Auxiliary jig and wafer transmission system

Abstract

The utility model provides an auxiliary jig and a wafer transmission system. The auxiliary jig comprises an upper bottom plate, a lower bottom plate and an angle adjusting structure. A fixing structure and M first connecting parts are arranged on the upper bottom plate; the fixing structure is arranged on the upper surface of the upper bottom plate; the first connecting part penetrates through the upper bottom plate; x second connecting parts are arranged on the lower bottom plate; the second connecting parts penetrate through the lower bottom plate; the second connecting parts correspond to the first connecting parts in position; the angle adjusting structure is fixed between the upper bottom plate and the lower bottom plate through the first connecting part and the second connecting part. A fixing structure is arranged on an upper bottom plate of the auxiliary jig to fix a wafer carrier; and wafer damage caused by sliding of the wafer carrier is avoided. The angle adjusting structure is arranged between the upper bottom plate and the lower bottom plate to adjust the angle between the upper bottom plate and the lower bottom plate, so that the wafer carrier is inclined on the upper bottom plate, the wafer can be directly transferred into the wafer carrier, and pollution of fingers to the back of the wafer is avoided.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor device preparation, and relates to an auxiliary jig and a wafer transfer system. Background Art

[0002] In the prior art, when placing a wafer after manual grinding, it is necessary to hold up the wafer by hand to place the wafer into the corresponding wafer carrier. At this time, the hand will touch the back surface of the wafer, resulting in fingerprints remaining on the back surface of the wafer and causing pollution to the back surface of the wafer. At the same time, in the prior art, a foam pad jig is often used, and the wafer carrier is directly placed on the foam pad. However, since the foam pad is not fixed and the carrier for carrying the wafer has a certain weight, the foam pad is likely to slide, causing the wafer carrier to slip and resulting in wafer damage.

[0003] Therefore, in order to make up for the defect that the jig for placing the wafer carrier is likely to slide and cause wafer damage, it is necessary to further improve the structure of the jig.

[0004] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the utility model and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art just because these solutions are described in the background art part of the utility model. Summary of the Utility Model

[0005] In view of the above-mentioned disadvantages of the prior art, the purpose of the utility model is to provide an auxiliary jig and a wafer transfer system, which are used to solve the problems in the prior art that using a foam pad to fix the wafer carrier is likely to slip and cause wafer damage; at the same time, when placing the wafer, it is also necessary to touch the back surface of the wafer by hand, resulting in pollution of the back surface of the wafer.

[0006] To achieve the above purpose and other related purposes, the utility model provides an auxiliary jig, which includes: an upper bottom plate, a lower bottom plate and an angle adjustment structure;

[0007] A fixing structure and M first connecting components are arranged on the upper bottom plate; the fixing structure is arranged on the upper surface of the upper bottom plate; each first connecting component penetrates through the upper bottom plate; where M is a natural number greater than or equal to 1;

[0008] X second connecting components are arranged on the lower bottom plate; each second connecting component penetrates through the lower bottom plate; the positions of each second connecting component correspond to those of each first connecting component; where X is a natural number greater than or equal to 1;

[0009] The angle adjustment structure is fixed between the upper bottom plate and the lower bottom plate through the first connecting component and the second connecting component.

[0010] Optionally, the angle adjustment structure is a hydraulic lift configured to adjust the angle between the upper bottom plate and the lower bottom plate.

[0011] Optionally, the fixing structure includes N protruding components; each protruding component is disposed on the upper bottom plate, where N is a natural number greater than 1.

[0012] Optionally, the shape of each protruding component is set to an L shape or a straight shape.

[0013] Optionally, the angle range between the upper bottom plate and the lower bottom plate is set to 0° to 60°.

[0014] Optionally, the upper bottom plate is an aluminum upper bottom plate or a plastic upper bottom plate; the lower bottom plate is a stainless steel lower bottom plate or a plastic lower bottom plate.

[0015] The present utility model further provides a wafer transfer system, which at least includes: a wafer carrier and the auxiliary jig;

[0016] The wafer carrier is placed on the upper bottom plate of the auxiliary jig and fixed by the fixing structure.

[0017] Optionally, the fixing structure includes 4 L-shaped protruding components, where two L-shaped protruding components are disposed at one end of the upper bottom plate to match the back end of the wafer carrier; the other two are disposed at the other end of the upper bottom plate to match the open end of the wafer carrier.

[0018] Optionally, the distance from the open end of the wafer carrier to the lower bottom plate is equal to or greater than the distance from the back end of the wafer carrier to the lower bottom plate.

