Tin dispensing equipment for semiconductor production

By introducing an automatic tin smoke treatment structure into the semiconductor production point tin equipment, the impact of toxic substances in tin smoke on human health during point tin processing is solved, effective smoking and purification of flue gas is achieved, and the safety of the processing environment is improved.

CN222939863UActive Publication Date: 2025-06-03SEMI CONDUCTOR RES INST SHANDONG
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Patent Information

Application Number
CN202421311136.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-11
Publication Date
2025-06-03
Estimated Expiration
2034-06-11

AI Technical Summary

Technical Problem

During the semiconductor dot processing process, the tin smoke produced contains toxic substances. Long-term inhalation will affect human health and affect processing safety.

Method used

A semiconductor production point tin equipment is designed, equipped with an automatic point tin flue gas treatment structure, including a feeding conveyor belt, door-type bracket, multi-end point tin machine, telescopic hydraulic cylinder, guide rail frame and flue gas suction purification assembly. The flue gas suction purification component generates negative pressure through the pumping fan, sucks the flue gas generated when the point tin is sucked, and purifies it by purifying the filter filler in the purifying filter box.

Benefits of technology

Effectively suck and purify the flue gas generated during point tin processing, remove harmful substances, improve the safety of the processing environment, and protect the health of workers.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses semiconductor production tin soldering equipment which comprises a processing table, a tin soldering device, a tin soldering device and a tin soldering device. The processing table is provided with an automatic tin soldering flue gas treatment structure. The utility model relates to the technical field of semiconductor processing equipment, in particular to an automatic tin soldering flue gas treatment structure which comprises a feeding conveying belt, a door-shaped support, a multi-end tin soldering machine, two pairs of telescopic hydraulic cylinders, two pairs of guide rail frames and a flue gas suction and purification assembly. The inhaled tin smoke is harmful, the tin smoke is mainly small particles and steam generated by oxidation of tin during welding or soldering iron heating, the small particles and the steam may contain toxic substances such as tin oxide and other metal compounds, and long-time inhaling of the tin smoke can affect human health. Symptoms such as respiratory tract discomfort, headache and weakness can be caused, and the processing safety is influenced.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, and particularly relates to a semiconductor production tin - dotting device. Background Technique

[0002] Semiconductor is an electronic material with properties between those of conductors and insulators. Its conductivity is between that of metals (good conductors) and non - metals (insulators). Semiconductors play a crucial role in modern electronic technology. Due to their properties, semiconductors are widely used in fields such as electronic devices, integrated circuits, and optoelectronic devices. When existing semiconductors are subjected to tin - dotting processing, tin fumes are generated, and inhaling tin fumes is harmful. Tin fumes are mainly tiny particles and vapors produced by the oxidation of tin during soldering or when the soldering iron is heated. These tiny particles and vapors may contain toxic substances such as tin oxide and other metal compounds. Prolonged inhalation of tin fumes can affect human health, potentially causing symptoms such as respiratory discomfort, headache, and fatigue, thus affecting processing safety. Content of the Utility Model

[0003] To achieve the above - mentioned purposes, the utility model is realized through the following technical solutions: A semiconductor production tin - dotting device, comprising: a processing table, on which an automatic tin - dotting flue gas treatment structure is installed;

[0004] The automatic tin - dotting flue gas treatment structure includes: a loading conveyor belt, a gantry bracket, a multi - point tin - dotting machine, two pairs of telescopic hydraulic cylinders, two pairs of guiding track frames, and a flue gas suction and purification assembly;

[0005] The loading conveyor belt is installed on the upper wall surface of the processing table, the gantry bracket is installed outside the loading conveyor belt, the multi - point tin - dotting machine is installed on the inner upper wall surface of the gantry bracket, two pairs of telescopic hydraulic cylinders are installed on the gantry bracket, the output ends of the two pairs of telescopic hydraulic cylinders are installed on the multi - point tin - dotting machine, two pairs of guiding track frames are installed on the inner side wall surfaces of both sides of the gantry bracket, the multi - point tin - dotting machine is movably installed in the two pairs of guiding track frames, and the flue gas suction and purification assembly is installed on the gantry bracket and the processing table.

[0006] Preferably, support legs are installed on the lower wall surface of the processing table.

[0007] Preferably, the two pairs of telescopic hydraulic cylinders are installed on the multi - point tin - dotting machine through connecting frames.

