Anti-collision carrying mechanical arm

Abstract

The utility model relates to an anti-collision carrying mechanical arm, and belongs to the technical field of semiconductor detection and measurement. According to the utility model, the damping shaft is arranged to connect the first joint and the second joint so as to construct the wafer carrying mechanical arm structure which can be turned over upwards when being collided, and the extension spring, the pulley and the damping material are configured as buffer parts to reduce the oscillation of the wafer; in addition, damping optimization is carried out on the turnover shaft, and a limiting stop block is arranged to ensure that the turnover shaft is stably and safely turned over in a specified stroke; in addition, a wafer limiting groove with an improved edge is formed in the pincerlike structure for bearing and fixing the wafer, so that the wafer is prevented from falling off, and meanwhile, collision can be avoided when the wafer is taken and placed.

Description

Technical Field

[0001] The utility model relates to a collision - proof handling robotic arm, belonging to the technical field of semiconductor detection and measurement. Background Art

[0002] In the process of semiconductor detection and measurement manufacturing, handling arms are often used to accurately and quickly handle semiconductor detection and measurement equipment.

[0003] However, during the operation of existing handling arms, there are not only collision risks due to the space limitations caused by the dense equipment in the semiconductor manufacturing environment, but also the pallet mechanism is prone to collide with the handling arm due to the cumulative repetition error of the motor during the movement and positioning of the handling arm. Moreover, collisions frequently occur during high - speed dynamic operations. At the same time, equipment failures or human - caused operation errors may also interfere with the normal operation of the handling arm, resulting in damage or detachment of the wafers from the equipment.

[0004] Currently, although there are robotic arm structures with anti - collision plates in the prior art, such as CN105140161A and CN221186578U, due to the generally large collision force and the relatively light weight of the wafers themselves during actual operation, it is generally difficult to maintain stable movement when these robotic arms lift up in case of collision. In most cases, not only will the wafers be shaken and jolted, but there will even be a situation where the wafers fly out of the robotic arm, seriously affecting the production quality. In addition, most robotic arms often have problems such as difficulty in resetting or over - hasty or over - excessive resetting after avoidance, with a very low error tolerance. Summary of the Utility Model

[0005] To solve the above problems, the utility model provides a collision - proof handling robotic arm, which is installed on a semiconductor front - end measurement device. The handling robotic arm includes:

[0006] A first joint, with an installation groove below the first joint, and a tension spring and a first pulley are fixed in the installation groove;

[0007] A second joint, which has a clamp - shaped structure for fixing wafers, and a second pulley and a wire - winding ring are connected below the second joint; and

[0008] A damping shaft, connecting the first joint and the second joint;

[0009] Wherein, the tension spring is connected to the wire - winding ring through the first pulley and the second pulley in sequence by winding the wire.

[0010] Furthermore, one end of the tension spring is connected through an adjusting bolt and an adjusting nut. Through the cooperation of the bolt and the nut, turning the nut can adjust the initial position of the tension spring, facilitating the adjustment of the folding force.

[0011] Furthermore, the winding is wound around the first pulley at least once, and the winding is wound around the second pulley at least once, so as to ensure the tension of the winding.

[0012] Furthermore, one end of the mounting slot close to the second joint is connected to a limit stopper extending below the second joint to prevent the second joint from flipping over too far downward.

[0013] Furthermore, a wafer limiting groove is provided on the upper surface of the clamp structure, and a shock-absorbing material is laid on the bottom of the wafer limiting groove, so that the second joint can provide a buffer for the wafer when encountering a collision, thereby increasing friction and reducing shock.

[0014] In one embodiment of the present invention, the shock absorbing material is fluororubber.

[0015] Furthermore, the height of the groove wall of the wafer limiting groove at one end close to the first joint is at least 1 mm higher than the height of the upper surface of the shock-absorbing material, so as to prevent the wafer from falling off when the second joint is tilted.

[0016] Furthermore, a groove wall edge at one end of the wafer limiting groove away from the first joint is provided with a draft angle of 2° to prevent collision when taking and placing the wafer.