[0019] As described above, the present utility model provides an auxiliary jig and a system, which have the following beneficial effects:

[0020] 1. The auxiliary jig of the present utility model is provided with an upper bottom plate and a lower bottom plate, and protruding components are disposed on the upper bottom plate to fix the wafer carrier; making the entire jig more stable and not easy to slide; further avoiding damage to the wafer caused by the wafer carrier slipping.

[0021] 2. The wafer transfer system of the present utility model is based on an auxiliary jig provided with an angle adjustment structure between the upper bottom plate and the lower bottom plate. By adjusting the angle between the upper bottom plate and the lower bottom plate, the wafer carrier is inclined on the upper bottom plate, that is, the distance from the open end of the wafer carrier to the lower bottom plate is greater than or equal to the distance from the back end of the wafer carrier to the lower bottom plate, so that the wafer can be directly moved into the wafer carrier, avoiding finger contact with the back of the wafer and reducing contamination of the back of the wafer. Description of the Drawings

[0022] Figure 1Shown is a schematic structural view of the auxiliary jig of the present utility model.

[0023] Figure 2 Shown is a top view of the upper bottom plate of the present utility model.

[0024] Figure 3 Shown is a side view of the upper bottom plate of the present utility model.

[0025] Figure 4 Shown is a side view of the protruding part of the present utility model.

[0026] Figure 5 Shown is a front view of the protruding part of the present utility model.

[0027] Figure 6 Shown is a side view of the protruding part of the present utility model.

[0028] Figure 7 Shown is a top view of the lower bottom plate of the present utility model.

[0029] Figure 8 Shown is a side view of the lower bottom plate of the present utility model.

[0030] Figure 9 Shown is a schematic structural view of the auxiliary system of the present utility model.

[0031] Element number description

[0032] 1 Auxiliary jig

[0033] 10 Upper bottom plate

[0034] L1 Length of the upper bottom plate

[0035] L2 Width of the upper bottom plate

[0036] L3 Height of the upper bottom plate

[0037] 100 Fixing structure

[0038] 100a Protruding part

[0039] L4 Length of the protruding part

[0040] L5 Width of the protruding part

[0041] L6 Length of the first step of the trapezoidal groove

[0042] L7 Width of the first step of the trapezoidal groove

[0043] L8 Length of the second step of the trapezoidal groove

[0044] L9 Width of the second step of the trapezoidal groove

[0045] 100b Fixing part

[0046] L10 Distance between two fixing parts

[0047] 101 First connecting part

[0048] L11 Lateral distance between first connecting parts

[0049] L12 Longitudinal distance between first connecting parts

[0050] 11 Lower bottom plate

[0051] 11a First module

[0052] 11b Second module

[0053] 11c Third module

[0054] 11d Fourth module

[0055] L13 Length of the lower bottom plate

[0056] L14 Width of the lower bottom plate

[0057] L15 Height of the lower bottom plate

[0058] 110 Second connecting part

[0059] L16 Maximum lateral distance between second connecting parts

[0060] L17 Minimum lateral distance between second connecting parts

[0061] L18 Maximum longitudinal distance between second connecting parts

[0062] 12 Angle adjustment structure

[0063] α Angle

[0064] 2 Wafer transfer system

[0065] 20 Wafer carrier

[0066] 200 Open end of the wafer carrier

[0067] 201 Rear north end of the wafer carrier

[0068] L19 First lateral distance between the fixing part and the edge of the upper bottom plate

[0069] L20 First longitudinal distance between the fixing part and the edge of the upper bottom plate

[0070] L21 Second lateral distance between the fixing part and the edge of the upper bottom plate

[0071] The second longitudinal distance between the L22 fixing part and the edge of the upper bottom plate

[0072] The distance from the open end of H1 to the lower bottom plate

[0073] The distance from the back end of H2 to the lower bottom plate Specific implementation mode

[0074] The following is a specific example to illustrate the implementation mode of the present utility model. Those familiar with this technology can easily understand other advantages and effects of the present utility model from the content disclosed in this specification.

[0075] Please refer to Figures 1 to 9 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present utility model can be implemented. Therefore, they do not have technical essence. Any change in the decoration of the structure, the proportional relationship or the adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" cited in this specification are only for the convenience of clear narration, and are not used to limit the scope under which the present utility model can be implemented. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope under which the present utility model can be implemented.

[0076] Embodiment 1

[0077] As Figure 1 shown, this embodiment provides an auxiliary jig 1, including: an upper bottom plate 10, a lower bottom plate 11 and an angle adjustment structure 12.

