Semiconductor packaging dispensing jig
By designing a semiconductor package dispensing fixture including a fixture base, an elastic support assembly, an adjustment assembly and a clamping assembly, the problems of insufficient adaptability and residual glue dripping in the prior art are solved, and the adaptation of chips of different sizes and the effective discharge of dispensing residues is achieved, and the quality and efficiency of the dispensing process are improved.
Patent Information
- Application Number
- CN202421756573.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-07-24
AI Technical Summary
The existing semiconductor packaging dispensing fixtures can only be adapted to one specification and model of semiconductor chips, and the residual glue on the dispensing gun head is easily dripped into the positioning groove of the fixture, affecting the flatness of the chip.
A semiconductor package dispensing fixture is designed, including a fixture base, an elastic support assembly, an adjustment assembly and a clamping assembly. There are multiple sets of liquid discharge tanks on the top of the fixture base to discharge the dripping residual rubber; the elastic support assembly is buffered by rubber columns and springs; the adjustment assembly adjusts the position of the clamping assembly through a knob and a threaded convex shaft; the clamping assembly realizes vertical compression of the chip through an L-shaped press rod and a slider.
The fixture can adapt to semiconductor chips of different sizes, and through elastic support and adjustment of the component design, ensuring the flatness and compression force of the chip, effectively ejecting dispensing residues, and improving the quality and efficiency of the dispensing process.
Smart Images
Figure CN222931187U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of jigs, in particular to a semiconductor packaging dispensing jig. Background Art
[0002] A semiconductor packaging dispensing jig is a tooling device used for dispensing operations in the semiconductor packaging process. In the semiconductor manufacturing process, dispensing is a key process step for applying glue or adhesive to specific positions on chips, wafers, or packages. The dispensing jig is usually designed to fix and position the components to be dispensed and ensure that the glue is applied to the target surface in an accurate manner.
[0003] The existing semiconductor packaging dispensing jigs can usually only be adapted to one specification and model of semiconductor chips during use, which has great limitations during use. Moreover, when semiconductor packaging dispensing is processed, the glue remaining on the dispensing gun head is likely to drip into the positioning groove of the jig, which will affect the flatness of the placement during semiconductor chip packaging.
[0004] Therefore, a semiconductor packaging dispensing jig is proposed. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a semiconductor packaging dispensing jig to solve the problems raised in the above background art.
[0006] The utility model specifically adopts the following technical solutions to achieve the above purpose:
[0007] A semiconductor packaging dispensing jig includes a jig base. A plurality of drain grooves for discharging dripping residual glue are opened on the top surface of the jig base. An elastic support component is arranged on the surface of the jig base. An adjustment component is arranged on the top surface of the jig base. A clamping component for pressing the semiconductor chip is slidably arranged on the surface of the adjustment component, and the adjustment component is used to adjust the position of the clamping component.
[0008] Further, the jig base includes a base body. A positioning groove is opened on the top surface of the base body. Countersunk holes are opened on the top surface of the base body. A plurality of drain grooves corresponding to the positioning groove are opened on the surface of the base body.
[0009] Further, the elastic support component includes a concave hole. A concave hole is opened on the bottom surface of the positioning groove. A first spring is fixedly installed on the bottom surface of the concave hole. The top end of the first spring is fixedly installed with a rubber column, and the rubber column is movably inserted into the inside of the concave hole.
[0010] Further, the adjustment component includes a side plate and a U-shaped frame. A side plate is fixedly installed on the top surface of the fixture base. A threaded convex shaft is fixedly installed on the surface of the U-shaped frame, and a knob is threadedly sleeved on the surface of the threaded convex shaft. Rotating shafts and rectangular shafts are fixedly installed on the inner walls of both sides of the side plate.
[0011] Further, the clamping component includes an L-shaped pressing rod. The L-shaped pressing rod is rotatably sleeved on the surface of the rotating shaft. A slider is slidably sleeved on the surface of the rectangular shaft. Second springs are fixedly installed on the top surface and the bottom surface of the slider.
[0012] Further, the side wall of the U-shaped frame is in close fit with the side wall of the side plate, and the threaded convex shaft is slidably arranged inside the side plate.
