Transmission mechanism of plasma degumming machine

Abstract

The utility model relates to the technical field of plasma degumming machines, and discloses a transmission mechanism of a plasma degumming machine, which comprises a degumming machine body, a degumming bin is arranged on the front side of the degumming machine body, two synchronous electric push rods are fixedly mounted in the degumming machine body, the electric push rods are fixedly connected with a sealing bin door, and the sealing bin door is fixedly connected with the degumming bin. Two guide rods are fixedly installed on the back face of the sealing bin door. According to the transmission mechanism of the plasma degumming machine, through cooperative arrangement of an adjusting plate, a first clamping groove plate, a sliding groove, supporting rods, a second clamping groove plate, a fastening rotary knob, a scale bar, a mounting groove, a spring and an insertion block, the distance between the two supporting rods is adjusted according to the size of a wafer during use; and furthermore, the heights of the two second clamping groove plates on the supporting rods are adjusted according to the scale strips, and then the wafers are inserted into the notches in the clamping groove plates, so that the wafers with different sizes can be conveniently placed, and the processing range of the degumming machine is effectively expanded.

Description

Technical Field

[0001] The utility model relates to the technical field of plasma stripping machines, and particularly relates to a transmission mechanism of a plasma stripping machine. Background Technique

[0002] The main uses of the Q235 plasma stripping machine are to remove the bottom glue after semiconductor chip development and to remove the denatured photoresist after the dry etching process. Plasma stripping means that in a vacuum state, a gas is made to generate active plasma, and in this way, under the dual action of physics and chemistry, the surface of the part to be cleaned is bombarded, and the substance to be removed on the surface is turned into ions or gas, and then these cleaned substances are pumped out by a vacuum pump, so as to achieve the cleaning purpose.

[0003] At present, when using a plasma stripping machine to perform a stripping operation on a wafer, it needs to be placed on a placement rack first, but the existing placement rack can only place wafers of one size, resulting in a lower processing range and controlling the position of the wafer in the plasma stripping machine. Therefore, the utility model provides a transmission mechanism of a plasma stripping machine. Content of the Utility Model

[0004] (I) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the utility model provides a transmission mechanism of a plasma stripping machine, which solves the problems put forward in the above background technique.

[0006] (II) Technical Solutions

[0007] To achieve the above purposes, the utility model provides the following technical solutions to be realized: A transmission mechanism of a plasma stripping machine includes a stripping machine body. A stripping chamber is opened on the front surface of the stripping machine body. Two synchronous electric push rods are fixedly installed inside the stripping machine body. A sealing chamber door is fixedly connected to the electric push rod. Two guide rods are fixedly installed on the back surface of the sealing chamber door. A limiting baffle is fixedly installed at one end of the guide rod. A gear box is fixedly installed between the two guide rods on the back surface of the sealing chamber door. A driving motor is fixedly installed inside the gear box. A transmission rod is splined to the output end of the driving motor. A driving gear is fixedly installed at one end of the transmission rod. A driven gear is meshed on the surface of the driving gear. A threaded rod is fixedly installed at one end of the driven gear. The end of the threaded rod away from the gear box is rotatably connected to the limiting baffle. Two adjusting plates are threadedly connected to the surface of the threaded rod. The two adjusting plates are fixedly connected through a first clamping groove plate. A sliding groove is opened inside the adjusting plate. A support rod is slidably connected inside the sliding groove. A second clamping groove plate is slidably connected to the surface of the support rod.

[0008] Preferably, the bottom of the adjusting plate is slidably connected to the guide rod, and fastening knobs are threadedly connected to both ends of the second slot plate.

[0009] Preferably, a scale bar is provided on one side of the support rod.

[0010] Preferably, an installation groove is formed inside the support rod, a spring is arranged inside the installation groove, and a plug is installed at one end of the spring.

[0011] Preferably, rubber pads are provided at the notch openings of the first slot plate and the second slot plate.

