Wafer bearing device and thin film deposition equipment

Abstract

The utility model provides a wafer bearing device and thin film deposition equipment, and relates to the technical field of chemical vapor deposition equipment. The wafer bearing device comprises a wafer bearing body and a cooling structure, the wafer bearing body is provided with a wafer placing area, and the wafer placing area is used for placing a to-be-deposited wafer; the cooling structure is connected with the wafer bearing body, the cooling structure and the wafer to be deposited are located on the two opposite sides of the wafer bearing body respectively, and the orthographic projection of the cooling structure on the wafer bearing body is arranged on the periphery of the wafer containing area in a surrounding mode. The wafer bearing device can improve the problem of supercooling of the film, thereby reducing the risk of cracking of the film.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical vapor deposition equipment, and particularly relates to a wafer carrier device and a thin film deposition device. Background Art

[0002] Chemical vapor deposition is a traditional technology for preparing thin films. Its principle is to use gaseous precursor reactants. Through chemical reactions between atoms and molecules, certain components in the gaseous precursor are decomposed to form active groups. These groups adsorb, diffuse and migrate, and chemically react after colliding with the substrate surface, and finally form a thin film. Chemical vapor deposition is the most widely used technology in modern industry for depositing a variety of thin film materials, including a wide range of insulating thin film materials, most metal thin film materials and metal alloy thin film materials.

[0003] In the chemical vapor deposition process, if the thin film deposited on the wafer surface is rapidly cooled, it is easy to cause cracks in the deposited thin film layer. Therefore, how to provide a new thin film deposition device to improve the problem of cracks in the thin film layer caused by excessive cooling of the thin film layer is important and meaningful. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer carrier device and a thin film deposition device, which can improve the problem of excessive cooling of the thin film, thereby reducing the risk of cracks in the thin film.

[0005] The embodiments of the utility model are implemented as follows:

[0006] On the one hand, the utility model provides a wafer carrier device, which includes a wafer carrier and a cooling structure; the wafer carrier has a wafer placement area for placing the wafer to be deposited; the cooling structure is connected to the wafer carrier, and the cooling structure and the wafer to be deposited are respectively located on opposite sides of the wafer carrier, and the orthographic projection of the cooling structure on the wafer carrier surrounds the outer periphery of the wafer placement area. This wafer carrier device can improve the problem of excessive cooling of the thin film, thereby reducing the risk of cracks in the thin film.

[0007] Optionally, there is no overlapping area between the orthographic projection of the cooling structure on the wafer carrier and the wafer placement area.

[0008] Optionally, the wafer carrier device further includes a base, and the wafer carrier is fixed on the base.

[0009] Optionally, the wafer carrier device further includes support columns, one end of each support column is connected to the wafer carrier and the other end is connected to the base.

[0010] Optionally, there are multiple support columns, and the multiple support columns are spaced and evenly distributed on the base.

[0011] Optionally, the wafer placement area has a placement groove recessed on a side of the wafer carrier facing away from the cooling structure, and the placement groove is used for placing the wafer to be deposited.

[0012] Optionally, there are at least two wafer placement areas, adjacent two wafer placement areas are spaced apart, and the areas of different wafer placement areas are different.

[0013] Optionally, the cooling structure includes at least two first structures, the first structures correspond to the wafer placement areas one by one, and each first structure surrounds the outer periphery of each wafer placement area.

[0014] Optionally, the wafer carrier device further includes a base and support columns. The wafer carrier is fixed on the base, one end of the support column is connected to the wafer carrier, and the other end is connected to the base; there are a plurality of support columns arranged at intervals, and the plurality of support columns surround the outer periphery of the first placement area, and the first placement area is the wafer placement area with the smallest area among at least two wafer placement areas.

[0015] On the other hand, the present utility model provides a thin film deposition device, and the thin film deposition device includes the above-mentioned wafer carrier device.

[0016] The beneficial effects of the present utility model include:

[0017] The wafer carrier device provided by the present application includes a wafer carrier and a cooling structure; the wafer carrier has a wafer placement area for placing the wafer to be deposited; the cooling structure is connected to the wafer carrier, and the cooling structure and the wafer to be deposited are respectively located on opposite sides of the wafer carrier, and the orthographic projection of the cooling structure on the wafer carrier surrounds the outer periphery of the wafer placement area. By arranging the cooling structure on the outer periphery of the wafer placement area, on the one hand, the cooling structure can achieve the purpose of cooling and dissipating heat for the wafer to be deposited and the thin film deposited thereon; on the other hand, the bottom of the wafer to be deposited is not provided with a cooling structure, which can slow down the cooling rate of the bottom of the thin film deposited on the wafer to be deposited as much as possible, and can avoid excessive cooling of the thin film deposited on the wafer to be deposited, thereby reducing the risk of cracks in the thin film. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0019] Figure 1 It is one of the schematic structural diagrams of the wafer carrier device provided by the embodiment of the present utility model;

[0020] Figure 2 This is the second structural schematic diagram of the wafer carrier device provided by the embodiment of the present utility model;

[0021] Figure 3 This is the structural schematic diagram of the cooling structure provided by the embodiment of the present utility model;

[0022] Figure 4 This is the structural schematic diagram of the wafer carrier provided by the embodiment of the present utility model.

