Multi-channel heat dissipation system

Abstract

The multi-channel heat dissipation system comprises a frame, a fan set, a cover plate and a radiator, the frame comprises a bottom plate and side plates surrounding the bottom plate, a containing cavity is formed between the bottom plate and the side plates, baffles are arranged in the containing cavity to divide the containing cavity into a plurality of airflow cavities, and the side plate where each airflow cavity is located is provided with an air outlet hole set; the air outlet hole group comprises a plurality of air outlet holes penetrating through the side plate; the fan set comprises a plurality of fans, and each air outlet hole is internally connected with one fan; the radiator is installed in the containing cavity and located on the top of the containing cavity. The cover plate is connected with the top surfaces of the side plates to seal the accommodating cavity; a plurality of air inlet holes are formed in the cover plate, so that airflow flows through the radiator from the air inlet holes and then enters the airflow chamber. Compared with the prior art, more uniform air flow distribution can be provided, the small fans are lighter, the total weight of the system can be reduced, the mode that the multiple small fans are arranged on the side plates is adopted, and compared with the mode that a large fan is arranged, the overall height size of the system is reduced.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation devices, and particularly to a multi-channel heat dissipation system. Background Art

[0002] With the development of technology, as the computing power requirements of electronic devices are getting higher and higher, and the volume requirements are getting smaller and smaller, the heat generation of electronic devices has increased sharply. Solving the heat dissipation and energy consumption problems has become an extremely important and crucial task in the overall machine design process. However, due to the low integration of traditional air cooling, the performance of the fans and radiators involved in heat dissipation is poor, resulting in a relatively large volume and weight of the device, which cannot meet the system weight and space utilization requirements. Summary of the Invention

[0003] The purpose of this application is to provide a multi-channel heat dissipation system that can reduce the weight and size of the system while having good heat dissipation performance.

[0004] To achieve the above purpose, the following technical solutions are adopted in this application:

[0005] A multi-channel heat dissipation system, comprising:

[0006] A frame, including a bottom plate and side plates surrounding the bottom plate. An accommodation cavity is formed between the bottom plate and the side plates. A baffle is provided in the accommodation cavity to divide the accommodation cavity into multiple air flow chambers. An air outlet hole group is provided on the side plate where each air flow chamber is located. The air outlet hole group includes multiple air outlet holes penetrating the side plate.

[0007] A fan group, the fan group includes multiple fans, and one of the fans is connected to each air outlet hole.

[0008] A radiator installed in the accommodation cavity and located at the top of the accommodation cavity;

[0009] A cover plate, the cover plate is connected to the top surface of the side plate to seal the accommodation cavity; multiple air inlet holes are provided on the cover plate to enable air flow to enter the air flow chamber after flowing through the radiator from the air inlet holes.

[0010] Further, the baffle is in a straight plate shape, and both ends of the baffle are connected to the side plate to divide the accommodation cavity into two air flow chambers;

[0011] The air outlet hole group is located on the side plates opposite to the baffle.

[0012] Further, a limiting plate is also provided in the air flow chamber. The limiting plate is provided with diversion holes opposite to the air outlet holes;

[0013] A fan limiting groove is formed between the limiting plate and the side plate where the air outlet hole is located. The fan is arranged in the fan limiting groove, and the air inlet end of the fan faces the diversion hole, and the air outlet end faces the air outlet hole.

[0014] Further, the height of the limiting plate is lower than that of the side plate;

[0015] The radiator is connected to the top surface of the limiting plate.

[0016] Further, a water tank is also connected in the air flow chamber, and a liquid inlet end is connected to the water tank;

[0017] The liquid inlet pipeline of the water tank is connected to the liquid inlet of the radiator through a water pump, and the liquid outlet of the radiator is connected to the liquid outlet end through a liquid outlet pipeline.

[0018] Further, a liquid supplement end is also connected to the water tank.

[0019] Further, the liquid inlet end, the liquid outlet end and the liquid supplement end are connected to the side plate;

[0020] Fluid connectors are connected to the liquid inlet end, the liquid outlet end and the liquid supplement end respectively.

