Pressure sensor

Abstract

The present disclosure relates to a pressure sensor comprising: a metal sleeve; a connector; a pressure detection module including a pressure detection element; comprising an EMC capacitor; and a flexible protection element including a metal layer and an insulating layer covering the metal layer, the flexible protection element being attached to the pressure detection element and configured such that the insulating layer of the flexible protection element covers the first surface and the second surface of the pressure detection element. The electronic module assembly includes a first connection portion electrically connected to the EMC capacitor, and the flexible protection element includes a second connection portion electrically connected to the metal layer to enable the EMC capacitor to be electrically connected to the metal layer of the flexible protection element via the first connection portion and the second connection portion.

Description

Technical Field

[0001] The present disclosure relates to a pressure sensor. Background Art

[0002] A pressure sensor is a commonly used sensor in industrial practice and is widely used in various industrial environments.

[0003] Conventionally, in order to enable a pressure sensor to have good electromagnetic compatibility (EMC), an EMC capacitor is provided in an electronic module assembly (EMA) of the pressure sensor. However, in existing pressure sensors, since the EMC capacitor in the electronic module assembly is usually grounded by being electrically connected to a metal sleeve or a metal housing, the EMC capacitor is difficult to withstand the impact of a high voltage (for example, a voltage higher than 50V). The high voltage will break down the EMC capacitor and cause leakage, thereby affecting the EMC performance of the pressure sensor, making the pressure sensor unable to work properly, and also causing interference to other systems and devices. Summary of the Utility Model

[0004] In view of the problems existing in the prior art, the present disclosure provides a pressure sensor that can not only ensure good EMC performance but also withstand the impact of a high voltage (for example, a high voltage up to 1800V).

[0005] According to one aspect of the present disclosure, there is provided a pressure sensor, the pressure sensor comprising:

[0006] A metal sleeve, a sensor port being defined at the bottom of the metal sleeve, the sensor port being configured to receive a fluid;

[0007] A connector attached to the top of the metal sleeve, the metal sleeve, the connector and the sensor port jointly defining an inner cavity of the pressure sensor;

[0008] A pressure detection module configured to detect the pressure of the fluid and generate a pressure signal, the pressure detection module being encapsulated in the inner cavity and including a pressure detection element, the pressure detection element including a first surface configured to sense the fluid pressure and a second surface opposite to the first surface;

[0009] An electronic module assembly encapsulated in the inner cavity, the electronic module assembly being configured to generate a pressure detection signal based on the pressure signal and including an EMC capacitor; and

[0010] A flexible protection element disposed between the pressure detection element and the electronic module assembly, the flexible protection element including a metal layer and an insulating layer covering the metal layer, the flexible protection element being attached to the pressure detection element and configured to cover a first surface and a second surface of the pressure detection element with the insulating layer of the flexible protection element,

[0011] wherein, the electronic module assembly includes a first connection portion electrically connected to the EMC capacitor, and the flexible protection element includes a second connection portion electrically connected to the metal layer, so that the EMC capacitor can be electrically connected to the metal layer of the flexible protection element via the first connection portion and the second connection portion.

[0012] In one embodiment of the pressure sensor, the pressure sensor further includes a side clamping element, and the first connection portion is electrically connected to the second connection portion through the side clamping element.

[0013] In one embodiment of the pressure sensor, the first connection portion includes a first pad and a second pad disposed on the electronic module assembly, the second connection portion includes a third pad and a fourth pad disposed on the flexible protection element, and the first pad and the second pad are respectively electrically connected to the third pad and the fourth pad through the side clamping element.

[0014] In one embodiment of the pressure sensor, a metal surface layer is provided on the first surface of the pressure detection element, and the pressure detection element includes a third connection portion electrically connected to the metal surface layer, so that the EMC capacitor can be electrically connected to the second connection portion via the first connection portion, the third connection portion and the metal surface layer.

[0015] In one embodiment of the pressure sensor, the metal surface layer is provided by brushing gold on the first surface of the pressure detection element.

[0016] In one embodiment of the pressure sensor, the pressure sensor further includes a side clamping element, and the first connection portion is electrically connected to the third connection portion through the side clamping element.