[0023] Reference numerals: 10 - wafer carrier; 11 - wafer placement area; 111 - placement groove; 12 - clamping groove; 20 - cooling structure; 21 - first structure; 22 - inlet; 23 - outlet; 30 - base; 40 - support column. Detailed implementation manners

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model to be protected, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0026] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0027] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed when in use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0028] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0029] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0030] Please refer to Figure 1 、 Figure 2 and Figure 3 , this embodiment provides a wafer carrier device, which includes a wafer carrier 10 and a cooling structure 20; the wafer carrier 10 has a wafer placement area 11 for placing the wafer to be deposited; the cooling structure 20 is connected to the wafer carrier 10, and the cooling structure 20 and the wafer to be deposited are respectively located on opposite sides of the wafer carrier 10, and the orthographic projection of the cooling structure 20 on the wafer carrier 10 surrounds the outer periphery of the wafer placement area 11. This wafer carrier device can improve the problem of excessive cooling of the thin film, thereby reducing the risk of cracks in the thin film.

[0031] The wafer carrier device provided in this application is used to carry the wafer to be deposited, and is used to cool and dissipate heat from the thin film after the thin film deposition, while minimizing the temperature drop at the bottom of the wafer, thereby reducing the risk of cracks in the thin film deposited on the wafer due to excessive cooling.

[0032] The wafer carrier 10 has a wafer placement area 11 for placing the wafer to be deposited, so as to support and carry the wafer to be deposited.

[0033] In this embodiment, optionally, as Figure 1 and Figure 2 shown, the wafer placement area 11 has a placement groove 111, and the placement groove 111 is recessed on the side of the wafer carrier 10 facing away from the cooling structure 20, and the placement groove 111 is used to place the wafer to be deposited. In this way, the wafer to be deposited can be placed in the placement groove 111.

[0034] Among them, the above-mentioned placement groove 111 can be adapted to the shape of the wafer to be deposited, and the wafer to be deposited can be partially or fully received in the placement groove 111. In this way, the outer wall of the placement groove 111 can limit the wafer to be deposited, and can avoid the radial displacement of the wafer to be deposited.

[0035] Of course, the concave placement groove 111 corresponding to the wafer placement area 11 on the side of the wafer carrier 10 facing away from the cooling structure 20 is only an example and does not limit the present application. For example, in other embodiments, a retaining wall can also be protruded on the wafer carrier 10. The retaining wall is arranged around the outer periphery of the wafer placement area 11, and a placement space for placing the wafer to be deposited is formed through the retaining wall, so that the placement space can also play a role in restricting the radial displacement of the wafer to be deposited. Among them, the above-mentioned retaining wall can be arranged in a ring shape or can include a plurality of spaced-apart blocks.

[0036] The cooling structure 20 is connected to the wafer carrier 10. It should be noted that the above-mentioned cooling structure 20 can be clamped on the wafer carrier 10 or can be fixedly connected to the wafer carrier 10 through a connecting member. The present application does not limit this.

[0037] For example, a clamping groove 12 can be recessed on the side of the wafer carrier 10 facing away from the wafer placement area 11. As Figure 3 and Figure 4 shown, the above-mentioned cooling structure 20 can be clamped in the clamping groove 12. In this way, the fixing method is relatively simple and convenient for the assembly of the wafer carrying device.

[0038] In this embodiment, the cooling structure 20 and the wafer to be deposited are respectively located on opposite sides of the wafer carrier 10. Of course, when the cooling structure 20 is clamped in the wafer carrier 10, the cooling structure 20 is at least partially embedded in the wafer carrier 10. At this time, the part embedded in the wafer carrier 10 can well cool and dissipate heat from the side wall of the wafer.

[0039] Furthermore, it is worth noting that in this embodiment, the orthographic projection of the cooling structure 20 on the wafer carrier 10 surrounds the outer periphery of the wafer placement area 11. In this way, on the one hand, the cooling structure 20 can also serve the purpose of cooling and dissipating heat from the wafer to be deposited and the thin film deposited thereon; on the other hand, the bottom of the wafer to be deposited is not provided with the cooling structure 20, which can slow down the cooling rate of the bottom of the thin film deposited on the wafer to be deposited as much as possible, and can avoid the excessive cooling of the thin film deposited on the wafer to be deposited, thereby reducing the risk of cracks in the thin film.