[0013] The beneficial effects of the present utility model are as follows:
[0014] Fixed on the operating table of the dispensing machine through the fixture base. When dispensing the semiconductor chip, by placing the semiconductor chip inside the fixture base and making the semiconductor chip located at the top of the elastic support component, the position of the clamping component is adjusted through the adjustment component, so that the pressing end of the clamping component is located above the semiconductor chip. Through the clamping component, the semiconductor chip is vertically pressed, and through the elastic support component, the pressure received by the semiconductor chip is buffered and absorbed. Through the liquid discharge groove, the residual glue during dispensing the semiconductor chip is discharged. Description of the Drawings
[0015] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;
[0016] Figure 2 is a cross-sectional view of the fixture base of the present utility model;
[0017] Figure 3 is the present utility model Figure 2 partial enlarged view of part A;
[0018] Figure 4 is a schematic diagram of the adjustment component and the clamping component of the present utility model;
[0019] Reference numerals: 1. Fixture base; 101. Base body; 102. Positioning groove; 103. Countersunk hole; 2. Liquid discharge groove; 3. Elastic support component; 301. Concave hole; 302. First spring; 303. Rubber column; 4. Adjustment component; 401. Side plate; 402. U-shaped frame; 403. Threaded convex shaft; 404. Knob; 405. Rotating shaft; 406. Rectangular shaft; 5. Clamping component; 501. L-shaped pressing rod; 502. Slider; 503. Second spring. Detailed Embodiment
[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. The components of the embodiments of the present utility model described and illustrated herein can generally be arranged and designed in a variety of different configurations.
[0021] Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.
[0022] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.
[0023] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "inside", "outside", "above", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model.
[0024] Such as Figures 1 to 4As shown in the figure, a dispensing fixture for semiconductor packaging includes a fixture base 1. On the top surface of the fixture base 1, multiple drainage grooves 2 are provided for discharging the dripping residual glue. On the surface of the fixture base 1, an elastic support assembly 3 is provided. On the top surface of the fixture base 1, an adjustment assembly 4 is provided. On the surface of the adjustment assembly 4, a clamping assembly 5 for pressing the semiconductor chip is slidably arranged, and the adjustment assembly 4 is used to adjust the position of the clamping assembly 5. More specifically, it is fixed on the operating table of the dispensing machine through the fixture base 1. When dispensing the semiconductor chip, the semiconductor chip is placed inside the fixture base 1, and the semiconductor chip is located at the top of the elastic support assembly 3. The position of the clamping assembly 5 is adjusted through the adjustment assembly 4, so that the pressing end of the clamping assembly 5 is located above the semiconductor chip. The semiconductor chip is vertically pressed through the clamping assembly 5. The pressure received by the semiconductor chip is buffered and absorbed through the elastic support assembly 3. The residual glue during dispensing the semiconductor chip is discharged through the drainage grooves 2.
[0025] The fixture base 1 includes a base body 101. On the top surface of the base body 101, a positioning groove 102 is provided. On the top surface of the base body 101, a countersunk hole 103 is provided. On the surface of the base body 101 and corresponding to the positioning groove 102, multiple drainage grooves 2 are provided. More specifically, the semiconductor chip is placed through the positioning groove 102 on the top surface of the base body 101, and it is convenient to fix it on the operating table of the dispensing machine through the countersunk hole 103 on the top surface of the base body 101.
[0026] The elastic support assembly 3 includes a concave hole 301. The concave hole 301 is provided on the bottom surface of the positioning groove 102. A first spring 302 is fixedly installed on the bottom surface of the concave hole 301. The top end of the first spring 302 is fixedly installed with a rubber column 303, and the rubber column 303 is movably inserted into the concave hole 301. More specifically, when the clamping assembly 5 vertically presses the semiconductor chip, the semiconductor chip presses the rubber column 303 under the action of the vertical pressure, and the first spring 302 is compressed. The excessive pressure received by the semiconductor chip is absorbed through the first spring 302 and the rubber column 303, preventing the semiconductor chip from being damaged.
[0027] The adjusting component 4 includes a side plate 401 and a U-shaped frame 402. The top surface of the fixture base 1 is fixedly installed with the side plate 401. The surface of the U-shaped frame 402 is fixedly installed with a threaded convex shaft 403, and a knob 404 is threadedly sleeved on the surface of the threaded convex shaft 403. The inner walls of both sides of the side plate 401 are fixedly installed with a rotating shaft 405 and a rectangular shaft 406. More specifically, by rotating the knob 404, the knob 404 is separated from the side wall of the side plate 401, thereby releasing the fixation of the rotating shaft 405. By pulling the rotating shaft 405, the position of the clamping component 5 is adjusted, so that it can be adapted to semiconductor chips of different sizes for pressing and clamping operations.
