Die bonder die bonding clamp
By designing an internally clamped solid crystal fixture, using the drive motor and gear transmission system, and combining the limit blocks of the ring array, the problems of poor clamping effect and large space occupation in the prior art are solved, and stable internal clamping and efficient use of wafer disks are achieved.
Patent Information
- Application Number
- CN202421997986.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-08-19
AI Technical Summary
The clamps used to clamp wafers in existing solid crystal machines are not effective, which can easily cause wafer deflection, and the external clamping method occupies a large amount of work space, affecting actual use.
A solid crystal fixture fixture with internal clamping is designed, and the clamping assembly is clamped and fixed from the inside of the wafer disc. The drive motor and gear transmission system are used to cooperate with the limit blocks of the ring array to achieve stable clamping of the wafer disc.
The device avoids the use of work space through internal clamping, improves the stability and practicality of the clamping of the wafer, and ensures the fixedness of the wafer during the transfer process.
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Figure CN222939876U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of die bonders, in particular to a die bonding fixture for a die bonder. Background Art
[0002] The device for storing wafers in a die bonder is a wafer tray. The wafer tray is generally set as a circular disk, and wafers are densely placed on the wafer tray. Generally, the wafers are set as square. When wafers are needed, the required wafers are transferred by a negative pressure suction nozzle. During the transfer process of the wafers, it is necessary to ensure the fixation of the wafer tray to facilitate the adsorption position from shifting. The clamping device is generally a clamping plate arranged on both sides of the wafer tray. After the clamping plates on both sides move towards the wafer tray, the wafer tray is clamped to fix the wafer tray.
[0003] The application number 202211066345.8 discloses a die bonding fixture for a die bonder. The problems raised in its background art are as follows: By clamping the side wall of the wafer tray with clamping plates on both sides, the clamping effect is not good, and it is easy to cause the wafer tray to deflect. However, it has the following problems;
[0004] By energizing two electromagnets, the two second movable blocks move closer to each other, increasing the pressure of the fourth spring on the first movable block. Subsequently, the first movable block increases the outward thrust on the friction rod through the rotating rod. Since one end of the friction rod is in close contact with the outer wall of the wafer tray, after the pressure increases, the friction force of the friction rod on the wafer tray increases, thereby improving the clamping effect on the wafer tray. It fixes the wafer tray from the outside of the wafer tray, occupying a relatively large working space of the die bonder, which is not conducive to actual use and has certain deficiencies. To solve the above problems, a die bonding fixture for a die bonder is proposed. Summary of the Utility Model
[0005] The utility model provides a die bonding fixture for a die bonder, which includes a workbench. A clamping assembly is arranged on the top of the workbench, and a wafer tray is arranged outside the clamping assembly;
[0006] The clamping assembly includes a gear ring, a driving motor, a gear disk, a first mounting ring, a second mounting ring, a rack, a second gear, a third gear, a limiting block, a connecting rod, a first chute, a first slider, a through groove, and a second chute. The first mounting ring and the second mounting ring are both fixedly arranged on the top of the workbench, and the first mounting ring is located on the outer wall of the second mounting ring. The outer wall of the gear ring is slidably connected to the inner wall of the first mounting ring. The output shaft of the driving motor is in transmission connection with the lower end of the inner wall of the gear ring. The upper end of the inner wall of the gear ring is in transmission connection with the rack. The bottom of the rack is slidably connected to the tops of the first mounting ring and the second mounting ring, and the racks are arranged in a circular array. The mutually remote ends of the racks all extend outside the first mounting ring. The limiting blocks are fixedly arranged in a circular array at the ends of the racks located outside the first mounting ring. The bottoms of the limiting blocks are slidably connected to the top of the workbench.
[0007] Preferably, an installation groove is formed at the top of the workbench, the driving motor is fixedly arranged in the installation groove, a rotating shaft extending outside the installation groove is fixedly arranged on the output shaft of the driving motor, one end side wall of the rotating shaft outside the installation groove is fixedly connected to the inner wall of the toothed disc, the outer wall of the toothed disc is meshed with the lower end of the inner wall of the toothed ring, the driving motor is connected to the controller through a wire, and the side wall of the rotating shaft is rotatably connected to the inner side wall of the installation groove.
[0008] Preferably, the connecting rods are rotatably arranged on the top of the workbench in an annular array, and the connecting rods are located between the first installation ring and the second installation ring. The first gear and the second gear are arranged on the side wall of the connecting rods in an annular array. The first gear is fixedly connected to the connecting rod. The first gear is located above the second gear. The outer wall of the first gear is meshed with the side wall of the rack, and the outer wall of the second gear is meshed with the upper end of the inner wall of the toothed ring.
[0009] Preferably, the first sliding groove is formed in the inner wall of the first installation ring. A first sliding block is placed inside the first sliding groove. One side of the first sliding block away from the first sliding groove is fixedly connected to the outer wall of the toothed ring. Both the first sliding block and the first sliding groove are annularly designed.
[0010] Preferably, the through grooves are formed in the tops of the first installation ring and the second installation ring in an annular array. The second sliding grooves are formed in the bottom inner walls of the through grooves in an annular array. Second sliding blocks are placed inside the second sliding grooves respectively. The tops of the second sliding blocks are fixedly connected to the bottom of the rack respectively.
