Chip vacuum film pressing device

Abstract

The utility model discloses a chip vacuum film pressing device which comprises a sliding table part, the sliding table part comprises a substrate and a sliding driving piece arranged on the upper end face of the substrate, the sliding driving piece is provided with a negative pressure lower groove block piece used for film pressing, and the two ends of the substrate are provided with limiting pieces used for positioning the negative pressure lower groove block piece; the pressing table part comprises a supporting table arranged at the rear end of the upper end face of the base plate and an upper groove pressing piece arranged on the supporting table; the film pressing device has the advantages that through mechanical film pressing, tight fitting is achieved, the sealing performance is improved, vacuumizing is better facilitated, the lower groove block used for containing the chip can move front and back and can be moved out from the lower portion of the pressing table part, and the chip obtained after film pressing is completed can be conveniently taken out from the lower groove block.

Description

Technical Field

[0001] The utility model relates to the technical field of film covering, in particular to a chip vacuum film pressing device. Background Art

[0002] Film pressing generally refers to pressing a film onto a substrate. Existing film pressing devices usually position the film and the substrate in a vacuum chamber and then perform film pressing in a vacuum environment. Chinese Patent Publication No.: CN212991052U discloses a chip manufacturing vacuum film covering device, including a workbench, a film pressing frame and an air extraction chamber. An air extraction chamber is opened inside the workbench. The bottom of the air extraction chamber is connected with a three-way valve through a threaded groove. One end of the bottom of the three-way valve is connected with an electromagnetic valve through a threaded groove. One end of the bottom of the workbench is installed with an air extraction pump through a mounting frame. A reserved groove is opened at the top of the workbench. A chip groove is opened at the bottom of the reserved groove. Mesh plates are installed on both sides of the chip groove through mounting grooves. However, the above device has the following defects in use:

[0003] 1. Place the chip in the chip groove of the workbench and perform film covering operation by manually lowering the film pressing frame. The sealing performance of manual pressing is low.

[0004] 2. After film pressing is completed, the film pressing frame is located above the workbench, making it inconvenient to take out the chip. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is that the existing film covering operation has low sealing performance with manual pressing, and it is inconvenient to take out the chip after film pressing is completed. To solve the above problems, a chip vacuum film pressing device is proposed, including

[0006] A sliding table part, which includes a substrate and a sliding driving part arranged on the upper end surface of the substrate. A negative pressure lower groove block part for film pressing is arranged on the sliding driving part. Limit parts for positioning the negative pressure lower groove block part are arranged at both ends of the substrate;

[0007] A pressing table part, which includes a support table arranged at the rear end of the upper end surface of the substrate and an upper pressing groove part arranged on the support table.

[0008] The technical solution of the present utility model is that the lower groove block of the negative pressure lower groove block part is connected to the sliding seat on the electric screw rod, so that the lower groove block can move back and forth on the substrate. When pressing the film, the electric screw rod drives the lower groove block to move below the pressing table part. After the film pressing is completed, the electric screw rod drives the lower groove block to move out from below the pressing table part, which is convenient to take out the chip after the film pressing from the lower groove block; the air cylinder is installed at the upper end of the support table, and the telescopic end of the air cylinder is connected to the sliding plate through a connecting shaft, and the upper groove block is installed on the lower end surface of the sliding plate. The air cylinder drives the sliding plate to move downward, so that the upper groove block is tightly pressed on the lower groove block. Compared with the traditional manual pressing, the pressing degree is higher and the sealing performance is better, which is more conducive to the vacuum pump for vacuum pumping treatment.

[0009] Preferably, the sliding driving member includes an electric screw rod arranged in the middle of the upper end surface of the substrate and positioning rods arranged on both sides of the upper end surface of the substrate. The sliding seat is threadedly connected to the electric screw rod, the bottom surface of the sliding seat fits with the substrate, and the slider is slidably connected to the positioning rod. The electric screw rod drives the sliding seat to move back and forth, and the slider further assists to prevent the structure connected to the sliding seat from shaking and misaligning during movement.

