Circuit board punching die

Abstract

The utility model relates to a circuit board punching die. The circuit board punching die comprises an upper die assembly and a lower die assembly. The upper die assembly comprises an upper die body, a demolding plate arranged on the bottom face of the upper die body and a punching head arranged on the upper die body and arranged on the demolding plate in a penetrating mode. The lower die assembly comprises a lower die base and a female die plate arranged on the top face of the lower die base, and a female die cutting edge vertically corresponding to the punching head is arranged on the female die surface of the female die plate. A limiting structure is arranged on the concave template, and a punching avoiding part corresponding to the limiting structure is arranged on the punching head; the limiting structure is arranged in the female die cutting edge in a protruding mode and used for limiting the waste part in the female die cutting edge from the non-stress edge of the waste part of the circuit board to be punched. According to the utility model, the problem that in the prior art, when a small window which is locally opened is punched on a circuit board, waste materials generated by punching are easily brought out to the surface of the flexible board, so that the flexible board is easily damaged when being subjected to secondary punching can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, and particularly relates to a circuit board punching die. Background Art

[0002] In the production process of flexible printed circuit boards (hereinafter referred to as flexible boards), it is sometimes necessary to use a punching die to punch off the waste part of the flexible printed circuit board to obtain a flexible board product. In the traditional technology, in the subsequent outer shape punching process of the flexible printed circuit board, especially in the punching and forming process after component assembly, it is often necessary to use a punching die to punch local open small windows on the flexible board (or circuit board). Since both sides of such open windows have been punched and formed in the previous process, when punching again with the punching die, the waste generated by punching is easily taken out of the concave die due to the small chip clamping area on the inner wall of the concave die and remains on the surface of the flexible board (or circuit board). During the secondary punching, these small waste materials remaining on the surface of the flexible board (or circuit board) will cause great damage to the flexible board (or circuit board) due to the extrusion of the upper die, forming batch indentations on the product surface, and even damaging the internal circuit layout of the flexible board (or circuit board), resulting in product scrapping. Summary of the Utility Model

[0003] The utility model provides a circuit board punching die, which can solve the technical problem that in the traditional technology, when punching local open small windows on the circuit board, the waste generated by punching is easily taken out to the surface of the flexible board, resulting in easy damage during the secondary punching of the flexible board.

[0004] In order to solve the above technical problem, the utility model provides a circuit board punching die, comprising:

[0005] An upper die assembly, comprising an upper die body, a stripping plate arranged on the bottom surface of the upper die body, and a punching head arranged on the upper die body and passing through the stripping plate;

[0006] A lower die assembly, comprising a lower die base, and a concave die plate arranged on the top surface of the lower die base, wherein a concave die edge corresponding to the punching head up and down is arranged on the concave die surface of the concave die plate;

[0007] Wherein, a limiting structure is arranged on the concave die plate, and a punching avoidance part corresponding to the limiting structure is arranged on the punching head; the limiting structure protrudes in the concave die edge and is used for limiting the waste part in the concave die edge from the non-force-bearing side of the waste part of the circuit board to be punched.

[0008] Optionally, the limiting structure comprises a limiting protrusion extending from the side wall of the concave die edge towards the middle of the concave die edge.

[0009] Optionally, the limiting structure includes at least one of the limiting protrusions, and correspondingly, at least one punching avoidance portion is provided on the punching head.

[0010] Optionally, the limiting structure includes a plurality of the limiting protrusions, and the plurality of limiting protrusions are used to limit the waste portion of the circuit board to be punched from the periphery thereof.

[0011] Optionally, the limiting structure includes one limiting protrusion on each of two opposite sides of the die cutting edge, and the two limiting protrusions are respectively used to limit two opposite non-force-bearing edges of the waste portion of the circuit board to be punched.

[0012] Optionally, the limiting protrusion is provided as a V-shaped boss;

[0013] The limiting protrusion extends downward from the top surface of the die cutting edge to the lower die base.

[0014] Optionally, the end surface of the protruding end of the limiting protrusion is used to protrude to the inner side of the non-force-bearing edge of the waste portion of the circuit board to be punched, and the distance between the end surface of the protruding end and the edge of the non-force-bearing edge of the waste portion of the circuit board to be punched is 0.04 - 0.06 mm.