[0040] In summary, the wafer carrier provided by the present application includes a wafer carrier 10 and a cooling structure 20; the wafer carrier 10 has a wafer placement area 11, and the wafer placement area 11 is used to place the wafer to be deposited; the cooling structure 20 is connected to the wafer carrier 10, and the cooling structure 20 and the wafer to be deposited are respectively located on opposite sides of the wafer carrier 10, and the orthographic projection of the cooling structure 20 on the wafer carrier 10 is arranged around the periphery of the wafer placement area 11. The present application arranges the cooling structure 20 on the periphery of the wafer placement area 11, so that, on the one hand, the cooling structure 20 can serve the purpose of cooling and dissipating the wafer to be deposited and the thin film deposited thereon; on the other hand, the cooling structure 20 is not arranged at the bottom of the wafer to be deposited, which can slow down the cooling rate of the bottom of the thin film deposited on the wafer to be deposited as much as possible, and can avoid excessive cooling of the thin film deposited on the wafer to be deposited, thereby reducing the risk of cracks in the thin film.

[0041] It should be noted that the present application does not limit the cooling method of the cooling structure 20 , for example, air cooling or liquid cooling can be used. The cooling structure 20 can be a cooling pipe with an inlet 22 and an outlet 23 .

[0042] In order to further reduce the cooling rate of the bottom of the film and avoid overcooling of the bottom of the film, optionally, the orthographic projection of the cooling structure 20 on the wafer carrier 10 has no overlapping area with the wafer placement area 11 .

[0043] Furthermore, in order to support the wafer carrier 10, in this embodiment, optionally, the wafer carrier device further includes a base 30, and the wafer carrier 10 is fixed on the base 30. The specific structure and shape of the base 30 are not limited in this application, and those skilled in the art can set it as needed, as long as it can play a supporting and fixing role.

[0044] In order to increase the heat dissipation area of ​​the wafer carrier so that the wafer to be deposited placed in the wafer placement area 11 and the thin film deposited on the wafer to be deposited can dissipate heat better, the wafer carrier can optionally further include a support column 40, one end of the support column 40 is connected to the wafer carrier 10 and the other end is connected to the base 30.

[0045] It should be noted that the radial dimension of the support column 40 is smaller than the radial dimension of the wafer placement area 11, and smaller than the radial dimension of the base 30. In this way, the wafer carrier 10 can be supported on the base 30 by the arrangement of the support column 40, and a gap for air flow is formed between the support column 40 and the base 30.

[0046] Optionally, the above-mentioned support columns 40 include a plurality of them, and the plurality of support columns 40 are spaced apart and evenly distributed on the base 30. In this way, the spaced-apart plurality of support columns 40 can not only ensure sufficient support strength, but also form a gap for air flow through the gap between two adjacent support columns 40, which is beneficial to heat dissipation.

[0047] In order to improve work efficiency, in this embodiment, optionally, the wafer placement area 11 includes at least two, and two adjacent wafer placement areas 11 are spaced apart, and the areas of different wafer placement areas 11 are different. In this way, the wafer carrier device provided in the present application can carry at least two different wafers to be deposited at the same time, so as to deposit and cool at least two different wafers to be deposited.

[0048] Among them, the area and shape of each wafer placement area 11 can correspond to the area and shape of wafers of different specifications, and the present application does not limit this.

[0049] It should be noted that when the wafer placement area 11 includes at least two, optionally, the cooling structure 20 includes at least two first structures 21, the first structures 21 correspond to the wafer placement areas 11 one by one, and each first structure 21 surrounds the outer periphery of each wafer placement area 11.

[0050] Among them, the number of the first structures 21 and the wafer placement areas 11 is the same and they correspond to each other one by one. Each first structure 21 surrounds the outer periphery of the corresponding wafer placement area 11, and is used to cool the wafer to be deposited and the thin film thereon in the wafer placement area 11.

[0051] Of course, when the cooling structure 20 includes at least two first structures 21, two adjacent first structures 21 can be connected to each other so that the cooling structure 20 is formed as a whole. In this way, it is convenient to install the cooling structure 20 on the wafer carrier 10.

[0052] In addition, when the cooling structure 20 adopts a cooling pipe structure and the cooling structure 20 includes at least two first structures 21, two adjacent first structures 21 can also be communicated with each other, as Figure 3 and Figure 4 shown. In this way, it is convenient for the cooling structure 20 to circulate in different first structures 21.