[0010] Preferably, the electric screw rod is parallel to the positioning rod, and the positioning rod has the same extending direction as the electric screw rod, so that the device can operate normally.

[0011] Preferably, the negative pressure lower groove block part includes a lower groove block arranged on the upper surface of the sliding seat. The lower surfaces on both sides of the lower groove block are connected to the slider. A groove for placing the chip is arranged in the lower groove block. A vacuum pump is arranged on the outer wall of one side of the lower groove block. The lower groove block slides on the sliding seat, which is convenient for completing the film pressing and also convenient for taking out the chip after moving forward. The vacuum pump is used to form a vacuum environment.

[0012] Preferably, the limiting member includes a support frame, the support frame is arranged at the front and rear ends of the upper end surface of the substrate, and a buffer limiter is arranged on the support frame. The limiting member is used to limit the position, so that the negative pressure lower groove block part and the upper pressing groove part are aligned in the vertical direction, which is convenient for subsequent film pressing.

[0013] Preferably, the support table includes a plurality of support columns arranged on the substrate. The upper ends of all the support columns are connected to the table board. The sliding plate is slidably connected to the support columns. The support table is used to support the upper pressing groove part. The sliding plate can move up and down along the support columns, so that the upper pressing groove part fits with the negative pressure lower groove block part to form a vacuum cavity under the action of the vacuum pump.

[0014] For the optimization of the technical solution of the present utility model, the upper pressing groove member includes an air cylinder disposed on the table board. A connecting shaft is provided at the telescopic end of the air cylinder, and the connecting shaft is connected to the upper end face of the sliding plate. The lower end face of the sliding plate is provided with an upper groove block. The air cylinder serves as a driving member to enable it to move up and down. The upper groove block and the lower groove block are closely attached under the action of the air cylinder.

[0015] The beneficial effects of the present utility model compared with the prior art are as follows:

[0016] In the technical solution of the present utility model, by connecting the lower groove block of the negative pressure lower groove block member to the sliding seat on the electric screw rod, the lower groove block can move back and forth on the substrate. When performing film pressing, the electric screw rod drives the lower groove block to move below the pressing table part. After the film pressing is completed, the electric screw rod drives the lower groove block to move out from below the pressing table part, facilitating the removal of the chip after film pressing from the lower groove block; by installing the air cylinder at the upper end of the support table, connecting the telescopic end of the air cylinder to the sliding plate through a connecting shaft, and installing the upper groove block on the lower end face of the sliding plate, the air cylinder drives the sliding plate to move downward, enabling the upper groove block to tightly press on the lower groove block. Compared with the traditional manual pressing, the pressing degree is higher and the sealing performance is better, which is more conducive to the vacuum pumping treatment by the vacuum pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional schematic diagram of the present utility model;

[0018] Figure 2 is a three-dimensional schematic diagram of the sliding table part of the present utility model;

[0019] Figure 3 is a three-dimensional schematic diagram of the pressing table part of the present utility model;

[0020] Among them: 100 - sliding table part, 110 - substrate, 120 - sliding drive assembly, 121 - electric screw rod, 122 - positioning rod, 123 - slider, 130 - negative pressure lower groove block member, 131 - lower groove block, 132 - groove position, 133 - vacuum pump, 140 - limiting member, 141 - support frame, 142 - buffer limiter, 200 - pressing table part, 210 - support table, 211 - support column, 212 - table board, 213 - sliding plate, 220 - upper pressing groove member, 221 - air cylinder, 222 - connecting shaft, 223 - upper groove block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The following will combine the accompanying drawings in the embodiments of the present utility model Figures 1 - 3 to describe the technical solutions in the embodiments of the present utility model in detail. Embodiment 1

[0022] As Figures 1 - 3 shown, the present utility model is a chip vacuum film pressing device, including:

[0023] The sliding table part 100, the sliding table part 100 includes a base plate 110 and a sliding driving member 120 installed on the upper end surface of the base plate 110. A negative pressure lower groove block member 130 for pressing the film is installed on the sliding driving member 120. Limit members 140 for positioning the negative pressure lower groove block member 130 are also provided at both ends of the base plate 110;

[0024] The pressing table part 200, the pressing table part 200 includes a support table 210 fixedly arranged at one end of the upper end of the base plate 110 and an upper pressing groove member 220 installed on the support table 210.

