Radio frequency connection board and radio frequency circuit board

Abstract

The utility model provides a radio frequency connection board. The radio frequency connection board comprises a radio frequency circuit board; the radio frequency connector is connected to the side edge of the radio frequency circuit board; the radio frequency circuit board comprises a radio frequency signal layer which comprises a radio frequency signal line and a grounding part, and the grounding part extends to a side edge; the grounding reference layer comprises a grounding conducting layer, the conducting layer extends to the side edge, and the grounding reference layer is located on the upper layer and / or the lower layer of the radio frequency signal layer; the middle dielectric layer is located between the radio frequency signal layer and the grounding reference layer; and the metalized wrapping edge is positioned on the side edge where the radio frequency circuit board is connected with the radio frequency connector and is respectively contacted with the conductive layer, the grounding part and the radio frequency connector. The utility model also relates to a radio frequency circuit board.

Description

Technical Field

[0001] This application relates to the field of microwave devices, and particularly to a radio frequency connection board and a radio frequency circuit board. Background Art

[0002] In the design of millimeter-wave radio frequency circuits, most of the transmission of radio frequency signals is through microstrip lines. The microstrip lines generally reach the edge of the millimeter-wave board and then are transmitted to the outside through the side-out radio frequency signal connectors. At this transition point, the radio frequency signals are particularly prone to being reflected back due to impedance mismatch, resulting in the deterioration of return loss and thus increasing the loss of radio frequency signals. Each metal layer of the traditional millimeter-wave board is connected through metallized vias or blind buried vias on the grounded metal copper foil, and the metallized shielding holes (including vias and blind buried vias) on both sides of the radio frequency line are connected. When the top metal layer is connected to the ground of the radio frequency connector, during the process of the radio frequency signal being transmitted from the top metal layer to the ground of the radio frequency connector, leakage occurs due to the transfer of the propagation medium, resulting in fluctuations and distortion of the signal during the transition to the connector. Summary of the Invention

[0003] To solve the problems of signal loss and distortion when the signal of the radio frequency circuit board transitions to the radio frequency connector, the purpose of this application is to provide a radio frequency connection board and a radio frequency circuit board, improve the loss caused by the leakage of radio frequency signals at the transition between the radio frequency circuit board and the radio frequency connector, and achieve a smooth transition of radio frequency signals from the radio frequency circuit board to the radio frequency connector.

[0004] This application proposes a radio frequency connection board, including: a radio frequency circuit board; a radio frequency connector connected to the side of the radio frequency circuit board; wherein, the radio frequency circuit board includes: a radio frequency signal layer including radio frequency signal lines and a grounding part, and the grounding part extends to the side; a ground reference layer including a grounded conductive layer, and the conductive layer extends to the side, and the ground reference layer is located above and / or below the radio frequency signal layer; an intermediate dielectric layer located between the radio frequency signal layer and the ground reference layer; a metallized edge located on the side of the radio frequency circuit board connected to the radio frequency connector, and in contact with the conductive layer, the grounding part, and the ground of the radio frequency connector respectively.

[0005] Optionally, the thickness of the metallized edge is 10um - 50um.

[0006] Optionally, the conductive layer is at least directly below or directly above the radio frequency signal line; and / or, the grounding part is at least on both sides of the extending direction of the radio frequency signal line.

[0007] Optionally, the metallized edge covers at least the portion of the RF circuit board connected to the RF connector, or the metallized edge covers the entire side edge of the RF connection board.

[0008] Optionally, the RF circuit board further includes a top metal layer and a bottom metal layer, and the RF signal layer and the ground reference layer are located between the top metal layer and the bottom metal layer; the top metal layer includes top signal transmission lines, and the top signal transmission lines are connected to the RF signal lines through metal plugs.

[0009] Optionally, the top signal transmission lines are microstrip lines; or the top metal layer further includes a top ground, and the top signal transmission lines are ground coplanar waveguides.

[0010] Optionally, the grounding portion, the conductive layer, the top ground, and the bottom metal layer are electrically connected through grounding plugs.

[0011] Optionally, the RF connector is a crimp-type RF connector, including: an inner conductor crimped to the top signal transmission line; an outer conductor located outside the inner conductor, and a portion of the inner conductor protrudes beyond the side edge of the outer conductor, and the side edge of the outer conductor is crimped to the metallized edge, and the outer conductor is used for grounding; an insulating dielectric layer located between the inner conductor and the outer conductor.

