Chip mounting equipment with automatic correction function

By designing a negative pressure suction cup with correction slide holes in the patch device, automatic correction of components is achieved, and component skew problem in existing patch devices is solved, and the accuracy and efficiency of patch processing are improved.

CN222928592UActive Publication Date: 2025-05-30JIANGXI HONGSEN TECH CO LTD
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Patent Information

Application Number
CN202421599299.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-08
Publication Date
2025-05-30
Estimated Expiration
2034-07-08

AI Technical Summary

Technical Problem

Existing patch devices are prone to skew problems during the assembly of components, resulting in inaccurate capture of images by the alignment camera and affecting the correction effect.

Method used

A patch device with automatic correction function is designed, using a negative pressure suction cup with calibration slide hole, combined with a telescopic robot arm and a alignment laser sensor, to achieve automatic correction of skew after grabbing, ensuring accurate alignment.

Benefits of technology

Through the automatic correction function, the components are accurately and efficiently mounted, the quality and efficiency of patch processing are improved, and the offset problem of circuit boards during patching is avoided.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses chip mounting equipment with an automatic correction function. The chip mounting equipment comprises a processing table, a sliding frame, a fixing assembly, a chip mounting assembly and an alignment assembly, a movable sliding rail is arranged on the machining table, the sliding frame stands on the machining table, the fixing assembly is clamped and installed in the movable sliding rail and can slide left and right, the surface mounting assembly is installed on the sliding frame, and the alignment assembly is installed on the surface mounting assembly; the mounting assembly comprises a telescopic mechanical arm, a negative pressure suction cup and a plurality of correction sliding blocks. According to the utility model, the negative pressure sucker with the correction slide hole is designed, so that the negative pressure sucker can automatically correct the deflection problem after grabbing a component; the fixing assembly is designed to fix the circuit board, so that the circuit board can be prevented from deviating in the surface mounting process to influence the surface mounting processing; an alignment assembly is designed to realize high-precision alignment, and an auxiliary alignment assembly is additionally designed to further improve the accuracy of vertical alignment of the component and the circuit board bonding pad; the utility model has the advantages of strong practicability and strong popularization significance.
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Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to a chip mounter with an automatic correction function. Background Art

[0002] A chip mounter, also known as a "pick and place machine" or a "surface mount system", is configured after a dispensing machine or a screen printer in a production line. It is a device that accurately places surface mount components on PCB pads by moving a pick and place gripper. During the process of picking and placing components by existing chip mounters, since the components often skew during placement and transmission, it is necessary to correct the skew angle through a alignment camera in cooperation with a control system after picking up the components, so as to ensure that the components and the pads can be accurately aligned and mounted. However, the method of capturing images by the alignment camera and then calculating and correcting not only has cumbersome steps, but also is prone to problems such as inaccurate image capture by the alignment camera, which affects the correction effect. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a chip mounter with an automatic correction function in view of the deficiencies in the prior art.

[0004] A chip mounter with an automatic correction function includes a processing table, a sliding frame, a fixing component, a mounting component and an alignment component. A moving slide rail is provided on the processing table. The sliding frame stands on the processing table. The fixing component is clamped and installed in the moving slide rail and can slide left and right. The mounting component is installed on the sliding frame, and the alignment component is installed on the mounting component. The mounting component includes a telescopic robotic arm, a negative pressure suction cup and a plurality of correction sliders. The telescopic robotic arm is installed on the sliding frame and can move horizontally and vertically. The negative pressure suction cup is installed at the lower end of the telescopic robotic arm. A plurality of negative pressure suction holes and correction chutes are provided at the bottom of the negative pressure suction cup. A plurality of the correction sliders are respectively clamped and installed in a plurality of the correction chutes and can be adjusted to slide.

[0005] Further, the sliding frame includes a vertical frame and a horizontal frame. The vertical frame stands on the processing table, and a longitudinal slide rail is provided on the vertical frame. The horizontal frame is clamped and installed on the longitudinal slide rail and can slide back and forth. A horizontal slide rail is provided on the horizontal frame. The telescopic robotic arm is clamped and installed on the horizontal slide rail and can slide left and right.

[0006] Further, the fixing component includes a lifting slide rod, a pressing plate and a limiting block. The lifting slide rod is clamped and installed on the moving slide rail and can be adjusted to slide left and right. The pressing plate is installed at the upper end of the lifting slide rod, and a limiting slide hole is provided on the pressing plate. The limiting block is clamped and installed in the limiting slide hole and can be adjusted to slide back and forth.

