Cleaning and annealing device for bonding copper wires

Abstract

The utility model discloses a cleaning and annealing device for a bonding copper wire, which belongs to the technical field of annealing and comprises a copper wire body, an annealing furnace bin is arranged in the middle of the copper wire body, stabilizing mechanisms are arranged on the left side and the right side of the annealing furnace bin, and a cleaning mechanism is arranged on the right side of the copper wire body. The cleaning and annealing device for the bonding copper wires is additionally provided with a stabilizing mechanism and a cleaning mechanism, the stabilizing mechanism and the cleaning mechanism supplement each other, the stabilizing mechanism adopts multiple sets of limiting structures, multiple sets of copper wire bodies can be conveyed at the same time, and the stabilizing mechanism is matched with the limiting structures of the circular rings; a plurality of groups of spray headers in the cleaning mechanism are used for spraying cooling liquid after the copper wires pass through the annealing furnace so as to reduce the temperature gradient of the copper wires, and the plurality of groups of spray headers spray uniformly, so that the cleaning liquid is more effectively contacted with and removes dirt on the surfaces of the copper wires, and the uniform annealing effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of annealing, in particular to a cleaning and annealing device for bonding copper wires. Background Technique

[0002] Bonding copper wire is a kind of wire formed by chemically or physically connecting two or more copper wires together through certain technological means. It is usually composed of fine copper wires, which are combined together through the metallic bonding between atoms under certain temperature and pressure to form a continuous linear structure. Bonding copper wire has high electrical conductivity and good mechanical strength, and is widely used in the fields of electronics, electrical appliances, communication, etc., such as for manufacturing wires and connectors on printed circuit boards.

[0003] The patent document with the application number CN202321283468.7 discloses a cleaning and annealing device for bonding copper wires. Among them, it includes an annealing device body, a cleaning tank, a material receiving device and a material guiding device. The cleaning tank is fixedly connected to the feeding end of the annealing device body, the material receiving device is fixedly connected to the discharging end of the annealing device body, the material guiding device is fixedly connected to one side of the cleaning tank, an annular plate is arranged inside the cleaning tank, a cleaning brush is fixedly connected to the inner side of the annular plate, a power mechanism is fixedly connected to the top of the annular plate, the power mechanism includes an adjusting tooth, the adjusting tooth is meshed and connected with an adjusting tooth plate at the top, an adjusting motor is fixedly connected to one side of the inner wall of the cleaning tank, and the output end of the adjusting motor is fixedly connected with a connecting plate. Based on the retrieval of the above patent and the discovery of the cleaning and annealing devices in the existing technology, it is found that when the cleaning and annealing device is applied, due to the possible vibration or distortion of the copper wire during the transmission process, the dirt on the surface of the copper wire cannot be completely cleaned off. When the copper wire is heat-treated in the annealing furnace, due to uneven heat transfer, the diameter and mechanical properties of the copper wire may be uneven. Content of the Utility Model

[0004] The purpose of the utility model is to provide a cleaning and annealing device for bonding copper wires to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A cleaning and annealing device for bonding copper wires, including a copper wire body, an annealing furnace chamber is arranged in the middle of the copper wire body, stabilizing mechanisms are arranged on both the left and right sides of the annealing furnace chamber, a cleaning mechanism is arranged on the right side of the copper wire body, the stabilizing mechanism includes a first driving roller body, a second driving roller body, a first circular ring, a first limiting nut, a second circular ring and a second limiting nut, a threaded groove is opened on the first driving roller body, a first circular ring is arranged in the middle of the first driving roller body, first limiting nuts are arranged on both the front and back sides of the first circular ring, and five groups of the first circular rings and first limiting nuts are distributed on the first driving roller body from front to back.

[0006] Optionally, a threaded groove is provided on the second driving roller body, and a second circular ring is arranged in the middle of the second driving roller body.

[0007] Optionally, second limiting nuts are arranged on both the front and rear sides of the second circular ring, and the five groups of second circular rings and second limiting nuts are distributed on the second driving roller body from front to back.

