Projector

Abstract

The utility model belongs to the technical field of DLP projection, and especially relates to a projector comprising a housing which is provided with an air outlet and an air inlet; the mainboard, the projection ray machine and the fan are respectively fixed in the shell, and an air blowing port of the fan corresponds to the air outlet; the air outlet radiator is fixed in the shell and is arranged between the air outlet and an air blowing port of the fan; the ray machine heat conduction structure is connected between the projection ray machine and the air outlet radiator; the air inlet radiator is fixed in the shell and is arranged at the air inlet; the semiconductor chilling plate is attached to the air inlet radiator, the air inlet heat conduction structure is connected between the semiconductor chilling plate and the air outlet radiator, and the semiconductor chilling plate is electrically connected with the mainboard. According to the projector, hot air at the air inlet can be cooled, external heat is prevented from being transmitted into the shell, the problem that an existing projector is poor in heat dissipation effect and cannot be normally used in a high-temperature environment is solved, and the use experience of a user can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of DLP projection, and particularly relates to a projector. Background Art

[0002] At present, DLP (Digital Light Processing) projection technology has been widely used due to its characteristics such as high brightness, high contrast, and high resolution. Many projectors use DLP projection technology for imaging.

[0003] The projection optical machine is the main component of the projector. During operation, the projection optical machine generates a large amount of heat. Existing projectors dissipate heat through a radiator and a fan. The fan blows hot air out through the heat dissipation port on the housing, and external air enters the interior of the projection optical machine through the ventilation port on the housing. The heat dissipation effect is relatively poor, and the projection optical machine is in a high-temperature state. Among them, the temperatures of the main heat-generating components such as the light source, DMD chip, and optical lens on the projection optical machine are even higher, resulting in problems such as blurred and unclear images projected by the projection optical machine, seriously affecting the display quality of the projector.

[0004] When using the projector in summer or high-temperature environments, the hot air enters the interior of the projection optical machine from the ventilation port, further reducing the heat dissipation effect. Even if the fan rotates at full speed, it is not enough to keep the temperatures of the main heat-generating components of the projection optical machine within the normal operating range, resulting in the projector being unable to work properly and seriously affecting the user experience. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a projector, aiming to solve the problem that the existing projector has a poor heat dissipation effect and cannot be used normally in high-temperature environments, and can improve the user experience.

[0006] The utility model discloses a projector, which includes a housing provided with an air outlet and an air inlet; a main board, a projection optical machine, and a fan respectively fixed inside the housing. The projection optical machine and the fan are respectively electrically connected to the main board, and the air blowing port of the fan is correspondingly arranged with the air outlet; it further includes an air outlet radiator fixed inside the housing and arranged between the air outlet and the air blowing port of the fan, an optical machine heat conduction structure connected between the projection optical machine and the air outlet radiator, an air inlet radiator fixed inside the housing and arranged at the air inlet, a semiconductor refrigeration chip attached to the air inlet radiator, and an air inlet heat conduction structure connected between the semiconductor refrigeration chip and the air outlet radiator. The semiconductor refrigeration chip is electrically connected to the main board.

[0007] As an improvement, the air inlet radiator is attached to the inner side wall of the housing around the air inlet.

[0008] As an improvement, the air inlet radiator includes a ring body, a plurality of partition plates disposed inside the ring body, the plurality of partition plates respectively extend along the axial direction of the ring body, and the plurality of partition plates are sequentially spaced apart along the vertical direction of the axial direction of the ring body, dividing the inside of the ring body into a plurality of ventilation channels; the semiconductor refrigeration sheet is attached to the outer side of the ring body.

[0009] As an improvement, the ring body is arranged in a rectangular shape, and each partition plate is respectively connected between the first side wall and the second side wall on the opposite sides of the ring body; the semiconductor refrigeration sheet is attached to the first side wall or the second side wall.

[0010] As an improvement, mounting plates are respectively provided at opposite sides outside the ring body.

[0011] As an improvement, an air inlet heat dissipation substrate is attached to the side of the semiconductor refrigeration sheet away from the air inlet radiator, and the air inlet heat conduction structure is attached to the side of the air inlet heat dissipation substrate away from the semiconductor refrigeration sheet corresponding to the air inlet side and is attached to or penetrates through the air outlet radiator corresponding to the air outlet side.

[0012] As an improvement, a DMD radiator is attached to the outside of the projection optical machine corresponding to the DMD chip of the projection optical machine, and an optical machine heat dissipation substrate is attached to the outside of the projection optical machine corresponding to the light source of the projection optical machine. The optical machine heat conduction structure is attached to the optical machine heat dissipation substrate corresponding to the projection optical machine side and is attached to or penetrates through the air outlet radiator corresponding to the air outlet side.