[0021] Further, a power supply module is also connected in the air flow chamber, and the power supply module is electrically connected to the water pump and the fan.

[0022] Further, the power supply module and the water tank are located in different air flow chambers respectively.

[0023] Further, a temperature sensor is also provided at the liquid outlet of the radiator, and the temperature sensor and the fan are both signal-connected to the controller.

[0024] The beneficial effects of the present application are as follows:

[0025] By setting multiple air flow chambers and air outlet groups, the cooling effect of the system is ensured through the form of multi-channel heat dissipation; in the present application, an air outlet group is designed on the side plate, and a fan is connected in each air outlet of the air outlet group. By using multiple small fans, compared with the form of using a large fan, not only can a more uniform air flow distribution be provided, but also the small fans are lighter, which helps to reduce the total weight of the system. Moreover, by using the form of arranging multiple small fans on the side plate, compared with arranging a large fan, the overall height dimension of the system is also reduced.

[0026] The frame of the present application integrates the bottom plate, the side plate and the baffle, forming a compact structure, reducing the need for additional support members, optimizing the internal space and reducing the overall weight of the system.

[0027] By setting the radiator at the top of the accommodation cavity and dividing the accommodation cavity into multiple air flow chambers, and arranging air outlet groups for air flow to flow out on the side plates where each air flow chamber is located, this design form can flexibly set the air flow chambers, better adapt to the exhaust requirements of different devices, and improve the flexibility and utilization efficiency of the space. Brief Description of the Drawings

[0028] Figure 1 It is an exploded view of the overall structure of this application;

[0029] Figure 2 It is a schematic structural diagram of the frame in this application;

[0030] Figure 3 It is a schematic structural diagram of the radiator connection component in this application;

[0031] Figure 4 It is a schematic diagram of the overall structure of the heat dissipation system in this application;

[0032] Figure 5 It is a schematic diagram of the partial structure of the cover plate in this application.

[0033] Wherein: 1. Frame; 11. Baffle; 12. Air outlet hole; 13. Limiting plate; 131. Diversion hole; 2. Fan group; 3. Radiator; 31. Water tank; 32. Water pump; 33. Liquid inlet end; 34. Liquid replenishing end; 35. Liquid outlet end; 4. Cover plate; 5. Power supply module; 6. Controller. Detailed Description of the Preferred Embodiments

[0034] In order to make the technical means, creative features, achieved purposes and functions of this application easy to understand, the following further elaborates this application in combination with specific embodiments.

[0035] It should be noted that in the description of this application, the orientation or positional relationship indicated by the terms "front", "rear", "left", "right", "up", "down", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application rather than requiring this application to be constructed and operated in a specific orientation, so it cannot be understood as a limitation to this application. The terms "front", "rear", "left", "right", "up", "down" used in the description of this application refer to the directions in the drawings, and the terms "inside" and "outside" respectively refer to the directions towards or away from the geometric center of a specific component.

[0036] This application provides a dual-channel high-efficiency compact air-cooled heat dissipation system, which adopts single-side air intake and two-side air outlet. The cold air is drawn by high-performance fans on both sides to pass through the radiator to take away heat. The fans adopt high-performance fans, and the performance reaches the leading level in the country under the same size. The radiator adopts a micro-channel tube-and-fin radiator, which has the characteristics of light weight and strong performance.

[0037] The system adopts a structural design of single-sided air intake and double-sided air outlet. Five high-performance fans are arranged on each side of the system for system heat dissipation. After the air enters through the air inlet, it exchanges heat with the tube-and-fin radiator, and then is discharged from the system through the fans on both sides. The heat dissipation power of the system reaches 5 kW, and the efficiency reaches 0.67. In addition, there are liquid inlet, liquid outlet and liquid replenishment ports in the heat dissipation system for quick connection between the system and the outside world. The system structure is highly compact. On the premise of meeting high heat dissipation performance, the total height of the system is compressed to about 200 mm.