[0008] Optionally, the stabilizing mechanism further includes a first support and a first bearing bracket, and the first driving roller body and the second driving roller body are placed on the first bearing bracket.

[0009] Optionally, a first support is arranged on the left side of the annealing furnace chamber, and a first bearing bracket is fixedly installed at the upper end of the first support.

[0010] Optionally, the cleaning mechanism includes a second support, a second bearing bracket, a first mounting plate, a first spray head, a second mounting plate, a second spray head and a water tank body, and a second support is arranged on the right side of the annealing furnace chamber.

[0011] Optionally, a second bearing bracket is fixedly installed at the upper end of the second support, and a first mounting plate and a second mounting plate are fixedly installed at the upper end of the second bearing bracket.

[0012] Optionally, a water tank body is fixedly installed at the upper ends of the first mounting plate and the second mounting plate, a first spray head is installed at the lower end of the first mounting plate, and a second spray head is installed at the lower end of the second mounting plate.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. In the present utility model, a stabilizing mechanism is provided. By arranging multiple groups of first circular rings and second circular rings (circular ring limiting structures), the stabilizing mechanism can effectively limit the vibration and distortion of the copper wire during the transmission process, ensuring that the dirt on the surface of the copper wire is fully cleaned and effectively annealed. The first circular rings and second circular rings in the stabilizing mechanism can be adjusted in position, and the circular ring limiting structures can also be increased or decreased to adapt to copper wires of different sizes, improving the applicability and flexibility of the device; since the stabilizing mechanism can simultaneously and stably limit multiple groups of copper wire bodies, the cleaning and annealing operations of multiple groups of copper wires can be carried out simultaneously, improving the production efficiency and equipment utilization rate.

[0015] 2. In the present utility model, a cleaning mechanism is provided. The cleaning mechanism is provided with multiple groups of spray heads for spraying a coolant on the copper wire after it passes through the annealing furnace to reduce the temperature gradient of the copper wire. The multiple groups of spray heads are evenly sprayed, enabling the cleaning liquid to more effectively contact and remove the dirt on the surface of the copper wire, ensuring uniform annealing effect. By evenly spraying the coolant through the multiple groups of spray heads in the cleaning mechanism, it helps to achieve a uniform temperature distribution of the copper wire during the annealing process, thereby improving the uniformity of the diameter and mechanical properties of the copper wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model in a three-dimensional front view;

[0017] Figure 2 is a schematic structural diagram of the present utility model in a planar front view;

[0018] Figure 3 is a schematic structural diagram of the present utility model in a three-dimensional sectional view;

[0019] Figure 4 is a schematic structural diagram of the present utility model in a three-dimensional top view;

[0020] Figure 5 is a schematic structural diagram of the present utility model in a planar top view.

[0021] In the figure: 1. Copper wire body; 2. Annealing furnace chamber; 3. Stabilizing mechanism; 301. First support; 302. First bearing frame; 303. First driving roller body; 304. Second driving roller body; 305. First ring; 306. First limit nut; 307. Second ring; 308. Second limit nut; 4. Cleaning mechanism; 401. Second support; 402. Second bearing frame; 403. First mounting plate; 404. First spray head; 405. Second mounting plate; 406. Second spray head; 407. Water tank body. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1 to 5, in the embodiment of the present utility model, a cleaning and annealing device for bonding copper wires includes a copper wire body 1. An annealing furnace chamber 2 is arranged in the middle of the copper wire body 1. Stabilizing mechanisms 3 are arranged on both the left and right sides of the annealing furnace chamber 2. A cleaning mechanism 4 is arranged on the right side of the copper wire body 1. The stabilizing mechanism 3 includes a first driving roller body 303, a second driving roller body 304, a first circular ring 305, a first limiting nut 306, a second circular ring 307, and a second limiting nut 308. A threaded groove is formed on the first driving roller body 303. A first circular ring 305 is arranged in the middle of the first driving roller body 303. First limiting nuts 306 are arranged on both the front and back sides of the first circular ring 305. Five groups of the first circular ring 305 and the first limiting nuts 306 are distributed on the first driving roller body 303 from front to back. A threaded groove is formed on the second driving roller body 304. A second circular ring 307 is arranged in the middle of the second driving roller body 304. Second limiting nuts 308 are arranged on both the front and back sides of the second circular ring 307. Five groups of the second circular ring 307 and the second limiting nuts 308 are distributed on the second driving roller body 304 from front to back. The stabilizing mechanism 3 further includes a first support 301 and a first bearing bracket 302. The first driving roller body 303 and the second driving roller body 304 are placed on the first bearing bracket 302. A first support 301 is arranged on the left side of the annealing furnace chamber 2. A first bearing bracket 302 is fixedly installed at the upper end of the first support 301;

