High-yield wafer sand blasting carrier

Abstract

The utility model relates to a high-yield wafer sand blasting carrier. The high-yield wafer sand blasting carrier comprises a clamp and a wafer fixing plate arranged on the clamp, the wafer fixing plate is connected with a wafer through a temporary bonding technology; and a sand blasting resistant mask plate is arranged on the surface of the wafer. According to the utility model, through arranging the clamp with the clamping groove, after the wafer is fixed on the wafer fixing plate through a temporary bonding technology, the wafer fixing plate assembled with the wafer can be rapidly clamped on the clamp with the clamping groove. The wafer fixing plate is made of a high-flatness and low-surface-roughness material, the wafer is fixed on the wafer fixing plate which is smooth in surface and free of burrs, and damage to the wafer can be avoided in the process that the wafer is installed on the wafer fixing plate. The wafer and the wafer fixing plate are connected through the temporary bonding technology, the bonding technology is removed after machining is completed, and therefore the wafer is free of scratches and falls off. The high-yield wafer sand blasting carrier provided by the utility model has the advantages of simple structure and low cost, and can greatly improve the wafer yield.

Description

Technical Field

[0001] The utility model relates to the technical field of precision processing of wafer materials, in particular to a high-yield wafer sandblasting carrier applied to wafer sandblasting. Background Technique

[0002] The processing of the microstructures on the wafer surface is an essential link in the design and manufacturing of integrated chips. How to form specific microstructures on the wafer surface has always been a technical problem in wafer processing. Lithography technology can achieve processing at the micron level, but for most sensor chips, micron-level high-precision processing is not required. At the same time, lithography equipment requires high R & D costs and expensive processing fees.

[0003] The sandblasting process is a process that uses high-pressure air flow and mixes abrasives such as fine sand, glass beads, and calcium carbonate to form a high-speed sandblasting flow to bombard the surface of the material to achieve the purpose of removing the material. Under the protection of the mask plate, selective removal on the wafer surface can be achieved, and a microstructure pattern can be formed on the wafer surface.

[0004] During the wafer sandblasting process, the wafer to be processed needs to be placed on the processing table, and at the same time, the relative position of the wafer needs to be kept fixed. Since wafers are generally 4 inches, 6 inches, or 8 inches in size and only a few hundred microns thick, when fixing the wafer, it is necessary to avoid wafer breakage or scratches. Ordinary jigs will cause the following problems when fixing the wafer: (1) The wafer is not fixed stably, resulting in relative movement of the wafer during the sandblasting process; (2) Scratches are generated on the fixing surface or the wafer is broken when the wafer is fixed.

[0005] Currently, the sandblasting process is mainly applied to fields such as rust and paint removal on metal surfaces, deep cleaning of material surfaces, increasing the roughness of material surfaces, and etching of glass and metal patterns. There are relatively few cases of applying the sandblasting process to wafer processing. Therefore, the clamping method for wafers is not perfect. The unstable clamping of wafers, scratches and even breakage on the wafer surface are problems that need to be solved urgently. Summary of the Invention

[0006] In order to solve the deficiencies in the prior art, the purpose of the utility model is to provide a high-yield wafer sandblasting carrier applied to wafer sandblasting.

[0007] To achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A high-yield wafer sandblasting carrier, the carrier includes: a jig and a wafer fixing plate detachably installed on the jig.

[0009] The wafer fixing plate is connected with a wafer through a temporary bonding technology; the temporary bonding technology includes laser bonding, adhesive bonding, thermoplastic polymer bonding, ultraviolet curing bonding, pyrolytic bonding, electrolyte bonding, mechanical bonding, magnetic bonding, etc.

[0010] A mask plate is arranged on the surface of the wafer.

[0011] Furthermore, the carrier is made of any one of metal, ceramic, and Peek materials. The carrier is made of non-metallic hard materials such as metal, ceramic, and Peek to avoid the problem of uneven wafer sandblasting caused by the deformation of the carrier under high-speed and high-pressure sandblasting conditions.

[0012] Furthermore, the carrier is fixed in the processing chamber of the sandblaster by screws.

[0013] Furthermore, the wafer fixing plate is made of glass or ceramic. The wafer fixing plate is made of materials with high flatness and low surface roughness, including glass, ceramic, etc., to ensure the overall flatness of the wafer to be sandblasted and avoid scratches on the wafer, which may affect its later use.

[0014] Furthermore, the carrier includes a fixture main body and a clamping groove arranged on the fixture main body.

[0015] Furthermore, the wafer fixing plate is installed in the clamping groove.

[0016] Furthermore, a limiting member is arranged on the outer periphery of the wafer. The limiting member is used to protect the mask plate in the area where the edge of the wafer does not need to be sandblasted, preventing it from being damaged during the sandblasting process and ultimately causing damage to the wafer.

