High-performance heat insulation board
By using multi-layered thermal insulation layer and solid wood layer in the fire-proof wood board, combined with the hot press forming process, the problem of insufficient performance of existing fire-proof wood boards is solved, and the natural appearance, touch and thermal insulation performance of high-performance thermal insulation boards is improved.
Patent Information
- Application Number
- CN202421327134.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-06-11
AI Technical Summary
Existing fire-resistant wood panels have shortcomings in color, texture, touch, strength, hardness and performance in humid environments, limiting their application in decorative and load-bearing occasions.
High-performance thermal insulation wood panels composed of the first solid wood layer, the second solid wood layer and the thermal insulation layer are adopted. The thermal insulation layer includes an alkali-resistant glass fiber mesh layer and a silica aerosol layer, an infrared light-shielding layer and an edge sealing layer, and the overall performance is improved by an integrated process of heat pressing.
It realizes the natural appearance and touch of the wooden board, and also has excellent thermal insulation and moisture resistance, improving its application performance in decoration and load-bearing occasions.
Smart Images

Figure CN222920732U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat insulation boards, and particularly relates to a high-performance heat insulation wood board. Background Art
[0002] The common types of fireproof wood boards on the market at present include mineral wool boards, zirconium silicate boards, aluminum silicate boards, and flame retardant boards. Although these fireproof wood boards have excellent fireproof performance, they still have the following deficiencies: 1. The colors and textures of some fireproof wood boards may be relatively single, not as rich and diverse as natural wood, which to a certain extent limits their application in decorative scenarios where natural beauty needs to be shown; 2. Some fireproof wood boards may not be able to achieve the delicate touch of natural wood, which may affect their use in some high-end decoration fields; 3. Compared with natural wood, the strength and hardness of some fireproof wood boards may be slightly inferior, making them perform poorly in occasions with higher requirements for load-bearing or wear resistance; 4. Some fireproof wood boards may have problems such as moisture absorption, swelling or deformation in a humid environment, which will affect their service life and decorative effect. Content of the Utility Model
[0003] Aiming at the defects in the prior art, the purpose of the utility model is to provide a high-performance heat insulation wood board, which not only has the strength, hardness and moisture resistance of natural wood itself, but also has excellent heat insulation performance.
[0004] The technical solution adopted by the utility model is as follows:
[0005] A high-performance heat insulation wood board, comprising a first solid wood layer, a second solid wood layer and a heat insulation layer, wherein the heat insulation layer is located between the first solid wood layer and the second solid wood layer.
[0006] Further, the heat insulation layer includes a first alkali-resistant fiberglass mesh layer, a second alkali-resistant fiberglass mesh layer and a silica aerosol layer, the silica aerosol layer is located between the first alkali-resistant fiberglass mesh layer and the second alkali-resistant fiberglass mesh layer, the first alkali-resistant fiberglass mesh layer is arranged on the inner side of the first solid wood layer, and the second alkali-resistant fiberglass mesh layer is arranged on the inner side of the second solid wood layer.
[0007] Further, the heat insulation layer further includes a first infrared light-shielding layer and a second infrared light-shielding layer, the first infrared light-shielding layer is arranged between the first solid wood layer and the first alkali-resistant fiberglass mesh layer, and the second infrared light-shielding layer is arranged between the second solid wood layer and the second alkali-resistant fiberglass mesh layer.
[0008] Further, it further includes an edge-sealing layer, and the edge-sealing layer is arranged along the edges of the first solid wood layer, the second solid wood layer and the heat insulation layer.
[0009] Further, the thickness of the silica aerosol layer is 600-900 microns.
[0010] Furthermore, the thickness of the first infrared light-shielding layer and the second infrared light-shielding layer is 100 to 300 microns.
[0011] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0013] Figure 1 It is a schematic structural diagram of a high-performance heat-insulating wooden board provided by an embodiment of the present application.
[0014] Among them, the first solid wood layer 1, the first infrared light-shielding layer 2, the first alkali-resistant fiberglass mesh layer 3, the silica aerosol layer 4, the second alkali-resistant fiberglass mesh layer 5, the second infrared light-shielding layer 6, the second solid wood layer 7, and the edge-sealing layer 8. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0015] Here, it should be noted that the functions, methods, etc. involved in the present utility model are merely conventional adaptive applications of the prior art. Therefore, the improvement of the present utility model over the prior art lies essentially in the connection relationship between the hardware, rather than the functions and methods themselves. That is, although the present utility model involves certain functions and methods, it does not include improvements to the functions and methods themselves. The description of the functions and methods in the present utility model is for better explaining the present utility model and facilitating a better understanding of the present utility model.
[0016] The following will describe in detail the embodiments of the technical solutions of the present utility model with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present utility model, and therefore are only examples and cannot be used to limit the protection scope of the present utility model.
[0017] It should be noted that unless otherwise specified, the technical terms or scientific terms used in the present application should have the ordinary meanings understood by those skilled in the art to which the present utility model belongs.
[0018] See Figure 1 , a high-performance heat-insulating wooden board of the present application includes a first solid wood layer 1, a second solid wood layer 7, a heat-insulating layer, and an edge-sealing layer 8. The heat-insulating layer is located between the first solid wood layer 1 and the second solid wood layer 7, and the edge-sealing layer 8 is disposed along the edges of the first solid wood layer 1, the second solid wood layer 7, and the heat-insulating layer.
