Notebook computer radiator

Abstract

The utility model discloses a notebook computer radiator, a heating device is arranged on a notebook computer, the notebook computer radiator comprises a heat conduction assembly and a fan installation frame, the heat conduction assembly covers the heating device, the fan installation frame is connected with the heat conduction assembly, heat dissipation fins are arranged on the heat conduction assembly, and the fan installation frame is connected with the heat conduction assembly. A cooling fan is arranged on the fan mounting frame, an air inlet hole and a first air outlet hole are formed in the fan mounting frame, and the cooling fins are connected with the first air outlet hole; a second air outlet hole is formed in the side, close to the heating device, of the fan installation frame, and air blown out of the cooling fan can penetrate through the second air outlet hole and then is blown to the heating device. According to the utility model, the fan mounting rack is provided with the second air outlet holes, so that the air blown out by the cooling fan can be directly blown to the heating device, the cooling of the heating device is accelerated, the cooling efficiency can be effectively improved, and the use requirements of high-performance products are met.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, and particularly relates to a notebook computer radiator. Background Art

[0002] With the miniaturization and high integration of chips, the local heat flux density will increase significantly. The improvement of computing power and speed brings huge power consumption and heat generation. The problem of chip heating is one of the main factors restricting the development of high-computing-power chips. Currently, the entire consumer electronics chip industry has actually entered a strange circle of "substantially improved performance and rapidly rising power consumption", showing a trend of "exchanging power consumption for performance". People's demands for the quality of notebook computers are getting higher and higher, and the heat dissipation of notebook computers is an important indicator. On the one hand, the heat dissipation performance affects people's usage experience, and on the other hand, too high a temperature will also accelerate the wear rate of various components in the notebook computer.

[0003] Common existing notebook computer radiators generally use a heat conduction substrate for heat conduction, and then use a fan to dissipate heat from the heat dissipation fins on the heat conduction substrate. The fan cannot directly blow air onto the heat-generating device, resulting in relatively low heat dissipation efficiency. Summary of the Utility Model

[0004] In order to solve some or all of the problems existing in the above-mentioned prior art, the utility model provides a notebook computer radiator. There is a heat-generating device on the notebook computer. The notebook computer radiator includes a heat conduction component and a fan mounting bracket. The heat conduction component covers the heat-generating device. The fan mounting bracket is connected to the heat conduction component. The heat conduction component is provided with heat dissipation fins. The fan mounting bracket is provided with a heat dissipation fan. The fan mounting bracket is provided with an air inlet hole and a first air outlet hole. The heat dissipation fins are connected to the first air outlet hole. A second air outlet hole is provided on one side of the fan mounting bracket close to the heat-generating device. The air blown out by the heat dissipation fan can blow towards the heat-generating device after passing through the second air outlet hole.

[0005] As a further improvement of the utility model, the notebook computer radiator further includes a heat pipe vapor chamber, which covers the heat-generating device and is connected to the heat conduction component. The air blown out by the heat dissipation fan can blow towards the heat pipe vapor chamber after passing through the second air outlet hole.

[0006] As a further improvement of the utility model, the fan mounting bracket is provided with heat insulation cotton, which is arranged between the air inlet hole and the second air outlet hole. The heat insulation cotton is hermetically connected to the notebook computer and is used to block the hot air on the heat-generating device from being inhaled into the heat dissipation fan.

[0007] As a further improvement of the present utility model, the heat conduction component includes a heat conduction substrate and a heat conduction tube. The heat conduction substrate covers the heat generating device, one end of the heat conduction tube is connected to the heat conduction substrate, and the other end is connected to the heat dissipation fins.

[0008] As a further improvement of the present utility model, there are two fan mounting brackets, and the heat dissipation fans are provided on each fan mounting bracket.