[0038] As Figures 1 to 5 shown, this application discloses a multi-channel heat dissipation system, including a frame 1, a fan group 2, a cover plate 4 and a radiator 3. The frame 1 includes a bottom plate and side plates surrounding the bottom plate. A receiving cavity is formed between the bottom plate and the side plates. A baffle 11 is provided in the receiving cavity to divide the receiving cavity into multiple air flow chambers. An air outlet hole group is provided on the side plate where each air flow chamber is located. The air outlet hole group includes multiple air outlet holes 12 penetrating the side plate; the fan group includes multiple fans, and one fan is connected in each air outlet hole 12; the radiator 3 is installed in the receiving cavity and is located at the top of the receiving cavity; the cover plate 4 is connected to the top surface of the side plate to seal the receiving cavity; multiple air inlet holes are provided on the cover plate 4 so that air flows through the radiator 3 from the air inlet holes and then enters the air flow chamber.

[0039] During use, when the fans are started, since the baffle 11 divides the receiving cavity into multiple air flow chambers, the fans in different air flow chambers will not interact with each other, ensuring that the air flow can circulate smoothly and cooling the medium in the radiator 3. Specifically, under the action of the fans, the outside air enters the system through the air inlet holes on the cover plate 4. The design of these air inlet holes ensures that the air can be evenly distributed on the entire surface of the radiator 3. The air first flows through the radiator 3. During this process, the air absorbs the heat on the radiator and cools the heat source medium water in the radiator. The air continues to flow downward and enters different air flow chambers, and the hot air is discharged out of the system through the air outlet holes 12 on the side plate. Since each air flow chamber has its own air outlet hole, this ensures that the hot air can be quickly and effectively discharged, avoiding the retention of hot air in the system. This process continues, ensuring that the heat source inside the system is always in an effective cooling state.

[0040] This application ensures the cooling effect of the system through the form of multi-channel heat dissipation by setting multiple air flow chambers and air outlet hole groups. The system designs an air outlet hole group on the side plate, and one fan is connected in each air outlet hole in the air outlet hole group. This application adopts the form of multiple small fans. Compared with using a large fan, it can not only provide a more uniform air flow distribution, but also the small fans are lighter, which helps to reduce the total weight of the system. Moreover, adopting the form of arranging multiple small fans on the side plate also reduces the overall height dimension of the system compared with the form of arranging a large fan.

[0041] The framework of this application integrates a bottom plate, side plates and a baffle, forming a compact structure, reducing the need for additional support members and optimizing the internal space.

[0042] By arranging the radiator 3 at the top of the accommodation cavity and dividing the accommodation cavity into multiple air flow chambers, and arranging an air outlet hole group for air flow to flow out on the side plate where each air flow chamber is located, this application can flexibly set the air flow chambers, better adapt to the exhaust requirements of different devices, and improve the flexibility and efficiency of the space.

[0043] The following will illustrate this application through specific embodiments.

[0044] As Figure 1 and Figure 2 shown, this application provides a framework 1. The framework 1 has a bottom plate and side plates connected around the bottom plate. An accommodation cavity is formed by surrounding between the bottom plate and the side plates. The side plates and the bottom plate can be integrally formed or formed by screw connection. Importantly, a baffle 11 is designed in the accommodation cavity. The baffle 11 can divide the accommodation cavity into multiple air flow chambers.

[0045] Furthermore, the shape of the framework 1 can be square, circular or other shapes. The baffle 11 can divide the accommodation cavity into two or three air flow chambers. When the baffle 11 adopts a straight plate design form, the baffle 11 can divide the accommodation cavity into two air flow chambers. When the baffle 11 adopts other special-shaped forms, the accommodation cavity can be divided into three air flow chambers. Combining with the attached drawings, this application will be described below with a square framework and the baffle 11 dividing the accommodation cavity into two air flow chambers.

[0046] As Figure 1 shown, both ends of the baffle 11 are respectively connected to two opposite front and rear side plates to divide the accommodation cavity into two left and right air flow chambers. The height of the baffle 11 is slightly lower than the height of the side plates to ensure no interference with the radiator 3.

