Temperature control system and semiconductor test equipment

Abstract

The utility model relates to the technical field of semiconductor testing, and discloses a temperature control system and semiconductor testing equipment, the temperature control system comprises a cooling circulation loop, a heat exchange medium source, a first temperature control assembly and a second temperature control assembly, the cooling circulation loop comprises a refrigerator, at least one first heat exchanger and a second heat exchanger which are sequentially connected in series; the heat exchange medium source is used for conveying a heat exchange medium to each first heat exchanger; each first heat exchanger corresponds to at least one first temperature control assembly, and each first temperature control assembly comprises a first temperature control part, a first heater and a first temperature detector; the second temperature control assembly comprises a second heater, a second temperature detector and a second temperature control piece. The semiconductor test equipment comprises a material supply device, a bearing station, a test mechanism, a material receiving device, a transportation device and a temperature control system. According to the utility model, only one refrigerating machine is needed to provide a cold source for a plurality of heat exchangers, the cost is low, the energy consumption is small, the occupied space is small, the cold source obtained by each heat exchanger is stable, and the temperature control of electronic components is accurate and stable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a temperature control system and semiconductor testing equipment. Background Art

[0002] During the testing of electronic components such as chips and integrated circuits, a temperature control system is required to control the temperature of the electronic components so as to keep the electronic components at a preset temperature during the testing process. A refrigerator and a heat exchanger are often involved in the temperature control system, and the refrigerator provides a refrigerant to the heat exchanger to cool the heat exchanger.

[0003] At present, there are two main cooling methods for temperature control systems with multiple heat exchangers: the first is to use a one-to-one method, using multiple refrigerators to cool multiple heat exchangers, and the number of refrigerators and heat exchangers is the same; the second is to use one refrigerator to provide a cold source for multiple heat exchangers through liquid separation.

[0004] In the above-mentioned cooling method, a one-to-one method is adopted, and multiple heat exchangers need to be equipped with multiple refrigerators for cooling, which not only leads to high cost and high energy consumption of the temperature control system, but also occupies a large space; while the liquid separation method is adopted, due to the uneven liquid separation and uncertain flow rate when the refrigerant enters each heat exchanger, the cold source obtained by each heat exchanger is unstable, which affects the stability of the temperature control of the electronic components.

[0005] Therefore, there is an urgent need for a temperature control system and semiconductor testing equipment to solve the above technical problems. Utility Model Content

[0006] Based on the above, the purpose of the utility model is to provide a temperature control system and semiconductor testing equipment, which only requires one refrigerator to provide a cold source for multiple heat exchangers, with low cost, low energy consumption, and small space occupation. In addition, the cold source obtained by each heat exchanger is stable, and the temperature control of the product to be tested is accurate and stable.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] In one aspect, the utility model provides a temperature control system, comprising:

[0009] A cooling circulation loop comprises a refrigerator, at least a first heat exchanger and a second heat exchanger connected in series;

[0010] a heat exchange medium source, used for delivering heat exchange medium to each of the first heat exchangers;

[0011] The first temperature control component, at least one of the first temperature control components corresponds to the heat transfer medium output end of each of the first heat exchangers. Each of the first temperature control components includes a first temperature control element, a first heater, and a first temperature detector. The first temperature control element is communicated with the heat transfer medium output end of the first heat exchanger. The first heater is used to heat the heat transfer medium flow path entering and leaving the first heat exchanger. The first temperature detector is used to detect the temperature at the heat exchange position between the first temperature control element and the object to be temperature-controlled. The first temperature detector is communicatively connected to the first heater;

[0012] The second temperature control component, including a second heater, a second temperature detector, and a second temperature control element. The second heater controls the temperature of the second temperature control element through heat exchange with the second heat exchanger. The second temperature detector is used to detect the temperature of the second temperature control element. The second temperature detector is communicatively connected to the second heater.

[0013] In some possible implementation manners, the temperature control system includes at least one of the first heat exchangers and at least one of the first temperature control components, and the first heat exchangers and the first temperature control components are arranged in one-to-one correspondence.