[0015] Optionally, the distance between the end surface of the protruding end and the edge of the non-force-bearing edge of the waste portion of the circuit board to be punched is 0.05 mm.

[0016] Optionally, the punching avoidance portion is a punching avoidance groove recessed on the side surface of the punching head, and the shape of the punching avoidance groove corresponds to the shape of the end surface of the protruding end of the limiting protrusion.

[0017] Optionally, the distance between the groove wall surface of the punching avoidance groove and the end surface of the protruding end of the limiting protrusion is 2 - 3 times the thickness value of the waste portion of the circuit board to be punched.

[0018] The beneficial effects brought by the technical solution provided by the present utility model include:

[0019] When it is necessary to punch the circuit board, the circuit board to be punched can be placed and positioned on the concave template on the lower die base of the lower die assembly, so that the waste portion of the circuit board to be punched is located at the die cutting edge. During the punching process, the non-force-bearing edge of the waste portion of the circuit board to be punched can be extruded and limited or blocked and limited by the limiting structure provided on the concave template, and the punched waste portion can be clamped or blocked to prevent the waste portion and the waste chips generated by punching from being lifted, thereby avoiding the waste chips from falling on the circuit board and causing damage to the circuit board during secondary punching.

[0020] Specifically, when punching the circuit board, the upper die body of the upper die assembly can first drive the punching head to move downward, so that the punching head punches the waste part of the circuit board to be punched located at the die edge; moreover, during the punching process, the non-force-bearing side of the waste part of the circuit board to be punched can be limited by the limiting structure, and the punching avoidance part provided on the punching head corresponds to the limiting structure, so that the limiting structure will not affect the punching of the waste part of the circuit board by the punching head; after the punching of the waste part is completed, the upper die body of the upper die assembly can drive the punching head to move upward, and the stripping plate provided on the bottom surface of the upper die body can separate the punching head from the waste part and the concave die plate. During this process, the limiting structure keeps limiting the waste part, so that the waste part and the waste chips generated by punching will not be taken out of the die edge by the punching head, thereby avoiding the waste chips generated by punching being taken out of the concave die and remaining on the surface of the circuit board, avoiding damage to it during the secondary punching of the circuit board, affecting the product quality, and even causing the product to be scrapped, thereby ensuring the product quality. Brief Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0022] Figure 1 Schematic structural diagram of the circuit board punching die according to the embodiment of the present invention;

[0023] Figure 2 Schematic structural diagram of the circuit board to be punched according to the embodiment of the present invention;

[0024] Figure 3 Schematic structural diagram of the force-bearing conditions of each side of the waste part of the circuit board to be punched according to the embodiment of the present invention;

[0025] Figure 4 Schematic structural diagram between the punching head, the die edge, the limiting structure and the waste part when the circuit board punching die punches the waste part of the circuit board to be punched according to the embodiment of the present invention;

[0026] Figure 5 Schematic diagram of the force-bearing conditions of each side of the waste part when the circuit board punching die punches the waste part of the circuit board to be punched according to the embodiment of the present invention.

[0027] In the figure: 10, a circuit board to be punched; 20, a waste part; 22, a stressed side; 24, a non-stressed side; 100, a circuit board punching die; 110, an upper die assembly; 112, an upper die body; 1122, an upper die base; 1124, an upper die connecting plate; 114, a stripper plate; 116, a punching head; 1162, a punching avoidance part; 120, a lower die assembly; 122, a lower die base; 124, a concave die plate; 1242, a concave die surface; 1244, a concave die edge; 1246, a limiting structure (limiting protrusion). Detailed implementation mode

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] As Figures 1 to 3 shown, the present utility model provides a circuit board punching die 100, which includes an upper die assembly 110 and a lower die assembly 120 corresponding to the upper die assembly 110 up and down. When punching a circuit board, the circuit board 10 to be punched can be positioned and placed on the lower die assembly 120, and then the upper die assembly 110 and the lower die assembly 120 are closed, so that the upper die assembly 110 punches the circuit board on the lower die assembly 120 (such as punching a local open small window on the circuit board 10 to be punched), and punches off the waste part 20 of the circuit board 10 to be punched to obtain a circuit board product.

