Semiconductor IC lead angle bending mechanism

Abstract

The utility model provides a semiconductor I C lead angle bending mechanism, which belongs to the field of semiconductors, and comprises a bottom plate, a press-down fixed mounting rack, a track mounting plate, a gearbox mounting plate, a motor and an arc-shaped bending pressure plate, the upper surface of the bottom plate is fixedly connected with a mounting table, the press-down fixed mounting rack is fixedly connected to the left side of the upper surface of the mounting table, and the motor is fixedly connected with the arc-shaped bending pressure plate. The gearbox mounting plate is fixedly connected to the right side of the upper surface of the mounting table, the rail mounting plates are symmetrically and fixedly connected to the upper surface of the bottom plate, first rails are fixedly connected to the upper surfaces of the two rail mounting plates, and fixing plates are fixedly connected to the side faces, close to the gearbox mounting plate, of the two rail mounting plates. According to the utility model, a brand new structure is designed, and an ingenious linkage mechanism is adopted, so that the current situations that the bending position and the bending angle cannot be flexibly adjusted in a semi-vivid manner in the prior art are changed. The production efficiency is linearly improved, and the quality is directly improved. The mechanism can be applied to various similar products.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductors, and particularly relates to a semiconductor IC lead bending mechanism. Background Art

[0002] Semiconductor IC lead bending mechanisms are widely used in the semiconductor packaging industry, especially in packaging forms that require lead bending, such as DIP (Dual In-line Package), SOP (Small Outline Package), etc. In addition, with the continuous development of semiconductor technology, new packaging forms are emerging continuously, posing higher requirements and challenges to the bending mechanism.

[0003] At present, most in the industry still adopt semi-automatic ones, which have poor stability, high labor costs, a high abnormal rate of appearance quality, and high labor costs. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problems raised in the above background art, and to propose a semiconductor scribe and form die that can be applied to improve the lead bending accuracy, precisely control its springback, and can specify the position of the bending angle.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A semiconductor IC lead bending mechanism, including a bottom plate, a downward pressure fixed mounting frame, a track mounting plate, a gearbox mounting plate, a motor, and an arc-shaped bending pressing plate. The upper surface of the bottom plate is fixedly connected with a mounting table. The downward pressure fixed mounting frame is fixedly connected to the left side of the upper surface of the mounting table. The gearbox mounting plate is fixedly connected to the right side of the upper surface of the mounting table. The track mounting plates are symmetrically and fixedly connected to the upper surface of the bottom plate. The upper surfaces of the two track mounting plates are fixedly connected with a first track. On one side of the two track mounting plates close to the gearbox mounting plate, fixing plates are fixedly connected respectively. The upper surfaces of the two fixing plates are fixedly connected with a second track. The upper surface of the downward pressure fixed mounting frame is fixedly connected with a downward pressure cylinder. The output end of the downward pressure cylinder is fixedly connected with a downward pressure block;

[0007] The upper surface of the gearbox mounting plate is fixedly connected with a gearbox. The rear side of the gearbox is fixedly connected with a motor mounting plate. The side of the motor mounting plate is fixedly connected with a steering gear. The input end of the steering gear is fixedly connected to the output end of the motor. The output end of the steering gear is fixedly connected with a coupling. The other end of the coupling is fixedly connected with a transmission shaft inside. A driving double gear is fixedly connected to the transmission shaft.

[0008] Preferably, the first track and the second track are located between the downward pressure fixed mounting frame and the gearbox mounting plate. A placement groove is formed between the first track and the second track. The downward pressure block is located directly above the placement groove.

[0009] Preferably, the transmission shaft penetrates through and is rotatably connected to the front and rear sides of the gearbox. Symmetrically, first driven gears penetrate through and are rotatably connected to the upper parts of the front and rear sides inside the gearbox, and second driven gears penetrate through and are rotatably connected to the lower parts of the front and rear sides inside the gearbox. The two first driven gears and the two second driven gears are all meshed with the active double gear.

[0010] Preferably, arc-shaped grooves are provided on the front and rear sides inside the gearbox. Arc-shaped racks are symmetrically and fixedly connected to the front and rear of the arc-shaped surface of the arc-shaped bending pressing plate. Circular sliders are fixedly connected to the sides of the two arc-shaped racks, and the circular sliders are slidably connected to the arc-shaped grooves opened on the front and rear sides inside the gearbox.

[0011] Preferably, the two arc-shaped racks are meshed with the two second driven gears.

[0012] Preferably, the pressing plate on the arc-shaped bending pressing plate is located above the placing groove, and the arc-shaped bending pressing plate is located inside the gearbox.

