Electric kettle with heat dissipation structure
By using thermal glue on the PCB module of the electric kettle and installing metal plates on the bottom shell, preliminary and secondary heat dissipation of components is achieved, the problem of excessive temperature rise of components is solved, and reliability and service life is improved.
Patent Information
- Application Number
- CN202421550816.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-07-02
AI Technical Summary
When the PCB module of the existing electric kettle is continuously working, the temperature rise of the components will exceed its temperature resistance range, resulting in a decrease in reliability and service life.
An electric kettle with a heat dissipation structure is designed. By placing thermal glue on the PCB module and installing metal plates on the bottom shell, preliminary and secondary heat dissipation are achieved and the heat dissipation effect is enhanced.
By enhancing the heat dissipation effect, the electric kettle can keep the temperature of the components within an acceptable operating range during continuous heating, thereby improving the reliability and service life of the components.
Smart Images

Figure CN222929580U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electric kettles, in particular to an electric kettle with a heat dissipation structure. Background Art
[0002] The PCB module of an electric kettle is generally arranged at the bottom. However, due to the small space at the bottom and the heating element provided at the bottom of the kettle, when the kettle works continuously, the temperature rise of the relay, thyristor and other rectifying components on the PCB module will exceed their temperature resistance range. Content of the Utility Model
[0003] An object of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide an electric kettle with a heat dissipation structure.
[0004] The electric kettle with a heat dissipation structure according to an embodiment of the utility model includes a kettle body and a bottom shell. A cavity for accommodating the PCB module is formed between the bottom of the kettle body and the bottom shell. A heat-conducting glue is provided below the PCB module and abuts against the components on the PCB module. A metal plate is provided on the bottom shell and abuts against the heat-conducting glue.
[0005] According to some embodiments of the utility model, the components include a relay, a thyristor, and a rectifying device.
[0006] According to some embodiments of the utility model, it includes an annular support structure arranged in the cavity. A heating plate is provided above the support structure. The PCB module, the heat-conducting glue, and the metal plate are respectively arranged below the support structure. The lower end of the support structure is detachably connected to the bottom shell.
[0007] According to some embodiments of the utility model, a clamping portion is provided at the lower end of the support structure, and a card slot corresponding to the clamping portion is provided on the bottom shell. The clamping portion is clamped with the card slot.
[0008] According to some embodiments of the utility model, a plurality of downwardly extending supporting feet perpendicular to the heating plate are provided on the support structure, and the clamping portion is arranged at the end of the supporting feet.
[0009] According to some embodiments of the utility model, the plurality of supporting feet are evenly distributed along the circumference of the heating plate.
[0010] According to some embodiments of the utility model, it further includes a sealing ring, and the sealing ring is sleeved on the heating plate to abut against the inner wall of the outer shell of the kettle body.
[0011] The electric kettle with a heat dissipation structure according to the embodiments of the present utility model has at least the following beneficial effects: A heat-conducting adhesive is placed on the components of the PCB module. The heat-conducting adhesive first conducts preliminary heat dissipation for the components. A metal plate is additionally installed on the bottom shell, and the metal plate contacts the heat-conducting adhesive for secondary heat dissipation, significantly enhancing the heat dissipation effect. After enhanced heat dissipation, when the electric kettle is continuously heated, the maximum temperature of the components on the PCB module remains below the tolerable working temperature after the temperature rises, thereby improving the reliability and service life of the components.
[0012] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The following further describes the specific embodiments of the present utility model with reference to the drawings;
[0014] Figure 1 is a structural diagram of an electric kettle with a heat dissipation structure;
[0015] Figure 2 is a cross-sectional view of an electric kettle with a heat dissipation structure;
[0016] Figure 3 is Figure 2 an enlarged structural diagram of a partial area A in
[0017] Figure 4 is an exploded structural diagram of an electric kettle with a heat dissipation structure. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] This part will detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The role of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but it cannot be understood as a limitation on the protection scope of the present utility model.
[0019] In the description of the present utility model, it should be understood that for orientation descriptions, such as up, down, front, back, left, right, etc., the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.
