Composite air-cooling and liquid-cooling radiator

Abstract

The utility model discloses a composite air-cooling and liquid-cooling radiator, which comprises a substrate, a liquid flow inlet nozzle, a liquid flow outlet nozzle and a fin assembly, the liquid flow inlet nozzle and the liquid flow outlet nozzle are respectively arranged at two ends of the substrate, through holes are arranged at two ends of the upper surface of the substrate, and the through holes are respectively communicated with the liquid flow inlet nozzle and the liquid flow outlet nozzle. The upper surface of the substrate is provided with a plurality of fin assemblies, the plurality of fin assemblies are distributed at equal intervals, and the two ends of each fin assembly are respectively communicated with through holes in the upper surface of the substrate. The wave-shaped fins with the heat conduction turbulent flow columns can improve the fin efficiency of the radiator, increase disturbance of airflow flowing through the fins and enhance the heat exchange efficiency, the overall structure is compact, the space size and the weight of a traditional composite heat dissipation device are reduced, and the device is simple and ingenious in design.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and relates to a radiator combining air cooling and liquid cooling. Background Art

[0002] With the development of electronic components towards high integration and miniaturization, the heat flux density of electronic devices has increased sharply, resulting in higher requirements for heat dissipation of electronic devices. Radiators can be used to dissipate heat from electronic components. However, traditional radiators have low heat dissipation efficiency and cannot adapt to the power consumption changes of components, that is, they cannot meet the heat dissipation requirements of electronic components with power consumption changes, leading to too high device temperature and ultimately affecting the performance and lifespan of components; in a liquid cooling system, a pump is used to circulate the coolant in the heat dissipation pipe for heat dissipation. All along, the liquid cooling method has been widely used in industrial applications, such as heat dissipation of steamships, automobiles, aircraft engines, etc.; air cooling is the main heat dissipation method for traditional heat-generating components and also played a great role in the early stage; since the heat dissipation speed of liquid is much faster than that of air, liquid cooling radiators often have good heat dissipation effects, can also be well controlled in terms of noise, and have a small volume and strong heat dissipation capacity, and their application fields are becoming more and more extensive, gradually replacing the traditional air cooling method; currently, some high-end heat components use liquid cooling radiators for heat dissipation. However, once there is a problem with the supply of the cooling medium and the liquid cooling is interrupted and does not work, the heat components cannot dissipate heat in time, and it is easy to occur situations such as burning out of the heat components.

[0003] Chinese Patent CN215766592U discloses an air-cooled and liquid-cooled composite radiator, including a base and a cover plate. It is characterized in that a card slot is provided in the middle of the upper surface of the base, a heat element is installed on the lower surface, an internal water channel is provided at the bottom of the card slot, a liquid inlet and a liquid outlet are provided on one end surface of the base, the liquid inlet is communicated with the inlet of the internal water channel, the liquid outlet is connected to the outlet of the internal water channel, a first fin is provided on the top of the cover plate, and the cover plate is embedded in the card slot and welded to the base, solving the problem that when the cooling medium liquid enters the internal water channel through the liquid inlet and flows, the medium liquid moves between the liquid cooling internal water channels to achieve heat conduction. The larger the heat exchange area, the higher the heat exchange rate. The medium liquid that absorbs heat finally leaves the radiator from the liquid outlet to take away heat. When there is a problem with the supply of the cooling medium liquid in the liquid cooling radiator and the liquid cooling is interrupted and does not work, the high-end heat element is cooled by the air-cooled radiator to protect the high-end heat components from being burned out, thereby protecting the system, and having the characteristics of good heat dissipation effect, high use safety, simple structure, and convenient operation. Summary of the Invention

[0004] In view of the above situation, to overcome the defects of the prior art, the purpose of the present utility model is to provide a radiator with combined air cooling and liquid cooling, which can adapt to the power consumption of different electronic components, that is, different heat dissipation methods can be adopted for electronic components with different operating power consumptions, and the corrugated fins with heat conduction turbulators can improve the fin efficiency of the radiator, increase the airflow disturbance flowing through the fins, enhance the heat exchange efficiency, the overall structure is compact, reducing the space size and weight of the traditional combined heat dissipation device, and the device is simple and ingeniously designed.

[0005] To achieve the above purpose, the present utility model provides the following technical solutions:

[0006] A radiator with combined air cooling and liquid cooling, including a substrate, a liquid flow inlet nozzle, a liquid flow outlet nozzle, and a fin assembly. The two ends of the substrate are respectively provided with a liquid flow inlet nozzle and a liquid flow outlet nozzle. Through holes are provided at both ends of the upper surface of the substrate, and the through holes are respectively communicated with the liquid flow inlet nozzle and the liquid flow outlet nozzle. A plurality of fin assemblies are provided on the upper surface of the substrate, and the plurality of fin assemblies are evenly distributed at equal intervals. Both ends of the fin assembly are respectively communicated with the through holes on the upper surface of the substrate.