[0078] Among them, a fixing structure 100 and M first connecting components 101 are arranged on the upper bottom plate 10; the fixing structure 100 is arranged on the upper surface of the upper bottom plate 10; each first connecting component 101 penetrates through the upper bottom plate 10; where M is a natural number greater than or equal to 1.

[0079] Specifically, in this embodiment, as Figure 2 and Figure 3As shown, the length L1 of the upper bottom plate 10 is 350 mm, the width L2 is 350 mm, and the height L3 is 6 mm. In actual use, the size of the upper bottom plate can be set arbitrarily according to needs, which will not be elaborated one by one here. A fixing structure 100 is provided on the upper bottom plate 10. The fixing structure 100 includes N protruding components 100a, where N is a natural number greater than 1. The shape of the protruding component 100a is set to be L-shaped or linear. Among them, the linear protruding component 100a provides support for the wafer carrier to ensure that the carrier does not slip. The L-shaped protruding component 100a can not only provide stable support for the wafer carrier, but also fix the left and right sides of the wafer carrier, further ensuring that the wafer carrier will not slip left and right and is more stable. In actual use, the shape of any protruding component that can be fixed and stably supported is applicable to the present invention, which will not be elaborated one by one here. Such as Figure 5 and Figure 6 As shown, the length L4 of the L-shaped protruding component 100a is set to 20 mm, and the width L5 is set to 6 mm. In actual use, the length and width of the protruding component can be set arbitrarily according to needs, not limited to this embodiment. Such as Figure 4 As shown, a trapezoidal groove is provided on the L-shaped protruding component 100a, and the length L6 of the first stage of the trapezoidal groove is set to 17 mm, and the width L7 is set to 5 mm; the length L8 of the second stage is set to 15 mm, and the width L9 is set to 3 mm. In actual use, the size of the trapezoidal groove can be set arbitrarily according to needs, which will not be elaborated one by one here. Such as Figure 2 As shown, two fixing components 100b are provided on each protruding component 100a. The two fixing components 100b are arranged in the trapezoidal groove. The distance L10 between the two fixing components 100b is set to 7 mm. The distance L10 between the two fixing components 100b should be less than the length L8 of the second stage of the trapezoidal groove. By setting the trapezoidal groove, it plays a better protective role for the fixing component 100b and reduces the maintenance cost. The two fixing components 100b (including but not limited to screws) penetrate the corresponding protruding component 100a to fix each protruding component 100a on the upper bottom plate 10, so that the upper bottom plate 10 and the protruding component 100a can be flexibly fixed to provide support for the wafer carrier, and then fix the wafer carrier.

[0080] More specifically, as an example, such as Figure 2 As shown, 4 first connecting components 101 are provided on the upper bottom plate 10. In actual use, the number of the first connecting components 101 can be set arbitrarily according to needs, not limited to this embodiment. The 4 first connecting components 101 are distributed in a rectangle, and the horizontal distance (width of the rectangle) L11 between each first connecting component 101 is set to 15 mm, and the vertical distance (length of the rectangle) L12 is set to 35 mm. In actual use, the horizontal distance and vertical distance between the first connecting components can be set arbitrarily according to needs, which will not be elaborated one by one here.

[0081] As shown Figure 7 in the figure, there are X second connecting components 110 provided on the lower bottom plate 11; each second connecting component 110 penetrates through the lower bottom plate 11; the positions of each second connecting component 110 correspond to those of each first connecting component 101.

[0082] Specifically, in this embodiment, the upper bottom plate 10 is set as an aluminum upper bottom plate or a plastic upper bottom plate with characteristics such as being lightweight and easy to process. The lower bottom plate 11 is set as a stainless steel lower bottom plate or a plastic lower bottom plate. That is, by setting the lower bottom plate as a stainless steel lower bottom plate with characteristics such as being strong, durable, having a strong load-bearing capacity, and good stability. Or the lower bottom plate 11 is set as a plastic lower bottom plate with characteristics such as being lightweight and easy to install. By setting the corresponding materials for the upper bottom plate 10 and the lower bottom plate 11, the auxiliary jig 1 is made more stable, and the influence caused by the friction with the wafer carrier is also relatively small. In actual use, the upper bottom plate and the lower bottom plate can adopt any materials as needed, not limited to this embodiment.

