Single wafer cleaning machine

Abstract

The utility model discloses a single wafer cleaning machine, and relates to the technical field of wafer processing. The cleaning machine comprises a cleaning machine main body, a plurality of scrubbing stations are arranged in the cleaning machine main body, a rack is arranged in the scrubbing stations, a bearing frame is rotatably arranged on the rack, a fixing part which acts on a wafer and fixes or unfixes the wafer is arranged on the bearing frame, a collecting box used for receiving liquid medicine is arranged on the rack, and the cleaning machine main body is provided with a plurality of cleaning devices. A spraying rod and a scrubbing rod are hinged in the scrubbing station, a spraying pipe is arranged on the spraying rod, the free end of the spraying pipe is communicated with liquid supply equipment through a hose, a shaft rod is rotationally arranged on the scrubbing rod, and a brush roller in rolling lap joint with a wafer is arranged on the shaft rod. When the wafer cleaning device is used for cleaning the wafer, liquid medicine is sprayed to the wafer through the spraying pipe, the upper surface of the wafer is uniformly brushed through the rotating brush roller, impurities are brushed out of the upper surface of the wafer during brushing, metal ion residues are finally reduced, and the cleaning effect is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a single-wafer cleaning machine. Background Art

[0002] A wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. During processing, the wafer needs to be cleaned to remove surface metal ions. The cleaning is mostly performed by a single-chip cleaning machine. Existing single-chip cleaning machines, when in use, often only rely on spraying liquid medicine on the surface of the wafer to remove metal ions through liquid medicine reaction. However, the liquid medicine spraying is often uneven, resulting in poor cleaning effect and more metal ion residues. Therefore, a single-chip wafer cleaning machine is proposed. Summary of the invention

[0003] The purpose of this application is to solve the problem that the existing single-wafer cleaning machine, when in use, often only relies on spraying liquid medicine on the surface of the wafer to remove metal ions through liquid medicine reaction, but the liquid medicine spraying is often uneven, resulting in poor cleaning effect and more metal ion residues. Therefore, a technical problem of a single-wafer cleaning machine is proposed. This application provides a single-wafer cleaning machine.

[0004] In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions:

[0005] A single-wafer cleaning machine comprises a cleaning machine main body, wherein a plurality of scrubbing stations are arranged in the cleaning machine main body, a frame is arranged in the scrubbing station, a carrier is rotatably arranged on the frame, a fixing part for acting on the wafer and fixing or releasing the wafer is arranged on the carrier, a collecting box for receiving liquid is arranged on the frame, a spray rod and a scrubbing rod are hinged in the scrubbing station, a spray pipe is arranged on the spray rod, the free end of the spray pipe is connected to a liquid supply device through a hose, an axle rod is rotatably arranged on the scrubbing rod, and a brush roller for rolling and overlapping with the wafer is arranged on the axle rod.

[0006] Furthermore, a driving motor is arranged on the frame, and an output shaft of the driving motor is connected to the supporting frame via a gear pair.

[0007] Furthermore, the fixing member includes an annular tube and a vacuum pump both arranged on the carrier frame, the annular tube is connected with a plurality of fixing tubes and connecting tubes, the wafer is overlapped with the fixing tube, and the free end of the connecting tube is connected with the vacuum pump.

[0008] Furthermore, the collecting box is slidably arranged on the frame, and a cylinder push rod with a movable end connected to the collecting box is arranged in the scrubbing station.

[0009] Further, a blower is provided in the brushing station. Through holes are formed in the carrier frame. One end of each through hole communicates with a nozzle, and the other end communicates with the output end of the blower through a rotary joint.

[0010] Further, baffles are provided on the opposite sides of the brushing rod.

[0011] Further, grooves are formed in the brush roller. Protrusions that are inserted and matched with the grooves are provided on the shaft rod. A locking nut that abuts and overlaps with the brush roller is provided on the shaft rod in a threaded manner.

[0012] Further, a limiting plate that is spaced apart from the brushing rod is provided on the shaft rod. The brush roller abuts and overlaps with the limiting plate.