[0025] As Figure 2 shown, the sliding driving member 120 includes an electric screw rod 121. The electric screw rod 121 is fixedly installed in the middle of the upper end surface of the base plate 110. Positioning rods 122 are provided on both sides of the electric screw rod 121. The positioning rods 122 are parallel to the electric screw rod 121 and are fixedly installed on both sides of the upper end surface of the base plate 110.

[0026] A sliding seat is threadedly connected to the electric screw rod 121. The bottom surface of the sliding seat is in contact with the base plate 110. Therefore, when the electric screw rod 121 is started, the sliding seat will move on the electric screw rod 121, and a slider 123 is slidably connected to the positioning rod 122.

[0027] The negative pressure lower groove block member 130 includes a lower groove block 131. The lower groove block 131 is fixedly installed on the sliding seat on the electric screw rod 121. The bottom parts on both sides of the lower groove block 131 are fixedly connected to the slider 123. The lower groove block 131 is in the shape of an uncovered box, and a platform protrudes in the middle of its interior. A groove 132 for placing the chip is concavely formed on the upper end surface of the platform. A vacuum pump 133 is fixedly installed on the side wall of the lower groove block 131. The vacuum pump 133 evacuates the interior of the lower groove block 131 to form a negative pressure when pressing the film.

[0028] After the electric screw rod 121 is started, the lower groove block 131 moves together with the sliding seat, and the slider 123 further assists in the movement to prevent shaking. When pressing the film, the electric screw rod 121 drives the lower groove block 131 to move below the pressing table part 200. After the film pressing is completed, the electric screw rod 121 drives the lower groove block 131 to move out from below the pressing table part 200, which is convenient for taking out the chip after the film pressing from the lower groove block 131.

[0029] The limit member 140 includes a support frame 141. The support frame 141 is fixedly installed at the front and rear ends of the upper end surface of the base plate 110. Buffer limiters 142 are fixedly installed on the support frames 141. The buffer limiters 142 can limit the position when the lower groove block 131 moves. The limit member 140 at the rear end enables the lower groove block 131 to be aligned with the upper groove block 223 when moving below the upper pressing groove member 220, facilitating the completion of the film pressing operation. The limit member 140 at the front end enables the lower groove block 131 after the film pressing to move to the outermost side, facilitating the taking out of the chip.

[0030] As Figure 3 shown, the support platform 210 includes a platform plate 212. The four sides of the bottom of the platform plate 212 are fixedly supported by welding to the support columns 211. The bottoms of the support columns 211 are fixedly welded to the rear end of the substrate 110. The four sides of the sliding plate 213 pass through the support columns 211 and can move up and down in the vertical direction.

[0031] The upper pressing groove member 220 includes a pneumatic cylinder 221. The fixed end of the pneumatic cylinder 221 is installed on the platform plate 212. The telescopic end of the pneumatic cylinder 221 is fixedly connected to the connecting shaft 222. The connecting shaft 222 is fixedly connected to the upper end surface of the sliding plate 213. Under the action of the pneumatic cylinder 221, the sliding plate 213 can be driven to move up and down. The lower end surface of the sliding plate 213 is fixedly installed with an upper groove block 223.

[0032] When the negative pressure lower groove block member 130 moves backward under the action of the sliding driving member 120 until it fits with the rear limiting member 140, at this time, the lower groove block 131 of the negative pressure lower groove block member 130 is directly below the upper groove block 223 of the upper pressing groove member 220. Under the action of the pneumatic cylinder 221, the sliding plate 213 moves downward, pressing the upper groove block 223 onto the lower groove block 131 to make them fit tightly. Compared with the traditional manual pressing, the pressing degree is higher, the sealing performance is better, and it is more conducive to the vacuum pump 133 to carry out vacuum pumping treatment.