[0030] Specifically, the upper die assembly 110 may include an upper die body 112, a stripper plate 114 provided on the bottom surface of the upper die body 112, and a punching head 116 provided on the upper die body 112 and passing through the stripper plate 114. Further, the upper die body 112 of the upper die assembly 110 may include an upper die base 1122 and an upper die connecting plate 1124 provided at the bottom of the upper die base 1122. The stripper plate 114 may be movably provided at the bottom of the upper die connecting plate 1124, and the punching head 116 may protrude from the bottom of the upper die connecting plate 1124 and pass through the stripper plate 114.

[0031] Moreover, the lower die assembly 120 may include a lower die base 122 and a concave die plate 124 disposed on the top surface of the lower die base 122. A concave die edge 1244 corresponding to the punching head 116 is provided on the concave die surface 1242 of the concave die plate 124. A limiting structure 1246 is provided on the concave die plate 124, and a punching avoidance portion 1162 corresponding to the limiting structure 1246 is provided on the punching head 116. The limiting structure 1246 may protrude into the concave die edge 1244 and is used to limit the waste portion 20 within the concave die edge 1244 from the non-force-bearing side 24 of the waste portion 20 of the circuit board 10 to be punched (referring to the side of the waste portion 20 of the circuit board 10 to be punched that does not need to be punched during the punching process, such as the already punched edge of the locally open small window of the circuit board 10 to be punched).

[0032] When punching the circuit board is required, the circuit board 10 to be punched can be placed and positioned on the concave die plate 124 on the lower die base 122 of the lower die assembly 120. During the punching process, the non-force-bearing side 24 of the waste portion 20 of the circuit board 10 to be punched can be squeezed and limited or blocked and limited by the limiting structure 1246 provided on the concave die plate 124, and the punched waste portion 20 can be clamped or blocked to prevent the waste portion 20 and the waste chips generated by punching from being lifted, thereby preventing the waste chips from falling on the circuit board and causing damage to the circuit board during secondary punching of the circuit board.

[0033] Specifically, when punching the circuit board 10 to be punched, the upper die body 112 of the upper die assembly 110 can first drive the punching head 116 to move downward, so that the punching head 116 punches the waste portion 20 of the circuit board 10 to be punched located at the concave die edge 1244, and the punching head 116 can act on the force-bearing side 22 of the waste portion 20 (referring to the side of the waste portion 20 of the circuit board 10 to be punched that needs to be punched during the punching process), so that the waste portion 20 is cut off and separated from the circuit board at the force-bearing side 22 position. Moreover, during the punching process, the non-force-bearing side 24 of the waste portion 20 of the circuit board 10 to be punched can be limited by the limiting structure 1246, and the punching avoidance portion 1162 provided on the punching head 116 corresponds to the limiting structure 1246, so that the limiting structure 1246 does not affect the punching of the waste portion 20 of the circuit board by the punching head 116.

[0034] After the punching head 116 finishes punching the waste portion 20, the upper die body 112 of the upper die assembly 110 can drive the punching head 116 to move upward, and the stripping plate 114 provided on the bottom surface of the upper die body 112 separates the punching head 116 from the waste portion 20 and the concave die plate 124. During this process, the limiting structure 1246 keeps limiting the waste portion 20, so that the waste portion 20 and the waste chips generated by punching will not be carried out of the concave die edge 1244 by the punching head 116. Thus, it can be avoided that the waste chips generated by punching are carried out of the concave die and remain on the surface of the circuit board, and it can be avoided that the circuit board is damaged during the secondary punching, which affects the product quality and even causes the product to be scrapped. Therefore, the product quality can be guaranteed.

[0035] Furthermore, as Figures 4 to 5 shown, the limiting structure 1246 provided on the concave die plate 124 may include a limiting protrusion extending from the side wall surface of the concave die edge 1244 towards the middle of the concave die edge 1244. That is, a protruding block is provided on the side wall surface of the concave die edge 1244 of the concave die plate 124 to form a limiting protrusion, thereby forming a limiting structure 1246 for limiting the waste portion 20 of the circuit board. Moreover, the limiting protrusion may be located on the side wall surface of the concave die edge 1244 corresponding to the non-force-bearing side 24 of the waste portion 20 of the circuit board to be punched, so as to facilitate limiting the non-force-bearing side 24 of the waste portion 20. Moreover, the limiting protrusion may be fixedly provided on the side wall surface of the concave die edge 1244; in addition, the limiting protrusion may also be detachably provided on the side wall surface of the concave die edge 1244, and the limiting protrusion can be replaced according to needs.