[0014] In some possible implementation manners, the first temperature control component includes a blowing temperature control component, wherein the heat transfer medium source is a gas dryer, the first temperature control element is a blowing pipeline, and the outlet of the blowing pipeline blows towards the object to be temperature-controlled; the first heat exchanger is a plate heat exchanger, and the plate heat exchanger includes a refrigerant channel and a drying gas channel capable of performing heat exchange. The outlet of the drying gas channel is communicated with the blowing pipeline. The first heater is arranged on the blowing pipeline. The first temperature detector is used to detect the temperature at the outlet of the blowing pipeline.

[0015] In some possible implementation manners, the temperature control system further includes a bypass pipeline, and the bypass pipeline enables the gas output by the gas dryer to be directly communicated with the blowing pipeline without passing through the drying gas channel of the plate heat exchanger.

[0016] In some possible implementation manners, the temperature control system further includes a control valve, and the control valve is used to control the connection between the gas dryer and the bypass pipeline or the connection between the gas dryer and the drying gas channel of the plate heat exchanger.

[0017] In some possible implementation manners, the second temperature control component includes a head temperature control component, wherein the second temperature control element is a head, the head is used to contact and conduct heat for temperature control of the object to be temperature-controlled, the second heater is used to heat the head, the second heat exchanger is a flow channel heat exchanger, and a cooling flow channel is arranged in the flow channel heat exchanger. The flow channel heat exchanger is used to cool the second heater; the second temperature detector is used to detect the temperature of the head.

[0018] In some possible embodiments, the indenter is fixedly connected to the bottom of the flow channel heat exchanger, and the second heater is disposed inside the indenter.

[0019] In some possible embodiments, the second heater is a heating rod or a heating sheet.

[0020] In some possible embodiments, the cooling flow channel includes an inlet flow channel and an outlet flow channel. The inlet flow channel is communicated with the refrigerant output end of the first heat exchanger, and the outlet flow channel is communicated with the refrigerant return end of the refrigerator.

[0021] In some possible embodiments, the inlet flow channel and the outlet flow channel are wound around each other to form a double helix structure.

[0022] On the other hand, the present invention provides a semiconductor testing device, including a feeding device, a loading station, a testing mechanism, a collecting device, a transporting device, and a temperature control system according to any one of the above solutions. The feeding device is used to supply products to be tested. The transporting device is used to transport the products to be tested in the feeding device to the loading station. The testing mechanism is used to test the products to be tested at the loading station. The temperature control system is used to control the testing temperature of the products to be tested at the loading station. The transporting device is also used to transport the tested products at the loading station to the collecting device.

[0023] The beneficial effects of the present invention are as follows:

[0024] The temperature control system provided by the present invention forms a cooling circulation loop by sequentially connecting a refrigerator with at least one first heat exchanger and a second heat exchanger in series, and can realize simultaneous refrigeration of multiple heat exchangers. Since the heat exchange medium supplied by the heat exchange medium source to each first heat exchanger is stable, and the cooling capacity output by the refrigerator is certain, the loss of the refrigerant of the refrigerator is fixed when passing through each first heat exchanger. Therefore, the cooling capacity obtained by each first heat exchanger and the second heat exchanger is certain, avoiding the problem that the cold source obtained by each heat exchanger is unstable due to uneven distribution of the refrigerant, which affects the temperature control of electronic components.

[0025] The first temperature control component and the second temperature control component of the present invention respectively detect the actual temperature of the corresponding temperature control parts through the corresponding temperature detectors, and feedback the actual temperature to the control device. The control device compares the actual temperature with the target temperature. When the target temperature > the actual temperature, the control device will increase the heating power of the corresponding heater to make the actual temperature reach the target temperature. When the target temperature < the actual temperature, the control device will decrease the heating power of the corresponding heater to make the actual temperature reach the target temperature. Thus, a stable temperature environment is provided for the products to be tested, ensuring the temperature control accuracy and stability of product testing.