[0028] The clamping component 5 includes an L-shaped pressing rod 501. The L-shaped pressing rod 501 is rotatably sleeved on the surface of the rotating shaft 405. A slider 502 is slidably sleeved on the surface of the rectangular shaft 406. The top surface and the bottom surface of the slider 502 are fixedly installed with a second spring 503. More specifically, by the slider 502 sliding on the surface of the rotating shaft 405 and the slider 502 sliding on the surface of the rectangular shaft 406, the positions of the L-shaped pressing rod 501, the slider 502 and the second spring 503 can be adjusted. By pressing the L-shaped pressing rod 501, the L-shaped pressing rod 501 is flipped to compress the second spring 503, thereby releasing the vertical pressing on the semiconductor chip. Under the elastic action of the second spring 503, the end of the L-shaped pressing rod 501 is used to fix the semiconductor chip.
[0029] The side wall of the U-shaped frame 402 is arranged in contact with the side wall of the side plate 401, and the threaded convex shaft 403 is slidably arranged inside the side plate 401. More specifically, by the side plate 401 and the U-shaped frame 402 being in contact and the threaded convex shaft 403 being inside the side plate 401, the movement of the U-shaped frame 402 is limited and guided.
[0030] In summary: Fixed on the operating table of the dispensing machine through the fixture base 1. When dispensing the semiconductor chip, by placing the semiconductor chip inside the fixture base 1 and making the semiconductor chip located at the top of the elastic support component 3, the position of the clamping component 5 is adjusted through the adjusting component 4, so that the pressing end of the clamping component 5 is located above the semiconductor chip. Through the clamping component 5, the semiconductor chip is vertically pressed. Through the elastic support component 3, the pressure received by the semiconductor chip is buffered and absorbed. Through the drain groove 2, the residual glue during dispensing the semiconductor chip is discharged.
[0031] The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present utility model. Without departing from the spirit and scope of the present utility model, various changes and improvements will occur to the present utility model, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.
Claims
1. A semiconductor packaging dispensing fixture, characterized in that: The jig base (1) comprises a jig base (1), the top surface of which is provided with a plurality of drainage grooves (2) for discharging dripping residual adhesive, the surface of the jig base (1) is provided with an elastic support component (3), the top surface of the jig base (1) is provided with an adjustment component (4), the surface of the adjustment component (4) is slidably provided with a clamping component (5) for pressing a semiconductor chip, and the adjustment component (4) is used to adjust the position of the clamping component (5).
2. A semiconductor packaging dispensing jig according to claim 1, characterized in that: The fixture base (1) comprises a base body (101), a positioning groove (102) is provided on the top surface of the base body (101), a countersunk hole (103) is provided on the top surface of the base body (101), and a plurality of drainage grooves (2) are provided on the surface of the base body (101) corresponding to the positioning groove (102).
3. A semiconductor packaging dispensing jig according to claim 2, characterized in that: The elastic support assembly (3) comprises a concave hole (301), the bottom surface of the positioning groove (102) is provided with the concave hole (301), a first spring (302) is fixedly mounted on the bottom surface of the concave hole (301), a rubber column (303) is fixedly mounted on the top end of the first spring (302), and the rubber column (303) and the inside of the concave hole (301) are movably plug-connected.
4. The semiconductor packaging dispensing jig according to claim 1, characterized in that: The adjustment assembly (4) comprises a side plate (401) and a U-shaped frame (402); the side plate (401) is fixedly mounted on the top surface of the fixture base (1); a threaded convex shaft (403) is fixedly mounted on the surface of the U-shaped frame (402); a knob (404) is threadedly sleeved on the surface of the threaded convex shaft (403); and a rotating shaft (405) and a rectangular shaft (406) are fixedly mounted on the inner walls of both sides of the side plate (401).
5. A semiconductor packaging dispensing jig according to claim 4, characterized in that: The clamping assembly (5) comprises an L-shaped pressure rod (501), the surface of the rotating shaft (405) is rotatably sleeved with the L-shaped pressure rod (501), the surface of the rectangular shaft (406) is slidably sleeved with a slider (502), and the top surface of the slider (502) and the bottom surface of the slider (502) are fixedly mounted with a second spring (503).
6. A semiconductor packaging dispensing jig according to claim 4, characterized in that: The side wall of the U-shaped frame (402) and the side wall of the side plate (401) are arranged in close contact, and the threaded protruding shaft (403) is arranged in a sliding manner inside the side plate (401).