[0012] Preferably, an observation window is provided on the front surface of the sealed bin door.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the present utility model provides a transmission mechanism of a plasma stripping machine, which has the following beneficial effects:

[0015] For the transmission mechanism of the plasma stripping machine, through the combined setting of the adjusting plate, the first slot plate, the sliding groove, the support rod, the second slot plate, the fastening knob, the scale bar, the installation groove, the spring and the plug, when in use, the distance between the two support rods is adjusted according to the size of the wafer, and then the height of the two second slot plates on the support rod is adjusted according to the scale bar, and then the wafer is inserted into the notch opening in the slot plate, so as to facilitate the placement of wafers of different sizes, and effectively expand the processing range of the stripping machine. Through the combined setting of the electric push rod, the sealed bin door, the guide rod, the limit baffle, the gear box, the driving motor, the transmission rod, the driving gear, the driven gear and the threaded rod, when in use, the controller controls the electric push rod to contract and drives the sealed bin door to seal the stripping chamber at the same time, and then the driving motor drives the transmission rod and the driving gear to rotate, and then the driven gear drives the threaded rod to rotate through meshing and adjusts the position of the wafer holder in the stripping chamber, so as to adjust the amount of plasma received by the wafer, avoid damaging the wafer, improve the stripping effect, and facilitate the worker to take the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 is a schematic structural diagram of the present utility model;

[0018] Figure 3 is a top view structural sectional view of the sealed bin door in the present utility model;

[0019] Figure 4 is a side view structural sectional view of the adjusting plate and the support rod in the present utility model;

[0020] Figure 5 In the present utility model Figure 3 The enlarged view of the structure at position A.

[0021] In the figure: 1. Degumming machine body; 2. Degumming bin; 3. Electric push rod; 4. Sealed bin door; 5. Guide rod; 6. Limit baffle; 7. Gear box; 8. Driving motor; 9. Transmission rod; 10. Driving gear; 11. Driven gear; 12. Threaded rod; 13. Adjusting plate; 14. First card slot plate; 15. Chute; 16. Support rod; 17. Second card slot plate; 18. Tightening knob; 19. Scale bar; 20. Installation groove; 21. Spring; 22. Insert block; 23. Observation window. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1-5, the present utility model provides a technical solution: including a debonding machine body 1, a debonding chamber 2 is opened on the front of the debonding machine body 1, two synchronous electric push rods 3 are fixedly installed inside the debonding machine body 1, a sealing chamber door 4 is fixedly connected to the electric push rod 3, two guide rods 5 are fixedly installed on the back of the sealing chamber door 4, a limiting baffle 6 is fixedly installed at one end of the guide rod 5, a gear box 7 is fixedly installed between the two guide rods 5 on the back of the sealing chamber door 4, a driving motor 8 is fixedly installed inside the gear box 7, a transmission rod 9 is splined to the output end of the driving motor 8, a driving gear 10 is fixedly installed at one end of the transmission rod 9, a driven gear 11 is meshed on the surface of the driving gear 10, a threaded rod 12 is fixedly installed at one end of the driven gear 11, and the end of the threaded rod 12 away from the gear box 7 is rotatably connected to the limiting baffle 6. Through the cooperative setting of the electric push rod 3, the sealing chamber door 4, the guide rod 5, the limiting baffle 6, the gear box 7, the driving motor 8, the transmission rod 9, the driving gear 10, the driven gear 11 and the threaded rod 12, when in use, the controller controls the electric push rod 3 to contract and drives the sealing chamber door 4 to seal the debonding chamber, and then the driving motor 8 drives the transmission rod 9 and the driving gear 10 to rotate, and then the driven gear 11 drives the threaded rod 12 to rotate while adjusting the position of the wafer holder in the debonding chamber, so as to adjust the plasma amount received by the wafer, avoid damaging the wafer, improve the debonding effect, and facilitate the worker to take the wafer. Two adjusting plates 13 are threadedly connected to the surface of the threaded rod 12, and the two adjusting plates 13 are fixedly connected by a first slot plate 14. A sliding groove 15 is opened inside the adjusting plate 13, a support rod 16 is slidably connected inside the sliding groove 15, a second slot plate 17 is slidably connected to the surface of the support rod 16, the bottom of the adjusting plate 13 is slidably connected to the guide rod 5, fastening knobs 18 are threadedly connected to both ends of the second slot plate 17, a scale bar 19 is arranged on one side of the support rod 16, an installation groove 20 is opened inside the support rod 16, a spring 21 is arranged inside the installation groove 20, and a plug 22 is installed at one end of the spring 21. Through the cooperative setting of the adjusting plate 13, the first slot plate 14, the sliding groove 15, the support rod 16, the second slot plate 17, the fastening knob 18, the scale bar 19, the installation groove 20, the spring 21 and the plug 22, when in use, the distance between the two support rods 16 is adjusted according to the size of the wafer, and then the height of the two second slot plates 17 on the support rod 16 is adjusted according to the scale bar 19, and then the wafer is inserted into the slot opening in the slot plate, so as to facilitate the placement of wafers of different sizes and effectively expand the processing range of the debonding machine. Rubber pads are arranged at the slot openings of the first slot plate 14 and the second slot plate 17, and an observation window 23 is arranged on the front of the sealing chamber door 4.