[0026] The temperature control system and semiconductor testing equipment provided by the present utility model only require one refrigerating machine to provide cold sources for multiple heat exchangers, with low cost, low energy consumption, small occupied space, and stable cold sources obtained by each heat exchanger, and accurate and stable temperature control for the product to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. is a schematic structural diagram of a temperature control system provided by an embodiment of the present utility model;

[0028] Figure 2 FIG. is a schematic control principle diagram of a temperature control system provided by an embodiment of the present utility model;

[0029] Figure 3 FIG. is a schematic structural diagram of another temperature control system provided by an embodiment of the present utility model;

[0030] Figure 4 FIG. is a schematic control principle diagram of another temperature control system provided by an embodiment of the present utility model;

[0031] Figure 5 FIG. is a schematic structural diagram of a flow channel heat exchanger and a press head provided by an embodiment of the present utility model;

[0032] Figure 6 FIG. is a schematic structural diagram of the flow channel heat exchanger after removing the cover body provided by an embodiment of the present utility model;

[0033] Figure 7 FIG. is an exploded view of a flow channel heat exchanger and a press head provided by an embodiment of the present utility model;

[0034] Figure 8 FIG. is a schematic structural diagram of a second heater provided by an embodiment of the present utility model.

[0035] In the figures:

[0036] 1, refrigerating machine;

[0037] 21, first temperature control member; 22, first heat exchanger; 23, first heater; 24, first temperature detector;

[0038] 31, second temperature control member; 32, second heat exchanger; 320, cooling flow channel; 3201, liquid inlet flow channel; 3202, liquid outlet flow channel; 321, base; 322, cover body; 323, liquid inlet pipe; 324, liquid outlet pipe; 325, central column; 33, second heater;

[0039] 41, first pipeline; 42, second pipeline; 43, third pipeline; 44, fourth pipeline; 45, bypass pipeline; 46, control valve; 47, intermediate pipeline. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] The present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0041] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0042] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0043] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0044] This embodiment provides a temperature control system, which can be used in semiconductor test equipment to solve the problems of high cost, high energy consumption, and large occupied space caused by using multiple refrigerators corresponding to multiple heat exchangers one by one in the existing temperature control system, and the problem that when using one refrigerator to provide cold sources for multiple heat exchangers through liquid separation, the liquid separation is uneven and the cold sources obtained by each heat exchanger are unstable, thus affecting the temperature control stability of the product to be tested. Specifically, the product to be tested in this embodiment can be a chip, an intermediate product generated during the chip manufacturing process, or other electronic components, etc., and this embodiment does not make any limitations thereto.

[0045] Such as Figures 1-8As shown in the figure, the temperature control system provided in this embodiment includes a cooling circulation loop, a heat exchange medium source, at least one first temperature control component, and a second temperature control component. The cooling circulation loop includes a refrigerator 1, at least one first heat exchanger 22, and a second heat exchanger 32 connected in series in sequence. The amount of cold output by the refrigerator 1 is constant, and the refrigerator 1 provides a cold source for each first heat exchanger 22 and the second heat exchanger 32 in sequence. In this embodiment, the first heat exchanger 22 is a heat exchanger with a constant heat exchange capacity, such as a plate heat exchanger, a shell-and-tube heat exchanger, etc., and heat exchange can be achieved through the refrigerant flowing on one side and the heat exchange medium flowing on the other side. The heat exchange medium source is used to transport a heat exchange medium (such as air, water, oil, etc.) with a certain temperature to each first heat exchanger 22. The heat exchange medium transported by the heat exchange medium source is a fluid with a constant flow rate and a constant temperature, so that when the refrigerant output by the refrigerator 1 flows through each first heat exchanger 22, the refrigerant and the heat exchange medium flowing in each first heat exchanger 22 can achieve uniform and stable heat exchange, and the loss of the refrigerant at each first heat exchanger 22 is a fixed value, so that each first heat exchanger 22 and the second heat exchanger 32 can obtain a refrigerant with a fixed amount of cold, avoiding the problem that the cold source obtained by each heat exchanger is unstable due to the liquid separation method, which affects the temperature control of the product to be tested.