[0024] The second bearing bracket 402 is used to support and fix the first driving roller body (303) and the second driving roller body (304) so that they can rotate smoothly. The first circular ring 305 is used to limit the copper wire body 1 and keep it stable during the transmission process. The first limiting nut 306 is used to adjust the position of the first circular ring 305, which helps to improve the applicability and flexibility of the device. The second circular ring 307 is used to limit the copper wire body 1 and keep it stable during the transmission process, which helps to prevent the copper wire from vibrating or twisting during the transmission process and ensures that the dirt on the surface of the copper wire is fully cleaned. The second limiting nut 308 is used to adjust the position of the second circular ring 307, which improves the applicability and flexibility of the device;

[0025] The cleaning mechanism 4 includes a second support 401, a second bearing bracket 402, a first mounting plate 403, a first spray head 404, a second mounting plate 405, a second spray head 406, and a water tank body 407. A second support 401 is arranged on the right side of the annealing furnace chamber 2. A second bearing bracket 402 is fixedly installed at the upper end of the second support 401. The first mounting plate 403 and the second mounting plate 405 are fixedly installed at the upper end of the second bearing bracket 402. A water tank body 407 is fixedly installed at the upper ends of the first mounting plate 403 and the second mounting plate 405. The first spray head 404 is installed at the lower end of the first mounting plate 403. The second spray head 406 is installed at the lower end of the second mounting plate 405;

[0026] The second support 401 is used to support and fix other parts of the cleaning mechanism 4 to ensure its stability during the operation of the equipment. The second bearing bracket 402 is used to support and fix the spray head so that it can smoothly spray the coolant. The first mounting plate 403 is used to fix the first spray head 404, and the first spray head 404 is used to spray the coolant to reduce the temperature gradient of the copper wire, which helps to improve the spraying effect of the coolant and ensure the uniform annealing of the copper wire. The second mounting plate 405 is used to fix the second spray head 406 so that it can accurately spray the coolant, which helps to improve the mounting stability of the spray head and ensure the uniform spraying of the coolant. The second spray head 406 is used to spray the coolant to reduce the temperature gradient of the copper wire, which helps to improve the spraying effect of the coolant and ensure the annealing of the copper wire. The water tank body 407 provides a stable coolant supply for the spray head, which helps to improve the storage stability of the coolant.