[0007] Further, the alignment component includes a mounting ring and a plurality of alignment laser sensors. The mounting ring is sleeved on the telescopic robotic arm, and the plurality of alignment laser sensors are all installed on the mounting ring from top to bottom.

[0008] Further, the sliding carriage further includes a transverse reinforcing rod. The transverse reinforcing rod is installed between the vertical frames, and an adjustment sliding hole is further provided on the transverse reinforcing rod. The telescopic robotic arm includes a telescopic sleeve, a telescopic rod core, and a plurality of auxiliary alignment magnetic strips. The telescopic sleeve is designed with an opening downward. The telescopic rod core is vertically inserted into the telescopic sleeve from bottom to top and can be vertically lifted and lowered. The plurality of auxiliary alignment magnetic strips are respectively snap-fitted on four sides of the telescopic rod core.

[0009] Further, the chip mounter with an automatic correction function further includes an auxiliary alignment component. The auxiliary alignment component includes a telescopic adjustment rod, an auxiliary alignment frame, a plurality of electromagnets, and alignment laser receivers. The telescopic adjustment rod is snap-fitted in the adjustment sliding hole and can be adjusted and slid left and right. The telescopic adjustment rod can also be telescoped back and forth. The auxiliary alignment frame is clamped between the telescopic adjustment rods and is located below the negative pressure suction cup. The plurality of electromagnets are installed on the inner side of the auxiliary alignment frame and are correspondingly arranged with the plurality of auxiliary alignment magnetic strips. The plurality of alignment laser receivers are installed at the upper end of the auxiliary alignment frame and are vertically corresponding to the plurality of alignment laser sensors.

[0010] In summary, the beneficial effects of the chip mounter with an automatic correction function of the present invention are as follows: By designing a negative pressure suction cup with a correction sliding hole, the negative pressure suction cup can automatically correct the skew problem after grasping the components, so as to achieve precise and efficient chip mounting processing; Designing a fixing component to fix the circuit board can avoid the circuit board shifting during the chip mounting process and affecting the chip mounting processing; Designing an alignment component to achieve high-precision alignment, and additionally designing an auxiliary alignment component to further improve the accuracy of the vertical alignment between the component and the circuit board pad, making the quality of the chip mounting processing higher; The present invention has strong practicability and has strong popularization significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of a chip mounter with an automatic correction function of the present invention;

[0012] Figure 2 is Figure 1 the exploded structural diagram of

[0013] Figure 3 is Figure 2 the structural diagram of the sliding carriage in

[0014] Figure 4 is Figure 2 the exploded structural diagram of the fixing component in

[0015] Figure 5 is Figure 2 a schematic exploded view of the mounting component in

[0016] Figure 6 is Figure 5 a schematic exploded view of the telescopic robotic arm in

[0017] Figure 7 is Figure 2 a schematic exploded view of the alignment component in

[0018] Figure 8 is Figure 2 a schematic exploded view of the auxiliary alignment component in Detailed implementation manners

[0019] In order to make the objectives, technical solutions and advantages of the utility model clearer, the following further details the utility model in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0020] As Figures 1 to 8 shown, the utility model provides a chip mounter 100 with an automatic calibration function, which includes a processing table 10, a sliding frame 20, a fixing component 30, a mounting component 40 and an alignment component 50. A moving slide rail 11 is provided on the processing table 10. The sliding frame 20 stands on the processing table 10. The fixing component 30 is clamped and installed in the moving slide rail 11 and can slide left and right. The mounting component 40 is installed on the sliding frame 20. The alignment component 50 is installed on the mounting component 40. It can be understood that several driving devices, sensors and control systems are also included in the utility model. Since they are all conventional technical contents in this technical field, they will not be elaborated here.

[0021] The sliding frame 20 includes a vertical frame 21 and a horizontal frame 22. The vertical frame 21 stands on the processing table 10, and a longitudinal slide rail (not shown in the figure) is provided on the vertical frame 21. The horizontal frame 22 is clamped and installed on the longitudinal slide rail and can slide back and forth. And a horizontal slide rail (not shown in the figure) is provided on the horizontal frame 22. The telescopic robotic arm 41 is clamped and installed on the horizontal slide rail and can slide left and right. The sliding frame 20 provided with the longitudinal slide rail and the horizontal slide rail can drive the mounting component 40 to freely locate at any pad of the circuit board for chip mounting processing, greatly improving the applicable range of the chip mounter.