[0012] The present application also provides an RF circuit board, and the side edge of the RF circuit board is used to connect an RF connector, including: an RF signal layer including RF signal lines and a grounding portion; a ground reference layer including a grounded conductive layer located above and / or below the RF signal layer; an intermediate dielectric layer located between the RF signal layer and the ground reference layer; a metallized edge located on the side edge of the RF circuit board connected to the RF connector, and in contact with the conductive layer, the grounding portion, and the ground of the RF connector respectively.

[0013] Optionally, the thickness of the metallized edge is 10um - 50um.

[0014] Compared with the prior art, in the present application, the side of the radio frequency circuit board (including the millimeter-wave board) is metallized to form a metallized edge, and the grounding metal of each metal layer in the radio frequency circuit board (including the grounding part of the radio frequency signal layer and the conductive layer in the grounding reference layer) is extended to the side of the radio frequency circuit board and contacts the metallized edge. When a radio frequency connector is installed on the side of the radio frequency circuit board, the metallized edge contacts the radio frequency connector, thus forming a grounding path: the grounding metal of each metal layer - the metallized edge - the grounding of the radio frequency connector. This grounding conduction path is short, and the grounding area formed by the metallized edge is large, greatly reducing the loss caused by the leakage of radio frequency signals at the transition between the radio frequency circuit board and the radio frequency connector, realizing a smooth transition of radio frequency signals from the radio frequency circuit board to the radio frequency connector, and providing a good port matching solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a radio frequency circuit board without a metallized edge according to an embodiment of the present application;

[0016] Figure 2 is Figure 1 an exploded view of each metal layer in

[0017] Figure 3 is a radio frequency circuit board with a metallized edge according to an embodiment of the present application;

[0018] Figure 4 is a schematic diagram of a radio frequency connector of a radio frequency connection board according to an embodiment of the present application;

[0019] Figure 5 is a schematic diagram of a radio frequency connection board according to an embodiment of the present application;

[0020] Figure 6 is a curve graph of the insertion loss test results of a 50 OHM through line of a millimeter-wave board without metallized edge treatment on the side;

[0021] Figure 7 is a curve graph of the insertion loss test results of a 50 OHM through line of a millimeter-wave board with metallized edge treatment on the side;

[0022] Figure 8 is a schematic diagram of another radio frequency connector according to an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Although the description of the present application will be introduced in combination with preferred embodiments, this does not mean that the features of this invention are limited to this implementation manner. On the contrary, the purpose of introducing the invention in combination with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present application, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0024] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings and is defaulted to the same definition.

[0025] To make the purpose, technical solutions and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below with reference to the drawings.

[0026] Figure 1 is an example of a radio frequency circuit board for millimeter waves in the present application. To clearly show the structures of each layer in the radio frequency circuit board, Figure 1 the metallized edge is not shown. In Figure 1 the illustrated embodiment, the radio frequency circuit board includes four metal layers: the first layer is the top metal layer L1, the second layer is the radio frequency signal layer L2, the third layer is the ground reference layer L3, and the fourth layer is the bottom metal layer L4. Among them, there are intermediate dielectric layers between the metal layers to isolate between the metal layers. For example, the first intermediate dielectric layer H1 is between the top metal layer L1 and the radio frequency signal layer L2, the second intermediate dielectric layer H2 is between the radio frequency signal layer L2 and the ground reference layer L3, and the third intermediate dielectric layer H3 is between the ground reference layer L3 and the bottom metal layer L4. In addition, although the same dielectric substrate is selected in most embodiments, different substrates can also be selected to form the intermediate dielectric layer, that is, the dielectric constant of each layer of substrate can be different, so that the width of the radio frequency signal trace can be set more flexibly.

[0027] Among them, the ground reference layer L3 includes a grounded conductive layer. In one embodiment, the ground reference layer L3 is entirely covered with the grounded conductive layer. In other embodiments, the ground reference layer L3 may include a grounded conductive layer and other structures, such as other signal transmission lines, etc.