[0007] Furthermore, the fin assembly includes a fin body, an inlet manifold cylinder, an outlet manifold cylinder, and a heat conduction turbulator. A plurality of liquid flow channels are provided inside the fin body. The inlet manifold cylinder and the outlet manifold cylinder are respectively provided at both ends of the fin body. One end of the liquid flow channel inside the fin body is communicated with the inlet manifold cylinder, and the other end of the liquid flow channel inside the fin body is communicated with the outlet manifold cylinder. The inlet manifold cylinder passes through the through hole at one end of the upper surface of the substrate and is communicated with the liquid flow inlet nozzle. A plurality of heat conduction turbulators are provided on the outer side surface of the fin body. The outlet manifold cylinder passes through the through hole at the other end of the upper surface of the substrate and is communicated with the liquid flow outlet nozzle.

[0008] Furthermore, a U-shaped groove is provided on one side of the inlet manifold cylinder and the outlet manifold cylinder, and the U-shaped groove is communicated with the liquid flow channel inside the fin body.

[0009] Furthermore, one end of the heat conduction turbulator is provided with an open cylindrical shape.

[0010] Furthermore, a plurality of mounting positions are provided on the outer side surface of the fin body, and the open cylindrical shape at one end of the heat conduction turbulator is embedded in the mounting positions on the outer side surface of the fin body.

[0011] Furthermore, the shape of the fin body is wavy.

[0012] The radiator with combined air cooling and liquid cooling can adapt to different power consumptions of electronic components, that is, different heat dissipation methods can be adopted for electronic components with different operating power consumptions. The corrugated fins with heat conduction turbulators can improve the fin efficiency of the radiator, increase the airflow disturbance flowing through the fins, enhance the heat exchange efficiency, enable the electronic components to work within a reasonable temperature range, extend the service life of the electronic devices, have a compact overall structure, reduce the space size and weight of the traditional combined heat dissipation device, and have a simple device and ingenious design. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 FIG. is a schematic structural diagram of the radiator with combined air cooling and liquid cooling of the present invention;

[0014] Figure 2 FIG. is an exploded structural diagram of the radiator with combined air cooling and liquid cooling of the present invention;

[0015] Figure 3 FIG. is a schematic structural diagram of the fin assembly of the present invention;

[0016] Figure 4 FIG. is an exploded structural diagram of the fin assembly of the present invention;

[0017] Reference numerals: 1, substrate; 11, through hole; 2, liquid flow inlet nozzle; 3, liquid flow outlet nozzle; 4, fin assembly; 41, fin body; 410, installation position; 411, liquid flow channel; 42, inlet manifold cylinder; 420, U-shaped groove; 43, outlet manifold cylinder; 44, heat conduction turbulator; 440, opening. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The following describes in detail a plastic encapsulated connector for a new energy vehicle provided by the present invention with reference to the drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; moreover, the drawing part is only for more specifically describing the embodiments, and is not intended to specifically limit the present invention.

[0019] It should be noted that in the specification, references to "one embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc. indicate that the described embodiments may include specific features, structures or characteristics, but not necessarily every embodiment includes the specific feature, structure or characteristic. Additionally, when combining embodiments to describe a specific feature, structure or characteristic, implementing such feature, structure or characteristic in combination with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the relevant art.

[0020] Generally, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or can be used to describe a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood to not necessarily be intended to convey a set of exclusive factors, but rather, depending at least in part on the context, can alternatively allow for the existence of other factors that are not necessarily explicitly described.

[0021] It will be understood that the meanings of "on", "above", and "over" in the present disclosure should be construed in the broadest manner such that "on" not only means "directly on" something, but also includes the meaning of being "on" something with intervening features or layers therebetween, and "above" or "over" not only means "above" or "over" something, but can also include the meaning of being "above" or "over" something with no intervening features or layers therebetween.

[0022] In addition, spatially relative terms such as "under", "below", "lower", "above", "upper", etc. are used herein for convenience of description to describe the relationship of one element or feature to another or other elements or features, as shown in the figures. Spatially relative terms are intended to encompass different orientations in the use or operation of the device in addition to the orientation depicted in the figures. The device can be oriented in other ways, and the spatially relative descriptors used herein can be interpreted accordingly.

[0023] Referring Figures 1-4 As shown, a composite air-cooled and liquid-cooled radiator includes a substrate 1, a liquid flow inlet nozzle 2, a liquid flow outlet nozzle 3, and a fin assembly 4. The two ends of the substrate 1 are respectively provided with a liquid flow inlet nozzle 2 and a liquid flow outlet nozzle 3. Through holes 11 are provided at both ends of the upper surface of the substrate 1, and the through holes 11 are respectively communicated with the liquid flow inlet nozzle 2 and the liquid flow outlet nozzle 3. A plurality of fin assemblies 4 are provided on the upper surface of the substrate 1, and the plurality of fin assemblies 4 are evenly spaced. Both ends of the fin assembly 4 are respectively communicated with the through holes 11 on the upper surface of the substrate 1.