[0047] Furthermore, air outlet hole groups are provided on the left and right side plates. The air outlet hole group includes 4-6 air outlet holes 12 penetrating the side plates. As Figure 2 shown, limiting plates 13 are also provided in the left and right air flow chambers. Specifically, both ends of the limiting plate 13 are connected to the front and rear side plates, and the limiting plate 13 is parallel to the left and right side plates and the baffle 11. The limiting plate 13 is provided with diversion holes 131 opposite to the air outlet holes 12. Specifically, the number of the diversion holes 131 is the same as the number of the air outlet holes 12 and the positions are opposite. A fan limiting groove is formed between the limiting plate 13 and the side plate where the air outlet holes 12 are located. The fan is installed in the fan limiting groove, and the air inlet end of the fan faces the diversion holes 131 and the air outlet end faces the air outlet holes 12 to discharge the gas in the air flow chamber.

[0048] In this application, the height of the limit plate 13 is lower than that of the side plate; both left and right ends of the radiator 3 are connected to the top surface of the limit plate 13 by screws. The four sides of the cover plate 4 are fixed to the top surface of the side plate by screws to seal the accommodation cavity.

[0049] In some further embodiments, the cooling system adopts two groups of 5 high-performance blowers on each single side. The size of the blower is 119*119*38 mm. Under the pressure of 200 Pa, the air volume of a single blower reaches 523 m3 / h, and the air volume of 10 blowers reaches 5230 m3 / h.

[0050] Preferably, the radiator adopts a tube-and-fin radiator with a minimum equivalent diameter of about 960 μm. The heat dissipation power of the product reaches 5 kW, and the efficiency reaches 0.67.

[0051] In some further embodiments, as Figure 3 shown, the cooling system is further provided with a water tank 31. The liquid inlet pipeline of the water tank 31 is connected to the liquid inlet of the radiator 3 through a water pump 32, and the liquid outlet of the radiator 3 is connected to the liquid outlet end 35 through a liquid outlet pipeline. The water tank can transfer the heat source medium water generated by the equipment. The heat source medium enters the radiator 3 through the liquid inlet, is cooled, and then flows through the liquid outlet pipeline from the liquid outlet to the liquid outlet end 35, and finally returns to the equipment.

[0052] Furthermore, a liquid supplement end 34 is also provided on the water tank. When the cooling system is running, the coolant will expand as the temperature rises. The liquid supplement end and the connected water tank can serve as a buffer zone to absorb the expanded coolant and prevent the system pressure from being too high. When the system cools down, the volume of the coolant shrinks, and the coolant in the water tank will be sucked into the system again to maintain pressure balance.

[0053] In some further embodiments, the liquid inlet end 33, the liquid outlet end 35, and the liquid supplement end 34 are connected to the side plate; fluid connectors are connected to the liquid inlet end 33, the liquid outlet end 35, and the liquid supplement end 34. Adopting the design form integrated on the side plate and installing fluid connectors, the fluid connectors provide a fast and convenient connection method, enabling the system to be easily connected and disconnected without using tools.

[0054] In one embodiment, a power supply module 5 is further connected in the air flow chamber. The power supply module 5 is electrically connected to the water pump 32 and the blowers. The power supply module 5 supplies power to the blowers and the water pump 32 to ensure the normal operation of the blowers and the water pump 32. The power supply module 5 and the water tank 31 are located in different air flow chambers respectively, dispersing the force to ensure the overall stability of the system.

[0055] In one embodiment, a temperature sensor is further provided at the liquid outlet of the radiator 3. The temperature sensor and the fan are both signal-connected to the controller 6. The temperature sensor detects the temperature of the liquid outlet of the radiator 3. When the temperature of the liquid outlet of the radiator 3 is higher than the set value, the rotational speed of the fan needs to be increased to ensure that the temperature of the liquid flowing out of the liquid outlet of the radiator 3 meets the requirements.