[0008] Preferably, the flue gas suction and purification assembly includes: a pair of suction hoppers, a pair of exhaust pipes, a negative - pressure exhaust box, a pair of suction fans, a pair of purification filter boxes, and filter packing;

[0009] A pair of air extraction drawers are installed on a portal bracket. One end of a pair of exhaust pipes is installed on the pair of air extraction drawers. A negative pressure exhaust box is installed on the lower wall surface of the processing table. A pair of air extraction fans are installed on the negative pressure exhaust box. A pair of purification and filtration boxes are installed on both sides of the negative pressure exhaust box. The other end of the pair of exhaust pipes is installed on the pair of purification and filtration boxes. Filter fillers are filled in the pair of purification and filtration boxes.

[0010] Preferably, a pair of air extraction fans are installed on the negative pressure exhaust box through fixing bolts.

[0011] Preferably, flow guiding plates are installed inside the pair of purification and filtration boxes.

[0012] Beneficial effects

[0013] The utility model provides a semiconductor production tin - spotting device, which has the following beneficial effects: This solution uses an automatic tin - spotting flue gas treatment structure. The semiconductor is tin - spot welded through an automatic feeding tin - spotting structure. At the same time, when the welding process is carried out, the flue gas generated during tin - spotting is suctioned, and the flue gas is purified to ensure the safety of the processing environment. It solves the problem that existing semiconductors generate tin fume during tin - spotting processing. Inhaling tin fume is harmful. Tin fume is mainly composed of tiny particles and vapors generated by the oxidation of tin during welding or when the soldering iron is heated. These tiny particles and vapors may contain toxic substances such as tin oxide and other metal compounds. Prolonged inhalation of tin fume will affect human health, possibly causing respiratory discomfort, headache, fatigue and other symptoms, and affecting the safety of processing. Description of the drawings

[0014] Figure 1 It is a three - dimensional structure schematic diagram of a semiconductor production tin - spotting device described in the utility model.

[0015] Figure 2 It is a front - view structure schematic diagram of a semiconductor production tin - spotting device described in the utility model.

[0016] Figure 3 It is a side - view structure schematic diagram of a semiconductor production tin - spotting device described in the utility model.

[0017] Figure 4 It is a side - view cross - sectional structure schematic diagram of the purification and filtration box of a semiconductor production tin - spotting device described in the utility model.

[0018] Figure 5 It is an enlarged structure schematic diagram of the fixing bolt of a semiconductor production tin - spotting device described in the utility model.

[0019] In the figure: 1 - processing table; 2 - loading conveyor belt; 3 - gantry bracket; 4 - multi - endpoint tin machine; 5 - telescopic hydraulic cylinder; 6 - guiding track frame; 7 - support leg; 8 - connecting frame; 9 - air extraction hopper; 10 - exhaust pipe; 11 - negative - pressure exhaust box; 12 - air extraction fan; 13 - purification and filtration box; 14 - filtration filler; 15 - fixing bolt; 16 - deflector plate. Detailed implementation mode

[0020] Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Embodiment: Please refer to Figures 1-5 , the present utility model provides a technical solution: a semiconductor production tin - dotting device. Considering that when semiconductor is tin - dotted and welded, fumes will be generated, and the fumes contain a large amount of oxides, organic volatiles and metal vapors. Directly dispersing into the air will affect the health of the staff and the processing safety. Based on the above, the following technical means are set in this case;

[0022] Specifically, this device at least includes a processing table 1, a loading conveyor belt 2, a gantry bracket 3, a multi - endpoint tin machine 4, two pairs of telescopic hydraulic cylinders 5, two pairs of guiding track frames 6 and a fume suction and purification assembly. The loading conveyor belt 2 is installed above the processing table 1 for the loading and movement of semiconductors, and cooperates with the multi - endpoint tin machine 4 for tin - dotting processing;

[0023] More specifically, the fume suction and purification assembly includes: a pair of air extraction hoppers 9, a pair of exhaust pipes 10, a negative - pressure exhaust box 11, a pair of air extraction fans 12, a pair of purification and filtration boxes 13 and a filtration filler 14. By the air extraction fans 12, the air inside the negative - pressure exhaust box 11 is exhausted to generate negative pressure, so that the fumes generated during tin - dotting are inhaled through the air extraction hoppers 9 and the exhaust pipes 10 and transported to the purification and filtration box 13, and are purified by the filtration filler 14 in the purification and filtration box 13, and the harmful substances in the fumes are filtered and adsorbed, thus realizing the suction and purification of the fumes.