[0017] In one embodiment of the pressure sensor, the first connection portion includes a first pad and a second pad disposed on the electronic module assembly, the third connection portion includes a fifth pad and a sixth pad disposed on the pressure detection element, and the first pad and the second pad are respectively electrically connected to the fifth pad and the sixth pad through the side clamping element.

[0018] In one embodiment of the pressure sensor, the second connection portion is an exposed portion of the metal layer of the flexible protection element that is not covered by the insulating layer.

[0019] In one embodiment of the pressure sensor, a first surface of the pressure detection element defines a pressure sensing area, and a metal layer of the flexible protection element includes a metal grid area corresponding to the pressure sensing area, and a metal grid is formed by etching away a part of the metal in the metal grid area.

[0020] In one embodiment of the pressure sensor, the pressure detection element is a ceramic capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By considering the following description of the preferred embodiments of the present disclosure in conjunction with the accompanying drawings, various objects, features, and advantages of the present disclosure will become more apparent. The drawings are only exemplary illustrations of the present disclosure and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar components.

[0022] Figure 1 is an exploded view of a pressure sensor according to the present disclosure.

[0023] Figure 2A is a schematic diagram of an electronic module assembly in a conventional pressure sensor.

[0024] Figure 2B is a schematic diagram of an electronic module assembly in a pressure sensor according to the present disclosure.

[0025] Figures 2C to 2E is an assembled schematic diagram of a pressure sensor according to the present disclosure, wherein Figure 2C shows the assembly of the pressure detection element and the flexible protection element, Figure 2D shows the assembly of the pressure detection element, the flexible protection element, and the electronic module assembly, Figure 2E shows the assembly of the pressure detection element, the flexible protection element, the electronic module assembly, and the base.

[0026] Figure 3 is a schematic diagram of a flexible protection element in a pressure sensor according to the present disclosure, showing a metal grid area defined in the metal layer of the flexible protection element.

[0027] Figure 4A is a schematic diagram of a pressure detection element in a pressure sensor according to the present disclosure.

[0028] Figure 4B and Figure 4C is an assembled schematic diagram of a pressure sensor according to the present disclosure, wherein Figure 4B shows the assembly of the pressure detection element and the flexible protection element, Figure 4C further shows an inner sealing ring crimped on the pressure detection element. DETAILED DESCRIPTION

[0029] The present disclosure will be described below with reference to the accompanying drawings, in which the preferred embodiments of the present disclosure are shown. However, it should be understood that the present disclosure can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure of the present disclosure more complete and fully explain the scope of protection of the present disclosure to those skilled in the art. It should also be understood that the technical features in the embodiments disclosed herein can be combined in various ways to provide more additional embodiments. Those skilled in the art can appropriately modify the detailed configuration without departing from the gist of the present disclosure.

[0030] It should be understood that in all the drawings, the same reference numerals represent the same elements. In the drawings, for clarity, the dimensions of some features may be deformed.

[0031] Unless otherwise specified, the terms (including technical terms and scientific terms) used herein shall have the meanings that are generally understood by those of ordinary skill in the technical field to which the present disclosure pertains. Unless otherwise specified, the terms "comprising" and "including" used in the specification and claims shall be interpreted in an open-ended sense, that is, "comprising" and "including" shall be interpreted as synonymous with the terms "comprising at least" or "including at least".

[0032] Unless otherwise specified, the terms "upper", "lower", "top", "bottom", etc. used in the present disclosure are only the relative orientations of the device and its related components in the state shown in the figure.

[0033] It should be understood that the words used in the specification are only for describing specific embodiments and are not intended to limit the present disclosure. For the sake of brevity and / or clarity, well-known functions or structures may not be described in detail.

[0034] In view of the above-mentioned defects in the prior art, the present disclosure provides a pressure sensor. The embodiments for implementing the present disclosure will be described below with reference to the drawings.