[0013] As an improvement, the air outlet radiator includes a plurality of spaced-apart heat dissipation fins, and ventilation channels are respectively formed between two adjacent heat dissipation fins; the air inlet heat conduction structure and the optical machine heat conduction structure respectively penetrate through the air outlet radiator.

[0014] As an improvement, the air inlets are respectively provided on the side walls of the housing on the left and right sides of the projection optical machine, and the air inlet radiator, the semiconductor refrigeration sheet attached to the air inlet radiator, and the air inlet heat conduction structure connecting the semiconductor refrigeration sheet and the air outlet radiator are respectively provided inside the housing corresponding to each air inlet.

[0015] As an improvement, the fan is arranged between the two air inlets, and the projection optical machine is arranged corresponding to the air suction port of the fan.

[0016] Due to the adoption of the above technical solution, the projector of the present utility model includes a housing, and the housing is provided with an air outlet and an air inlet; a main board, a projection optical machine and a fan are respectively fixed inside the housing, the projection optical machine and the fan are electrically connected to the main board respectively, and the air blowing port of the fan is correspondingly arranged with the air outlet; it further includes an air outlet radiator fixed inside the housing and arranged between the air outlet and the air blowing port of the fan, an optical machine heat conduction structure connected between the projection optical machine and the air outlet radiator, an air inlet radiator fixed inside the housing and arranged at the air inlet, a semiconductor refrigeration sheet attached to the air inlet radiator, and an air inlet heat conduction structure connected between the semiconductor refrigeration sheet and the air outlet radiator, and the semiconductor refrigeration sheet is electrically connected to the main board.

[0017] During operation, the fan sucks the air inside the housing into the fan and blows it out from the air blowing port of the fan. The air blown out by the fan passes through the air outlet radiator and is discharged to the outside of the housing through the air outlet. At the same time, the air in the external environment will enter the housing through the air inlet; when using the projector in summer or a high-temperature environment, the hot air in the external environment enters the housing through the air inlet and will transfer the external heat to the inside of the housing. Since the air inlet radiator is arranged at the air inlet and a semiconductor refrigeration sheet is attached to the air inlet radiator, after the semiconductor refrigeration sheet is powered on, using the semiconductor refrigeration technology, the side of the semiconductor refrigeration sheet in contact with the air inlet radiator forms a cold end, and the side away from the air inlet radiator forms a hot end. The heat of the air inlet radiator can be efficiently transferred from the cold end of the semiconductor refrigeration sheet to the hot end of the semiconductor refrigeration sheet, and then conducted to the air outlet radiator through the air inlet heat conduction structure, which can cool the hot air at the air inlet, so that the air with a lower temperature enters the housing, avoiding transferring the external heat to the inside of the housing. The inside of the projector will not be affected by the high-temperature environment and can be used normally in a high-temperature environment. At the same time, the heat generated by the projection optical machine can be directly transferred to the air outlet radiator through the optical machine heat conduction structure, which can improve the heat dissipation effect, solve the problem that the existing projector has a poor heat dissipation effect and cannot be used normally in a high-temperature environment, and can improve the user experience. Description of the Drawings

[0018] Figure 1 is a three-dimensional structural schematic diagram of the projector of the present utility model;

[0019] Figure 2 is an internal structural schematic diagram of the projector of the present utility model;

[0020] Figure 3 is an enlarged three-dimensional structural schematic diagram of the air inlet radiator of the projector of the present utility model;

[0021] Among them, 10 is the outer shell; 11 is the air outlet; 12 is the air inlet; 20 is the projection optical machine; 21 is the DMD radiator; 30 is the fan; 40 is the air inlet radiator; 41 is the ring body; 42 is the partition; 43 is the ventilation channel; 44 is the mounting plate; 50 is the air outlet radiator; 60 is the semiconductor refrigeration chip; 70 is the heat conduction structure of the air inlet; 80 is the heat dissipation substrate of the air inlet; 90 is the heat conduction structure of the optical machine; 91 is the heat dissipation substrate of the optical machine. Detailed implementation manners

[0022] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0023] Figures 1 to 3 is a schematic structural diagram of the projector of the present utility model, among which, Figure 1 shows a three-dimensional structural diagram of the projector of the present utility model, Figure 2 shows an internal structural diagram of the projector of the present utility model, Figure 3 shows a three-dimensional structural diagram (enlarged) of the air inlet radiator of the projector of the present utility model. For the convenience of description, only the parts related to the present utility model are given in the figure.

