COB packaging light source
By setting a wire fixing member on the substrate of the COB packaged light source and connecting it with the chip wire arc, the short circuit problem caused by cross-setting the lower arc interference is solved, and the stable operation of the light source is achieved.
Patent Information
- Application Number
- CN202421176506.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-05-27
AI Technical Summary
When the cross-array of chip wire arcs is stacked, existing COB package light sources are prone to interference, resulting in short circuits.
A wire fixing member is provided on the substrate, and connected to at least one wire arc by the wire fixing member, so that the wire arcs of different chips arranged crosswise form a height difference, that is, separation, and avoid linear arc interference.
Effectively avoid line arc interference, prevent COB short circuit, and ensure the normal operation of the light source.
Smart Images
Figure CN222928759U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of lighting components, and particularly relates to a COB packaged light source. Background Art
[0002] For multi-color COBs, which require high luminous efficiency, flip-chip and mirror aluminum substrates are usually used for manufacturing. At the same time, a good mixing effect is pursued. Besides the requirements for dot powder technology, the wire bonding of the chips is also a difficulty. As Figure 1 shown, the light colors of the chips 1' in different rows in series are different, and a mixing effect can be achieved by cross-placing the chips in different rows in series. At this time, the wire arcs 2' of the chips 1' in different rows will cross and overlap, resulting in interference, which may cause the COB to short-circuit. Summary of the Utility Model
[0003] The technical problem to be solved by the utility model is to provide a COB packaged light source to avoid wire arc interference and prevent the COB from short-circuiting.
[0004] To solve the above technical problem, the utility model provides a COB packaged light source, including a substrate and a light-emitting module disposed on the substrate. The light-emitting module includes several rows of chips. The chips in the same row are in series, and the chips in different rows are cross-set to form at least two mutually interfering wire arcs;
[0005] A wire fixing member is disposed on the substrate, and the wire fixing member is connected to at least one wire arc to separate the wire arcs.
[0006] As an improvement of the above solution, the wire fixing member includes an insulating layer and a conductive layer. The substrate, the insulating layer, and the conductive layer are connected in sequence, and the conductive layer is connected to at least one wire arc.
[0007] As an improvement of the above solution, the insulating layer is made of an insulating material, and the conductive layer is made of a metal material.
[0008] As an improvement of the above solution, the insulating material is glass, sapphire, plastic, or ceramic; the metal material is one or more of copper, palladium, nickel, gold, and silver.
[0009] As an improvement of the above solution, a functional mechanism is disposed on the conductive layer, and the functional mechanism is used to realize the corresponding functions of the light source.
[0010] As an improvement of the above solution, the functional mechanism is a chip, a silicon resistor, a constant current diode, or a linear IC rectifier diode.
[0011] As an improvement of the above solution, the size of the wire fixing member is 0.2*0.2*0.05 mm - 4*4*0.4 mm.
[0012] As an improvement of the above solution, the adjacent two rows of the chips are respectively provided with a first wire arc and a second wire arc;
[0013] The adjacent two rows of the chips are arranged in a cross manner, so that the first wire arc and the second wire arc are arranged in a cross manner; the first wire arc is connected to the wire fixing part, so that the first wire arc and the second wire arc are separated.
[0014] As an improvement of the above solution, the first wire arc includes a first wire arc segment and a second wire arc segment, and the first wire arc segment and the second wire arc segment are respectively connected to the wire fixing part.
[0015] As an improvement of the above solution, the wire fixing part and the substrate are adhesively connected by die bonding glue;
[0016] The substrate is a mirror-finished aluminum substrate.