[0017] Furthermore, the damping shaft includes a rotating shaft connecting the first joint and the second joint, and damping parts arranged on both sides of the rotating shaft. The rotating shaft is connected to the second joint and hinged to the first joint through a key, and the torque is transmitted through the key. Such a setting can make the transport robot arm flip smoothly and reduce shock.

[0018] Furthermore, the damping member is fixed to both sides of the rotating shaft by means of a fixing block and an inner hexagonal bolt, and the compression deformation of the elastic damping member can be controlled by adjusting the degree of tightening of the inner hexagonal bolt, thereby playing a role in damping adjustment.

[0019] Beneficial effects of the utility model:

[0020] The utility model sets a damping shaft to connect the first joint and the second joint to construct a wafer handling robot arm structure which can be folded upward when encountering a collision. It not only configures a tension spring, a pulley, and a shock-absorbing material as a buffer component to reduce the vibration of the wafer, but also optimizes the damping of the flipping shaft and sets a limit block to ensure smooth and safe flipping within a specified stroke. In addition, a wafer limit groove with an improved edge is set on the clamp structure that supports and fixes the wafer, which prevents the wafer from falling off and can also avoid collision when taking and placing the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1A three-dimensional schematic diagram of the overall structure in one embodiment of the present utility model from a certain perspective;

[0022] Figure 2 A three-dimensional schematic diagram of the overall structure in another embodiment of the present utility model from a different perspective;

[0023] Figure 3 A side perspective view of the overall structure in one embodiment of the present utility model;

[0024] Figure 4 A structural cross-sectional view of the damping shaft in one embodiment of the present utility model;

[0025] Figure 5 A partial view of the second joint in one embodiment of the present utility model;

[0026] In the figure: 1, the first joint; 2, the second joint; 3, the damping shaft; 4, the limit stop; 11, the tension spring; 12, the first pulley; 13, the second pulley; 14, the wire winding ring; 15, the wire winding; 21, the wafer limit groove; 22, the damping material; 211, the draft angle; 31, the rotating shaft; 32, the damping member. Specific embodiments

[0027] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0028] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0029] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] Embodiment 1

[0031] The present utility model provides a collision-proof handling robotic arm installed on a semiconductor front-end measurement device. The handling robotic arm includes:

[0032] A first joint 1, having an installation groove below the first joint 1. A tension spring 11 and a first pulley 12 are fixed in the installation groove; a sliding-matching drawplate can be installed at the lower part of the installation groove to block the tension spring 11 and the first pulley 12 in the installation groove;

[0033] A second joint 2, having a clamping structure for fixing a wafer. A second pulley 13 and a wire winding ring 14 are connected below the second joint 2; and

[0034] A damping shaft 31 connecting the first joint 1 and the second joint 2;

[0035] Wherein, the tension spring 11 is connected to the wire winding ring 14 through a wire 15 passing through the first pulley 12 and the second pulley 13 in sequence.

[0036] Furthermore, one end of the tension spring 11 is connected through an adjusting bolt and an adjusting nut. Through the cooperation of the bolt and the nut, turning the nut can adjust the initial position of the tension spring 11, facilitating the adjustment of the folding force.

[0037] Furthermore, the wire 15 is wound around the first pulley 12 for at least one turn, and the wire 15 is wound around the second pulley 13 for at least one turn to ensure the tension of the wire 15.

[0038] Furthermore, a limiting stop block 4 extending to the lower part of the second joint 2 is connected to one end of the installation groove close to the second joint 2 to prevent the second joint 2 from flipping down too much.

[0039] Furthermore, a wafer limiting groove 21 is provided on the upper surface of the clamping structure, and a shock-absorbing material 22 is laid flat at the bottom of the wafer limiting groove 21, so that when the second joint 2 encounters a collision, it can provide buffering for the wafer, increasing friction and also reducing vibration. The shock-absorbing material 22 is fluororubber.

[0040] Furthermore, the height of the groove wall of the wafer limiting groove 21 at one end close to the first joint 1 is at least 1 mm higher than the upper surface height of the shock-absorbing material 22 to prevent the wafer from falling off when the second joint 2 is tilted.

[0041] Furthermore, a groove wall edge at one end of the wafer limiting groove away from the first joint 1 is provided with a draft angle of 2° to prevent collision when taking and placing the wafer.