[0083] More specifically, in this embodiment, as shown Figure 7 and Figure 8 in the figure, the size (length L13 * width L14 * height L14) of the lower bottom plate 11 is set to 350 mm * 350 mm * 8 mm; in actual use, the size of the lower bottom plate can be set arbitrarily as needed, and will not be elaborated here one by one. The height L15 of the lower bottom plate 11 is set higher than the height L3 of the upper bottom plate 10 in order to better bear the weight of the upper bottom plate 10 and the wafer carrier. There are 8 second connecting components 110 provided on the lower bottom plate 11, and the second connecting components 110 penetrate through the lower bottom plate 11. Each second connecting component 110 is evenly arranged on the diagonal of the lower bottom plate 11. The lower bottom plate 11 is evenly divided into four modules, and two second connecting components 110 are evenly distributed on each module, and the second connecting components 110 on each module are centered on the center point of the lower bottom plate 11 as the center of symmetry. That is, the two second connecting components 110 on the first module 11a are centrosymmetric with the two second connecting components 110 on the third module 11c; at the same time, the two second connecting components 110 on the second module 11b are also centrosymmetric with the two second connecting components 110 on the fourth module 11d. The maximum horizontal distance L16 between the two second connecting components 110 on the first module 11a and the two second connecting components 110 on the second module 11b is 100 mm, and the minimum horizontal distance L17 is 75 mm. The maximum vertical distance L18 between the two second connecting components 110 on the first module 11a and the two second connecting components 110 on the fourth module 11d is also 100 mm. In actual use, the horizontal distance and vertical distance between the second connecting components between the modules can be set arbitrarily as needed, and will not be elaborated here one by one.

[0084] As Figure 1 shown, the angle adjustment structure 12 is fixed between the upper base plate 10 and the lower base plate 11 through the first connecting member 101 and the second connecting member 110.

[0085] Specifically, in this embodiment, the first connecting member 101 and the second connecting member 110 are set as screws to fix the angle adjustment mechanism 12 between the upper base plate 10 and the lower base plate 11, so that the angle adjustment mechanism 12 is more stably fixed between the upper base plate 10 and the lower base plate 11. In actual use, any device that can fix the angle adjustment mechanism between the upper base plate and the lower base plate is applicable to the first connecting member and the second connecting member of the present utility model, and is not limited to this embodiment. The angle adjustment structure 12 is set as a hydraulic lift for adjusting the angle between the upper base plate 10 and the lower base plate 11. In actual use, any device that can adjust the angle between the upper base plate and the lower base plate is applicable to the present utility model, and will not be elaborated one by one here. And the range of the angle α adjusted by the angle adjustment structure 12 is 0° to 60°, such as 10°, 20°, 40°, 55°. In actual use, the angle adjustment between the upper base plate and the lower base plate can be set arbitrarily according to needs (excluding the angles that cannot fix the wafer carrier), and will not be elaborated one by one here.

[0086] Embodiment Two

[0087] This embodiment provides a wafer transfer system 2, including a wafer carrier 20 and the auxiliary jig 1 provided in Embodiment One. So as to place the wafer into the wafer carrier 20 without pollution, and the wafer carrier 20 is not easy to slip.

[0088] Specifically, in this embodiment, as Figure 9As shown, the wafer carrier 20 is placed on the upper base plate 10 of the auxiliary jig 1 and fixed by the fixing structure 100. The fixing structure 100 includes 4 L-shaped protruding components 100a; in actual use, the number of L-shaped protruding components can be set arbitrarily according to needs, which will not be elaborated here one by one. Two of the L-shaped protruding components 100a are arranged at one end of the upper base plate 10 to match the back end 201 of the wafer carrier 20; that is, the corners of the two L-shaped protruding components 100a are arranged face to face at one end of the upper base plate 10. And two fixing parts 100b are arranged on each L-shaped protruding component 100a. At this time, the first lateral distance L19 between one of the fixing parts 100b of the L-shaped protruding component 100a close to the edge of the upper base plate 10 and the edge of the upper base plate 10 is 110 mm, and the first longitudinal distance L20 is 63 mm. The other two are arranged at the other end of the upper base plate 10 to match the open end 200 of the wafer carrier 20. That is, the corners of the other two L-shaped protruding components 100a are arranged back to back at the other end of the upper base plate 10. And two fixing parts 100b are arranged on the longitudinal regions of each L-shaped protruding component 100a. At this time, the second lateral distance L21 between one of the fixing parts 100b of the L-shaped protruding component 100a close to the edge of the upper base plate 10 and one edge of the upper base plate 10 is 88.5 mm, and the second longitudinal distance L22 to the other edge is 63 mm. By adjusting the angle adjustment structure 12, the height of one end of the upper base plate 10 that matches the back end of the wafer carrier 20 is reduced, so that an angle α is formed between the upper base plate 10 and the lower base plate 11, and the distance H1 from the open end of the wafer carrier 20 to the lower base plate 11 is equal to or greater than the distance H2 from the back end of the wafer carrier 20 to the lower base plate 11. The open end and the back end of the wafer carrier 20 are inclined, which is convenient for directly moving the wafer to the open end of the wafer carrier 20 and entering the wafer carrier 20, avoiding touching the back end of the wafer with fingers and further reducing the contamination of the back end of the wafer. In actual use, the positions of the L-shaped protruding components on the upper base plate can be set arbitrarily according to needs, which will not be elaborated here one by one.