[0024] It should be noted that if the present utility model involves directional indications, such as up, down, front, back, left, right, etc., then such directional indications are only used to explain the relative positional relationship between components in a specific posture. If the specific posture changes, then such directional indications will also change accordingly; if the descriptions such as "first", "second", etc. involved in the present utility model are used, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features.

[0025] By Figure 1 , Figure 2 and Figure 3It can be seen that the projector of the present utility model includes a housing 10, which is provided with an air outlet 11 and an air inlet 12; a main board (not shown in the figure), a projection optical machine 20 and a fan 30 that are respectively fixed inside the housing 10. The projection optical machine 20 and the fan 30 are respectively electrically connected to the main board, and the air blowing port of the fan 30 is correspondingly arranged with the air outlet 11; it further includes an air outlet radiator 50 fixed inside the housing 10 and arranged between the air outlet 11 and the air blowing port of the fan 30, an optical machine heat conduction structure 90 connected between the projection optical machine 20 and the air outlet radiator 50, an air inlet radiator 40 fixed inside the housing 10 and arranged at the air inlet 12, a semiconductor refrigeration sheet 60 attached to the air inlet radiator 40, and an air inlet heat conduction structure 70 connected between the semiconductor refrigeration sheet 60 and the air outlet radiator 50. The semiconductor refrigeration sheet 60 is electrically connected to the main board.

[0026] During operation, the fan 30 sucks the air inside the housing 10 into the fan 30 and blows it out from the air blowing port of the fan 30. The air blown out by the fan 30 passes through the air outlet radiator 50 and the air outlet 11 and is discharged to the outside of the housing 10. At the same time, the air in the external environment will enter the inside of the housing 10 through the air inlet 12; when using the projector in summer or a high-temperature environment, the hot air in the external environment enters the inside of the housing 10 through the air inlet 12, and will transfer the external heat to the inside of the housing 10. Since the air inlet radiator 40 is arranged at the air inlet 12 and a semiconductor refrigeration sheet 60 is attached to the air inlet radiator 40, after the semiconductor refrigeration sheet 60 is powered on, using the semiconductor refrigeration technology, the side of the semiconductor refrigeration sheet 60 in contact with the air inlet radiator 40 forms a cold end, and the side far from the air inlet radiator 40 forms a hot end. The heat of the air inlet radiator 40 can be efficiently transferred from the cold end of the semiconductor refrigeration sheet 60 to the hot end of the semiconductor refrigeration sheet 60, and then conducted to the air outlet radiator 50 through the air inlet heat conduction structure 70, which can cool the hot air at the air inlet 12, so that the air with a lower temperature enters the inside of the housing 10, avoiding transferring the external heat to the inside of the housing 10. The inside of the projector will not be affected by the high-temperature environment and can be used normally in a high-temperature environment. At the same time, the heat generated by the projection optical machine 20 can be directly transferred to the air outlet radiator 50 through the optical machine heat conduction structure 90, which can improve the heat dissipation effect, solves the problem that the existing projector has a poor heat dissipation effect and cannot be used normally in a high-temperature environment, and can improve the user experience.

[0027] Specifically, the principle of the semiconductor refrigeration technology is a well-known technology and will not be elaborated here.

[0028] In the present utility model, in order to facilitate the transfer of heat from the air in the external environment to the inlet air radiator 40 when passing through the air inlet 12, the inlet air radiator 40 is attached to the inner side wall of the housing 10, so that all the air passing through the air inlet 12 can pass through the inlet air radiator 40, preventing the uncooled air from entering the interior of the housing 10.

[0029] As Figure 3 shown, the inlet air radiator 40 includes an annular body 41, a plurality of partition plates 42 arranged inside the annular body 41. The plurality of partition plates 42 respectively extend along the axial direction of the annular body 41, and the plurality of partition plates 42 are sequentially arranged at intervals in the direction perpendicular to the axial direction of the annular body 41, dividing the interior of the annular body 41 into a plurality of ventilation channels 43; the thermoelectric cooler 60 is attached to the outside of the annular body 41.

[0030] Specifically, the annular body 41 is arranged in a rectangular shape, and each partition plate 42 is respectively connected between the first side wall and the second side wall on the opposite sides of the annular body 41; the thermoelectric cooler 60 is attached to the first side wall or the second side wall of the annular body 41, so that the heat of the annular body 41 and the plurality of partition plates 42 can transfer heat to the thermoelectric cooler 60, further improving the heat dissipation effect.