[0028] Figure 2 ForFigure 1 The exploded view of each metal layer in, for the sake of clear display, in Figure 2 the intermediate dielectric layer is not shown. The top metal layer L1 includes a top signal transmission line 3 and a top ground 5. The RF signal layer L2 includes an RF signal line 1 (for transmitting RF signals) and a ground portion 6. Combining Figure 1 , the RF signal line 1 in the RF signal layer L2 is connected to the top signal transmission line 3 on the surface of the RF circuit board through a metal plug 2 between the top metal layer L1 and the RF signal layer L2. The top signal transmission line 3 is used to transmit the RF signal to the RF connector. Among them, the metal plug 2 is formed in a blind hole for transmitting signals between the RF signal line 1 and the top signal transmission line 3.

[0029] Those skilled in the art can understand that although Figure 2 in the example structure of the RF circuit board shown, the top signal transmission line 3 and the top ground 5 in the top metal layer L1 form a coplanar waveguide with ground (CPWG) structure with the remaining layers, but the top metal layer L1 may also not include the top ground 5 and form a microstrip line (MS) structure with the remaining layers.

[0030] Two rows of ground plugs 4 are arranged on both sides of the RF signal line 1 and the top signal transmission line 3. The ground plug 4 can be arranged in a through hole to achieve ground conduction between the metal layers and form a metal shield on both sides of the RF signal line 1 and the top signal transmission line 3. For example, the ground conduction of the ground portion 6, the conductive layer grounded in the ground reference layer L3, the top ground 5 and the bottom metal layer L4 is realized. The ground plug 4 can also be arranged in a blind hole to facilitate the routing of the inner layer. In some embodiments, the ground plug 4 can also be formed elsewhere to achieve ground conduction between the metal layers.

[0031] In addition, if in the RF circuit board, the inner layer (that is, other metal layers except the top and bottom layers of the RF circuit board. For example, L2 and L3) does not extend to the side of the RF circuit board, when the RF connector is installed on the side of the RF circuit board, at the transition where they are connected, the ground path between the RF circuit board and the RF connector is: the reference of the top signal transmission line 3 in the RF signal layer L2 (the ground of the RF signal layer L2 directly below the top signal transmission line 3) - the ground plug 4 - the top ground 5 - the ground of the RF connector, thus forming a return current. This return current path is relatively long, and the RF signal is particularly prone to signal reflection at the transmission connection due to impedance mismatch, which will cause echo loss and thus increase the total loss of the transmission line.

[0032] In order to reduce the loss caused by the leakage of the RF signal at the transition between the RF circuit board and the RF connector, as Figure 3 shown, this application passes through inFigure 1 Based on the structure of the RF circuit board shown in the figure, a metallized edge 7 is provided on side A1 where the RF circuit board is connected to the RF connector, and the metallized edge is in contact with the RF connector, the conductive layer extending to the side of the RF circuit board, and the grounding portion 6 respectively. Thus, on the basis of the original grounding path, a new grounding path with the shortest path and the largest current-carrying area is added: the grounding metal of the inner metal layer - the metallized edge 7 - the grounding of the RF connector, enabling the grounding of each layer to be directly connected to the grounding of the RF connector through the metallized edge 7 with large flux, shortening the return path of the RF signal to the ground, greatly reducing signal loss, and improving signal quality.

[0033] Specifically, in combination with Figure 2 and Figure 3 , the RF circuit board shown in the figure includes: an RF signal layer L2, in which RF signal lines 1 and a grounding portion 6 are provided for the transmission of RF signals in the inner layer of the RF circuit board; a ground reference layer L3, including a conductive layer for grounding (in this solution, the entire ground reference layer L3 is a conductive layer), located below the RF signal layer L2, and the conductive layer is preferably a grounded copper foil. When an RF signal is transmitted in the RF signal line 1, the ground reference layer L3 and the grounded copper foil in the projection area of the RF signal line 1 in the top metal layer L1 serve as reference layers. The RF signal line 1 can be electrically connected to the top signal transmission line 3 for the extraction of RF signals; the conductive layer and the grounding portion 6 extend to the side of the RF circuit board for connection to the metallized edge 7. The metallized edge 7 is located on the side of the RF circuit board and is in contact with the conductive layer and the grounding portion 6, and the metallized edge preferably uses copper foil. In this solution, the top grounding 5 and the bottom metal layer L4 also extend to the side and are connected to the metallized edge 7 to increase the connection between the metallized edge 7 and each grounding, further reducing the loss of RF signals.