[0022] The fixing component 30 includes a lifting slide rod 31, a pressing plate 32 and a limiting block 33. The lifting slide rod 31 is engaged and installed on the moving slide rail 11 and can be adjusted and slid left and right. The pressing plate 32 is installed at the upper end of the lifting slide rod 31, and a limiting slide hole 321 is provided on the pressing plate 32. The limiting block 33 is engaged and installed in the limiting slide hole 321 and can be adjusted and slid back and forth. The lifting slide rod 31 can drive the pressing plate 32 to press and fix the surface of the circuit board, while the limiting block 33 can limit the side of the circuit board, so as to effectively prevent the circuit board from being displaced during the chip mounting process.

[0023] The chip mounting component 40 includes a telescopic robotic arm 41, a negative pressure suction cup 42 and a plurality of calibration sliders 43. The telescopic robotic arm 41 is installed on the sliding frame 20 and can move horizontally and vertically. The negative pressure suction cup 42 is installed at the lower end of the telescopic robotic arm 41. A plurality of negative pressure suction holes 421 and calibration chutes 422 are provided at the bottom of the negative pressure suction cup 42. A plurality of the calibration sliders 43 are respectively engaged and installed in a plurality of the calibration chutes 422 and can be adjusted and slid. When the negative pressure suction cup 42 grabs a component, the component adsorbed on the bottom of the negative pressure suction cup 42 is very likely to be in a skewed position. At this time, a plurality of calibration sliders 43 will slide from the four sides to the center at the same time. During the sliding process, the calibration sliders 43 will push the component, so that it can be completely calibrated from the skewed state.

[0024] The alignment component 50 includes an installation ring 51 and a plurality of alignment laser sensors 52. The installation ring 51 is sleeved on the telescopic robotic arm 41, and a plurality of the alignment laser sensors 52 are all installed on the installation ring 51 from top to bottom. After the chip mounting component 40 grabs a component, the alignment laser sensors 52 will start to work and emit alignment laser downward. When the alignment laser corresponds to the alignment target on the circuit board up and down, the up and down alignment of the component and the chip mounting pad can be realized, and then the precise and efficient chip mounting processing can be realized.

[0025] The sliding frame 20 further includes a transverse strengthening rod 23. The transverse strengthening rod 23 is installed between the vertical frames 21, and an adjustment slide hole 231 is also provided on the transverse strengthening rod 23. The telescopic robotic arm 41 includes a telescopic sleeve 411, a telescopic rod core 412 and a plurality of auxiliary alignment magnetic strips 413. The telescopic sleeve 411 is designed with an opening downward. The telescopic rod core 412 passes through the telescopic sleeve 411 from bottom to top and can be lifted vertically. A plurality of the auxiliary alignment magnetic strips 413 are respectively engaged and installed on the four sides of the telescopic rod core 412.

[0026] The chip mounter 100 with an automatic correction function further includes an auxiliary alignment assembly 60. The auxiliary alignment assembly 60 includes a telescopic adjustment rod 61, an auxiliary alignment frame 62, a plurality of electromagnets 63, and alignment laser receivers 64. The telescopic adjustment rod 61 is snap-fitted in the adjustment slide hole 231 and can be adjusted and slid left and right. The telescopic adjustment rod 61 can also be telescoped back and forth. The auxiliary alignment frame 62 is clamped between the telescopic adjustment rods 61 and is located below the negative pressure suction cup 42. A plurality of the electromagnets 63 are installed on the inner side of the auxiliary alignment frame 62 and are arranged corresponding to a plurality of auxiliary alignment magnetic strips 413. A plurality of the alignment laser receivers 64 are installed on the upper end of the auxiliary alignment frame 62 and are vertically corresponding to a plurality of alignment laser sensors 52.

[0027] After the alignment assembly 50 completes the vertical alignment of the mounting assembly 40 and the circuit board pads, the telescopic rod core 412 in the telescopic robotic arm 41 will drive the negative pressure suction cup 42 and the grabbed component to descend vertically. During the descent, the telescopic rod core 412 will gradually pass through the auxiliary alignment frame 62. At this time, the auxiliary alignment magnetic strips 413 on the four sides of the telescopic rod core 412 correspond to the electromagnets 63 on the inner side of the auxiliary alignment frame 62, and the magnetic force generated between the two can keep the telescopic rod core 412 descending vertically without being deflected due to factors such as vibration.