[0024] Preferably, the fin assembly 4 includes a fin body 41, an inlet header 42, an outlet header 43, and heat-conducting turbulators 44. A plurality of liquid flow channels 411 are provided inside the fin body 41. The inlet header 42 and the outlet header 43 are respectively provided at both ends of the fin body 41. One end of the liquid flow channels 411 inside the fin body 41 communicates with the inlet header 42, and the other end of the liquid flow channels 411 inside the fin body 41 communicates with the outlet header 43. The inlet header 42 passes through a through hole 11 at one end of the upper surface of the substrate 1 and communicates with the liquid inlet nozzle 2. A plurality of heat-conducting turbulators 44 are provided on the outer side surface of the fin body 41. The outlet header 43 passes through a through hole 11 at the other end of the upper surface of the substrate 1 and communicates with the liquid outlet nozzle 3.

[0025] Preferably, a U-shaped groove 420 is provided on one side of the inlet header 42 and the outlet header 43, and the U-shaped groove 420 communicates with the liquid flow channels 411 inside the fin body 41.

[0026] Preferably, one end of the heat-conducting turbulator 44 is a cylindrical shape with an opening 440.

[0027] Preferably, a plurality of mounting positions 410 are provided on the outer side surface of the fin body 41, and the cylindrical shape with an opening 440 at one end of the heat-conducting turbulator 44 is embedded in the mounting positions 410 on the outer side surface of the fin body 41.

[0028] Preferably, the shape of the fin body 41 is wavy.

[0029] The working principle is as follows: When an electronic component is installed on the lower surface of the radiator substrate and the operating power consumption of the electronic component is small, heat dissipation is only carried out by air cooling. That is, the heat generated by the electronic component can be transferred to the radiator corrugated fins through the radiator substrate, and the cold air takes away the heat transferred to the fins through convective heat transfer, achieving the purpose of dissipating heat from the electronic component; when the operating power consumption of the electronic component is large, heat dissipation is carried out by both air cooling and liquid cooling. The heat generated by the electronic component is transferred to the radiator corrugated fins through the radiator substrate. Part of the heat is taken away by air convection heat transfer, and the other part of the heat is taken away by the coolant flowing through the liquid flow channels inside the fins, which can achieve efficient heat dissipation for high-power electronic devices.

[0030] Based on the disclosure and teachings of the above specification, those skilled in the art to which the present utility model pertains can also make appropriate changes and modifications to the above embodiments. Therefore, the present utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present utility model should also fall within the protection scope of the claims of the present utility model. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present utility model.

Claims

1. A composite air-cooled and liquid-cooled radiator, characterized in that: The invention comprises a substrate, a liquid flow inlet nozzle, a liquid flow outlet nozzle, and a fin assembly. The two ends of the substrate are respectively provided with a liquid flow inlet nozzle and a liquid flow outlet nozzle. The two ends of the upper surface of the substrate are provided with through holes, and the through holes are respectively connected with the liquid flow inlet nozzle and the liquid flow outlet nozzle. The upper surface of the substrate is provided with a plurality of fin assemblies, and the plurality of fin assemblies are distributed at equal intervals. The two ends of the fin assembly are respectively connected with the through holes on the upper surface of the substrate. The fin assembly comprises a fin body, an inlet collecting column, an outlet collecting column, and a heat-conducting spoiler column. The fin body has a heat-conducting spoiler column. The fin body is provided with a plurality of liquid flow channels, and an inlet collecting column and an outlet collecting column are respectively provided at both ends of the fin body. One end of the liquid flow channel inside the fin body is connected with the inlet collecting column, and the other end of the liquid flow channel inside the fin body is connected with the outlet collecting column. The inlet collecting column is connected with the liquid flow inlet nozzle through a through hole at one end of the upper surface of the substrate, and a plurality of heat-conducting spoiler columns are provided on the outer side of the fin body, and the outlet collecting column is connected with the liquid flow outlet nozzle through a through hole at the other end of the upper surface of the substrate.

2. The composite air-cooled and liquid-cooled radiator according to claim 1 is characterized in that: A U-shaped groove is provided on one side of the inlet current collecting column and the outlet current collecting column, and the U-shaped groove is connected with the liquid flow channel inside the fin body.

3. The composite air-cooled and liquid-cooled radiator according to claim 1 is characterized in that: One end of the heat-conducting spoiler column is provided with an open cylindrical shape.

4. The composite air-cooled and liquid-cooled radiator according to claim 3 is characterized in that: The outer side surface of the fin body is provided with a plurality of mounting positions, and the cylindrical heat-conducting spoiler column with an opening at one end is embedded in the mounting position on the outer side surface of the fin body.

5. The composite air-cooled and liquid-cooled radiator according to claim 1 is characterized in that: The fin body is in a wave shape.

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