[0053] Optionally, the wafer carrier device further includes a base 30 and support columns 40. The wafer carrier 10 is fixed on the base 30. One end of the support column 40 is connected to the wafer carrier 10 and the other end is connected to the base 30; the support columns 40 include a plurality of them that are spaced apart, and the plurality of support columns 40 surround the outer periphery of the first placement area, and the first placement area is the wafer placement area 11 with the smallest area among at least two wafer placement areas 11.

[0054] That is to say, when the wafer placement area 11 includes at least two, the wafer carrier device may also include a base 30 and support columns 40. At this time, one end of the support column 40 is connected to the wafer carrier 10 and the other end is connected to the base 30. Since the specific structures of the base 30 and the support columns 40 have been described and explained in detail above, they will not be elaborated here again and reference can be made to the foregoing description.

[0055] In this embodiment, the above-mentioned support columns 40 include a plurality of spaced-apart ones, and the plurality of support columns 40 surround the outer periphery of the first placement area with the smallest area. In this way, the heat dissipation area of the wafer to be deposited placed in the wafer placement area 11 with a larger area and the thin film thereon can be further increased, thereby improving its heat dissipation effect.

[0056] In addition, it should be noted that it is also possible that part or all of the second placement area is exposed outside the base 30 (or the orthographic projection of the second placement area on the base 30 does not overlap or only partially overlaps with the base 30). Herein, the second placement area is the wafer placement area 11 excluding the first placement area among all the wafer placement areas 11.

[0057] On the other hand, the present invention provides a thin film deposition device, which includes the above-mentioned wafer carrier device. Since the specific structure and its effects of the above-mentioned wafer carrier device have been described and explained in detail above, they will not be elaborated here again in this application. For the thin film deposition device provided in this application, since the above-mentioned wafer carrier device is adopted, on the one hand, the cooling structure 20 can serve the purpose of cooling and dissipating heat of the wafer to be deposited and the thin film deposited thereon; on the other hand, no cooling structure 20 is provided at the bottom of the wafer to be deposited, which can slow down the cooling rate of the bottom of the thin film deposited on the wafer to be deposited as much as possible, and can avoid excessive cooling of the thin film deposited on the wafer to be deposited, thereby reducing the risk of cracks in the thin film, and thus improving the production yield and quality of the thin film deposition device.

[0058] The above are only optional embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0059] In addition, it should be noted that in the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.

Claims

1. A wafer carrying device, characterized in that: It includes a wafer carrier and a cooling structure; the wafer carrier has a wafer placement area, and the wafer placement area is used to place the wafer to be deposited; the cooling structure is connected to the wafer carrier, and the cooling structure and the wafer to be deposited are respectively located on opposite sides of the wafer carrier, and the orthographic projection of the cooling structure on the wafer carrier is arranged around the periphery of the wafer placement area.

2. The wafer carrier device according to claim 1, characterized in that: The orthographic projection of the cooling structure on the wafer carrier has no overlapping area with the wafer placement area.

3. The wafer carrier device according to claim 1, characterized in that: The wafer carrying device also includes a base, and the wafer carrying body is fixed on the base.

4. The wafer carrier device according to claim 3, characterized in that: The wafer carrying device further comprises a supporting column, one end of which is connected to the wafer carrying body, and the other end of which is connected to the base.

5. The wafer carrier device according to claim 4, characterized in that: The supporting columns include a plurality of supporting columns, and the plurality of supporting columns are spaced apart and evenly distributed on the base.

6. The wafer carrying device according to claim 1, characterized in that: The wafer placement area has a placement groove, which is recessed on a side of the wafer carrier away from the cooling structure, and is used for placing the wafer to be deposited.

7. The wafer carrier device according to any one of claims 1 to 6, characterized in that: The wafer placement areas include at least two, two adjacent wafer placement areas are arranged at intervals, and areas of different wafer placement areas are different.

8. The wafer carrying device according to claim 7, characterized in that: The cooling structure includes at least two first structures, the first structures correspond to the wafer placement areas one by one, and each of the first structures is arranged around the periphery of each of the wafer placement areas.

9. The wafer carrying device according to claim 7, characterized in that: The wafer carrying device also includes a base and a support column, the wafer carrying body is fixed on the base, one end of the support column is connected to the wafer carrying body, and the other end is connected to the base; the support column includes a plurality of support columns arranged at intervals, and the plurality of support columns are arranged around the periphery of a first placement area, and the first placement area is the wafer placement area with the smallest area among at least two wafer placement areas.

10. A thin film deposition device, characterized in that: A wafer carrier comprising the wafer carrier described in any one of claims 1 to 9.

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