[0036] In addition, the limiting protrusion may not only protrude from the side wall surface of the concave die edge 1244, but also be directly provided on the concave die surface 1242 of the concave die plate 124 and extend from the concave die surface 1242 towards the middle of the concave die edge 1244, and can also limit the non-force-bearing side 24 of the waste portion 20 of the circuit board to be punched.

[0037] Moreover, the limiting protrusion may extend from the top surface of the concave die edge 1244 towards the lower die base 122. That is, the limiting protrusion can be provided to penetrate along the depth direction of the concave die edge 1244, and the top surface of the limiting protrusion may be flush with the concave die surface 1242, and its bottom surface may be flush with the top surface of the lower die base 122. When punching the waste portion 20 of the circuit board 10 to be punched, the waste portion 20 can be extruded between the protruding surface of the limiting protrusion and the side wall surface of the concave die edge 1244 by the punching head 116, so that the non-force-bearing side of the waste portion 20 is closely pressed against the protruding surface of the limiting protrusion and is not easily separated from above the concave die edge 1244.

[0038] In addition, the limiting protrusion can also be provided only at the top position of the die cutting edge 1244. Moreover, the non-force-bearing side 24 of the waste portion 20 can be clamped and limited by the limiting protrusion provided on the side wall surface at the top of the die cutting edge 1244, so that when punching the waste portion 20, the side surface of the non-force-bearing side 24 of the waste portion 20 is clamped, preventing the punched waste portion 20 from being lifted when the punching head 116 rises. In this case, the circuit board 10 to be punched can be directly placed on the die surface 1244, with the waste portion 20 located at the die cutting edge 1244, and the non-force-bearing side 24 of the waste portion 20 can be located on the top surface of the limiting protrusion.

[0039] In addition, the waste portion 20 can also be blocked and limited by the limiting protrusion from the top surface of the non-force-bearing side 24 of the waste portion 20 of the circuit board 10 to be punched, preventing the punched waste portion 20 from being lifted when the punching head 116 rises. In this case, before punching the circuit board, the circuit board 10 to be punched can be placed on the die plate 124, and the non-force-bearing side 24 of the waste portion 20 of the circuit board 10 to be punched can be clamped under the limiting protrusion, thereby achieving the blocking and limiting of the waste portion 20 before punching. At this time, the limiting protrusion can be set as a movable structure, that is, after placing the circuit board 10 to be punched on the die surface 1242, the limiting protrusion can be pressed on the circuit board 10 to be punched; alternatively, the circuit board 10 to be punched can also be inserted under the limiting protrusion from the side.

[0040] In addition, the limiting structure 1246 can include at least one limiting protrusion, and at least one punching avoidance portion 1162 is correspondingly provided on the punching head 116. That is, one limiting protrusion can be provided to limit the waste portion 20 of the circuit board 10 to be punched, or multiple limiting protrusions can be provided to limit the waste portion 20 of the punched circuit board, so as to prevent the waste portion 20 and the waste chips generated by punching from being lifted and falling onto the circuit board after punching. In addition, one punching avoidance portion 1162 can also be correspondingly provided on the punching head 116 to cooperate with one limiting protrusion; in addition, multiple punching avoidance portions 1162 can also be correspondingly provided on the punching head 116 to cooperate with multiple limiting protrusions.

[0041] Furthermore, the limiting structure 1246 can include multiple limiting protrusions, and the multiple limiting protrusions are used to limit the waste portion 20 of the circuit board 10 to be punched from its peripheral side. By providing multiple limiting protrusions to limit the waste portion 20 from its peripheral side, the limiting of the waste portion 20 can be made more reliable, preventing the waste portion 20 from being lifted from one side by the punching head 116 after punching.