[0046] In this embodiment, at least one first temperature control component corresponds to the heat exchange medium output end of each first heat exchanger 22. Each first temperature control component includes a first temperature control element 21, a first heater 23, and a first temperature detector 24. The first temperature control element 21 is communicated with the heat exchange medium output end of the first heat exchanger 22, and the first temperature control element 21 is used to control the temperature of the object to be temperature-controlled at the loading station through the heat exchange medium. Specifically, the object to be temperature-controlled in this embodiment can be a product to be tested or a test chamber, etc. The first heater 23 is used to heat the heat exchange medium flow path between the heat exchange medium source and the first heat exchanger 22 or the heat exchange medium flow path flowing out of the first heat exchanger 22, and both can increase the temperature of the heat exchange medium. The first temperature detector 24 is used to detect the temperature at the heat exchange position between the first temperature control element 21 and the object to be temperature-controlled, and the first temperature detector 24 is communicatively connected with the first heater 23. In this embodiment, the first temperature detector 24 detects the actual temperature at the heat exchange position between the first temperature control element 21 and the object to be temperature-controlled and feeds the actual temperature back to the control device. The control device compares the actual temperature with the target temperature. When the target temperature > the actual temperature, the control device will increase the heating power of the first heater 23 to make the actual temperature reach the target temperature; when the target temperature < the actual temperature, the control device will decrease the heating power of the first heater 23 to make the actual temperature reach the target temperature; thus, a stable temperature environment is provided for the product to be tested, ensuring the temperature control accuracy and stability of the product test.

[0047] The second temperature control component of this embodiment includes a second heater 33, a second temperature detector, and a second temperature control member 31. The second temperature control member 31 is used for contact temperature control of the object to be temperature-controlled. The second heater 33 and the second heat exchanger 32 perform temperature control on the second temperature control member 31 through heat exchange. The second temperature detector is used to detect the temperature of the second temperature control member 31, and the second temperature detector is communicatively connected to the second heater 33. In this embodiment, the actual temperature of the second temperature control member 31 is detected by the second temperature detector and fed back to the control device. The control device compares the actual temperature with the target temperature. When the target temperature > the actual temperature, the control device increases the heating power of the second heater 33 to make the actual temperature reach the target temperature; when the target temperature < the actual temperature, the control device decreases the heating power of the second heater 33 to make the actual temperature reach the target temperature. Thus, a stable temperature environment is provided for the product to be tested, ensuring the temperature control accuracy and stability of the product test.

[0048] In summary, for the temperature control system provided in this embodiment, only one refrigerating machine 1 is required to provide a cold source for multiple heat exchangers, which has low cost, low energy consumption, and small occupied space. Moreover, the cold source obtained by each heat exchanger is stable, and the temperature control of the product to be tested is accurate and stable.

[0049] For the temperature control system provided in this embodiment, each first heat exchanger 22 can be correspondingly connected to a first temperature control component to meet the temperature control requirement at one place; or each first heat exchanger 22 can be correspondingly connected to two or more first temperature control components to meet the temperature control requirements at multiple places through one first heat exchanger 22. Preferably, in this embodiment, the number of first heat exchangers 22 is the same as the number of first temperature control components, and each first heat exchanger 22 and each first temperature control component are arranged in one-to-one correspondence, which is beneficial to simplifying the system structure and increasing the heat exchange efficiency.

