 with the wafer tray rotates toward the marking laser head 9, and the anti-slip assembly 5 rotates synchronously in a circle. The bottom end of the movable rod 52 of the anti-slip assembly 5 is a dome structure, and the bottom end of the movable rod 52 slides against the top wall of the machine base 1. When rotating, the movable rod 52 moves toward the arc strip 3, first sliding over the slope surface at the end of the arc strip 3, and the reverse force of the arc strip 3 causes the movable rod 52 to lift. The movable rod 52 drives the limit block 51 fixed at the end to rise synchronously. After the limit block 51 is lifted, the edge of the wafer tray is The edge is limited to prevent the centrifugal force generated by the rotation of the turntable 2 from causing the wafer tray to detach from the placement slot 4; after the negative pressure pump cooperates with the L-shaped tube 10 to clean, when the stepping motor 13 works again, it drives the placement slot 4 to change its position again, and the placement slot 4 rotates toward the transfer track 6. At the same time, the movable rod 52 of the anti-detachment component 5 moves downward from the slope surface at the end of the arc-shaped bar 3, thereby driving the limit block 51 to move downward, and finally the end of the movable rod 52 cooperates with the elastic force of the spring 53 and the slope surface of the arc-shaped bar 3 to slide to the top wall of the machine base 1. The limit block 51 is now retracted in the movable opening 41, thereby avoiding blocking the transfer of the wafer tray.

[0029] Example 3

[0030] Reference Figures 1-4, which is the third embodiment of the utility model. This embodiment is based on the above two embodiments. When in use, the wafer to be labeled is placed in the wafer tray, and the wafer tray is transferred to the placement slot 4 through the conveying track 7. Then the stepper motor 13 works to drive the turntable 2 to rotate, and the turntable 2 drives the placement slot 4 to rotate synchronously in a circle. The placement slot 4 with the wafer tray rotates toward the marking laser head 9, and the anti-slip assembly 5 rotates synchronously in a circle. The bottom end of the movable rod 52 of the anti-slip assembly 5 is a dome structure, and the bottom end of the movable rod 52 slides against the The top wall of the machine base 1, when rotating, the movable rod 52 moves toward the arc-shaped bar 3, first slides over the slope surface at the end of the arc-shaped bar 3, and the reverse force of the arc-shaped bar 3 lifts the movable rod 52, and the movable rod 52 drives the limit block 51 fixed at the end to be lifted synchronously. After the limit block 51 is lifted, the edge of the wafer tray is limited to prevent the centrifugal force generated by the rotation of the turntable 2 from causing the wafer tray to be separated from the placement slot 4. The wafer tray stops after it rotates to the position of the marking laser head 9, and the robot 8 works to cooperate with the marking laser head 9 to mark the wafer. After the marking is completed, the stepper motor 13 works again and rotates the placement slot 4 again, thereby driving the marked wafer to the position of the L-shaped tube 10. The negative pressure pump works and cooperates with the L-shaped tube 10 to suck away the debris on the surface of the wafer, thereby ensuring the cleanliness of the wafer during subsequent transportation. At the same time, the marking laser head 9 can mark the newly transported wafer, realizing the simultaneous marking and cleaning. When the stepper motor 13 works again, it drives the placement slot 4 to change its position again, and the placement slot 4 rotates toward the direction of the transfer track 6. At the same time, the movable rod 52 of the anti-slip assembly 5 moves downward from the slope surface at the end of the arc-shaped strip 3, thereby driving the limit block 51 to move downward. Finally, the end of the movable rod 52 cooperates with the elastic force of the spring 53 and the slope surface of the arc-shaped strip 3 to slide to the top wall of the base 1. The limit block 51 retracts into the movable opening 41 at this time, and a fixed push rod embedded in the inner wall of the placement groove 4 can be used. The driving end of the push rod pushes the wafer tray inside the placement groove 4, thereby realizing the function of moving the wafer tray in the placement groove 4 to the transfer track 6, which is convenient for the next process.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer production and processing dedicated labeling device, comprising a base (1), characterized in that: A stepper motor (13) is fixedly installed at the top center of the base (1), and the output shaft end of the stepper motor (13) is fixedly connected to the turntable (2). A plurality of placement grooves (4) are provided at the top edge of the turntable (2). An anti-slip assembly (5) is movably provided at the middle of one side of the placement groove (4) away from the center of the turntable (2). The bottom ends of the anti-slip assembly (5) respectively slide against the base (1) and the arc strip (3). The arc strip (3) is fixedly connected to the top of the base (1) and is provided between the turntable (2) and the base (1). The top two sides of the machine base (1) are respectively fixedly connected to a conveying track (7) and one end of a support column (12); the conveying track (7) is connected to a placement slot (4); the other end of the support column (12) is fixedly connected to a support ring (11); the support ring (11) is fixedly sleeved with an L-shaped tube (10); the L-shaped tube (10) is fixedly connected to a negative pressure pump; the other two sides of the top of the machine base (1) are respectively fixedly connected to a transfer track (6) and a manipulator (8); the transfer track (6) is connected to another placement slot (4); and a marking laser head (9) is fixedly installed on the manipulator (8).

2. The wafer production and processing dedicated labeling device according to claim 1, characterized in that: Four placement grooves (4) are evenly distributed around the circumference.

3. The wafer production and processing dedicated labeling device according to claim 1, characterized in that: The length direction of the transfer track (6) and the length direction of the conveying track (7) are arranged perpendicular to each other.

4. The wafer production and processing dedicated labeling device according to claim 1, characterized in that: Both ends of the arc strip (3) are provided with slope surfaces respectively; one end of the arc strip (3) is flush with the edge of the conveying track (7), and the other end is flush with the edge of the transfer track (6).

5. The wafer production and processing dedicated labeling device according to claim 1, characterized in that: A movable opening (41) is provided at the bottom of one side of the placement groove (4).

6. The wafer production and processing dedicated labeling device according to claim 5, characterized in that: The anti-slip assembly (5) comprises a limit block (51), a movable rod (52), a spring (53), and a limit ring (54); the limit block (51) is slidably arranged in the movable opening (41); one end of the limit block (51) is fixedly connected to one end of the movable rod (52); the other end of the movable rod (52) slides through the turntable (2) and then slides against the top wall of the machine base (1); the side of the movable rod (52) away from the limit block (51) is fixedly sleeved with the limit ring (54); one side of the limit ring (54) is fixedly connected to one end of the spring (53); and the other end of the spring (53) is fixedly connected to the bottom wall of the turntable (2).

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