[0027] The working principle of the present utility model is as follows: The cleaning and annealing device for bonding copper wires of the present utility model is additionally provided with a stabilizing mechanism 3 and a cleaning mechanism 4. Before using the cleaning and annealing device for bonding copper wires, it is necessary to pre-connect the annealing furnace chamber 2 to the power supply and connect it to the control terminal, connect the water tank body 407 to the external water supply end, and install the whole device on the conveyor belt of the copper wire body 1. When using the cleaning and annealing device for bonding copper wires, first insert the copper wire body 1 through the stabilizing mechanism 3, insert the copper wire body 1 to the right, extend it through the annealing furnace chamber 2 and then to the cleaning mechanism 4. Between the first ring 305 and the second ring 307 in the stabilizing mechanism 3, the copper wire body 1 can be stably transmitted, and multiple groups of the first ring 305 and the second ring 307 (ring limiting structure) in the stabilizing mechanism 3 can simultaneously and stably limit multiple groups of copper wire bodies 1. The copper wire body 1 is transmitted into the annealing furnace chamber 2 for annealing operation. After annealing in the annealing furnace chamber 2, the first spray head 404 and the second spray head 406 in the cleaning mechanism 4 spray downward evenly, spraying the coolant evenly, which can effectively clean the copper wire body 1 and perform uniform annealing operation on the copper wire body 1. The difference is that the first ring 305 and the second ring 307 in the stabilizing mechanism 3 can be adjusted, and the ring limiting structure can also be increased or decreased, so as to adapt to different situations of transporting the copper wire body 1. To sum up, the stabilizing mechanism 3 and the cleaning mechanism 4 complement each other. The stabilizing mechanism 3 adopts multiple groups of limiting structures, which can simultaneously transport multiple groups of copper wire bodies 1, and cooperate with the ring limiting structure to ensure the stable transmission effect of multiple groups of copper wire bodies 1. And multiple groups of spray heads in the cleaning mechanism 4 are used to spray the coolant after the copper wire passes through the annealing furnace to reduce the temperature gradient of the copper wire. The multiple groups of spray heads spray evenly, making the cleaning liquid more effectively contact and remove the dirt on the surface of the copper wire, ensuring the uniform annealing effect.

[0028] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A cleaning and annealing device for bonding copper wires, comprising a copper wire body (1), wherein an annealing furnace chamber (2) is arranged in the middle of the copper wire body (1), characterized in that: The left and right sides of the annealing furnace chamber (2) are both provided with stabilizing mechanisms (3), the right side of the copper wire body (1) is provided with a cleaning mechanism (4), the stabilizing mechanism (3) comprises a first transmission roller body (303), a second transmission roller body (304), a first circular ring (305), a first limiting nut (306), a second circular ring (307) and a second limiting nut (308), the first transmission roller body (303) is provided with a thread groove, the middle part of the first transmission roller body (303) is provided with a first circular ring (305), the front and rear sides of the first circular ring (305) are both provided with first limiting nuts (306), and five groups of the first circular ring (305) and the first limiting nuts (306) are distributed on the first transmission roller body (303) from front to back.

2. The cleaning and annealing device for bonding copper wire according to claim 1, characterized in that: A thread groove is provided on the second transmission roller body (304), and a second ring (307) is provided in the middle of the second transmission roller body (304).

3. A bonding copper wire cleaning and annealing device according to claim 2, characterized in that: Second limiting nuts (308) are provided on both the front and rear sides of the second circular ring (307), and five groups of the second circular ring (307) and the second limiting nuts (308) are distributed on the second transmission roller body (304) from front to back.

4. The cleaning and annealing device for bonding copper wire according to claim 1, characterized in that: The stabilizing mechanism (3) further comprises a first support (301) and a first bearing frame (302), and the first transmission roller body (303) and the second transmission roller body (304) are placed on the first bearing frame (302).

5. The cleaning and annealing device for bonding copper wire according to claim 1, characterized in that: A first support (301) is provided on the left side of the annealing furnace bin (2), and a first bearing frame (302) is fixedly mounted on the upper end of the first support (301).

6. The cleaning and annealing device for bonding copper wire according to claim 1, characterized in that: The cleaning mechanism (4) comprises a second support (401), a second bearing frame (402), a first mounting plate (403), a first spray head (404), a second mounting plate (405), a second spray head (406) and a water tank body (407), and the second support (401) is arranged on the right side of the annealing furnace chamber (2).

7. A bonding copper wire cleaning and annealing device according to claim 6, characterized in that: A second bearing frame (402) is fixedly mounted on the upper end of the second support (401), and a first mounting plate (403) and a second mounting plate (405) are fixedly mounted on the upper end of the second bearing frame (402).

8. The bonding copper wire cleaning and annealing device according to claim 6, characterized in that: A water tank body (407) is fixedly mounted on the upper ends of the first mounting plate (403) and the second mounting plate (405), a first spray head (404) is mounted on the lower end of the first mounting plate (403), and a second spray head (406) is mounted on the lower end of the second mounting plate (405).

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