[0024] Furthermore, the loading conveyor belt 2 is installed on the upper wall surface of the processing table 1, the gantry bracket 3 is installed outside the loading conveyor belt 2, the multi - endpoint tin machine 4 is installed on the inner upper wall surface of the gantry bracket 3, two pairs of telescopic hydraulic cylinders 5 are installed on the gantry bracket 3, the output ends of the two pairs of telescopic hydraulic cylinders 5 are installed on the multi - endpoint tin machine 4, two pairs of guiding track frames 6 are installed on the inner side walls of both sides of the gantry bracket 3, the multi - endpoint tin machine 4 is movably embedded on the two pairs of guiding track frames 6, and the fume suction and purification assembly is installed on the gantry bracket 3 and the processing table 1;

[0025] A pair of air extraction drawers 9 are installed on the portal bracket 3. One end of a pair of exhaust pipes 10 is installed on the pair of air extraction drawers 9. The negative pressure exhaust box 11 is installed on the lower wall surface of the processing table 1. A pair of air extraction fans 12 are installed on the negative pressure exhaust box 11. A pair of purification and filtration boxes 13 are installed on both sides of the negative pressure exhaust box 11. The other end of the pair of exhaust pipes 10 is installed on the pair of purification and filtration boxes 13. The filtering filler 14 is filled in the pair of purification and filtration boxes 13.

[0026] In the specific implementation process, further, support legs 7 are installed on the lower wall surface of the processing table 1.

[0027] In the specific implementation process, further, two pairs of telescopic hydraulic cylinders 5 are installed on the multi-point soldering machine 4 through the connecting frame 8.

[0028] In the specific implementation process, further, a pair of air extraction fans 12 are installed on the negative pressure exhaust box 11 through the fixing bolts 15.

[0029] In the specific implementation process, further, flow guiding plates 16 are installed inside the pair of purification and filtration boxes 13.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor production tinning device, comprising: The processing table (1) is characterized in that an automatic tinning fume treatment structure is installed on the processing table (1); The automatic tinning fume treatment structure comprises: a feeding conveyor belt (2), a door-shaped bracket (3), a multi-end tinning machine (4), two pairs of telescopic hydraulic cylinders (5), two pairs of guide rail frames (6) and a fume suction purification component; A feeding conveyor belt (2) is mounted on the upper wall surface of a processing table (1), a door-shaped bracket (3) is mounted on the outer side of the feeding conveyor belt (2), a multi-end tinning machine (4) is mounted on the inner upper wall surface of the door-shaped bracket (3), two pairs of telescopic hydraulic cylinders (5) are mounted on the door-shaped bracket (3), output ends of the two pairs of telescopic hydraulic cylinders (5) are mounted on the multi-end tinning machine (4), two pairs of guide rail frames (6) are mounted on the inner side wall surfaces of the door-shaped bracket (3), the multi-end tinning machine (4) is movably embedded in the two pairs of guide rail frames (6), and a smoke extraction and purification component is mounted on the door-shaped bracket (3) and the processing table (1); The smoke extraction and purification component comprises: a pair of suction hoppers (9), a pair of exhaust pipes (10), a negative pressure exhaust box (11), a pair of exhaust fans (12), a pair of purification filter boxes (13) and filter fillers (14); A pair of exhaust hoppers (9) are embedded in the door-shaped bracket (3), one end of a pair of exhaust pipes (10) is installed on the pair of exhaust hoppers (9), a negative pressure exhaust box (11) is installed on the lower wall of the processing table (1), a pair of exhaust fans (12) are installed on the negative pressure exhaust box (11), a pair of purification filter boxes (13) are installed on both sides of the negative pressure exhaust box (11), the other end of the pair of exhaust pipes (10) is installed on the pair of purification filter boxes (13), and filter fillers (14) are filled on the pair of purification filter boxes (13).

2. The semiconductor production tinning equipment according to claim 1, characterized in that: Support legs (7) are installed on the lower wall surface of the processing table (1).

3. The semiconductor production tinning equipment according to claim 1, characterized in that: Two pairs of telescopic hydraulic cylinders (5) are installed on a multi-end tinning machine (4) through a connecting frame (8).

4. The semiconductor production tinning equipment according to claim 1, characterized in that: A pair of exhaust fans (12) are mounted on the negative pressure exhaust box (11) via fixing bolts (15).

5. The semiconductor production tinning equipment according to claim 1, characterized in that: A pair of purification filter boxes (13) are internally provided with guide plates (16).