[0033] A method for using a chip vacuum laminating device according to this embodiment is as follows:

[0034] First, by starting the electric lead screw 121, drive the negative pressure lower groove block member 130 to move forward until it fits with the front limiting member 140. Place the chip on the inner slot 132 of the lower groove block 131 of the negative pressure lower groove block member 130. Then start the electric lead screw 121 again to drive the negative pressure lower groove block member 130 to move backward until it fits with the rear limiting member 140. At this time, the lower groove block 131 of the negative pressure lower groove block member 130 is directly below the upper groove block 223 of the upper pressing groove member 220. Then start the pneumatic cylinder 221 to make the upper groove block 223 move downward and fit tightly with the lower groove block 131. Then start the vacuum pump 133 to carry out vacuum pumping treatment between the upper groove block 223 and the lower groove block 131.

[0035] After completing the vacuum lamination, turn off the vacuum pump 133, inject air to restore the normal air pressure, start the pneumatic cylinder 221 to make the upper groove block 223 move upward, and at the same time start the electric lead screw 121 to make the lower groove block 131 move forward to facilitate the removal of the laminated chip.

[0036] The above embodiments are only used to illustrate the technical idea of the present utility model, and the protection scope of the present utility model cannot be limited thereby. Any modification made on the basis of the technical solution according to the technical idea proposed by the present utility model falls within the protection scope of the present utility model.

Claims

1. A chip vacuum lamination device, characterized in that: include A sliding platform (100), the sliding platform (100) comprising a base plate (110) and a sliding driving member (120) arranged on an upper end surface of the base plate (110), a negative pressure lower groove block (130) for laminating is arranged on the sliding driving member (120), and limiting members (140) for positioning the negative pressure lower groove block (130) are arranged at both ends of the base plate (110); The pressing platform part (200) comprises a support platform (210) arranged at the rear end of the upper end surface of the base plate (110) and an upper pressing groove member (220) arranged on the support platform (210).

2. A chip vacuum lamination device according to claim 1, characterized in that: The sliding drive member (120) comprises an electric screw (121) arranged in the middle of the upper end surface of the base plate (110) and positioning rods (122) arranged on both sides of the upper end surface of the base plate (110); the sliding seat is threadedly connected to the electric screw (121); the bottom surface of the sliding seat is in contact with the base plate (110); and the sliding block (123) is slidably connected to the positioning rods (122).

3. A chip vacuum lamination device according to claim 2, characterized in that: The electric screw rod (121) is parallel to the positioning rod (122).

4. A chip vacuum lamination device according to claim 2, characterized in that: The negative pressure lower slot block (130) comprises a lower slot block (131) arranged on the upper surface of the sliding seat, the lower surfaces of both sides of the lower slot block (131) are connected to the sliding block (123), a slot (132) for placing a chip is provided in the lower slot block (131), and a vacuum pump (133) is provided on one side outer wall of the lower slot block (131).

5. The chip vacuum lamination device according to claim 1, characterized in that: The stopper (140) comprises a support frame (141), the support frame (141) being arranged at the front and rear ends of the upper end surface of the base plate (110), and a buffer stopper (142) being arranged on the support frame (141).

6. The chip vacuum lamination device according to claim 1, characterized in that: The support platform (210) comprises a plurality of support columns (211) arranged on a base plate (110), the upper ends of all the support columns (211) being connected to a platform plate (212), and the slide plate (213) being slidably connected to the support columns (211).

7. A chip vacuum lamination device according to claim 6, characterized in that: The upper groove member (220) comprises a pneumatic cylinder (221) arranged on a table (212); a connecting shaft (222) is arranged at the telescopic end of the pneumatic cylinder (221); the connecting shaft (222) is connected to the upper end surface of the slide plate (213); and an upper groove block (223) is arranged on the lower end surface of the slide plate (213).

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