[0035] As Figures 1 to 3 shown, according to an embodiment of the present disclosure, a pressure sensor is provided, which mainly includes components such as a connector 2, an electronic module assembly 3, a pressure detection module, a flexible protection element 6, and a metal sleeve 9. A sensor port is defined at the bottom of the metal sleeve 9, and the sensor port is configured to receive fluid. The connector 2 is attached to the top of the metal sleeve 9 so that the connector 2, the metal sleeve 9, and the sensor port jointly define the inner cavity of the pressure sensor. Preferably, the metal sleeve 9 can be a metal hexagonal tube.

[0036] In addition, in this embodiment, the pressure sensor may further include auxiliary components such as sealant 1, internal sealing ring 7, base 8, and external sealing ring 10 to facilitate the assembly of the sensor and ensure good sealing performance.

[0037] The pressure detection module is configured to detect the pressure of the fluid and generate a pressure signal. The pressure detection module is encapsulated in the inner cavity of the pressure sensor and includes a pressure detection element 5. The pressure detection element 5 includes a first surface 50 (see Figure 4A ) configured to sense the fluid pressure and a second surface opposite to the first surface 50. Preferably, the pressure detection element 5 may be a ceramic capacitor.

[0038] The electronic module assembly 3 is encapsulated in the inner cavity of the pressure sensor and is configured to generate a pressure detection signal based on the pressure signal. The electronic module assembly 3 includes an EMC capacitor to enable the pressure sensor to have good electromagnetic compatibility (EMC).

[0039] As Figure 2A shown, in a conventional pressure sensor, the electronic module assembly 3 includes a first pin 30A and a second pin 30B, and pads 31A, 31B, and 31C are provided. The first pin 30A and the second pin 30B are electrically connected to the EMC capacitor and are abutted against the metal sleeve 9 (equivalent to grounding), thereby enabling the pressure sensor to have good electromagnetic compatibility through the EMC capacitor. However, in this case, the EMC capacitor is difficult to withstand the impact of too high a voltage (for example, a voltage higher than 50V). Since the EMC capacitor is electrically connected to the metal sleeve 9 via the first pin 30A and the second pin 30B, the too high voltage will break down the EMC capacitor and cause leakage, thereby affecting the EMC performance of the pressure sensor, making the pressure sensor unable to work properly, and also causing interference to other systems and devices.

[0040] To solve the above problems, as Figures 2C to 2E shown, in the pressure sensor provided in the present disclosure, the first pin 30A and the second pin 30B are cancelled, and a flexible protection element 6 is provided between the electronic module assembly 3 and the pressure detection element 5. The flexible protection element 6 includes a metal layer and an insulating layer covering the metal layer. As Figure 2CAs shown, the flexible protection element 6 is attached to the pressure detection element 5 and configured such that the insulating layer of the flexible protection element 6 covers the first surface and the second surface of the pressure detection element 5. In addition, the electronic module assembly 3 includes a first connection portion electrically connected to the EMC capacitor, and the flexible protection element 6 includes a second connection portion electrically connected to the metal layer, so that the EMC capacitor of the electronic module assembly 3 can be electrically connected to the metal layer of the flexible protection element via the first connection portion and the second connection portion. With the above arrangement, since the EMC capacitor of the electronic module assembly 3 is not electrically connected to the metal sleeve 9 but only to the metal layer covered by the insulating layer of the flexible protection element 6, the pressure sensor can not only ensure good EMC performance but also withstand the impact of high voltage (for example, a high voltage of up to 1800V).

[0041] Preferably, as Figure 1 and Figure 2C shown, the pressure sensor may include a side clamping element 4. The side clamping element 4 can clamp the electronic module assembly 3, the pressure detection element 5, and the flexible protection element 6, thereby ensuring that the first connection portion is electrically connected to the second connection portion through the side clamping element 4. Further preferably, the first connection portion may include a first pad 32A and a second pad 32B provided on the electronic module assembly 3. As Figure 2B shown, the first pad 32A and the second pad 32B may be provided on both sides of the original pads 31A, 31B, and 31C of the electronic module assembly 3. Similarly, the second connection portion may include a third pad 61A and a fourth pad 61B provided on the flexible protection element 6. As Figure 2D shown, by clamping the electronic module assembly 3, the pressure detection element 5, and the flexible protection element 6 with the side clamping element 4, the first pad 32A and the second pad 32B of the electronic module assembly 3 can be electrically connected to the third pad 61A and the fourth pad 61B of the flexible protection element 6 respectively. Thus, the EMC capacitor of the electronic module assembly 3 can be electrically connected to the metal layer of the flexible protection element 6 via the direct connection between the first pad 32A and the third pad 61A, and between the second pad 32B and the fourth pad 61B.