[0009] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0010] The present utility model not only retains the function of cooling the heat dissipation fins through the heat dissipation fan, but also, by providing a second air outlet hole on the fan mounting bracket, enables the air blown out by the heat dissipation fan to directly blow onto the heat generating device after passing through the second air outlet hole, thereby accelerating the heat dissipation of the heat generating device, effectively improving the heat dissipation efficiency, and meeting the usage requirements of high-performance products. Description of the Drawings

[0011] In order to more clearly illustrate the solutions in the present utility model or the prior art, the following will give a brief introduction to the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0012] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0013] Figure 2 It is a schematic diagram of the exploded structure of an embodiment of the present utility model. Detailed Embodiments

[0014] Unless otherwise defined, all technical and scientific terms used in the present utility model have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs; the terms used in the description are only for the purpose of describing specific embodiments and are not intended to limit the present utility model; the terms "including" and "having" and any variations thereof in the description and claims of the present utility model and the above description of the drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the description and claims of the present utility model or the above drawings are used to distinguish different objects and not to describe a specific order.

[0015] References to "embodiments" in the present utility model mean that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present utility model. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an exclusive, independent, or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present utility model can be combined with other embodiments.

[0016] In order to enable those skilled in the art of the present technology to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

[0017] As Figure 1-2 shown, a notebook computer radiator is provided. A heating device, such as a motherboard chip, etc., is installed on the notebook computer. The notebook computer radiator is used to dissipate heat from the heating device, thereby extending the service life of the heating device. The notebook computer radiator includes a heat conduction component and a fan mounting bracket 1. The heat conduction component covers the heating device and is used to conduct the heat generated by the operation of the heating device. The fan mounting bracket 1 is fixedly connected to the heat conduction component. Heat dissipation fins 2 are installed on the heat conduction component. By providing the heat dissipation fins 2, the heat dissipation area can be increased, thereby improving the heat dissipation efficiency. A heat dissipation fan 3 is installed on the fan mounting bracket 1. The fan mounting bracket 1 is provided with an air inlet hole 11 and a first air outlet hole 12. The heat dissipation fins 2 are connected to the first air outlet hole 12. When the heat dissipation fan 3 operates, air can be inhaled from the air inlet hole 11 and blown out in the direction of the first air outlet hole 12. In this embodiment, the heat dissipation fan 3 is a fan that inhales air from both end faces and blows air to the side. The air inlet holes 11 are respectively arranged on the front and rear end faces of the fan mounting bracket 1, and the first air outlet hole 12 is arranged on the side edge of one side of the fan mounting bracket 1.

[0018] When the notebook computer radiator operates, the heat generated by the operation of the heating device will be conducted to the heat dissipation fins 2 through the heat conduction component. When the heat dissipation fan 3 operates, the air outside the air inlet hole 11 flows into the air inlet hole 11, and then is blown out through the first air outlet hole 12 to the heat dissipation fins 2, taking away the heat on the heat dissipation fins 2 and reducing the temperature of the heat dissipation fins 2. With the continuous operation of the heat dissipation fan 3, the purpose of dissipating heat from the heating device is achieved.

[0019] A second air outlet hole 13 is provided on the side of the fan mounting bracket 1 close to the heating device. The air blown out by the heat dissipation fan 3 can pass through the second air outlet hole 13 and then blow towards the heating device. When the heat dissipation fan 3 operates, the external air flows into the fan mounting bracket 1 through the air inlet hole 11. Part of the air is blown out through the first air outlet hole 12 to dissipate heat from the heat dissipation fins 2, and another part of the air will be blown out through the second air outlet hole 13 to the heating device, thereby directly blowing air on the heating device to achieve the purpose of dissipating heat from the heating device and reducing its temperature.

[0020] This laptop cooler not only retains the function of cooling the heat dissipation fins 2 through the cooling fan 3, but also, by providing a second air outlet hole 13 on the fan mounting bracket 1, enables the air blown out by the cooling fan 3 to be directly blown onto the heat-generating device, thereby accelerating the heat dissipation of the heat-generating device, effectively improving the heat dissipation efficiency, and meeting the usage requirements of high-performance products.

[0021] To further improve the heat dissipation performance, this laptop cooler further includes a heat pipe vapor chamber 4. The heat pipe vapor chamber 4 can be any existing one, and its thermal conductivity is much greater than that of an ordinary copper plate. The heat pipe vapor chamber 4 covers the heat-generating device, is connected to the heat conduction component, and the air blown out by the cooling fan 3 can blow towards the heat pipe vapor chamber 4 after passing through the second air outlet hole 13. During operation, the heat generated by the heat-generating device is conducted to the heat pipe vapor chamber 4, then conducted to the heat conduction component through the heat pipe vapor chamber 4, and further conducted to the heat dissipation fins 2. By providing the heat pipe vapor chamber 4, the heat on the heat-generating device can be conducted to the heat dissipation fins 2 faster, and the heat dissipation area is also increased, thereby improving the heat dissipation efficiency. Moreover, the air blown out by the cooling fan 3 can also directly blow onto the heat pipe vapor chamber 4 through the second air outlet hole 13, further improving the heat dissipation efficiency.