[0013] Compared with the prior art, the present utility model has the following advantages:

[0014] By designing a brand-new structure and through a clever linkage mechanism, the present utility model changes the original semi-automatic situation and the situation where the bending position cannot be flexibly adjusted and the bending angle cannot be flexibly adjusted. The production efficiency increases linearly and the quality is directly improved. This mechanism can be applied to various similar products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view structural schematic diagram of the semiconductor IC lead bending mechanism proposed by the present utility model;

[0016] Figure 2 It is a front view structural schematic diagram of the semiconductor IC lead bending mechanism proposed by the present utility model;

[0017] Figure 3 It is an internal mechanism schematic diagram of the semiconductor IC lead bending mechanism proposed by the present utility model;

[0018] Figure 4 It is a bending device structural schematic diagram of the semiconductor IC lead bending mechanism proposed by the present utility model.

[0019] In the figure: 1 bottom plate, 2 mounting table, 3 track mounting plate, 4 fixing plate, 5 downward pressing and fixing mounting frame, 6 downward pressing cylinder, 7 downward pressing block, 8 first track, 9 second track, 10 gearbox mounting plate, 11 gearbox, 12 motor mounting plate, 13 motor, 14 steering gear, 15 coupling, 16 transmission shaft, 17 active double gear, 18 first driven gear, 19 second driven gear, 20 arc rack, 21 circular slider, 22 arc groove, 23 arc bending pressing plate, 24 placement groove. Detailed implementation mode

[0020] The technical solutions in the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] Refer to Figures 1-4 , a semiconductor IC lead bending mechanism, including a bottom plate 1, a downward pressing and fixing mounting frame 5, a track mounting plate 3, a gearbox mounting plate 10, a motor 13 and an arc bending pressing plate 23. The upper surface of the bottom plate 1 is fixedly connected with a mounting table 2. The downward pressing and fixing mounting frame 5 is fixedly connected to the upper surface of the mounting table 2 on the left side. The gearbox mounting plate 10 is fixedly connected to the upper surface of the mounting table 2 on the right side. The track mounting plates 3 are symmetrically and fixedly connected to the upper surface of the bottom plate 1. The upper surfaces of the two track mounting plates 3 are fixedly connected with a first track 8. One side surface of the two track mounting plates 3 close to the gearbox mounting plate 10 is fixedly connected with a fixing plate 4. The upper surfaces of the two fixing plates 4 are fixedly connected with a second track 9. The first track 8 and the second track 9 are located between the downward pressing and fixing mounting frame 5 and the gearbox mounting plate 10. A placement groove 24 is formed between the first track 8 and the second track 9. The downward pressing block 7 is located directly above the placement groove 24. The pressing plate on the arc bending pressing plate 23 is located above the placement groove 24. The upper surface of the downward pressing and fixing mounting frame 5 is fixedly connected with a downward pressing cylinder 6. The output end of the downward pressing cylinder 6 is fixedly connected with a downward pressing block 7. The placement groove 24 is used to place the semiconductor material to be bent. When the semiconductor material is placed in the placement groove 24, the downward pressing cylinder 6 is started to drive the downward pressing block 7 to press down, realizing the pressing effect on the semiconductor material.

[0022] The upper surface of the gearbox mounting plate 10 is fixedly connected with a gearbox 11. The rear side surface of the gearbox 11 is fixedly connected with a motor mounting plate 12. The side surface of the motor mounting plate 12 is fixedly connected with a steering gear 14. The input end of the steering gear 14 is fixedly connected to the output end of a motor 13. The output end of the steering gear 14 is fixedly connected with a coupling 15. The other end of the coupling 15 is fixedly connected with a transmission shaft 16 inside. A driving double gear 17 is fixedly connected to the transmission shaft 16. The transmission shaft 16 runs through and is rotatably connected to the front and rear side surfaces of the gearbox 11. The upper parts of the front and rear side surfaces inside the gearbox 11 are symmetrically and rotatably connected through the middle with first driven gears 18. The lower parts of the front and rear side surfaces inside the gearbox 11 are symmetrically and rotatably connected through the middle with second driven gears 19. The two first driven gears 18 and the two second driven gears 19 are all meshed with the driving double gear 17. Arc-shaped grooves 22 are provided on the front and rear side surfaces inside the gearbox 11. Arc-shaped racks 20 are symmetrically fixedly connected to the front and rear of the arc-shaped surface of an arc-shaped bending pressing plate 23. Circular sliders 21 are fixedly connected to the side surfaces of the two arc-shaped racks 20. The circular sliders 21 are slidably connected to the arc-shaped grooves 22 opened on the front and rear side surfaces inside the gearbox 11. The two arc-shaped racks 20 are meshed with the two second driven gears 19.

[0023] When the motor 13 starts, the steering gear 14 will change the rotation direction of the motor 13. At this time, the steering gear 14 will drive the coupling 15 to rotate. The coupling 15 will drive the driving double gear 17 on the transmission shaft 16 to rotate inside the gearbox 11. Since the two first driven gears 18 and the two second driven gears 19 are all meshed with the driving double gear 17, the driving double gear 17 will drive the two first driven gears 18 and the two second driven gears 19 to rotate. Also, since the two arc-shaped racks 20 are meshed with the two second driven gears 19, the second driven gears 19 will drive the two arc-shaped racks 20 to rotate. The two arc-shaped racks 20 drive the circular sliders 21 to slide in the arc-shaped grooves 22 opened on the front and rear side surfaces inside the gearbox 11, so that the arc-shaped bending pressing plate 23 rotates, thus realizing the bending effect.