[0020] In the description of the present utility model, the meaning of "several" is one or more, the meaning of "multiple" is more than two, and understandings such as "greater than", "less than", "exceeding", etc. do not include the corresponding number, while understandings such as "above", "below", "within", etc. include the corresponding number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0021] Referring to Figures 1 to 4 , a kind of electric kettle with a heat dissipation structure of the present utility model includes a kettle body 10 and a bottom shell 20. A cavity for accommodating a PCB module 11 is formed between the bottom of the kettle body 10 and the bottom shell 20. A heat conductive adhesive 12 is provided below the PCB module 11, and the heat conductive adhesive 12 abuts against components 111 (the components 111 include a relay, a thyristor, and a rectifying device) on the PCB module 11. A metal plate 21 is provided on the bottom shell 20, and the metal plate 21 is preferably an aluminum plate with good heat dissipation effect; the metal plate 21 abuts against the heat conductive adhesive 12. The heat conductive adhesive 12 is placed on the components 111 of the PCB module 11. First, the heat conductive adhesive 12 conducts preliminary heat dissipation on the components 111. At the same time, the metal plate 21 is additionally installed on the bottom shell 20, and the metal plate 21 contacts the heat conductive adhesive 12 for secondary heat dissipation, which significantly enhances the heat dissipation effect. After the heat dissipation is enhanced, when the electric kettle is continuously heated, the maximum temperature of the components 111 on the PCB module 11 can be maintained below the tolerable working temperature after the temperature rises, thereby improving the reliability and service life of the components 111.
[0022] Preferably, the heat conductive adhesive 12 is heat dissipation silica gel with good heat dissipation effect.
[0023] Such as Figure 4 , including an annular support structure 30 arranged in the cavity. A heating plate 31 is provided above the support structure 30. The PCB module 11, the heat conductive adhesive 12, and the metal plate 21 are respectively arranged below the support structure 30. The lower end of the support structure 30 is detachably connected to the bottom shell 20, which is convenient for the disassembly and installation of the bottom shell 20, so as to facilitate the subsequent maintenance of the PCB module 11 in the cavity.
[0024] Furthermore, a clamping portion 33 is provided at the lower end of the support structure 30, and a card slot 22 corresponding to the clamping portion 33 is provided on the bottom shell 20. The clamping portion 33 is clamped with the card slot 22. A plurality of downwardly extending support legs 32 perpendicular to the heating plate 31 are provided on the support structure 30, and the clamping portion 33 is arranged at the end of the support legs 32. The plurality of support legs 32 are evenly distributed along the circumference of the heating plate 31; the structure is simple and the support effect is good.
[0025] It further includes a sealing ring 34. The sealing ring sleeve 34 is arranged on the heating plate 31 to abut against the inner wall of the outer shell of the kettle body 10 to achieve good sealing.
[0026] It is easily understandable to those skilled in the art that, on the premise of no conflict, the above preferred modes can be freely combined and superimposed.
[0027] The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model. Any equivalent structural transformation made by using the content of the specification and drawings of the present utility model under the inventive concept of the present utility model, or directly or indirectly applied to other related technical fields, is included in the patent protection scope of the present utility model.
Claims
1. An electric kettle with a heat dissipation structure, characterized in that: include: A kettle body (10) and a bottom shell (20), wherein a cavity for accommodating a PCB module (11) is formed between the bottom of the kettle body (10) and the bottom shell (20), a thermal conductive adhesive (12) is provided below the PCB module (11) and the thermal conductive adhesive (12) abuts against components (111) on the PCB module (11), and a metal plate (21) is provided on the bottom shell (20), and the metal plate (21) abuts against the thermal conductive adhesive (12).
2. The electric kettle with a heat dissipation structure according to claim 1, characterized in that: The components (111) include relays, thyristors, and rectifiers.
3. The electric kettle with a heat dissipation structure according to claim 1, characterized in that: The thermally conductive adhesive (12) is heat dissipating silica gel.
4. The electric kettle with a heat dissipation structure according to claim 1, characterized in that: It comprises an annular support structure (30) arranged in the cavity, a heating plate (31) is arranged above the support structure (30), the PCB module (11), the thermal conductive adhesive (12) and the metal plate (21) are respectively arranged below the support structure (30), and the lower end of the support structure (30) is detachably connected to the bottom shell (20).
5. The electric kettle with a heat dissipation structure according to claim 4, characterized in that: A clamping portion (33) is provided at the lower end of the support structure (30), a clamping slot (22) corresponding to the clamping portion (33) is provided on the bottom shell (20), and the clamping portion (33) is clamped with the clamping slot (22).
6. The electric kettle with a heat dissipation structure according to claim 5, characterized in that: The support structure (30) is provided with a plurality of supporting legs (32) extending downwardly and perpendicular to the heating plate (31), and the clamping portion (33) is arranged at the end of the supporting legs (32).
7. The electric kettle with a heat dissipation structure according to claim 6, characterized in that: The plurality of supporting legs (32) are evenly distributed along the circumference of the heating plate (31).
8. The electric kettle with a heat dissipation structure according to claim 5, characterized in that: It also comprises a sealing ring (34), wherein the sealing ring (34) is sleeved on the heating plate (31) to abut against the inner wall of the outer shell of the kettle body (10).