[0017] Furthermore, the limiting member is made of a flexible protection material such as tape or rubber ring.

[0018] Furthermore, the limiting member is annular.

[0019] Furthermore, the clamping groove includes two L-shaped fixing plates, which are used for the quick loading and unloading of the wafer sandblasting carrier; the height of the clamping groove is greater than the thickness of the wafer fixing plate.

[0020] The present utility model provides a high - yield wafer sandblasting carrier for wafers, which is used to solve the problem that scratches and breakages are easily generated during wafer loading and unloading, and is applied to wafer materials such as glass, silicon, silicon carbide, and ceramics. By providing a fixture with a clamping groove, after the wafer is fixed on the wafer fixing plate through temporary bonding technology, the wafer fixing plate equipped with the wafer can be quickly clamped on the fixture with the clamping groove. By using a material with high flatness and low surface roughness to make the wafer fixing plate and fixing the wafer on the wafer fixing plate with a smooth surface and no burrs, damage to the wafer can be avoided during the process of installing the wafer onto the wafer fixing plate. By using temporary bonding technology to connect the wafer and the wafer fixing plate, debonding can be performed after processing, enabling the wafer to fall off naturally, effectively preventing the generation of scratches. The high - yield wafer sandblasting carrier described in the present utility model has a simple structure, low cost, and can greatly improve the wafer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. is a schematic diagram of the overall structure of the high - yield wafer sandblasting carrier in the present utility model;

[0022] Figure 2 FIG. is the front view of the high - yield wafer sandblasting carrier in the present utility model;

[0023] Figure 3 FIG. is the top view of the high - yield wafer sandblasting carrier in the present utility model;

[0024] Figure 4 is Figure 2 the view in the direction of A - A of;

[0025] Figure 5 FIG. is the side view of the high - yield wafer sandblasting carrier in the present utility model.

[0026] Wherein: 1, mask plate; 2, limiting member; 3, wafer fixing plate; 4, clamping groove; 5, fixture body; 6, wafer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following further describes the present utility model with reference to the drawings:

[0028] As Figures 1 - 5 shown, a high - yield wafer sandblasting carrier, the carrier includes a fixture and a wafer fixing plate 3 installed on the fixture; the wafer fixing plate 3 is connected with a wafer 6 through temporary bonding technology; a mask plate 1 is arranged on the surface of the wafer 6.

[0029] Preferably according to the present invention, the fixture is made of non-metallic hard materials such as metal, ceramic, and Peek. The fixture is fixed in the processing chamber of the sandblasting machine by screws. The fixture made of non-metallic hard materials such as metal, ceramic, and Peek can be provided with light holes or threaded holes on the wafer fixing plate, and is fixed to the processing chamber made of metal material by screws.

[0030] Preferably according to the present invention, the wafer fixing plate 3 is made of materials with high flatness and low surface roughness, such as ceramic, glass, etc. Using materials with high flatness and low surface roughness such as ceramic or glass to make the wafer fixing plate, on the one hand, such materials can withstand a certain high temperature, can realize the thermal bonding and fixing of the wafer by the temporary bonding technology, and at the same time can release the wafer from the bonding, and the material itself will not be damaged; on the other hand, the flat surfaces of materials with high flatness and low surface roughness such as ceramic and glass plates can be processed very smoothly, without burrs of metal plate materials, and can well reduce the generation of scratches during wafer loading and unloading.

[0031] Preferably according to the present invention, the mask plate 1 is attached to the upper surface of the wafer 6. The mask plate 1 is engraved with the pattern to be processed, and the purpose of selectively thinning the wafer 6 can be achieved.

[0032] Preferably according to the present invention, the carrier includes a fixture body 5 and a card slot 4 provided on the fixture body 5.

[0033] Preferably according to the present invention, the fixture is made of non-metallic hard materials such as metal, ceramic, and Peek. The fixture made of non-metallic hard materials such as metal, ceramic, and Peek can be provided with light holes or threaded holes on the plate, and is fixed to the processing chamber made of metal material by screws.

[0034] Preferably according to the present invention, the wafer fixing plate 3 is installed in the card slot 4. The wafer fixing plate 3 is made of materials with high flatness and low surface roughness such as ceramic or glass. The thickness of the wafer fixing plate 3 matches the slot width of the card slot 4. Through the design of the card slot 4, the purpose of rapid loading and unloading of the wafer fixing plate 3 can be achieved.

[0035] Preferably according to the present invention, the card slot 4 includes two L-shaped fixing plates. The two L-shaped fixing plates and the upper surface of the fixture body enclose a through groove with an opening at the top; the height of the card slot 4 is greater than the thickness of the wafer fixing plate 3. The wafer fixing plate 3 is inserted into the card slot 4 and is snap-connected to the card slot 4.