[0024] The functional principle of the present utility model can be elaborated through the following operation mode:

[0025] When the semiconductor material is placed in the placement groove 24, the downward pressing cylinder 6 is activated to drive the downward pressing block 7 to press down, thereby pressing the semiconductor material. At this time, the motor 13 is started, and the steering gear 14 will change the rotation direction of the motor 13. At this time, the steering gear 14 will drive the coupling 15 to rotate, and the coupling 15 will drive the driving double gear 17 on the transmission shaft 16 to rotate in the gearbox 11. Since the two first driven gears 18 and the two second driven gears 19 are both engaged with the driving double gear 17, the driving double gear 17 will drive the two first driven gears 18 and the two second driven gears 19 to rotate. Also, since the two arc-shaped racks 20 are engaged with the two second driven gears 19, the second driven gears 19 will drive the two arc-shaped racks 20 to rotate, and the two arc-shaped racks 20 drive the circular slider 21 to slide in the arc-shaped grooves 22 formed on the front and rear sides of the inner surface of the gearbox 11, thereby causing the arc-shaped bending pressing plate 23 to rotate, thus achieving the bending effect. By designing a brand-new structure and through a clever linkage mechanism, the original semi-automatic situation and the inability to flexibly adjust the bending position and the bending angle are changed. The production efficiency increases linearly and the quality is directly improved. This mechanism can be applied to various similar products.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A semiconductor IC lead angle bending mechanism, comprising a base plate (1), a downward pressing fixed mounting frame (5), a track mounting plate (3), a gear box mounting plate (10), a motor (13) and an arc-shaped bending pressing plate (23), characterized in that: The upper surface of the base plate (1) is fixedly connected to a mounting platform (2); the downward pressure fixed mounting frame (5) is fixedly connected to the left side of the upper surface of the mounting platform (2); the gear box mounting plate (10) is fixedly connected to the right side of the upper surface of the mounting platform (2); the track mounting plate (3) is symmetrically fixedly connected to the upper surface of the base plate (1); the upper surfaces of the two track mounting plates (3) are fixedly connected to a first track (8); the side surfaces of the two track mounting plates (3) close to the gear box mounting plate (10) are fixedly connected to a fixing plate (4); the upper surfaces of the two fixing plates (4) are fixedly connected to a second track (9); the upper surface of the downward pressure fixed mounting frame (5) is fixedly connected to a downward pressure cylinder (6); the output end of the downward pressure cylinder (6) is fixedly connected to a downward pressure block (7); The upper surface of the gear box mounting plate (10) is fixedly connected to a gear box (11); the rear side surface of the gear box (11) is fixedly connected to a motor mounting plate (12); the side surface of the motor mounting plate (12) is fixedly connected to a steering gear (14); the input end of the steering gear (14) is fixedly connected to the output end of the motor (13); the output end of the steering gear (14) is fixedly connected to a coupling (15); the other end of the coupling (15) is fixedly connected to a transmission shaft (16); and the transmission shaft (16) is fixedly connected to an active double gear (17).

2. The semiconductor IC lead bending mechanism according to claim 1, characterized in that: The first track (8) and the second track (9) are located between the downward pressing fixed mounting frame (5) and the gear box mounting plate (10), a placement groove (24) is formed between the first track (8) and the second track (9), and the downward pressing block (7) is located directly above the placement groove (24).

3. The semiconductor IC lead bending mechanism according to claim 1, characterized in that: The transmission shaft (16) is rotatably connected to the front and rear side surfaces of the gear box (11); a first driven gear (18) is symmetrically rotatably connected to the upper part of the front and rear side surfaces of the gear box (11); a second driven gear (19) is symmetrically rotatably connected to the lower part of the front and rear side surfaces of the gear box (11); the two first driven gears (18) and the two second driven gears (19) are meshed with the active double gear (17).

4. The semiconductor IC lead bending mechanism according to claim 1, characterized in that: The front and rear side surfaces of the gear box (11) are both provided with arc grooves (22); the arc surface of the arc-shaped bending pressure plate (23) is symmetrically fixedly connected to the front and rear arc racks (20); the side surfaces of the two arc racks (20) are both fixedly connected to circular sliders (21); the circular sliders (21) are slidably connected to the arc grooves (22) provided on the front and rear side surfaces of the gear box (11).

5. The semiconductor IC lead bending mechanism according to claim 4, characterized in that: The two arc-shaped racks (20) are meshed with two second driven gears (19).

6. The semiconductor IC lead bending mechanism according to claim 1, characterized in that: The pressure plate on the arc-shaped bending pressure plate (23) is located above the placement groove (24), and the arc-shaped bending pressure plate (23) is located in the gear box (11).

Images