[0042] In this embodiment, the limiting structure 1246 may include one limiting protrusion on each of two opposite sides of the die cutting edge 1244. The two limiting protrusions are respectively used to limit two opposite non-force-bearing edges 24 of the waste portion 20 of the circuit board 10 to be punched. By respectively arranging one limiting protrusion on both sides of the die cutting edge 1244 to limit the two non-force-bearing edges 24 of the waste portion 20 of the circuit board 10 to be punched, the structure of the limiting structure 1246 is relatively simple, and the limitation of the waste portion 20 is also relatively good. Further, both limiting protrusions are limited at the middle positions of the non-force-bearing edges 24 of the waste portion 20 of the die cutting edge 1244, and the force is balanced and stable. Moreover, the two limiting protrusions may be symmetrically arranged with respect to the center line of the die cutting edge 1244, and the force is more uniform.

[0043] In addition, the two limiting protrusions may also be arranged in a staggered manner on two opposite side wall surfaces of the die cutting edge 1244. In addition, according to needs, multiple limiting protrusions may also be respectively arranged on two opposite side wall surfaces of the die cutting edge 1244, so that each non-force-bearing edge 24 of the waste portion 20 can be limited by multiple limiting protrusions. Moreover, the multiple limiting protrusions on two opposite side wall surfaces of the die cutting edge 1244 are also arranged in one-to-one correspondence, and may also be arranged in a staggered manner.

[0044] Moreover, in this embodiment, the limiting protrusion may be set as a V-shaped boss. The protruding end of the V-shaped boss extends towards the middle of the die cutting edge 1244, and the non-force-bearing edge 24 of the waste portion 20 is limited by the protruding end of the V-shaped boss. Moreover, the protruding end of the V-shaped boss may be subjected to a rounding treatment, and the protruding end may be in an arc shape. Moreover, when the non-force-bearing edge 24 of the waste portion 20 is limited by the V-shaped boss, the protruding end of the V-shaped boss may extend to the inner side of the non-force-bearing edge 24 of the waste portion 20 (referring to the side close to the middle of the waste portion 20, that is, the protruding end of the V-shaped boss extends towards the middle of the waste portion 20).

[0045] In addition, the limiting protrusion may also be set as a rectangular boss, or a cylindrical boss, or an arc boss, and so on.

[0046] Moreover, the end face of the protruding end of the limiting protrusion can be used to protrude into the inner side of the non-force-bearing edge 24 of the waste portion 20 of the circuit board 10 to be punched, and the distance H1 between the end face of the protruding end of the limiting protrusion and the edge of the non-force-bearing edge 24 of the waste portion 20 of the circuit board 10 to be punched is 0.04 - 0.06 mm. That is, the limiting width H1 of the protruding end of the limiting protrusion on the non-force-bearing edge 24 of the waste portion 20 can be set to 0.04 - 0.06 mm, which not only facilitates the limitation of the waste portion 20 of the circuit board, but also does not affect the punching effect of the punching head 116 on the waste portion 20. Preferably, the distance H1 between the end face of the protruding end of the limiting protrusion and the edge of the non-force-bearing edge 24 of the waste portion 20 of the circuit board 10 to be punched is 0.05 mm, that is, the limiting width H1 can be set to 0.05 mm; in addition, the limiting width H1 can also be set to 0.04 mm, or 0.06 mm, or any value between 0.04 - 0.06 mm.

[0047] In addition, the punching avoidance portion 1162 provided on the punching head 116 can be a punching avoidance groove recessed on the side surface of the punching head 116, and the shape of the punching avoidance groove corresponds to the shape of the end face of the protruding end of the limiting protrusion. By providing a punching avoidance groove corresponding to the protruding end of the limiting protrusion on the side surface of the punching head 116, when the punching head 116 punches the waste portion 20 of the circuit board 10 to be punched, the protruding end of the limiting protrusion can be avoided through the punching avoidance groove, preventing the punching head 116 from interfering with the limiting protrusion and affecting the punching of the waste portion 20 of the circuit board 10 to be punched. Moreover, by correspondingly setting the shape of the punching avoidance groove and the shape of the end face of the protruding end of the limiting protrusion, the avoidance of the punching avoidance groove is more accurate and reliable.

