HF (hydrogen fluoride) agent tank of corrosion machine with novel structure
By setting up hydraulic rods, connecting frames and support plates in the reagent tank of the corrosion machine, the up and down movement of the silicon wafer is solved, and the corrosion effect is significantly improved.
Patent Information
- Application Number
- CN202421590565.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-08
AI Technical Summary
In existing corrosion machines, the silicon wafer is still in the corrosion process, resulting in insufficient contact with the solution, resulting in poor corrosion effect.
A new type of HF agent tank of structural corrosion machine was designed. By setting a hydraulic rod, connecting frame and support plate in the reagent tank, the silicon wafer in the flower basket moves up and down, and strengthens contact with the solution.
By constantly moving up and down, the silicon wafer contacts the solution in the reagent tank more comprehensively, which significantly improves the corrosion effect.
Smart Images
Figure CN222927428U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of etching machines, and particularly relates to an HF chemical agent tank of a novel-structured etching machine. Background Technique
[0002] When producing silicon wafers, an etching machine is used to etch the surface damage layer of the silicon wafers. Currently, the etching machine mainly uses alkaline etching solutions such as hydrofluoric acid (HF) to etch the silicon wafers.
[0003] The common etching machines currently include the body of the etching machine and a reagent tank. The reagent tank is filled with alkaline etching solutions such as hydrofluoric acid (HF). The silicon wafers to be etched are neatly placed in a flower basket. There are installation grooves in the flower basket, and the installation grooves play a role in limiting the silicon wafers. The flower basket is placed in the reagent tank, and the etching solution in the reagent tank etches the silicon wafers in the flower basket.
[0004] For the above technical conditions, there is also a defect that when the silicon wafers are placed in the reagent tank of the etching machine for etching, the silicon wafers are stationary, so that the contact between the silicon wafers and the solution is not comprehensive enough, and the surface of the silicon wafers shows poor etching conditions, resulting in a poor etching effect of the silicon wafers.
[0005] Based on this, the utility model designs an HF chemical agent tank of a novel-structured etching machine to solve the above problems. Content of the Utility Model
[0006] The purpose of the utility model is to provide an HF chemical agent tank of a novel-structured etching machine to solve the above technical problems.
[0007] To achieve the above purpose, the utility model provides the following technical solution: an HF chemical agent tank of a novel-structured etching machine, including the body of the etching machine. A reagent tank is opened on the body. An installation plate is fixedly arranged in the reagent tank. There are two installation plates in the reagent tank, and the two installation plates are respectively arranged on both sides of the reagent tank. A limiting plate is arranged on the installation plate, and there are multiple limiting plates on the installation plate. A hydraulic rod is fixedly arranged at the bottom of the reagent tank. The hydraulic rod is fixedly connected with a connecting frame. The connecting frame is above the installation plate. A support plate is fixedly arranged on the connecting frame, and there are multiple support plates on the connecting frame. The support plates are between the two installation plates.
[0008] Preferably, the side of the support plate away from the connecting frame is arc-shaped.
[0009] Preferably, a cylinder is fixedly arranged in the reagent tank, and the telescopic shaft of the cylinder is fixedly connected with a pressing rod.
[0010] Preferably, a protective cover is arranged on the body, and the reagent tank is below the protective cover.
[0011] Preferably, a plurality of diversion holes are formed in the connection frame.
[0012] In summary, the present application has the following beneficial technical effects: When etching a silicon wafer, place the carrier containing the silicon wafer on the mounting plate, start the hydraulic rod, and the connection frame drives the support plate to move along with the movement of the hydraulic rod. When the hydraulic rod extends, the support plate moves upward, and the support plate pushes the silicon wafer in the corresponding mounting groove in the carrier upward; when the hydraulic rod contracts, the support plate moves downward, and the silicon wafer in the carrier returns to its original position. In this way, the silicon wafers in the carrier continuously move up and down, making more comprehensive contact with the solution in the reagent tank, resulting in a better etching effect, achieving the effect of improving the etching effect of the etching machine on the silicon wafer. Description of the Drawings
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0014] Figure 1 It is a schematic cross-sectional structure diagram of the support plate in the reagent tank of the etching machine in this embodiment during operation;
[0015] Figure 2 It is a schematic cross-sectional structure diagram of the support plate in the reagent tank of the etching machine in this embodiment when not working;
[0016] Figure 3 It is a schematic top view structure diagram of the reagent tank in this embodiment;
[0017] Figure 4 It is a schematic installation structure diagram of the reagent tank in this embodiment;
[0018] Figure 5 It is a schematic simple structure diagram of the relationship between the support plate and the mounting groove in the carrier in this embodiment.
[0019] In the drawings, the list of components represented by each reference numeral is as follows:
[0020] 1. Cylinder; 2. Limiting plate; 3. Mounting plate; 4. Connection frame; 5. Hydraulic rod; 6. Support plate; 7. Machine body; 8. Reagent tank; 9. Protective cover; 10. Diversion hole; 11. Tightening rod; 12. Mounting groove. Detailed Description of the Embodiment
[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.
[0022] The following will be further described in detail with reference to the attached Figures 1-5 This application will be further described in detail.
[0023] The HF chemical agent tank of a new - type structure etching machine includes the body 7 of the etching machine. A reagent tank 8 is provided on the etching machine, and an HF solution for etching silicon wafers is contained in the reagent tank 8. The silicon wafers to be etched are neatly placed in a flower basket, and then the flower basket is placed in the reagent tank 8, and the HF solution etches the silicon wafers in the flower basket.