[0031] For the convenience of installation, mounting plates 44 are respectively provided on the opposite sides outside the annular body 41, and connection holes are provided on the mounting plates 44, and fixed connection can be achieved through screws. Of course, fixed connection can also be achieved by bonding.

[0032] In some other embodiments, the inlet air radiator 40 can also be directly set as a solid plate, and a plurality of through holes are provided on the plate surface of the solid plate, and each through hole forms a ventilation channel 43 respectively.

[0033] In the present utility model, in order to facilitate the connection of the inlet air heat conduction structure 70 between the thermoelectric cooler 60 and the outlet air radiator 50, an inlet air heat dissipation substrate 80 is attached to the side of the thermoelectric cooler 60 away from the inlet air radiator 40. The inlet air heat conduction structure 70 is attached to the side of the inlet air heat dissipation substrate 80 away from the thermoelectric cooler 60 corresponding to the air inlet 12, and is attached to the outlet air radiator 50 or penetrates through the outlet air radiator 50 corresponding to the air outlet 11.

[0034] Specifically, the inlet air heat conduction structure 70 is an inlet air heat pipe. A slot is provided on the inlet air heat dissipation substrate 80, and the inlet air heat pipe is fixed inside the slot by welding or bonding. As Figure 2 shown, it can increase the contact area between the inlet air heat pipe and the inlet air heat dissipation substrate 80 and improve the heat dissipation effect. Generally, the inlet air radiator 40, the thermoelectric cooler 60 and the inlet air heat dissipation substrate 80 are bonded together by thermal conductive glue.

[0035] In some other embodiments, the air inlet heat conduction structure 70 can also be set as a metal rod.

[0036] In the present utility model, air inlets 12 are respectively provided on the side walls of the housing 10 on the left and right sides of the projection optical machine 20. Inside the housing 10, an air inlet radiator 40, a semiconductor refrigeration sheet 60 attached to the air inlet radiator 40, and an air inlet heat conduction structure 70 connected between the semiconductor refrigeration sheet 60 and the air outlet radiator 50 are respectively provided corresponding to each air inlet 12 on each side, which can simultaneously cool the hot air at the air inlets 12 on both sides, increase the air intake, and further improve the heat dissipation effect.

[0037] In the present utility model, the main heat generating components of the projection optical machine 20 include a light source, a DMD (Digital Micromirror Device) chip, etc. In order to facilitate heat dissipation of the projection optical machine 20, a DMD radiator 21 is attached to the position corresponding to the DMD chip on the outside of the projection optical machine 20, and an optical machine heat dissipation substrate 91 is attached to the position corresponding to the light source on the outside of the projection optical machine 20. One side of the optical machine heat conduction structure 90 corresponding to the projection optical machine 20 is attached to the optical machine heat dissipation substrate 91, and the side corresponding to the air outlet 11 is attached to the air outlet radiator 50 or inserted into the air outlet radiator 50.

[0038] Specifically, the projection optical machine 20 is provided with three groups of light sources. Optical machine heat dissipation substrates 91 are respectively attached to the outside of the projection optical machine 20 corresponding to each group of light sources. The three groups of light sources are the first light source, the second light source, and the third light source respectively. The optical machine heat dissipation substrates 91 corresponding to the three groups of light sources are the first optical machine heat dissipation substrate, the second optical machine heat dissipation substrate, and the third optical machine heat dissipation substrate respectively; the optical machine heat conduction structure 90 includes two groups of optical machine heat pipes. One group of optical machine heat pipes is connected between the first optical machine heat dissipation substrate and the air outlet radiator 50, and the other group of optical machine heat pipes is connected between the second optical machine heat dissipation substrate, the third optical machine heat dissipation substrate and the air outlet radiator 50; usually, card slots are respectively provided on the first optical machine heat dissipation substrate, the second optical machine heat dissipation substrate, and the third optical machine heat dissipation substrate, and the optical machine heat pipes are fixed inside the card slots by welding or bonding.

[0039] To further improve the heat dissipation effect, the fan 30 is arranged between the two air inlets 12, and the projection optical machine 20 is arranged corresponding to the suction port of the fan 30, which can discharge the heat generated by the projection optical machine 20 more quickly. Usually, the fan 30 is a flat centrifugal fan.

[0040] In the present utility model, as Figure 2 shown, the air outlet radiator 50 includes a plurality of spaced-apart heat dissipation fins, and ventilation channels are respectively formed between two adjacent heat dissipation fins; the air inlet heat conduction structure 70 and the optical machine heat conduction structure 90 are respectively inserted into the air outlet radiator 50.