[0019] In this application, a first solid wood layer 1, a second solid wood layer 7, and a heat insulation layer located between the first solid wood layer 1 and the second solid wood layer 7 are provided. The middle heat insulation layer plays a role in heat insulation and heat preservation, and the outer first solid wood layer 1 and second solid wood layer 7 maintain the appearance and touch of solid wood. Therefore, the heat-insulated wooden board of this application not only has the strength, hardness, and moisture resistance of natural wood itself, but also has excellent heat insulation performance.
[0020] The first solid wood layer 1 and the second solid wood layer 7 are made of solid wood log materials, which are made into a plate-like structure by cutting, and dried in the sun or dried at high temperature to ensure that their humidity is below 12%, maintaining the appearance and touch of solid wood materials and improving their strength and hardness.
[0021] The heat insulation layer plays a major role in heat insulation and heat preservation. It includes a first alkali-resistant fiberglass mesh layer 3, a second alkali-resistant fiberglass mesh layer 5, and a silica aerosol layer 4. The silica aerosol layer 4 is located between the first alkali-resistant fiberglass mesh layer 3 and the second alkali-resistant fiberglass mesh layer 5. The first alkali-resistant fiberglass mesh layer 3 is arranged on the inner side of the first solid wood layer 1, and the second alkali-resistant fiberglass mesh layer 5 is arranged on the inner side of the second solid wood layer 7.
[0022] Furthermore, the heat insulation layer also includes a first infrared light-shielding layer 2 and a second infrared light-shielding layer 6. The first infrared light-shielding layer 2 is arranged between the first solid wood layer 1 and the first alkali-resistant fiberglass mesh layer 3, and the second infrared light-shielding layer 6 is arranged between the second solid wood layer 7 and the second alkali-resistant fiberglass mesh layer 5.
[0023] During preparation, silica aerosol can be sprayed on one side of the first alkali-resistant fiberglass mesh layer 3 and the second alkali-resistant fiberglass mesh layer 5 respectively to form the silica aerosol layer 4, and the thickness of the silica aerosol layer 4 is 600-900 microns; the sides of the first alkali-resistant fiberglass mesh layer 3 and the second alkali-resistant fiberglass mesh layer 5 sprayed with the silica aerosol layer 4 are opposed to each other and hot-pressed into one body; then infrared light-shielding agents are sprayed on the other sides of the first alkali-resistant fiberglass mesh layer 3 and the second alkali-resistant fiberglass mesh layer 5 respectively to form the first infrared light-shielding layer 2 and the second infrared light-shielding layer 6 respectively, and the thickness of the first infrared light-shielding layer 2 and the second infrared light-shielding layer 6 is 100-300 microns, thus obtaining the heat insulation layer.
[0024] The heat insulation layer is placed between the first solid wood layer 1 and the second solid wood layer 7, so that the first infrared light-shielding layer 2 is located on the inner side of the first solid wood layer 1, and the second infrared light-shielding layer 6 is located on the inner side of the second solid wood layer 7. Glue is coated on the inner sides of the first solid wood layer 1 and the second solid wood layer 7 respectively, and the first solid wood layer 1, the heat insulation layer, and the second solid wood layer 7 are hot-pressed into one body by hot pressing.
[0025] In this application, unless otherwise clearly defined and limited, terms such as "connected", "connected to", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0026] In the description of the present utility model, a large number of specific details are set forth. However, it can be understood that the embodiments of the present utility model can be practiced without these specific details. In some instances, well-known methods, systems, and technologies are not shown in detail so as not to obscure the understanding of this description.
[0027] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, systems, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, systems, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0028] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model, and they should all be covered by the scope of the claims and the description of the present utility model.
Claims
1. A high-performance heat-insulating wood board, characterized in that: It includes a first solid wood layer, a second solid wood layer and a heat-insulating layer, wherein the heat-insulating layer is located between the first solid wood layer and the second solid wood layer; the heat-insulating layer includes a first alkali-resistant glass fiber mesh cloth layer, a second alkali-resistant glass fiber mesh cloth layer and a silica aerosol layer, wherein the silica aerosol layer is located between the first alkali-resistant glass fiber mesh cloth layer and the second alkali-resistant glass fiber mesh cloth layer, the first alkali-resistant glass fiber mesh cloth layer is arranged on the inner side of the first solid wood layer, and the second alkali-resistant glass fiber mesh cloth layer is arranged on the inner side of the second solid wood layer.
2. The high performance heat insulating wood board according to claim 1, characterized in that: The heat insulation layer also includes a first infrared shading layer and a second infrared shading layer, the first infrared shading layer is arranged between the first solid wood layer and the first alkali-resistant glass fiber mesh layer, and the second infrared shading layer is arranged between the second solid wood layer and the second alkali-resistant glass fiber mesh layer.
3. The high performance heat insulating wood board according to claim 1, characterized in that: It also includes an edge sealing layer, which is arranged along the edges of the first solid wood layer, the second solid wood layer and the heat insulation layer.
4. The high performance heat insulating wood board according to claim 1, characterized in that: The thickness of the silicon dioxide aerosol layer is 600 to 900 microns.
5. The high performance heat insulating wood board according to claim 2, characterized in that: The thickness of the first infrared light-shielding layer and the second infrared light-shielding layer is 100 to 300 micrometers.
Citation Information
Cited By
Preparation method of high-performance heat insulation wood board
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