[0056] In summary, the heat dissipation system of the present application is applicable to fields such as aviation, aerospace, ships, and automobiles. It adopts a design scheme of single-sided air intake and two-sided air outlet. The cold air is drawn by high-performance fans on both sides to pass through the radiator to take away heat. Moreover, the fans are high-performance fans, and their performance reaches the leading level in the country under the same size. The radiator adopts a micro-channel tube-and-fin radiator, which has the characteristics of light weight and strong performance. The entire heat dissipation system has a high integration degree, a light weight, and an efficient heat dissipation capacity, and can provide a reliable temperature control solution.

[0057] As is known by technical common sense, the present application can be implemented by other embodiments that do not depart from its spiritual essence or necessary features. Therefore, the above-disclosed embodiments are illustrative in all aspects and not exclusive. All changes within the scope of the present application or within the scope equivalent to the present application are encompassed by the present application.

Claims

1. A multi-channel heat dissipation system, characterized in that: include: A frame (1) comprising a bottom plate and side plates surrounding the bottom plate, a receiving cavity being formed between the bottom plate and the side plates, a baffle (11) being provided in the receiving cavity to divide the receiving cavity into a plurality of airflow chambers, an air outlet group being provided on the side plate where each airflow chamber is located, the air outlet group comprising a plurality of air outlet holes (12) penetrating the side plates; A fan group (2), the fan group comprising a plurality of fans, each air outlet (12) being connected to one of the fans; A heat sink (3) installed in the accommodating cavity and located at the top of the accommodating cavity; A cover plate (4) is connected to the top surface of the side plate to seal the accommodating cavity; a plurality of air inlet holes are provided on the cover plate (4) so ​​that air flows from the air inlet holes through the radiator (3) and then enters the air flow chamber.

2. The multi-channel heat dissipation system according to claim 1, characterized in that: The baffle (11) is in the shape of a straight plate, and both ends of the baffle (11) are connected to the side plates to divide the accommodating cavity into two airflow chambers; The air outlet group is located on the side plate opposite to the baffle plate (11).

3. The multi-channel heat dissipation system according to claim 1, characterized in that: A limiting plate (13) is also provided in the air flow chamber, and a guide hole (131) opposite to the air outlet hole (12) is provided on the limiting plate (13); A fan limiting groove is formed between the limiting plate (13) and the side plate where the air outlet (12) is located, and the fan is arranged in the fan limiting groove, with the air inlet end of the fan facing the guide hole (131) and the air outlet end facing the air outlet (12).

4. The multi-channel heat dissipation system according to claim 3, characterized in that: The height of the limiting plate (13) is lower than the height of the side plate; The radiator (3) is connected to the top surface of the limiting plate (13).

5. The multi-channel heat dissipation system according to claim 1, characterized in that: The airflow chamber is also connected to a water tank (31), and the water tank (31) is connected to a liquid inlet terminal (33); The liquid inlet pipeline of the water tank (31) is connected to the liquid inlet of the radiator (3) through a water pump (32), and the liquid outlet of the radiator (3) is connected to the liquid outlet terminal (35) through a liquid outlet pipeline.

6. The multi-channel heat dissipation system according to claim 5, characterized in that: The water tank (31) is also connected to a liquid replenishing terminal (34).

7. The multi-channel heat dissipation system according to claim 6, characterized in that: The liquid inlet end (33), the liquid outlet end (35) and the liquid replenishment end (34) are connected to the side plate; The liquid inlet end (33), the liquid outlet end (35) and the liquid replenishment end (34) are all connected to a fluid connector.

8. The multi-channel heat dissipation system according to claim 5, characterized in that: A power module (5) is also connected in the airflow chamber, and the power module (5) is electrically connected to the water pump (32) and the fan.

9. The multi-channel heat dissipation system according to claim 8, characterized in that: The power module (5) and the water tank (31) are respectively located in different air flow chambers.

10. The multi-channel heat dissipation system according to claim 6, characterized in that: A temperature sensor is also provided at the liquid outlet of the radiator (3), and both the temperature sensor and the fan are signal-connected to the controller (6).

Images