[0042] As Figure 2E shown, during the assembly process of the pressure sensor, the flexible protection element 6 can be sleeved on the two buckles 81A and 81B of the base 8, thereby serving as a fixation during the assembly process. After the finished product is riveted, the connector 2 presses against the peripheral area of the flexible protection element 6, thereby realizing the wrapping of the components of the electronic module assembly 3.

[0043] The above describes an embodiment in which the first connection portion of the electronic module assembly 3 is directly electrically connected to the second connection portion of the flexible protection element 6. As another alternative, the first connection portion of the electronic module assembly 3 can also be indirectly electrically connected to the second connection portion of the flexible protection element 6 via a conductive portion provided on the pressure detection element 5. The following will refer to Figures 4A to 4C to illustrate such an alternative.

[0044] As Figures 4A to 4C shown, a metal surface layer is provided on the first surface 50 of the pressure detection element 5 configured to sense fluid pressure, and the pressure detection element 5 includes a third connection portion electrically connected to the metal surface layer, so that the EMC capacitor can be electrically connected to the second connection portion of the flexible protection element 6 via the first connection portion of the electronic module assembly 3, the third connection portion of the pressure detection element 5, and the metal surface layer. Preferably, the metal surface layer can be provided by gold plating on the first surface 50 of the pressure detection element 5.

[0045] As Figure 4B shown, the pressure sensor may include a side clip element 4. The side clip element 4 can clip the electronic module assembly 3, the pressure detection element 5, and the flexible protection element 6, thereby ensuring that the first connection portion is electrically connected to the third connection portion through the side clip element 4. As described above, the first connection portion may include a first pad 32A and a second pad 32B provided on the electronic module assembly 3. As Figure 4A shown, the third connection portion may include a fifth pad 52A and a sixth pad 52B provided on the pressure detection element 5. The metal surface layer can be electrically connected to the fifth pad 52A and the sixth pad 52B respectively through the conductive silver paste portions 53A and 53B. The fifth pad 52A and the sixth pad 52B can be provided on both sides of the original pads 51A, 51B, and 51C of the pressure detection element 5.

[0046] By clipping the electronic module assembly 3, the pressure detection element 5, and the flexible protection element 6 with the side clip element 4, the first pad 32A and the second pad 32B of the electronic module assembly 3 can be electrically connected to the fifth pad 52A and the sixth pad 52B of the pressure detection element 5 respectively. The flexible protection element 6 can expose the metal layer in the corresponding area. That is to say, the second connection portion of the flexible protection element 6 can be the exposed portion of the metal layer not covered by the insulating layer. Thus, as Figure 4C shown, after the sensor is riveted, through the pressure of the internal sealing ring 7, the EMC capacitor of the electronic module assembly 3 can be electrically connected to the metal layer of the flexible protection element 6 via the connection between the first pad 32A and the fifth pad 52A, the connection between the second pad 32B and the sixth pad 52B, the conductive silver paste portions 53A and 53B, and the connection between the metal surface layer of the pressure detection element 5 and the second connection portion of the flexible protection element 6.

[0047] In addition, in the pressure sensor according to the present disclosure, the flexible protection element 6 includes a metal layer. It has been found that the metal properties in this metal layer change with changes in environmental conditions (such as temperature, pressure, etc.), and the change in metal properties has an adverse effect on the measurement accuracy of the sensor.

[0048] To solve the above problems, a metal mesh region can be provided in the metal layer of the flexible protection element 6. Specifically, the first surface 50 of the pressure detection element 5 defines a pressure sensing region. As Figure 3 shown, the metal layer of the flexible protection element 6 includes a metal mesh region 60 corresponding to the pressure sensing region, and a metal mesh is formed by etching away a part of the metal in this metal mesh region 60. Since a part or even most of the metal is etched away in the metal mesh region 60, the adverse effect of the change in metal properties on the measurement accuracy of the sensor can be eliminated or reduced.