[0089] The wafer transfer system 2 of this embodiment uses the auxiliary jig 1 as in Embodiment 1 to fix the wafer carrier 20, which is not easy to slip and avoid wafer damage. And the wafer carrier 20 is tilted by the angle adjustment structure 12 in the auxiliary jig 1 to directly transfer the wafer into the wafer carrier 20, avoiding contamination caused by touching the back of the wafer with fingers.

[0090] In summary, the auxiliary jig of the present utility model includes: an upper bottom plate, a lower bottom plate, and an angle adjustment structure; a fixing structure and a first connecting component are provided on the upper bottom plate; the fixing structure is disposed on the upper surface of the upper bottom plate; the first connecting component penetrates through the upper bottom plate; a second connecting component is provided on the lower bottom plate; the second connecting component penetrates through the lower bottom plate; the position of the second connecting component corresponds to that of the first connecting component; the angle adjustment structure is connected between the first connecting component and the second connecting component. A plurality of protruding components are provided on the upper bottom plate of the auxiliary jig of the present utility model to fix the wafer carrier; this avoids damage to the wafer caused by the wafer carrier slipping. An angle adjustment structure is provided between the upper bottom plate and the lower bottom plate. By adjusting the angle between the upper bottom plate and the lower bottom plate, the wafer carrier is inclined on the upper bottom plate, so that the wafer can be directly transferred to the wafer carrier, avoiding contamination of the back surface of the wafer caused by finger contact with the back surface of the wafer. Therefore, the present utility model effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0091] The above embodiments are only illustrative of the principles and effects of the present utility model, and are not intended to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. An auxiliary fixture, characterized in that: The auxiliary fixture comprises: an upper base plate, a lower base plate and an angle adjustment structure; The upper base plate is provided with a fixing structure and M first connecting components; the fixing structure is provided on the upper surface of the upper base plate; each first connecting component penetrates the upper base plate; wherein M is a natural number greater than or equal to 1; The lower bottom plate is provided with X second connecting components; each second connecting component penetrates the lower bottom plate; each second connecting component corresponds to a position of each first connecting component; wherein X is a natural number greater than or equal to 1; The angle adjustment structure is fixed between the upper base plate and the lower base plate through the first connecting component and the second connecting component.

2. The auxiliary fixture according to claim 1, characterized in that: The angle adjustment structure is configured as a hydraulic lift for adjusting the angle between the upper base plate and the lower base plate.

3. The auxiliary fixture according to claim 1, characterized in that: The fixing structure includes N protruding parts; each protruding part is arranged on the upper base plate, wherein N is a natural number greater than 1.

4. The auxiliary fixture according to claim 3, characterized in that: The shape of each protruding part is set to be L-shaped or straight.

5. The auxiliary fixture according to claim 1, characterized in that: The angle between the upper base plate and the lower base plate is set to range from 0° to 60°.

6. The auxiliary fixture according to claim 1, characterized in that: The upper bottom plate is configured as an aluminum upper bottom plate or a plastic upper bottom plate; the lower bottom plate is configured as a stainless steel lower bottom plate or a plastic lower bottom plate.

7. A wafer transfer system, characterized in that: The wafer transfer system comprises: a wafer carrier and an auxiliary fixture as described in any one of claims 1 to 6; The wafer carrier is placed on the upper base plate of the auxiliary fixture and fixed by the fixing structure.

8. The wafer transfer system according to claim 7, characterized in that: The fixing structure includes four L-shaped protruding parts, two of which are arranged at one end of the upper base plate to match the back end of the wafer carrier; and the other two are arranged at the other end of the upper base plate to match the open end of the wafer carrier.

9. The wafer transfer system according to claim 7, characterized in that: The distance from the opening end of the wafer carrier to the lower base plate is equal to or greater than the distance from the back end of the wafer carrier to the lower base plate.

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