[0034] In the embodiment of this application, as shown in Figure 2 , the ground reference layer L3 is located below the RF signal layer L2, so the conductive layer is at least directly below the RF signal line 1 at A2. The conductive layer directly below at A2 serves as the ground reference for the RF signal layer L2, extends to the side, and can be connected to the metallized edge 7, which is conducive to forming the shortest conduction path between the conductive layer serving as the ground reference and the grounding of the RF connector, reducing signal loss. In some other embodiments, if the ground reference layer L3 is located above the RF signal layer L2, the conductive layer can also be directly above the RF signal line 1.

[0035] In the embodiment of the present application, the grounding portion 6 is at least located on both sides A3 in the extending direction of the RF signal line 1. The grounding portions 6 on both sides A3 and the RF signal line 1 form a coplanar waveguide. The grounding portions 6 on both sides A3 extend to the side edges and can be connected to the metallized edge 7, which is beneficial to forming the shortest conduction path between the grounding portions 6 on both sides A3 and the grounding of the RF connector, and can effectively suppress signal crosstalk.

[0036] Those skilled in the art can understand that, in addition to the above-mentioned layers, the RF circuit board in the RF connection board may further include more layers of other functional layers, such as a power supply layer, a control layer, etc. In addition, the signal lines in the RF signal layer are responsible for the transmission of RF signals in the inner layer. However, in order to transmit signals with the RF connector, it is also necessary to connect the signal lines in the RF signal layer to the top-layer signal transmission lines of the RF circuit board through metal plugs. Among them, the signal lines in the inner layer are strip lines, and the top-layer signal transmission lines can be microstrip line structures or coplanar waveguide structures. Among them, in the coplanar waveguide structure with a ground, the top-layer metal layer where the top-layer signal transmission line is located also includes a top-layer ground.

[0037] In some embodiments, the metallized edge 7 uses a copper-clad edge, but it is not limited to a copper-clad edge. Any material with good electrical conductivity can be used to make the metallized edge 7. Similarly, the grounding conductor is preferably a copper-clad ground.

[0038] In Figure 3 In the shown embodiment, the metallized edge 7 covers part of the side edge and covers the part where the RF circuit board is connected to the RF connector, so as to ensure that the width of the metallized edge 7 is not less than the width of the RF connector, obtaining as large a grounding area as possible and lower impedance. In some embodiments, the metallized edge 7 covers the side edges of the entire RF circuit board, and a large grounding area can also be obtained.

[0039] The metallized edge 7 forms an avoidance 71 at the top-layer signal transmission line 3 to have electrical isolation between the top-layer signal transmission line 3 and the metallized edge 7, ensuring that the RF signal can be normally led out.

[0040] In other embodiments, the number of metal layers in the RF circuit board is not limited to 4 layers. For example, there can be more layers. The grounding portions in the middle metal layers (neither the top-layer metal layer nor the bottom-layer metal layer) extend to the side edges of the RF circuit board and are connected to the metallized edge 7.

[0041] In addition, those skilled in the art can understand that Figure 3The RF circuit board shown is only an example for convenience of illustration. The metallized edge in the solution can be used for RF circuit boards of any structure. For example, it can be a 14-layer RF circuit board with the RF signal layer on the 9th layer and the ground reference layers on the 8th and 10th layers. Among them, the RF signal is transmitted through blind vias or through vias on each layer of the RF circuit board and connected to the microstrip line or grounded coplanar waveguide on the surface. And the grounding conductors of each layer (including but not limited to the grounding copper foil described in the embodiments of the present invention) also extend to the side of the RF circuit board to be connected to the metallized edge. Additionally, in the foregoing embodiment, only the side in contact with the RF connector is metallized, but based on actual requirements, the entire side of the RF circuit board can also be metallized.

[0042] In addition, according to the embodiments of the present application, the thickness of the metallized edge is preferably 10um to 50um, and more preferably, it is 15um, 20um, 25um, 30um, 35um, 40um, etc. The metallized edge with this thickness can provide stable and reliable signal transmission with impedance matching. However, those skilled in the art can understand that the thickness of the metallized edge is only an example and not a limitation.

[0043] Figure 4 It is a schematic diagram of the RF connector of the RF connection board according to the embodiments of the present application. The RF connector includes an inner conductor 13, an outer conductor 14, and an insulating dielectric layer. The insulating dielectric layer is located between the inner conductor 13 and the outer conductor 14 and plays a role in structural support and maintaining a constant impedance. For the sake of clearly showing the inner conductor 13 and the outer conductor 14, the insulating dielectric layer is not shown in the figure.