[0028] In summary, the beneficial effects of the chip mounter 100 with an automatic correction function of the present utility model are as follows: By designing the negative pressure suction cup 42 with a correction slide hole, the negative pressure suction cup 42 can automatically correct the skew problem after grabbing the component, thereby realizing precise and efficient chip mounting processing; Designing the fixing assembly 30 to fix the circuit board can avoid the circuit board shifting during the chip mounting process and affecting the chip mounting processing; Designing the alignment assembly 50 to achieve high-precision alignment, and additionally designing the auxiliary alignment assembly 60 to further improve the accuracy of the vertical alignment between the component and the circuit board pad, making the quality of the chip mounting processing higher; The present utility model has strong practicability and has strong popularization significance.

[0029] The above embodiments only represent one implementation mode of the utility model, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A patch device with automatic correction function, characterized in that: It includes a processing table, a sliding frame, a fixed component, a mounting component and an alignment component; the processing table is provided with a movable slide rail, the sliding frame is erected on the processing table, the fixed component is snap-fitted and installed in the movable slide rail and can slide left and right, the mounting component is installed on the sliding frame, and the alignment component is installed on the mounting component; the mounting component includes a telescopic mechanical arm, a negative pressure suction cup and a plurality of correction sliders, the telescopic mechanical arm is installed on the sliding frame and can move horizontally and telescope vertically, the negative pressure suction cup is installed at the lower end of the telescopic mechanical arm, the bottom of the negative pressure suction cup is provided with a plurality of negative pressure suction holes and correction slide grooves, and a plurality of correction sliders are snap-fitted and installed in a plurality of correction slide grooves respectively and can slide adjustable.

2. The patch device with automatic correction function as claimed in claim 1, characterized in that: The sliding frame includes a vertical frame and a horizontal frame. The vertical frame stands on the processing table and is provided with a longitudinal slide rail. The horizontal frame is snap-fitted and installed on the longitudinal slide rail and can slide forward and backward, and is provided with a transverse slide rail. The telescopic robotic arm is snap-fitted and installed on the transverse slide rail and can slide left and right.

3. The patch device with automatic correction function as claimed in claim 1, characterized in that: The fixing assembly includes a lifting slide bar, a pressing plate and a limit block; the lifting slide bar is mounted on the movable slide rail and can be adjusted to slide left and right, the pressing plate is mounted on the upper end of the lifting slide bar, and a limit slide hole is provided on the pressing plate, and the limit block is mounted in the limit slide hole and can be adjusted to slide forward and backward.

4. The patch device with automatic correction function as claimed in claim 1, characterized in that: The alignment component comprises a mounting ring and a plurality of alignment laser sensors. The mounting ring is sleeved on the telescopic mechanical arm, and the plurality of alignment laser sensors are mounted on the mounting ring from top to bottom.

5. The patch device with automatic correction function as claimed in claim 4, characterized in that: The sliding frame also includes a transverse reinforcement rod, which is installed between the vertical frames and is also provided with an adjustment slide hole; the telescopic mechanical arm includes a telescopic sleeve, a telescopic rod core and a plurality of auxiliary alignment magnetic strips, the telescopic sleeve is designed to be open downward, the telescopic rod core is inserted into the telescopic sleeve from bottom to top and can be vertically lifted and lowered, and the plurality of auxiliary alignment magnetic strips are respectively engaged and installed on the four sides of the telescopic rod core.

6. The patch device with automatic correction function as claimed in claim 5, characterized in that: It also includes an auxiliary alignment component, which includes a telescopic adjustment rod, an auxiliary alignment frame, a plurality of electromagnets and an alignment laser receiver. The telescopic adjustment rod is snap-fitted into the adjustment slide hole and can be adjusted to slide left and right. The telescopic adjustment rod can also be telescoped forward and backward. The auxiliary alignment frame is clamped and installed between the telescopic adjustment rods and is located below the negative pressure suction cup. A plurality of the electromagnets are installed on the inner side of the auxiliary alignment frame and correspond to a plurality of auxiliary alignment magnetic strips. A plurality of the alignment laser receivers are installed at the upper end of the auxiliary alignment frame and correspond to a plurality of alignment laser sensors up and down.