[0024] In summary, for the transfer mechanism of the plasma desmutting machine, through the cooperative setting of the adjusting plate 13, the first card slot plate 14, the sliding groove 15, the support rod 16, the second card slot plate 17, the fastening knob 18, the scale bar 19, the installation groove 20, the spring 21 and the insertion block 22, when in use, the distance between the two support rods 16 is adjusted according to the size of the wafer, and then the height of the two second card slot plates 17 on the support rods 16 is adjusted according to the scale bar 19, and then the wafer is inserted into the slot in the card slot plate, so as to facilitate the placement of wafers of different sizes and effectively expand the processing range of the desmutting machine. Through the cooperative setting of the electric push rod 3, the sealed bin door 4, the guide rod 5, the limit baffle 6, the gear box 7, the drive motor 8, the transmission rod 9, the driving gear 10, the driven gear 11 and the threaded rod 12, when in use, the controller controls the electric push rod 3 to contract and drive the sealed bin door 4 to seal the desmutting chamber, and then the drive motor 8 drives the transmission rod 9 and the driving gear 10 to rotate, and then the driven gear 11 drives the threaded rod 12 to rotate while adjusting the position of the wafer holder in the desmutting chamber, so as to adjust the amount of plasma received by the wafer, avoid damaging the wafer and improve the desmutting effect, and facilitate the worker to take the wafer.

[0025] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0026] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A transmission mechanism of a plasma degumming machine, comprising a degumming machine body (1), characterized in that: The front of the degumming machine body (1) is provided with a degumming chamber (2), and two synchronous electric push rods (3) are fixedly installed inside the degumming machine body (1), and the electric push rods (3) are fixedly connected to a sealed chamber door (4), and two guide rods (5) are fixedly installed on the back of the sealed chamber door (4), and a limit baffle (6) is fixedly installed on one end of the guide rod (5), and a gear box (7) is fixedly installed on the back of the sealed chamber door (4) between the two guide rods (5), and a driving motor (8) is fixedly installed inside the gear box (7), and the output end of the driving motor (8) is spline-connected to a transmission rod (9), and one end of the transmission rod (9) is fixedly installed. A driving gear (10) is installed, and a driven gear (11) is meshed on the surface of the driving gear (10). A threaded rod (12) is fixedly installed on one end of the driven gear (11). One end of the threaded rod (12) away from the gear box (7) is rotatably connected to the limit baffle (6). Two adjustment plates (13) are threadedly connected on the surface of the threaded rod (12). The two adjustment plates (13) are fixedly connected via a first slot plate (14). A slide groove (15) is provided inside the adjustment plate (13). A support rod (16) is slidably connected inside the slide groove (15). A second slot plate (17) is slidably connected on the surface of the support rod (16).

2. The transmission mechanism of a plasma degumming machine according to claim 1, characterized in that: The bottom of the adjustment plate (13) is slidably connected to the guide rod (5), and both ends of the second slot plate (17) are threadedly connected with a tightening knob (18).

3. The transmission mechanism of a plasma degumming machine according to claim 1, characterized in that: A scale bar (19) is provided on one side of the support rod (16).

4. The transmission mechanism of a plasma degumming machine according to claim 1, characterized in that: The support rod (16) is provided with a mounting groove (20) inside, a spring (21) is arranged inside the mounting groove (20), and an insert block (22) is installed at one end of the spring (21).

5. The transmission mechanism of a plasma degumming machine according to claim 1, characterized in that: Rubber pads are provided at the notches of the first card slot plate (14) and the second card slot plate (17).

6. The transmission mechanism of a plasma degumming machine according to claim 1, characterized in that: An observation window (23) is provided on the front side of the sealed compartment door (4).

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