[0048] Furthermore, the distance H2 between the groove wall surface of the punching avoidance groove and the end face of the protruding end of the limiting protrusion is 2 - 3 times the thickness value of the waste portion 20 of the circuit board 10 to be punched. This can not only make the shape of the punching avoidance groove correspond to the end face of the protruding end of the limiting protrusion, but also keep a preset distance between the two, completely avoiding the punching head 116 from punching through the waste material here to form new small waste chips. Specifically, the distance H2 between the groove wall surface of the punching avoidance groove and the end face of the protruding end of the limiting protrusion can be 2.5 times the thickness value of the waste portion 20 of the circuit board 10 to be punched, or can be set to 2 times the thickness value of the waste portion 20, or can be set to 3 times the thickness value of the waste portion 20, or can be set to any value between 2 - 3 times the thickness value of the waste portion 20.

[0049] The circuit board punching die 100 provided by the present utility model has a special structural design for the concave template 124 of the lower die assembly 120, that is, one or more inverted V-shaped blank clamping bosses (i.e., limiting bosses) are designed inside the die cutting edge 1244 of the concave template 124, which can firmly clamp the tiny punching waste inside the concave template 124 during the punching process of the circuit board and prevent it from being taken out of the die cutting edge 1244 to cause damage to the circuit board product, thereby improving the punching quality.

[0050] It should be noted that in the present utility model, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0051] The above are only specific embodiments of the present utility model, enabling those skilled in the art to understand or implement the present utility model. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features of the present utility model.

Claims

1. A circuit board punching die, characterized in that: include: An upper die assembly comprises an upper die body, a stripping plate arranged on the bottom surface of the upper die body, and a punching head arranged on the upper die body and penetrating the stripping plate; A lower die assembly comprises a lower die base and a concave die plate arranged on the top surface of the lower die base, wherein a concave die surface of the concave die plate is provided with a concave die cutting edge corresponding to the upper and lower parts of the punching head; Among them, a limiting structure is provided on the concave mold plate, and a punching avoidance portion corresponding to the limiting structure is provided on the punching head; the limiting structure is protrudingly arranged in the cutting edge of the concave mold, and is used to limit the waste part of the circuit board to be punched from the non-stress-bearing edge of the waste part in the concave mold cutting edge.

2. The circuit board punching die according to claim 1, characterized in that: The limiting structure comprises a limiting protrusion extending from the side wall of the die cutting edge toward the middle of the die cutting edge.

3. The circuit board punching die according to claim 2, characterized in that: The limiting structure includes at least one limiting protrusion, and the punching head is correspondingly provided with at least one punching avoidance portion.

4. The circuit board punching die according to claim 3, characterized in that: The limiting structure includes a plurality of limiting protrusions, and the plurality of limiting protrusions are used to limit the waste part of the circuit board to be punched from its peripheral side.

5. The circuit board punching die according to claim 4, characterized in that: The limiting structure includes one limiting protrusion each located on two opposite sides of the die cutting edge, and the two limiting protrusions are respectively used to limit two opposite non-stress-bearing edges of the waste portion of the circuit board to be punched.

6. The circuit board punching die according to any one of claims 2 to 5, characterized in that: The limiting protrusion is set as a V-shaped boss; The limiting protrusion is extended from the top surface of the die cutting edge toward the lower die seat.

7. The circuit board punching die according to any one of claims 2 to 5, characterized in that: The end face of the protruding end of the limiting protrusion is used to protrude to the inner side of the non-stress-bearing edge of the waste part of the circuit board to be punched, and the distance between the end face of the protruding end and the edge of the non-stress-bearing edge of the waste part of the circuit board to be punched is 0.04-0.06mm.

8. The circuit board punching die according to claim 7, characterized in that: The distance between the end surface of the protruding end and the edge of the non-stress-bearing side of the waste portion of the circuit board to be punched is 0.05 mm.

9. The circuit board punching die according to any one of claims 2 to 5, characterized in that: The punching avoidance portion is a punching avoidance groove recessed on the side surface of the punching head, and the shape of the punching avoidance groove corresponds to the shape of the end surface of the protruding end of the limiting protrusion.

10. The circuit board punching die according to claim 9, characterized in that: The distance between the groove wall surface of the punching avoidance groove and the end surface of the protruding end of the limiting protrusion is 2-3 times the thickness value of the waste part of the circuit board to be punched.

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