[0036] Preferably according to the present invention, a limiting member 2 is provided on the outer periphery of the wafer 6. The limiting member 2 is made of a flexible material such as tape or rubber, and the limiting member 2 is annular. The limiting member 2 is realized by using an annular tape, rubber and other flexible materials. While playing a role in limiting and protecting, it can also protect the edge of the mask plate 1, effectively preventing the phenomenon that the edge of the wafer warps due to the sandblasting effect during the sandblasting process.

[0037] The working principle of the present utility model is as follows:

[0038] A mask plate 1 is attached to the sandblasted surface of the wafer 6. The wafer 6 is fixed on a wafer fixing plate 3 made of high-flatness and low-surface roughness materials such as ceramics and glass plates through a temporary bonding technique. A ring of annular tape is attached to the edge of the fixed wafer 6 as the limiting member 2, and the wafer fixing plate 3 is clamped on the fixture.

[0039] During use, first attach the mask plate 1 engraved with the pattern to be processed on the wafer 6, and attach the wafer 6 with the mask plate 1 attached thereto to the wafer fixing plate 3 made of high-flatness and low-surface roughness materials such as ceramics or glass through a temporary bonding technique. To prevent the edge of the mask plate 1 from warping at the joint with the wafer 6 due to the sandblasting effect during the sandblasting process, a ring of flexible materials such as annular tape or rubber 2 needs to be attached to the edge of the wafer 6 as the limiting member. After the wafer 6 is packaged, it is fixed on the wafer fixing plate 3 made of high-flatness and low-surface roughness materials such as ceramics or glass. The wafer fixing plate 3 can be installed on the fixture body 5 through the card slot 4, and the fixture body 5 is fixed in the processing chamber of the sandblaster by screws.

[0040] After the processing is completed, remove the fixed wafer 6 and the wafer fixing plate 3 made of high-flatness and low-surface roughness materials such as ceramics or glass, remove the limiting member (in this embodiment, the limiting member is a flexible material such as annular tape or rubber) and the mask plate 1, debond the wafer fixing plate 3 with the wafer 6, connect the wafer 6 and the wafer fixing plate 3 for debonding, and the wafer 6 slides down naturally, thus effectively preventing the generation of scratches.

[0041] The above-described embodiments are only descriptions of the preferred embodiments of the present utility model, and do not limit the scope of the present utility model. Without departing from the design spirit of the present utility model, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present utility model shall fall within the protection scope determined by the claims of the present utility model.

Claims

1. A high-yield wafer sandblasting carrier, characterized in that: The carrier comprises: a clamp and a wafer fixing plate (3) detachably mounted on the clamp; the wafer fixing plate (3) is connected to a wafer (6) by means of a temporary bonding technology; and a mask plate (1) is arranged on the surface of the wafer (6).

2. The high-yield wafer sandblasting carrier according to claim 1, characterized in that: The carrier is made of any one of metal, ceramic and Peek materials.

3. The high-yield wafer sandblasting carrier according to claim 1 or 2, characterized in that: The carrier is fixed in the processing chamber of the sandblasting machine by screws.

4. The high-yield wafer sandblasting carrier according to claim 1, characterized in that: The wafer fixing plate (3) is made of glass or ceramic.

5. The high-yield wafer sandblasting carrier according to claim 1 or 2, characterized in that: The carrier comprises a clamp body (5) and a clamping slot (4) arranged on the clamp body (5).

6. The high-yield wafer sandblasting carrier according to claim 5, characterized in that: The wafer fixing plate (3) is installed in the clamping slot (4).

7. The high-yield wafer sandblasting carrier according to claim 1, characterized in that: A limiting member (2) is arranged on the periphery of the wafer (6); the limiting member (2) is used to protect the mask plate in the area of ​​the wafer edge that does not require sandblasting.

8. The high-yield wafer sandblasting carrier according to claim 7, characterized in that: The limiting member (2) is made of an adhesive tape or a rubber ring; the limiting member (2) is ring-shaped.

9. The high-yield wafer sandblasting carrier according to claim 1, characterized in that: The temporary bonding technology includes laser bonding, adhesive bonding, thermoplastic polymer bonding, UV curing bonding, pyrolysis bonding, electrolyte bonding, mechanical bonding, and magnetic bonding.

10. The high-yield wafer sandblasting carrier according to claim 6, characterized in that: The card slot (4) comprises two L-shaped fixing plates, and the fixing plates are used for fast loading and unloading of the wafer sandblasting carrier; the height of the card slot (4) is greater than the thickness of the wafer fixing plates (3).

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