Heat dissipation device for liquid heater control panel

Abstract

The utility model relates to an automobile air conditioner heater, in particular to a heat dissipation device for a liquid heater control panel, which comprises a connecting plate, a water inlet hole and a water outlet hole, the connecting plate is provided with a cooling flow channel, and the water inlet hole and the water outlet hole are communicated with the cooling flow channel, and the connecting plate is arranged on a heating seat and connected with the control panel. The water inlet hole is communicated with the water inlet of the heating seat, and the water outlet hole is communicated with the water outlet of the heating seat; and the cooling plate is arranged on the cooling flow channel, abuts against the control plate and is used for cooling the IGBT on the control plate. According to the heat dissipation device used for the liquid heater control panel, the cooling flow channel is led out from the heating flow channel to dissipate heat of the IGBT, heat dissipation of the IGBT can be guaranteed, heat generated by the IGBT can be recycled, and the utilization rate of electric energy is improved.

Description

Technical Field

[0001] The utility model relates to an automobile air conditioner heater, in particular to a heat dissipation device for a liquid heater control board. Background Art

[0002] Electric vehicles mainly use heating for warming, and IGBT is mainly used to control heating. IGBT generates a large amount of heat, so good heat dissipation is required. However, the existing heaters do not have a targeted heat dissipation design for IGBT, resulting in poor heat dissipation effect and affecting stability. For example, a high-efficiency heat exchange structure for an automobile heater disclosed in CN116923045A does not have a heat dissipation design for the control unit and mainly relies on the heat dissipation of the housing, resulting in poor heat dissipation of IGBT. Content of the Utility Model

[0003] To solve the above problem of poor IGBT heat dissipation, the utility model provides a heat dissipation device for a liquid heater control board, and the specific technical solution is as follows:

[0004] A heat dissipation device for a liquid heater control board includes: a connecting plate provided with a cooling channel, a water inlet hole and a water outlet hole communicated with the cooling channel. The connecting plate is arranged on a heating base and connected to the control board. The water inlet hole is communicated with the water inlet of the heating base, and the water outlet hole is communicated with the water outlet of the heating base; and a cooling plate arranged on the cooling channel and abutted against the control board for cooling the IGBT on the control board.

[0005] Preferably, a plurality of cooling bosses opposite to the IGBT are arranged on the cooling plate, and the cooling bosses abut against the control board.

[0006] Preferably, a fixing groove is further arranged on the connecting plate, and the bottom of the fixing groove is provided with a cooling channel, and the cooling plate is installed in the fixing groove.

[0007] Preferably, a plurality of fixing columns are further arranged on the connecting plate, and the fixing columns are connected to the control board by screws.

[0008] Preferably, it further includes: a heat conduction device arranged between the cooling plate and the control board.

[0009] Furthermore, the heat conduction device includes any one of a heat conduction pad, heat conduction silicone grease, and a heat conduction film.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] A heat dissipation device for a control board of a liquid heater provided by the utility model dissipates heat from the IGBT by leading out a cooling channel from the heating channel, which can not only ensure the heat dissipation of the IGBT, but also recycle the heat generated by the IGBT, improving the utilization rate of electric energy. Description of the Drawings

[0012] Figure 1 is a schematic structural view of the present application;

[0013] Figure 2 is a front view of the present application;

[0014] Figure 3 is a cross-sectional view of the present application;

[0015] Figure 4 is a front view of the connecting plate;

[0016] Figure 5 is a schematic structural view of the connecting plate;

[0017] Figure 6 is a schematic structural view of the cooling plate;

[0018] Figure 7 is an assembly schematic view of the heat dissipation device, the heating base, the heating substrate and the control board;

[0019] Figure 8 is Figure 7 a side view after hiding the heating base;

[0020] Figure 9 is a schematic structural view of the heating base. Detailed Embodiments

[0021] The present utility model will be further described below with reference to the accompanying drawings.

[0022] As Figures 1 to 9 shown, a heat dissipation device for a control board of a liquid heater includes a connecting plate 41 and a cooling plate 42. A cooling channel 413, a water inlet hole 411 and a water outlet hole 412 communicating with the cooling channel 413 are provided on the top surface of the connecting plate 41. The cooling channel 413 is U-shaped, and the water inlet hole 411 and the water outlet hole 412 are respectively located at both ends of the cooling channel 413. The cooling plate 42 is hermetically fixed on the connecting plate 41 and is located above the cooling channel 413. The cooling plate 42 also abuts against the bottom surface of the control board 3 and covers the area where the IGBT 31 is provided on the control board 3 for cooling the IGBT 31 on the control board 3. The connecting plate 41 is installed on the heating base 1 and is located above the heating substrate 2. The control board 3 is installed on the connecting plate 41. The water inlet hole 411 communicates with the water inlet 11 of the heating base 1, and the water outlet hole 412 communicates with the water outlet 12 of the heating base 1.