[0050] In practical applications, the number of first heat exchangers 22 can be flexibly set according to the temperature control requirements. This temperature control system can be provided with only one first heat exchanger 22, or two or more first heat exchangers 22 can be provided. Specifically, as Figure 1 and Figure 2 shown, in an alternative embodiment, the temperature control system includes one first heat exchanger 22 and one second heat exchanger 32. The refrigerant flowing out of the refrigerating machine 1 enters the refrigerant channel of the first heat exchanger 22 through the first pipeline 41, flows out of the refrigerant channel of the first heat exchanger 22, then enters the inlet of the second heat exchanger 32 through the second pipeline 42, then flows out from the outlet of the second heat exchanger 32, and then returns to the refrigerating machine 1 through the third pipeline 43, thus forming a closed cooling circulation loop. At the same time, the heat exchange medium output by the heat exchange medium source enters the heat exchange medium channel of the first heat exchanger 22 through the fourth pipeline 44, flows out of the heat exchange medium channel of the first heat exchanger 22, and then enters the first temperature control member 21 to realize the temperature control of the object to be temperature-controlled through the first temperature control member 21.

[0051] As Figure 3 and Figure 4 shown, in another alternative embodiment, the temperature control system includes two first heat exchangers 22 and a second heat exchanger 32. The refrigerant flowing out of the refrigerator 1 enters the refrigerant channel of a first heat exchanger 22 through the first pipeline 41, flows out of the refrigerant channel of this first heat exchanger 22 and then enters the refrigerant channel of another first heat exchanger 22 through the intermediate pipeline 47, flows out of the refrigerant channel of another first heat exchanger 22 and then enters the inlet of the second heat exchanger 32 through the second pipeline 42, then flows out from the outlet of the second heat exchanger 32, and then returns to the refrigerator 1 through the third pipeline 43, thus forming a closed cooling circulation loop. At the same time, the heat exchange medium output by the heat exchange medium source enters the heat exchange medium channels of the two first heat exchangers 22 respectively through two fourth pipelines 44, flows out of the heat exchange medium channels of the two first heat exchangers 22 and then enters two first temperature control components 21 respectively, and the temperature control of two objects to be temperature-controlled is realized through the two first temperature control components 21.

[0052] Referring Figure 1 to Figure 3 and

[0053] Further, referring Figure 2 to Figure 4, the temperature control system of this embodiment further includes a bypass pipeline 45. The bypass pipeline 45 enables the gas output by the gas dryer to be directly communicated with the blowing pipeline without passing through the drying gas channel of the plate heat exchanger, and a first heater 23 is arranged on the blowing pipeline. To facilitate the control and switching of the bypass pipeline 45, the temperature control system of this embodiment further includes a control valve 46. The control valve 46 is used to control the connection between the gas dryer and the bypass pipeline 45 or the connection with the drying gas channel of the plate heat exchanger. Specifically, the control valve 46 can be a switching valve or globe valves respectively arranged on the above two flow paths. By setting the bypass pipeline 45 in this embodiment, the gas output by the gas dryer can be divided into two flow paths. One flow path is directly connected to the first heater 23, and the other flow path is first cooled by the plate heat exchanger and then connected to the first heater 23. With such a setting, when the product to be tested requires a low-temperature environment, the normal-temperature gas output by the gas dryer can be first cooled by the plate heat exchanger and then thermally compensated by the first heater 23 to obtain an accurate test temperature; when the product to be tested requires a relatively high temperature, the constant-temperature gas (such as normal-temperature or gas higher than normal temperature) output by the gas dryer can be directly heated by the first heater 23 to obtain the required test temperature, with high heating efficiency and avoiding heat loss.

[0054] Reference Figure 1 and Figures 3-8 As shown, in this embodiment, the second temperature control component is preferably a platen temperature control component, where the second temperature control element 31 is a platen. The platen is used to directly contact the product to be tested for heat conduction temperature control; the second heater 33 is used to heat the platen, and specifically can be a heating rod or a heating sheet, etc.; the second heat exchanger 32 is a flow channel heat exchanger, and a cooling flow channel 320 is provided in the flow channel heat exchanger. The flow channel heat exchanger is used to cool the second heater 33 (or the platen); through the heat and cold confrontation between the flow channel heat exchanger and the second heater 33, the temperature control of the platen is realized, and then the platen with a certain temperature can conduct heat and control the temperature of the product to be tested. The second temperature detector is used to detect the actual temperature of the platen and feedback the actual temperature of the platen to the control device. The control device adjusts the heating power of the second heater 33 according to the difference between the actual temperature and the target temperature.