[0044] Among them, the inner conductor 13 is a cylindrical conductor, which is crimped with the top-layer signal transmission line 3 on the RF circuit board. The inner conductor 13 is pressed on the top-layer signal transmission line 3 for transmitting RF signals. The outer conductor 14 is used for grounding and includes upper and lower pads in contact with the upper and lower surfaces of the RF circuit board and a side surface in contact with the side of the RF circuit board. The outer conductor 14 is crimped on the side and the upper and lower surfaces of the RF circuit board and is in close contact with the metallized edge proposed in the present application to form a loop: the grounding metal of each metal layer - the metallized edge 7 - the outer conductor 14, thereby playing a role in forming a return path for high-frequency signals (especially millimeter waves), guiding high-frequency signals to the RF connector to reduce signal loss. In addition, the outer conductor 14 also has the function of shielding interference.

[0045] Figure 5This is a schematic diagram of a radio frequency connection board including a radio frequency connector and a radio frequency circuit board. Among them, the inner conductor 13 is crimped onto the top-layer signal transmission line 3, the upper and lower pads of the outer conductor 14 are crimped onto the surface grounding copper foil of the radio frequency circuit board, and the side metal of the outer conductor 14 is crimped onto the metallized edge. The radio frequency connector may further include a plurality of pads 15, some of which are crimped onto the top-layer metal layer of the radio frequency circuit board, and the other part of the pads are crimped onto the bottom-layer metal layer of the radio frequency circuit board, which can not only fix the radio frequency connector to the radio frequency circuit board, but also achieve the grounding connection between the radio frequency connector and the radio frequency circuit board through the top-layer metal layer and the bottom-layer metal layer.

[0046] Next, refer to Figure 6 、 Figure 7 to illustrate the performance or advantages of the metallized edge proposed in this application.

[0047] Figure 6 These are the insertion loss test results of the 50OHM through-lines of 6 millimeter-wave boards without metallized edge treatment on the side. The data shows that between 28Ghz and 40Ghz, the insertion loss tests of the 50OHM through-lines respectively have obvious depressions, with a depression of about 1dB, that is, the signal is distorted. Among them, Figure 6 the abscissa is the frequency (unit: Ghz), and the ordinate is the insertion loss (unit: dB).

[0048] Figure 7 These are the insertion loss test results of the 50OHM through-lines of 3 millimeter-wave boards with metallized edge treatment on the side and 1 millimeter-wave board with simulated side metallization treatment ( Figure 7 the first one in Figure 7 ). The data shows that between 28Ghz and 40Ghz, the insertion loss of the through-line test of the millimeter-wave board with simulated side metallization treatment has been improved to a certain extent (the number of depressions decreases, and the depression amplitude decreases). The insertion loss of the millimeter-wave board with side metallization treatment increases linearly with the increase of frequency, showing a low-jitter curve. It can be seen that the application of the metallized edge structure greatly improves the signal quality and is beneficial to signal transmission. Among them,

[0049] The radio frequency circuit board of this solution can be connected to a variety of radio frequency connectors. For example, Figure 8 the radio frequency connector shown can also be installed on the side of the radio frequency circuit board to transmit radio frequency signals. Figure 8The shown radio frequency connector includes an inner conductor 13, an outer conductor 14, and an insulating dielectric layer 141. The radio frequency connector further includes a pad 151 and a pad 152. The pad 151 is crimped to the top metal layer of the radio frequency circuit board, and the pad 152 is crimped to the bottom metal layer of the radio frequency circuit board, which can not only fix the radio frequency connector to the radio frequency circuit board, but also achieve the grounding connection between the radio frequency connector and the radio frequency circuit board through the top metal layer and the bottom metal layer.

[0050] When designing the millimeter-wave board, the entire radio frequency circuit board is metallized on the side. Thanks to the reference layer of the top signal transmission line, the grounding copper foils on both sides of the CPWG, and the metal shell of the radio frequency connector, that is, the outer conductor of the radio frequency connector, with the shortest path and the largest current-carrying area as much as possible, a good port matching is formed, which can greatly reduce the reflection of the radio frequency signal here, reduce the signal jitter, improve the signal transmission quality, and achieve a smooth transition of the radio frequency signal from the millimeter-wave board to the connector.