[0041] In some other embodiments, the air outlet radiator 50 can also be configured in the structure of the air inlet radiator 40, which can ensure that the air blown out of the air outlet of the fan 30 smoothly passes through the air outlet radiator 50 and the air outlet 11 and is discharged to the outside of the housing 10.

[0042] In the present utility model, as Figure 1 shown, the air inlet 12 includes a plurality of air intake holes, and the plurality of air intake holes are arranged vertically and horizontally to form a rectangular shape or a circular shape. Of course, the air inlet 12 can also be configured as follows, including a plurality of spaced air intake long through holes.

[0043] As Figure 1 shown, the air outlet 11 includes a plurality of spaced air outlet long through holes. Of course, the air outlet 11 can also be configured as follows, including a plurality of spaced air outlet holes, and the plurality of air outlet holes are arranged vertically and horizontally to form a rectangular shape or a circular shape.

[0044] The above are only some embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A projector, characterized in that: It includes a shell, which is provided with an air outlet and an air inlet; a mainboard, a projection light engine and a fan respectively fixed inside the shell, the projection light engine and the fan are respectively electrically connected to the mainboard, and the air outlet of the fan is arranged corresponding to the air outlet; it also includes an air outlet radiator fixed inside the shell and arranged between the air outlet and the air outlet of the fan, an optical machine heat-conducting structure connected between the projection light engine and the air outlet radiator, an air inlet radiator fixed inside the shell and arranged at the air inlet, a semiconductor cooling sheet attached to the air inlet radiator and an air inlet heat-conducting structure connected between the semiconductor cooling sheet and the air outlet radiator, and the semiconductor cooling sheet is electrically connected to the mainboard.

2. The projector according to claim 1, characterized in that The air inlet radiator is attached to the inner side wall of the shell around the air inlet.

3. The projector according to claim 2, characterized in that: The air inlet heat sink includes a ring body, and a plurality of partitions arranged inside the ring body. The plurality of partitions extend along the axial direction of the ring body respectively, and the plurality of partitions are arranged in sequence at intervals along the axial direction vertical to the ring body to divide the interior of the ring body into a plurality of ventilation channels; the semiconductor refrigeration sheet is attached to the outer side of the ring body.

4. The projector according to claim 3, characterized in that: The ring body is configured in a rectangular shape, and each of the partitions is respectively connected between a first side wall and a second side wall on opposite sides of the ring body; the semiconductor refrigeration sheet is attached to the first side wall or the second side wall.

5. The projector according to claim 3, characterized in that: Mounting plates are respectively arranged at two opposite sides of the outside of the ring body.

6. The projector according to claim 1, characterized in that: An air inlet heat dissipation substrate is attached to the side of the semiconductor refrigeration plate away from the air inlet heat sink, and the air inlet heat conduction structure is attached to the side of the air inlet heat dissipation substrate away from the semiconductor refrigeration plate corresponding to the air inlet side, and is attached to the air outlet heat sink or inserted into the air outlet heat sink corresponding to the air outlet side.

7. The projector according to claim 1, characterized in that: A DMD heat sink is attached to the outside of the projection optical machine at a position corresponding to the DMD chip of the projection optical machine, and a heat dissipation substrate of the projection optical machine is attached to the light source of the projection optical machine. The heat conductive structure of the optical machine is attached to the heat dissipation substrate of the projection optical machine at one side corresponding to the projection optical machine, and is attached to the air outlet heat sink at one side corresponding to the air outlet or is inserted into the air outlet heat sink.

8. The projector according to claim 1, characterized in that: The air outlet heat sink comprises a plurality of heat sink fins arranged at intervals, and ventilation channels are respectively formed between two adjacent heat sink fins; the air inlet heat conduction structure and the optical machine heat conduction structure are respectively inserted into the air outlet heat sink.

9. The projector according to any one of claims 1 to 8, characterized in that: The air inlets are respectively provided on the side walls of the shell located on the left and right sides of the projection light machine, and the air inlet radiator, the semiconductor refrigeration sheet attached to the air inlet radiator, and the air inlet heat conduction structure connected between the semiconductor refrigeration sheet and the air outlet radiator are respectively provided inside the shell corresponding to the air inlet on each side.

10. The projector according to claim 9, characterized in that The fan is arranged between the air inlets on both sides, and the projection light engine is arranged corresponding to the air inlet of the fan.

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