[0049] Compared with the existing pressure sensors, the pressure sensor according to the present disclosure can not only ensure good EMC performance but also withstand the impact of high voltage (for example, a high voltage of up to 1800V) by providing a flexible protection element therein.

[0050] Although the present disclosure has been described with reference to exemplary embodiments, it should be understood that the present disclosure is not limited to the above exemplary embodiments. Various variations and modifications can be made to the above exemplary embodiments without departing from the scope and scope of the present disclosure. The scope of the appended claims should be construed in the broadest sense so as to include all such variations and equivalent structures and functions.

Claims

1. A pressure sensor, characterized in that: The pressure sensor comprises: a metal sleeve defining a sensor port at a bottom of the metal sleeve, the sensor port being configured to receive a fluid; a connector attached to a top portion of the metal sleeve, the metal sleeve, the connector and the sensor port collectively defining an inner cavity of the pressure sensor; a pressure detection module configured to detect the pressure of the fluid and generate a pressure signal, the pressure detection module being encapsulated in the inner cavity and comprising a pressure detection element, the pressure detection element comprising a first surface configured to sense the pressure of the fluid and a second surface opposite to the first surface; an electronics module assembly enclosed in the inner cavity, the electronics module assembly being configured to generate a pressure detection signal based on the pressure signal and comprising an EMC capacitor; and a flexible protective element disposed between the pressure sensing element and the electronic module assembly, the flexible protective element comprising a metal layer and an insulating layer covering the metal layer, the flexible protective element being attached to the pressure sensing element and configured such that the insulating layer of the flexible protective element covers the first surface and the second surface of the pressure sensing element, The electronic module assembly includes a first connection portion electrically connected to the EMC capacitor, and the flexible protection element includes a second connection portion electrically connected to the metal layer, so that the EMC capacitor can be electrically connected to the metal layer of the flexible protection element via the first connection portion and the second connection portion.

2. The pressure sensor according to claim 1, characterized in that: The pressure sensor further includes an edge clamping element, and the first connection portion is electrically connected to the second connection portion through the edge clamping element.

3. The pressure sensor according to claim 2, characterized in that: The first connection portion includes a first solder pad and a second solder pad arranged on the electronic module assembly, the second connection portion includes a third solder pad and a fourth solder pad arranged on the flexible protective element, and the first solder pad and the second solder pad are respectively electrically connected to the third solder pad and the fourth solder pad through the edge card element.

4. The pressure sensor according to claim 1, characterized in that: A metal surface layer is provided on the first surface of the pressure sensing element, and the pressure sensing element includes a third connection part electrically connected to the metal surface layer, so that the EMC capacitor can be electrically connected to the second connection part via the first connection part, the third connection part and the metal surface layer.

5. The pressure sensor according to claim 4, characterized in that: The metal surface layer is provided by brushing gold on the first surface of the pressure sensing element.

6. The pressure sensor according to claim 5, characterized in that: The pressure sensor further includes an edge clamping element, and the first connection portion is electrically connected to the third connection portion through the edge clamping element.

7. The pressure sensor according to claim 6, characterized in that: The first connection portion includes a first solder pad and a second solder pad arranged on the electronic module assembly, the third connection portion includes a fifth solder pad and a sixth solder pad arranged on the pressure detection element, and the first solder pad and the second solder pad are respectively electrically connected to the fifth solder pad and the sixth solder pad through the edge card element.

8. The pressure sensor according to claim 7, characterized in that: The second connection portion is an exposed portion of the metal layer of the flexible protection element that is not covered by the insulation layer.

9. The pressure sensor according to any one of claims 1 to 8, characterized in that: The first surface of the pressure detection element defines a pressure sensing area, and the metal layer of the flexible protection element includes a metal grid area corresponding to the pressure sensing area, in which a metal grid is formed by removing a portion of metal by etching.

10. The pressure sensor according to any one of claims 1 to 8, characterized in that: The pressure detection element is a ceramic capacitor.

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