[0022] To prevent the hot air on the heat-generating device from being sucked into the cooling fan 3, a heat insulation cotton 5 is provided on the fan mounting bracket 1. The heat insulation cotton 5 is arranged between the air inlet hole 11 and the second air outlet hole 13, and is hermetically connected to the laptop. The heat insulation cotton 5 is used to block the hot air on the heat-generating device from being sucked into the cooling fan 3. By providing the heat insulation cotton 5, the air inlet hole 11 and the second air outlet hole 13 are isolated from each other, preventing the air blown out from the second air outlet hole 13 from flowing back into the fan mounting bracket 1 through the air inlet hole 11. The hot air and the cold air can be isolated, ensuring that the air blown out by the cooling fan 3 is always cold air, and improving the heat dissipation stability.

[0023] The heat conduction component includes a heat conduction substrate 6 and a heat conduction tube 7. The heat conduction substrate 6 covers the heat-generating device and can conduct out the heat generated during the operation of the heat-generating device. One end of the heat conduction tube 7 is connected to the heat conduction substrate 6, and the other end is connected to the heat dissipation fins 2. Through the heat conduction tube 7, the heat on the heat conduction substrate 6 can be conducted to the heat dissipation fins 2. Through the cooperation of the heat conduction substrate 6 and the heat conduction tube 7, the heat generated by the heat-generating device can be smoothly conducted to the heat dissipation fins 2, so that the cooling fan 3 can blow air to cool the heat dissipation fins 2, achieving the purpose of cooling the heat-generating device.

[0024] In this embodiment, there are two fan mounting brackets 1, and a cooling fan 3 is installed on each fan mounting bracket 1. The two fan mounting brackets 1 are respectively installed on the left and right sides of the heat generating device, so that the two cooling fans 3 can blow air on both sides of the heat generating device, improving the heat dissipation performance. In other embodiments, the number of the fan mounting brackets 1 and the cooling fans 3 can also be any other number.

[0025] The above specific implementation manner is the preferred implementation manner of the present utility model, and does not limit the specific implementation scope of the present utility model. The scope of the present utility model includes but is not limited to this specific implementation manner. All equivalent changes made in accordance with the present utility model are within the protection scope of the present utility model.

Claims

1. A notebook computer radiator, wherein the notebook computer is provided with a heating device, characterized in that: The notebook computer radiator comprises a heat conducting component and a fan mounting frame, wherein the heat conducting component covers the heating device, the fan mounting frame is connected to the heat conducting component, the heat conducting component is provided with a heat dissipation fin, the fan mounting frame is provided with a heat dissipation fan, the fan mounting frame is provided with an air inlet and a first air outlet, and the heat dissipation fin is connected to the first air outlet; A second air outlet is provided on one side of the fan mounting frame close to the heating device, and the air blown out by the heat dissipation fan can pass through the second air outlet and then blow toward the heating device.

2. The notebook computer radiator according to claim 1, characterized in that: The notebook computer radiator also includes a vapor chamber, which covers the heating device and is connected to the heat-conducting component. The air blown out by the cooling fan can be blown toward the vapor chamber after passing through the second air outlet.

3. The notebook computer radiator according to claim 1, characterized in that: The fan mounting frame is provided with heat insulating cotton, which is arranged between the air inlet and the second air outlet, and is sealed with the laptop computer. The heat insulating cotton is used to prevent hot air on the heating device from being sucked into the cooling fan.

4. The notebook computer radiator according to any one of claims 1 to 3, characterized in that: The heat-conducting assembly comprises a heat-conducting substrate and a heat-conducting pipe. The heat-conducting substrate covers the heating device. One end of the heat-conducting pipe is connected to the heat-conducting substrate, and the other end is connected to the heat-dissipating fin.

5. The notebook computer radiator according to claim 4, characterized in that: There are two fan mounting frames, and each fan mounting frame is provided with the heat dissipation fan.

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