[0017] Implementing the present invention has the following beneficial effects:
[0018] In the COB packaged light source of the present invention, a wire fixing part is arranged on the substrate, and at least one wire arc is connected by the wire fixing part, so that the wire arcs of different rows of chips arranged in a cross manner form a height difference, that is, separation, to avoid interference of the wire arcs and prevent COB short circuit. Description of the Drawings
[0019] Figure 1 is a schematic structural diagram of an existing COB packaged light source;
[0020] Figure 2 is a schematic structural diagram of the COB packaged light source of the present invention;
[0021] Figure 3 is Figure 2 a schematic side view of the wire fixing part;
[0022] Figure 4 is Figure 2 a schematic structural diagram of the wire fixing part. Detailed Embodiments
[0023] To make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings. It is hereby declared that the directional terms such as up, down, left, right, front, back, inside and outside that appear or will appear in the present invention are only based on the drawings of the present invention, and they are not specific limitations of the present invention.
[0024] Referring to Figure 2-4 , the present invention discloses a COB packaged light source, including a substrate 1 and a light-emitting module arranged on the substrate 1. The light-emitting module includes several rows of chips 2. The chips 2 in the same row are connected in series, and the chips 2 in different rows are arranged in a cross manner to form at least two interfering wire arcs.
[0025] A wire positioning member 3 is provided on the substrate 1, and the wire positioning member 3 is connected to at least one wire arc to separate the wire arcs.
[0026] In the COB packaged light source of the present utility model, a wire positioning member is provided on the substrate. By connecting the wire positioning member to at least one wire arc, the wire arcs of different rows of chips arranged crosswise form a height difference, that is, they are separated, avoiding interference between the wire arcs and preventing short - circuit of the COB.
[0027] As Figure 2-4 As shown, the wire positioning member 3 includes an insulating layer 31 and a conductive layer 32. The substrate 1, the insulating layer 31, and the conductive layer 32 are connected in sequence, and the conductive layer 32 is connected to at least one wire arc. The insulating layer plays a supporting role, while the conductive layer is welded to the wire arc to play an electrical connection role. Connecting the wire arc to the wire positioning member enables one or more wire arcs not to interfere with other wire arcs, forming a height difference, preventing short - circuit, and ensuring the normal operation of the COB.
[0028] Preferably, the insulating layer 31 is made of an insulating material, and the conductive layer 32 is made of a metal material. The insulating material plays a supporting and insulating role, while the conductive material plays a role in welding with the wire arc to ensure the normal operation of this row of chips.
[0029] More preferably, the insulating material is glass, sapphire, plastic, or ceramic; the metal material is one or more of copper, palladium, nickel, gold, and silver.
[0030] More preferably, a metal layer is plated on the surface of the insulating layer made of glass or plastic, and the wire arc is welded to the metal layer. Chips, silicon resistors, or constant - current diodes are provided on the surface of the insulating layer made of sapphire or ceramic, and the wire arc is welded to the chips, silicon resistors, or constant - current diodes. Since chips, silicon resistors, or constant - current diodes generate heat, and the thermal conductivity of sapphire or ceramic is higher than that of glass or plastic.
[0031] Preferably, a functional mechanism (not shown in the figure) is provided on the conductive layer 32, and the functional mechanism is used to implement the corresponding functions of the light source. More preferably, the functional mechanism is a chip, a silicon resistor, a constant - current diode, or a linear IC rectifier diode, but not limited thereto. When the COB packaged light source needs to implement certain functions such as multi - color light alternation, etc., a functional mechanism can be set to facilitate the realization of its functions.
[0032] Preferably, the size of the wire positioning member 3 is 0.2 * 0.2 * 0.05 mm - 4 * 4 * 0.4 mm. More preferably, the size of the wire positioning member 3 is 1 * 1 * 0.1 mm - 3 * 3 * 0.3 mm. Limiting the size of the wire positioning member ensures that the wire arcs connected to it are separated from and do not interfere with other wire arcs.