[0051] It should be noted that a large number of specific details are provided in the specification of the present application. However, it can be understood that the embodiments of the present application can be implemented without some or all of these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail so as not to obscure the understanding of this specification.

[0052] Similarly, in order to streamline the present application and help understand one or more of the various inventive aspects, in the above description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the disclosed method should not be construed as reflecting an intention that the claimed present application requires more features than are expressly recited in each claim. Rather, as reflected by the claims, the inventive aspects lie in less than all the features of the single embodiments disclosed previously. Thus, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim itself serves as a separate embodiment of the present application.

[0053] Those skilled in the art can understand that the modules in the devices in the embodiments can be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments can be combined into one module or unit or component, and in addition, they can be divided into multiple sub-modules or sub-units or sub-components. Except that at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all the features disclosed in this specification (including the accompanying claims, abstract and drawings) and all the processes or units of any method or device so disclosed. Unless otherwise explicitly stated, each feature disclosed in this specification (including the accompanying claims, abstract and drawings) can be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0054] In addition, those skilled in the art should understand that although some of the embodiments described herein include certain features included in other embodiments rather than other features, the combination of the features of different embodiments means that it is within the scope of this application and forms different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

Claims

1. A radio frequency connection board, characterized in that: include: RF circuit board; A radio frequency connector connected to a side of the radio frequency circuit board; Wherein, the radio frequency circuit board comprises: A radio frequency signal layer, comprising a radio frequency signal line and a grounding portion, wherein the grounding portion extends to the side edge; A ground reference layer, comprising a grounded conductive layer, the conductive layer extending to the side edge, the ground reference layer being located on an upper layer and / or a lower layer of the radio frequency signal layer; An intermediate dielectric layer, located between the radio frequency signal layer and the ground reference layer; The metallized edge is located at the side where the RF circuit board is connected to the RF connector, and is in contact with the conductive layer, the grounding portion and the grounding of the RF connector respectively.

2. The radio frequency connection plate according to claim 1, characterized in that: The thickness of the metallized edge is 10um-50um.

3. The radio frequency connection plate according to claim 1, characterized in that: The conductive layer is at least located directly below or directly above the radio frequency signal line; and / or the grounding portion is at least located on both sides of the extending direction of the radio frequency signal line.

4. The radio frequency connection plate according to claim 1, characterized in that: The metallized edging covers at least the portion where the RF circuit board is connected to the RF connector, or the metallized edging covers the entire side of the RF connection board.

5. The radio frequency connection plate according to claim 1, characterized in that: The radio frequency circuit board further comprises a top metal layer and a bottom metal layer, and the radio frequency signal layer and the ground reference layer are located between the top metal layer and the bottom metal layer; The top metal layer includes a top signal transmission line, and the top signal transmission line is connected to the radio frequency signal line through a metal plug.

6. The radio frequency connection plate according to claim 5, characterized in that: The top-layer signal transmission line is a microstrip line; or, the top-layer metal layer further includes a top-layer grounding layer, and the top-layer signal transmission line is a coplanar waveguide with grounding layer.

7. The radio frequency connection plate according to claim 6, characterized in that: The grounding portion, the conductive layer, the top grounding layer and the bottom metal layer are connected through a grounding plug.

8. The radio frequency connection plate according to claim 5, characterized in that: The radio frequency connector is a crimping radio frequency connector, comprising: An inner conductor, crimped to the top layer signal transmission line; An outer conductor is located outside the inner conductor, and the inner conductor includes a portion protruding from a side of the outer conductor, the side of the outer conductor is crimped to the metallized edge, and the outer conductor is used for grounding; The insulating medium layer is located between the inner conductor and the outer conductor.

9. A radio frequency circuit board, characterized in that: The side of the radio frequency circuit board is used to connect the radio frequency connector, including: The radio frequency signal layer includes a radio frequency signal line and a grounding part; A ground reference layer, including a grounded conductive layer, located above and / or below the radio frequency signal layer; An intermediate dielectric layer, located between the radio frequency signal layer and the ground reference layer; The metallized edge is located at the side where the RF circuit board is connected to the RF connector, and is in contact with the conductive layer, the grounding portion and the grounding of the RF connector respectively.

10. The radio frequency circuit board according to claim 9, characterized in that: The thickness of the metallized edge is 10um-50um.

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