[0042] Furthermore, the damping shaft includes a rotating shaft connecting the first joint 1 and the second joint 2, and a damping member 32 arranged on both sides of the rotating shaft 31. The rotating shaft 31 is connected to the second joint 2 and hinged to the first joint 1 through a key, and the torque is transmitted through the key. Such a setting can make the transport robot arm flip smoothly and reduce shock.

[0043] Furthermore, the damping member 32 is fixed to both sides of the rotating shaft by means of fixing blocks and hexagon socket bolts, and the compression deformation of the elastic damping member 32 can be controlled by adjusting the degree of tightening of the hexagon socket bolts, thereby playing a role in damping adjustment.

[0044] When the utility model encounters a collision during operation, the second joint 2 will flip upward, and the flipping process is relatively slow under the action of the damping member 32; then, within a short period of time after the impact stops, the second joint 2 will reset downward under its own weight and the traction of the tension spring 11, the first pulley 12, the second pulley 13 and the winding 15, and stop when it touches the limit block 4.

[0045] Example 2

[0046] Calculation of the flip angle of the second joint 2:

[0047] Take a 12-inch wafer as an example, its mass is 146g. Since the wafer surface is smooth, the friction coefficient is very small, so it is taken as 0.1 here. If the downward force of gravity exceeds the static friction, the wafer will move relative to the wafer, so the flip angle θ should satisfy:

[0048] mgsinθ<μmgcosθ

[0049] tanθ<μ

[0050] It is solved that the flip angle θ cannot exceed 5.71°. In the horizontal state, the flip angle must not exceed 5.71° to prevent the wafer from falling off by friction alone. To ensure the safety of the wafer, the height of the groove wall of the wafer limiting groove 21 close to the first joint 1 is at least 1 mm higher than the upper surface height of the shock-absorbing material 22, which can prevent the wafer from falling off when the second joint 2 is tilted, thereby limiting the movement of the wafer.

[0051] Although the present utility model has been disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Anyone who is familiar with this technology can make various modifications and alterations without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model should be defined by the claims.

Claims

1. A collision-proof handling robot arm installed in a semiconductor front-end measurement device, characterized in that: The handling robot arm comprises: A first joint, wherein a mounting groove is provided below the first joint, and a tension spring and a first pulley are fixed in the mounting groove; A second joint, the second joint having a clamp-shaped structure allowing the wafer to be fixed, a second pulley and a winding ring being connected below the second joint; and A damping shaft connecting the first joint and the second joint; Wherein, the tension spring is connected to the winding ring through the first pulley and the second pulley in sequence by winding.

2. The anti-collision handling robot arm according to claim 1, characterized in that: One end of the tension spring passes through an adjusting bolt and an adjusting nut.

3. The anti-collision handling robot arm according to claim 2, characterized in that: The winding wire is wound around the first pulley at least once, and the winding wire is wound around the second pulley at least once.

4. The anti-collision handling robot arm according to claim 3, characterized in that: One end of the mounting slot close to the second joint is connected with a limit stopper extending to below the second joint.

5. The anti-collision handling robot arm according to claim 1, characterized in that: The upper surface of the clamp structure is provided with a wafer limiting groove, and the bottom of the wafer limiting groove is paved with a shock absorbing material.

6. The anti-collision handling robot arm according to claim 5, characterized in that: The shock absorbing material is fluororubber.

7. The anti-collision handling robot arm according to claim 6, characterized in that: The height of the groove wall of the wafer limiting groove at one end close to the first joint is at least 1 mm higher than the height of the upper surface of the shock absorbing material.

8. The anti-collision handling robot arm according to claim 7, characterized in that: The edge of the groove wall of the wafer limiting groove at one end away from the first joint is provided with a draft angle of 2°.

9. The anti-collision handling robot arm according to claim 1, characterized in that: The damping shaft comprises a rotating shaft connecting the first joint and the second joint, and damping members arranged on both sides of the rotating shaft. The rotating shaft is connected to the second joint and hinged to the first joint through a key.

10. The anti-collision handling robot arm according to claim 9, characterized in that: The damping member is fixed to both sides of the rotating shaft through a fixing block and a hexagon socket bolt.

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