[0013] The beneficial effects of the present application are as follows:

[0014] When the present application cleans a wafer, the liquid medicine is sprayed onto the wafer through a spray pipe, and the upper surface of the wafer is evenly brushed by a rotating brush roller. During the brushing, impurities are brushed out from the upper surface of the wafer, ultimately reducing the residual metal ions and improving the cleaning effect. Therefore, it is more practical. Description of the Drawings

[0015] Figure 1 is a three-dimensional view of the structure of the present application;

[0016] Figure 2 is a three-dimensional view of a part of the structure of the present application;

[0017] Figure 3 is a three-dimensional view of a part of the structure of the present application;

[0018] Figure 4 is the present application Figure 3 of the three-dimensional cross-sectional view;

[0019] Figure 5 is the present application Figure 4 of the enlarged view at A;

[0020] Figure 6 is the present application Figure 4 of the enlarged view at B;

[0021] Figure 7 is a three-dimensional view of a part of the structure of the present application;

[0022] Figure 8 is a three-dimensional view of a part of the structure of the present application;

[0023] Figure 9 is the present application Figure 8 of the three-dimensional cross-sectional view;

[0024] Figure 10 is the present application Figure 9 of the enlarged view at C.

[0025] Reference numerals: 1, main body of the cleaning machine; 2, brushing station; 3, frame; 4, carrier; 5, collection box; 6, spray bar; 7, brushing rod; 8, spray pipe; 9, shaft rod; 10, brush roller; 11, drive motor; 12, gear pair; 13, annular pipe; 14, vacuum pump; 15, fixed pipe; 16, connecting pipe; 17, cylinder push rod; 18, fan; 19, through hole; 20, nozzle; 21, baffle; 22, groove; 23, rib; 24, lock nut; 25, limit plate. Detailed implementation manners

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0027] As Figures 1 - 10 shown, a single-wafer cleaning machine proposed in an embodiment of the present application includes a main body 1 of the cleaning machine. A plurality of brushing stations 2 are provided inside the main body 1 of the cleaning machine. A frame 3 is provided inside the brushing station 2. The frame 3 is fixedly provided inside the brushing station 2. A carrier 4 is rotatably provided on the frame 3. A fixing member for acting on the wafer and fixing or releasing the fixing thereof is provided on the carrier 4. A collection box 5 for receiving the liquid medicine is provided on the frame 3. The collection box 5 is annular in structure. A spray bar 6 and a brushing rod 7 are hinged inside the brushing station 2. A spray pipe 8 is provided on the spray bar 6. The spray pipe 8 is fixedly provided on the spray bar 6. The free end of the spray pipe 8 is communicated with a liquid supply device through a hose. The liquid supply device is not shown in the accompanying drawings of the specification. A shaft rod 9 is rotatably provided on the brushing rod 7. A brush roller 10 that rolls and abuts against the wafer is provided on the shaft rod 9. The brush roller 10 rolls and abuts against the upper surface of the wafer;

[0028] In the initial state, the spray bar 6 is away from the carrier 4, and the brushing rod 7 tends to be in the vertical direction. During use, the wafer is horizontally placed on the fixing member, and the wafer is fixed by the fixing member. The spray bar 6 is driven to rotate and located above the wafer. The brushing rod 7 is driven to rotate to the horizontal direction. The brush roller 10 rolls and abuts against the upper surface of the wafer. The carrier 4 is driven to rotate, driving the wafer to rotate together. The liquid medicine is supplied into the spray pipe 8 through the liquid supply device. The liquid medicine is sprayed onto the wafer through the spray pipe 8. Metal ions are removed through the reaction of the liquid medicine. At the same time, the shaft rod 9 is driven to rotate, driving the brush roller 10 to rotate together. The upper surface of the wafer is evenly brushed by the brush roller 10. During brushing, impurities are brushed out from the upper surface of the wafer. Through the combined action of liquid medicine spraying and brushing, the residual metal ions are finally reduced. The waste liquid generated by cleaning is collected by the collection box 5 for subsequent treatment. When the cleaning is completed, the spray bar 6 is driven to rotate to the initial position, the brushing rod 7 is driven to rotate to the initial position, the wafer is released from the fixing by the fixing member, and the wafer can be taken away from the fixing member;

[0029] To sum up, when cleaning the wafer, the present application sprays the chemical solution onto the wafer through the spray pipe 8, and the upper surface of the wafer is evenly brushed by the rotating brush roller 10, and impurities are brushed out from the upper surface of the wafer during the brushing, thereby ultimately reducing the residual metal ions and improving the cleaning effect, and is therefore more practical.

[0030] like Figure 5 As shown, in some embodiments, a driving motor 11 is provided on the frame 3, the driving motor 11 is fixed on the frame 3 and the output shaft is in a vertical direction, the output shaft of the driving motor 11 is connected to the carrier frame 4 through a gear pair 12, the gear pair 12 includes two meshing gears both in a horizontal direction, and the two gears are respectively fixed on the output shaft of the driving motor 11 and the carrier frame 4;

[0031] With reference to the above, when in use, the driving motor 11 works, the output shaft rotates, and the supporting frame 4 is driven to rotate together through the gear pair 12 .