[0033] Specifically, as Figure 2As shown, the adjacent two rows of the chips 2 are respectively provided with a first wire arc 4 and a second wire arc 5; the adjacent two rows of the chips 2 are arranged in a cross manner so that the first wire arc 4 and the second wire arc 5 are arranged in a cross manner; the first wire arc 4 is connected to the wire fixing member 3 so that the first wire arc 4 and the second wire arc 5 are separated. The adjacent two rows of chips are arranged in a cross manner, and the light-emitting colors of the two rows of chips are different, which can achieve a mixed light effect. However, at the same time, it will cause the wire arcs of the two rows of chips to cross and overlap, resulting in interference. For this reason, the present utility model connects one of the other wire arcs to the wire fixing member provided on the substrate, so that the two wire arcs form a height difference and thus are separated to avoid interference between the two.
[0034] Preferably, as Figure 4 shown, the first wire arc 4 includes a first wire arc segment 41 and a second wire arc segment 42, and the first wire arc segment 41 and the second wire arc segment 42 are respectively connected to the wire fixing member 3. The first wire arc segment and the second wire arc segment are respectively printed on the conductive layer of the wire fixing member, and the first wire arc segment and the second wire arc segment are electrically connected through the conductive layer to realize the normal operation of the chips in this row. If a functional mechanism is provided on the conductive layer, the first wire arc segment and the second wire arc segment are respectively electrically connected to the conductive layer and the functional mechanism.
[0035] Preferably, as Figure 4 shown, the wire fixing member 3 is arranged below the interference position of the first wire arc 4 and the second wire arc 5 to ensure that the first wire arc and the second wire arc do not interfere and are separated.
[0036] Preferably, the wire fixing member 3 and the substrate 1 are adhesively connected by die bonding glue.
[0037] Preferably, the substrate 1 is an aluminum substrate subjected to mirror treatment, and has good heat conduction effect.
[0038] In summary, the present utility model provides a COB packaged light source, which avoids wire arc interference and prevents COB short circuit.
[0039] The above is the preferred embodiment of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and retouches can be made, and these improvements and retouches are also regarded as the protection scope of the present utility model.
Claims
1. A COB packaged light source, characterized in that: It comprises a substrate and a light-emitting module arranged on the substrate, wherein the light-emitting module comprises a plurality of rows of chips, wherein the chips in the same row are connected in series, and the chips in different rows are cross-arranged to form at least two mutually interfering arcs; A line-fixing member is provided on the substrate, and the line-fixing member is connected to at least one wire arc to separate the wire arc.
2. The COB packaged light source according to claim 1, characterized in that: The alignment member comprises an insulating layer and a conductive layer. The substrate, the insulating layer and the conductive layer are connected in sequence. The conductive layer is connected to at least one wire arc.
3. The COB packaged light source according to claim 2, characterized in that: The insulating layer is made of insulating material, and the conductive layer is made of metal material.
4. The COB packaged light source according to claim 3, characterized in that: The insulating material is glass, sapphire, plastic or ceramic; the metal material is copper, palladium, nickel, gold or silver.
5. The COB packaged light source according to claim 2, characterized in that: The conductive layer is provided with a functional mechanism, and the functional mechanism is used to realize the corresponding function of the light source.
6. The COB packaged light source according to claim 5, characterized in that: The functional mechanism is a chip, a silicon resistor, a constant current diode or a linear IC rectifier diode.
7. The COB packaged light source according to claim 1, characterized in that: The size of the wiring member is 0.2*0.2*0.05mm-4*4*0.4mm.
8. The COB packaged light source according to claim 1, characterized in that: The chips in two adjacent rows are respectively provided with a first arc and a second arc; The chips in two adjacent rows are cross-arranged so that the first arc and the second arc are cross-arranged; the first arc is connected to the wiring member so that the first arc and the second arc are separated.
9. The COB packaged light source according to claim 8, characterized in that: The first wire arc includes a first wire arc segment and a second wire arc segment, and the first wire arc segment and the second wire arc segment are respectively connected to the line-fixing member.
10. The COB packaged light source according to any one of claims 1 to 9, characterized in that: The wiring member and the substrate are bonded and connected by a bonding adhesive; The substrate is an aluminum substrate that has been subjected to mirror finishing.