[0024] Mounting plates 3 are fixedly arranged in the reagent tank 8. There are two mounting plates 3 in the reagent tank 8, and the two mounting plates 3 are respectively arranged on both sides of the reagent tank 8. A limiting plate 2 is fixedly arranged on the side of the mounting plate 3 away from the bottom of the reagent tank 8. There are multiple limiting plates 2 on the mounting plate 3. The limiting plates 2 divide the mounting plate 3 into multiple spaces, which is convenient for etching multiple flower - basket silicon wafers. Just a flower basket can be placed on the mounting plate 3 between two adjacent limiting plates 2.
[0025] A hydraulic rod 5 is fixedly arranged at the bottom of the reagent tank 8. The hydraulic rod 5 is fixedly connected with a connecting frame 4. The connecting frame 4 is below the mounting plate 3. Multiple supporting plates 6 are fixedly arranged on the connecting frame 4. The supporting plates 6 are between the two mounting plates 3. When the hydraulic rod 5 is started, the hydraulic rod 5 drives the connecting frame 4 and the supporting plates 6 to move up and down.
[0026] Mounting grooves 12 are arranged in the flower basket. There are multiple mounting grooves 12 on the flower basket. The silicon wafers are placed in the mounting grooves 12, and the mounting grooves 12 play a role in limiting the silicon wafers. The positions of the mounting grooves 12 in the flower basket correspond to the positions of the supporting plates 6. When the supporting plate 6 moves upward, the silicon wafers in the mounting grooves 12 corresponding to the supporting plate 6 are jacked up. The side of the supporting plate 6 away from the connecting frame 4 is arc - shaped, and the shape of the supporting plate 6 is convenient for jacking up the silicon wafers.
[0027] Multiple cylinders 1 are fixedly arranged in the reagent tank 8. The telescopic shafts of the cylinders 1 are fixedly connected with pressing rods 11. The pressing rods 11 press against the side of the flower basket, and the pressing rods 11 play a role in improving the stability of the flower basket.
[0028] A protective cover 9 is provided on the machine body 7. The reagent tank 8 is located below the protective cover 9. Since the HF solution is corrosive, the protective cover 9 plays a protective role, making it difficult for operators to be harmed by the HF solution. There are flow guide holes 10 on the connecting frame 4, and multiple flow guide holes 10 are provided on the connecting frame 4. When the connecting frame 4 moves up and down under the action of the hydraulic rod 5, the flow guide holes 10 can enhance the fluidity of the liquid in the reagent tank 8.
[0029] The implementation principle of this embodiment is as follows: When corroding the silicon wafer, place the flower basket containing the silicon wafer on the mounting plate 3, start the hydraulic rod 5, and the connecting frame 4 drives the support plate 6 to move along with the movement of the hydraulic rod 5. When the hydraulic rod 5 extends, the support plate 6 moves upward, and the support plate 6 pushes the silicon wafer corresponding to the mounting groove 12 in the flower basket upward; when the hydraulic rod 5 contracts, the support plate 6 moves downward, and the silicon wafer in the flower basket returns to its original position. In this way, the silicon wafer in the flower basket moves up and down continuously, making more comprehensive contact with the solution in the reagent tank 8, resulting in a better corrosion effect and achieving the effect of improving the corrosion effect of the etching machine on the silicon wafer.
[0030] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by terms such as "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present invention.
[0031] In the present invention, unless otherwise clearly specified and defined, terms such as "installation", "setting", "connection", "fixation", "swivel connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A novel HF oxidizing agent tank of a structural etching machine, comprising a body (7) of the etching machine, characterized in that: The body (7) is provided with a reagent tank (8), a mounting plate (3) is fixedly arranged in the reagent tank (8), two mounting plates (3) are arranged in the reagent tank (8), and the two mounting plates (3) are respectively arranged on both sides of the reagent tank (8), a limiting plate (2) is arranged on the mounting plate (3), and a plurality of limiting plates (2) are arranged on the mounting plate (3), a hydraulic rod (5) is fixedly arranged at the bottom of the reagent tank (8), and the hydraulic rod (5) is fixedly connected to a connecting frame (4), and the connecting frame (4) is above the mounting plate (3), and a support plate (6) is fixedly arranged on the connecting frame (4), and a plurality of support plates (6) are arranged on the connecting frame (4), and the support plate (6) is between the two mounting plates (3).
2. The HF oxidizing agent tank of a novel structural etching machine according to claim 1 is characterized in that: The side of the support plate (6) away from the connection frame (4) is arranged in an arc shape.
3. The HF oxidizing agent tank of a novel structural etching machine according to claim 1 is characterized in that: A cylinder (1) is fixedly arranged in the reagent tank (8), and a telescopic shaft of the cylinder (1) is fixedly connected to a clamping rod (11).
4. The HF oxidizing agent tank of a novel structural etching machine according to claim 1 is characterized in that: The machine body (7) is provided with a protective cover (9), and the reagent tank (8) is located below the protective cover (9).
5. The HF oxidizing agent tank of a novel structural etching machine according to claim 1 is characterized in that: The connection frame (4) is provided with a flow guide hole (10), and a plurality of the flow guide holes (10) are provided on the connection frame (4).