[0032] like Figure 6 As shown, in some embodiments, the fixing member includes an annular tube 13 and a vacuum pump 14, both of which are arranged on the carrier 4. The annular tube 13 and the vacuum pump 14 are both fixed on the carrier 4. The annular tube 13 is in a horizontal direction. A plurality of fixing tubes 15 and connecting tubes 16 are connected to the annular tube 13. The plurality of fixing tubes 15 are in a vertical direction and distributed in an annular array. The free end of the fixing tube 15 is in an outwardly expanding cone shape, which can increase the contact area with the wafer, thereby improving the fixing effect. The wafer is in contact with the fixing tube 15 and overlaps. The free end of the connecting tube 16 is connected to the vacuum pump 14.

[0033] Referring to the above, when in use, the wafer is placed horizontally on multiple fixed tubes 15, and the vacuum pump 14 is operated to extract the air inside the multiple fixed tubes 15, the annular tube 13 and the connecting tube 16, so that a negative pressure state is formed inside the multiple fixed tubes 15, the annular tube 13 and the connecting tube 16, thereby adsorbing and fixing the wafer. Conversely, the vacuum pump 14 is operated to send air into the connecting tube 16, the annular tube 13 and the multiple fixed tubes 15, and the negative pressure state inside the connecting tube 16, the annular tube 13 and the multiple fixed tubes 15 is released, thereby releasing the wafer from adsorption and fixation.

[0034] like Figure 4 As shown, in some embodiments, the collection box 5 is slidably arranged on the frame 3, the collection box 5 slides in the vertical direction, and a cylinder push rod 17 whose movable end is connected to the collection box 5 is arranged in the scrubbing station 2, and the cylinder push rod 17 is in the vertical direction and fixed in the scrubbing station 2;

[0035] Referring to the above, in the initial state, the movable end of the cylinder push rod 17 retracts, and the collection box 5 is located at the initial position. When cleaning the wafer, the movable end of the cylinder push rod 17 extends, driving the collection box 5 to slide upward to the limit position. The collection box 5 shields the wafer, and the waste liquid will scatter due to the centrifugal force. The collection box 5 blocks and collects the scattered waste liquid. On the contrary, when the cleaning is completed, the movable end of the cylinder push rod 17 retracts, driving the collection box 5 to slide downward to the initial position. The collection box 5 does not shield the wafer, thus facilitating the removal of the wafer.

[0036] As Figures 5 - 6 shown, in some embodiments, a blower 18 is provided in the brushing station 2. The blower 18 is fixedly arranged in the brushing station 2. A through hole 19 is formed in the carrier 4. The through hole 19 is in the vertical direction and coaxially distributed with the carrier 4. One end of the through hole 19 communicates with a nozzle 20, and the other end communicates with the output end of the blower 18 through a rotary joint. The nozzle 20 is fixedly arranged at the top of the through hole 19 and is configured in a conical shape that expands outward. The bottom end of the through hole 19 communicates with the output end of the blower 18 through a rotary joint;

[0037] Referring to the above, during cleaning, some waste liquid may flow along the side wall of the wafer to the lower surface of the wafer, thus contaminating the lower surface of the wafer. Make the blower 18 work, send air into the rotary joint, the through hole 19 and the nozzle 20 in sequence, and finally the air is blown out from the nozzle 20 to the lower surface of the wafer, thereby forming an outwardly diffused air curtain on the lower surface of the wafer, preventing the waste liquid from flowing to the lower surface of the wafer, and further preventing the waste liquid from contaminating the lower surface of the wafer.

[0038] As Figure 8 shown, in some embodiments, baffles 21 are provided on the opposite sides of the brushing rod 7. The baffles 21 are fixedly arranged on the brushing rod 7. The two baffles 21 are symmetrically distributed with the brush roller 10 as the center;

[0039] Referring to the above, when the brush roller 10 rotates, the liquid medicine may splash. The two baffles 21 together block the splashing liquid medicine, avoiding the pollution caused by the splashing of the liquid medicine.