[0055] Preferably, the flow channel heat exchanger of this embodiment includes a base 321, a cover 322, a liquid inlet pipe 323, and a liquid outlet pipe 324. The pressure head is fixedly connected to the bottom of the base 321 through an adapter plate, and the second heater 33 is arranged inside the pressure head or between the pressure head and the base 321. The cooling flow channel 320 is arranged inside the base 321. The cooling flow channel 320 includes a liquid inlet flow channel 3201 and a liquid outlet flow channel 3202. The liquid inlet flow channel 3201 is communicated with the refrigerant output end of the first heat exchanger 22, and the liquid outlet flow channel 3202 is communicated with the refrigerant return end of the refrigerator 1. A central column 325 is also arranged inside the base 321, and the liquid inlet flow channel 3201 and the liquid outlet flow channel 3202 are communicated at the central column 325. Further, the cover 322 is covered on the cooling flow channel 320. The liquid inlet pipe 323 passes through the cover 322 and is communicated with the liquid inlet flow channel 3201, and the liquid outlet pipe 324 passes through the cover 322 and is communicated with the liquid outlet flow channel 3202. In this embodiment, the refrigerant output by the first heat exchanger 22 flows into the liquid inlet flow channel 3201 through the liquid inlet pipe 323, flows through the liquid outlet flow channel 3202, and then flows out through the liquid outlet pipe 324 and returns to the refrigerator 1, thus realizing the stable refrigeration of the refrigerator 1 to the flow channel heat exchanger. Further, the liquid inlet flow channel 3201 and the liquid outlet flow channel 3202 of this embodiment are wound around each other to form a double helix structure, and the liquid inlet flow channel 3201 and the liquid outlet flow channel 3202 are communicated in the central area of the base 321. The liquid inlet of the liquid inlet flow channel 3201 and the liquid outlet of the liquid outlet flow channel 3202 are respectively arranged at the edge of the base 321. Such a setting greatly improves the cooling efficiency of the flow channel heat exchanger.

[0056] Of course, in other embodiments, the first temperature control component is not limited to the blowing temperature control component, the first heat exchanger 22 is not limited to the plate heat exchanger, the second temperature control component is not limited to the pressure head temperature control component, and the second heat exchanger 32 is not limited to the flow channel heat exchanger. Other forms of temperature control components and heat exchangers can be selected according to specific test requirements, and this embodiment is not limiting.

[0057] This embodiment also provides a semiconductor test device for performing performance tests on products to be tested. The semiconductor test device includes a feeding device, a loading station, a testing mechanism, a collecting device, a transporting device, and the temperature control system as described above. The feeding device is used to supply products to be tested, the transporting device is used to transport the products to be tested in the feeding device to the loading station, the testing mechanism is used to test the products to be tested at the loading station, the temperature control system is used to control the test temperature of the products to be tested at the loading station, and the transporting device is also used to transport the tested products at the loading station to the collecting device to complete the entire test process. It should be noted that the above feeding device, testing mechanism, collecting device, and transporting device are all prior arts in this field, and this embodiment will not elaborate on them.

[0058] Note that the above is only the preferred embodiment of the present utility model and the technical principles applied. Those skilled in the art will understand that the present utility model is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present utility model. Therefore, although the present utility model has been described in more detail through the above embodiments, the present utility model is not limited to the above embodiments only. Without departing from the concept of the present utility model, more other equivalent embodiments can be included, and the scope of the present utility model is determined by the scope of the appended claims.