[0023] To further ensure the heat dissipation effect of the IGBT31, a number of cooling bosses 421 are provided on the cooling plate 42, which are arranged opposite to the IGBT31. The cooling bosses 421 abut against the control board 3. The cooling bosses 421 reduce the contact area with the control board 3, which can avoid generating a gap between the cooling plate 42 and the control board 3, thereby ensuring that the cooling bosses 421 are reliably attached to the control board 3, ensuring reliable heat conduction and ensuring the heat dissipation effect.

[0024] The connecting plate 41 is also provided with a fixing groove 414. A cooling flow channel 413 is provided at the bottom of the fixing groove 414. The cooling plate 42 is installed in the fixing groove 414. The fixing groove 414 facilitates the fixing of the cooling plate 42, is convenient for forming a sealed connection, reduces the assembly difficulty of the cooling plate 42, and improves the reliability of the connection.

[0025] To facilitate the connection with the control board 3 and ensure the installation space of the cooling plate 42, the connecting plate 41 is also provided with a number of fixing columns 415, and the fixing columns 415 are connected to the control board 3 by screws.

[0026] To further improve the reliability of heat conduction between the control board 3 and the cooling plate 42, a heat conduction device is also included. The heat conduction device is located between the cooling plate 42 and the control board 3. The heat conduction device includes any one of a heat conduction pad, heat conduction silicone grease, and a heat conduction film. The heat conduction device can not only conduct heat, but also effectively prevent a gap from forming between the cooling plate 42 or the cooling bosses 421 and the control board 3, realizing good heat conduction.

[0027] As Figure 9 shown, one end of the heating base 1 is provided with a water inlet 11 and a water outlet hole 412. A heating flow channel 13 is provided inside the heating base 1. The heating flow channel 13 communicates with the water inlet 11 and the water outlet 12. The heating base 1 is also provided with a first cooling hole 171 and a second cooling hole 172. The first cooling hole 171 communicates with the water inlet 11 and also with the water inlet hole 411. The second cooling hole 172 communicates with the water outlet 12 and also with the water outlet hole 412. A sealing ring is also provided between the heating base 1 and the connecting plate 41. The sealing ring is used to seal the connection between the first cooling hole 171 and the water inlet 11 and the connection between the second cooling hole 172 and the water outlet 12.

[0028] Both the connecting plate 41 and the cooling plate 42 are made of metal, and can be made of aluminum, which is light in weight and good in heat conduction.

[0029] During operation, the liquid at a lower temperature enters the heating flow channel 13 of the heating base 1 from the water inlet 11, and at the same time enters the cooling flow channel 413 through the first cooling hole 171 and the water inlet hole 411. The liquid at a lower temperature passes under the cooling bosses 421 and absorbs the heat of the IGBT31 and then becomes a liquid at a higher temperature. Then, it enters the water outlet 12 of the heating base 1 through the water outlet hole 412 and the second cooling hole 172 and is mixed with the heated liquid.

[0030] The technical principle of the present utility model has been described in conjunction with specific embodiments above. These descriptions are only for explaining the principle of the present utility model and cannot be construed in any way as a limitation on the protection scope of the present utility model. Based on the explanations herein, those skilled in the art can readily conceive of other specific embodiments of the present utility model without creative efforts, and these embodiments will fall within the protection scope of the claims of the present utility model.

Claims

1. A heat dissipation device for a liquid heater control panel, characterized in that: include: a connecting plate (41) provided with a cooling channel (413) and a water inlet hole (411) and a water outlet hole (412) communicating with the cooling channel (413); the connecting plate (41) is arranged on the heating seat (1) and connected to the control plate (3); the water inlet hole (411) is communicated with a water inlet (11) of the heating seat (1); and the water outlet hole (412) is communicated with a water outlet (12) of the heating seat (1); and A cooling plate (42) is disposed on the cooling channel (413) and abuts against the control board (3) for cooling the IGBT (31) on the control board (3).

2. A heat dissipation device for a liquid heater control panel according to claim 1, characterized in that: The cooling plate (42) is provided with a plurality of cooling bosses (421) arranged opposite to the IGBT (31), and the cooling bosses (421) are against the control plate (3).

3. A heat dissipation device for a liquid heater control panel according to claim 1, characterized in that: The connecting plate (41) is also provided with a fixing groove (414), the bottom of the fixing groove (414) is provided with a cooling channel (413), and the cooling plate (42) is installed in the fixing groove (414).

4. A heat dissipation device for a liquid heater control panel according to claim 1, characterized in that: The connecting plate (41) is also provided with a plurality of fixing columns (415), and the fixing columns (415) are connected to the control plate (3) via screws.

5. A heat dissipation device for a liquid heater control panel according to claim 1, characterized in that: Also includes: A heat conduction device is arranged between the cooling plate (42) and the control plate (3).

6. A heat dissipation device for a liquid heater control panel according to claim 5, characterized in that: The heat conducting device includes any one of a heat conducting pad, a heat conducting silicone grease and a heat conducting film.

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