[0040] As Figures 8 - 10 shown, in some embodiments, grooves 22 are formed in the brush roller 10. The grooves 22 are formed along the length direction of the brush roller 10. A convex strip 23 inserted and matched with the grooves 22 is arranged on the shaft rod 9. The convex strip 23 is fixedly arranged on the outer surface of the shaft rod 9 along the length direction of the shaft rod 9. A locking nut 24 that abuts and overlaps with the brush roller 10 is threadedly arranged on the shaft rod 9. A threaded section is formed on the shaft rod 9. The locking nut 24 is in threaded fit with the threaded section;

[0041] Referring to the above, during use, the brush roller 10 is in an installed state, that is, the brush roller 10 is completely located on the shaft rod 9, the convex strips 23 are completely located within the grooves 22, and the locking nut 24 is tightened and abuts against the brush roller 10. When the shaft rod 9 rotates, through the cooperation of the convex strips 23 and the grooves 22, the brush roller 10 is driven to rotate together. As the usage time increases, the brush roller 10 will wear out, so it is necessary to regularly replace the brush roller 10. The operation is as follows: loosen the locking nut 24 until it is away from the shaft rod 9, move the brush roller 10 until it is disengaged from the shaft rod 9, and the convex strips 23 exit the grooves 22 to achieve the disassembly of the brush roller 10. Then install a new brush roller 10, move the brush roller 10 until it is completely located on the shaft rod 9, and the convex strips 23 are correspondingly and completely inserted into the grooves 22. Finally, tighten the locking nut 24 onto the shaft rod 9 and make it abut against the brush roller 10.

[0042] As Figure 10 shown, in some embodiments, a limiting plate 25 spaced apart from the scrubbing rod 7 is provided on the shaft rod 9. The limiting plate 25 is fixedly provided on the shaft rod 9, and the brush roller 10 abuts against the limiting plate 25. One end of the brush roller 10 abuts against the limiting plate 25.

[0043] Referring to the above, when the brush roller 10 is in an installed state, one end thereof abuts against the limiting plate 25. When the shaft rod 9 rotates, the limiting plate 25 is driven to rotate together. Through the limiting plate 25, friction between the brush roller 10 and the scrubbing rod 7 during rotation can be avoided, thereby reducing the wear of the brush roller 10.

[0044] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A single wafer cleaning machine, comprising a cleaning machine body (1), wherein a plurality of scrubbing stations (2) are arranged in the cleaning machine body (1), characterized in that: A frame (3) is arranged in the scrubbing station (2), a carrier frame (4) is rotatably arranged on the frame (3), a fixing member for acting on the wafer and fixing or releasing the wafer is arranged on the carrier frame (4), a collecting box (5) for receiving the liquid is arranged on the frame (3), a spray rod (6) and a scrubbing rod (7) are hingedly connected in the scrubbing station (2), a spray pipe (8) is arranged on the spray rod (6), the free end of the spray pipe (8) is connected to the liquid supply device through a hose, and a shaft rod (9) is rotatably arranged on the scrubbing rod (7), and a brush roller (10) for rolling and overlapping with the wafer is arranged on the shaft rod (9).

2. A single wafer cleaning machine according to claim 1, characterized in that: A driving motor (11) is arranged on the frame (3), and an output shaft of the driving motor (11) is transmission-connected to the supporting frame (4) via a gear pair (12).

3. A single wafer cleaning machine according to claim 1, characterized in that: The fixing member comprises an annular tube (13) and a vacuum pump (14) both arranged on the carrier frame (4); a plurality of fixing tubes (15) and connecting tubes (16) are connected to the annular tube (13); the wafer and the fixing tube (15) are in contact and overlapped connection; and the free end of the connecting tube (16) is connected to the vacuum pump (14).

4. The single wafer cleaning machine according to claim 1, characterized in that: The collecting box (5) is slidably arranged on the frame (3), and a cylinder push rod (17) whose movable end is connected to the collecting box (5) is arranged in the scrubbing station (2).

5. The single wafer cleaning machine according to claim 1, characterized in that: A fan (18) is arranged in the scrubbing station (2), a through hole (19) is provided on the support frame (4), one end of the through hole (19) is connected to a blowing nozzle (20), and the other end is connected to an output end of the fan (18) via a rotary joint.

6. The single wafer cleaning machine according to claim 1, characterized in that: Baffles (21) are provided on opposite sides of the scrubbing rod (7).

7. The single wafer cleaning machine according to claim 1, characterized in that: The brush roller (10) is provided with a groove (22), the shaft rod (9) is provided with a convex strip (23) that is plugged into and fits with the groove (22), and the shaft rod (9) is threadedly provided with a locking nut (24) that is in contact and overlapped with the brush roller (10).

8. The single wafer cleaning machine according to claim 7, characterized in that: The shaft rod (9) is provided with a limiting plate (25) spaced apart from the brush rod (7), and the brush roller (10) is in contact with and overlaps the limiting plate (25).

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