Claims

1. Temperature control system, characterized in that: include: A cooling circulation loop comprises a refrigerator (1), at least one first heat exchanger (22) and a second heat exchanger (32) which are connected in series in sequence; a heat exchange medium source, used for delivering heat exchange medium to each of the first heat exchangers (22); a first temperature control component, wherein each heat exchange medium output end of the first heat exchanger (22) corresponds to at least one of the first temperature control components, and each of the first temperature control components comprises a first temperature control element (21), a first heater (23) and a first temperature detector (24), wherein the first temperature control element (21) is in communication with the heat exchange medium output end of the first heat exchanger (22), the first heater (23) is used to heat the heat exchange medium flow path entering and exiting the first heat exchanger (22), and the first temperature detector (24) is used to detect the temperature of the heat exchange position between the first temperature control element (21) and the object to be temperature controlled, and the first temperature detector (24) is in communication connection with the first heater (23); The second temperature control component comprises a second heater (33), a second temperature detector and a second temperature control element (31); the second heater (33) and the second heat exchanger (32) control the temperature of the second temperature control element (31) through heat exchange; the second temperature detector is used to detect the temperature of the second temperature control element (31); and the second temperature detector is communicatively connected to the second heater (33).

2. The temperature control system according to claim 1, characterized in that: The temperature control system comprises at least one of the first heat exchangers (22) and at least one of the first temperature control components, and the first heat exchangers (22) and the first temperature control components are arranged in a one-to-one correspondence.

3. The temperature control system according to claim 1, characterized in that: The first temperature control component comprises an air blowing temperature control component, wherein the heat exchange medium source is a gas dryer, the first temperature control component (21) is an air blowing pipeline, and the outlet of the air blowing pipeline blows toward the object to be temperature-controlled; the first heat exchanger (22) is a plate heat exchanger, and the plate heat exchanger comprises a refrigerant channel and a dry gas channel capable of heat exchange, and the outlet of the dry gas channel is connected to the air blowing pipeline, the first heater (23) is arranged on the air blowing pipeline, and the first temperature detector (24) is used to detect the temperature of the outlet of the air blowing pipeline.

4. The temperature control system according to claim 3, characterized in that: The temperature control system further comprises a bypass pipeline (45), wherein the bypass pipeline (45) allows the gas output from the gas dryer to be directly connected to the air blowing pipeline without passing through the drying gas channel of the plate heat exchanger.

5. The temperature control system according to claim 4, characterized in that: The temperature control system further comprises a control valve (46), wherein the control valve (46) is used to control the gas dryer to be in communication with the bypass pipeline (45) or with the drying gas channel of the plate heat exchanger.

6. The temperature control system according to any one of claims 1 to 5, characterized in that: The second temperature control component comprises a pressure head temperature control component, wherein the second temperature control component (31) is a pressure head, the pressure head is used to contact with the object to be temperature-controlled for heat conduction and temperature control, the second heater (33) is used to heat the pressure head, the second heat exchanger (32) is a flow channel heat exchanger, the flow channel heat exchanger is provided with a cooling flow channel (320), and the flow channel heat exchanger is used to cool the second heater (33); the second temperature detector is used to detect the temperature of the pressure head.

7. The temperature control system according to claim 6, characterized in that: The pressure head is fixedly connected to the bottom of the flow channel heat exchanger, and the second heater (33) is arranged in the pressure head.

8. The temperature control system according to claim 6, characterized in that: The second heater (33) is a heating rod or a heating plate.

9. The temperature control system according to claim 6, characterized in that: The cooling flow channel (320) comprises a liquid inlet flow channel (3201) and a liquid outlet flow channel (3202), wherein the liquid inlet flow channel (3201) is connected to the refrigerant output end of the first heat exchanger (22), and the liquid outlet flow channel (3202) is connected to the refrigerant return end of the refrigerator (1).

10. A semiconductor testing device, characterized in that It includes a feeding device, a loading station, a testing mechanism, a material receiving device, a transportation device and a temperature control system as described in any one of claims 1 to 9, the feeding device is used to supply the product to be tested, the transportation device is used to transport the product to be tested in the feeding device to the loading station, the testing mechanism is used to test the product to be tested at the loading station, the temperature control system is used to control the test temperature of the product to be tested at the loading station, and the transportation device is also used to transport the tested product at the loading station to the material receiving device.

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