[0011] Preferably, annularly arranged third sliding grooves are formed in the top of the workbench. Third sliding blocks are placed inside the third sliding grooves respectively. The tops of the third sliding blocks are fixedly connected to the bottoms of the limiting blocks respectively.
[0012] Preferably, a groove is formed in the bottom of the crystal disc. The limiting blocks are all arc-shaped. One side of the limiting block away from the rack is adapted to the inner side wall of the groove.
[0013] Compared with the prior art, the above technical solution of the present utility model has the following beneficial technical effects:
[0014] The device clamps and fixes the crystal disc from the inside of the crystal disc through the clamping assembly, does not occupy the space outside the crystal disc on the workbench, is convenient for actual work use, and clamps and fixes the crystal disc by simultaneously driving a plurality of limiting blocks, ensuring the stability of clamping and fixing the crystal disc, and has strong practicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of a die bonder die bonding fixture proposed by the present utility model.
[0016] Figure 2Schematic diagram of the workbench and clamping assembly structure of a die bonder die clamping fixture proposed by the present utility model.
[0017] Figure 3 Schematic diagram of the clamping assembly structure of a die bonder die clamping fixture proposed by the present utility model.
[0018] Figure 4 Partial exploded structure schematic diagram of the clamping assembly of a die bonder die clamping fixture proposed by the present utility model.
[0019] Figure 5 Schematic diagram of the crystal disk and groove structure of a die bonder die clamping fixture proposed by the present utility model.
[0020] Reference numerals; 1, workbench; 2, clamping assembly; 201, gear ring; 202, drive motor; 203, gear disk; 204, first mounting ring; 205, second mounting ring; 206, rack; 207, first gear; 208, limit block; 209, second gear; 2010, connecting rod; 2011, first slider; 2012, through groove; 2013, second chute; 2014, first chute; 3, crystal disk; 4, third chute; 5, groove. Detailed implementation manners
[0021] To make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the specific implementation manners and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary and are not intended to limit the scope of the present utility model. In addition, in the following descriptions, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.
[0022] As Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 shown, a die bonder die clamping fixture proposed by the present utility model includes a workbench 1, a clamping assembly 2 is arranged on the top of the workbench 1, and a crystal disk 3 is arranged outside the clamping assembly 2.
[0023] The clamping assembly 2 includes a gear ring 201, a drive motor 202, a gear plate 203, a first mounting ring 204, a second mounting ring 205, a rack 206, a second gear 209, a third gear, a stop block 208, a connecting rod 2010, a first slide 2014, a first slider 2011, a through groove 2012, and a second slide 2013. The first mounting ring 204 and the second mounting ring 205 are both fixedly arranged on the top of the workbench 1, and the first mounting ring 204 is located on the outer wall of the second mounting ring 205, and the outer wall of the gear ring 201 and the inner wall of the first mounting ring 204 are connected. Sliding connection, the output shaft of the driving motor 202 is transmission-connected to the lower end of the inner wall of the gear ring 201, the upper end of the inner wall of the gear ring 201 is transmission-connected to the rack 206, the bottom of the rack 206 is slidingly connected to the top of the first mounting ring 204 and the second mounting ring 205, and the rack 206 is arranged in a circular array, and the ends of the rack 206 away from each other extend to the outside of the first mounting ring 204, and the limit blocks 208 are fixed in a circular array at one end of the rack 206 located outside the first mounting ring 204, and the bottom of the limit blocks 208 is slidingly connected to the top of the workbench 1.
[0024] During the specific implementation, the bottom of the wafer disk 3 is placed on the outside of the clamping assembly 2, and then the driving motor 202 is started through the controller. The output shaft of the driving motor 202 drives the rotating shaft to rotate, the rotating shaft drives the gear plate to rotate, the gear plate drives the ring gear 201 to rotate along the first slide groove 2014, and the ring gear 201 rotates while driving the second gear 209 to rotate, the second gear 209 drives the connecting rod 2010 to rotate, the connecting rod 2010 drives the first gear 207 to rotate, and the first gear 207 rotates while driving the rack 206 to move along the second slide groove 2013, and the second rack 206 drives the limit block 208 to move along the third slide groove 4, so as to adjust the position of the limit block 208, that is, the wafer disk 3 is clamped and fixed by the limit block 208.
[0025] A mounting groove is provided on the top of the workbench 1, and the drive motor 202 is fixed in the mounting groove. The output shaft of the drive motor 202 is fixed with a rotating shaft extending outside the mounting groove. The side wall of one end of the rotating shaft outside the mounting groove is fixedly connected to the inner wall of the gear plate 203, and the outer wall of the gear plate 203 is meshed with the lower end of the inner wall of the gear ring 201. The drive motor 202 is connected to the controller through a wire, and the side wall of the rotating shaft is rotatably connected to the inner wall of the mounting groove. The drive motor 202 drives the gear plate to rotate, thereby driving the gear ring 201 to rotate, which is convenient for moving the rack 206. The moving direction of the rack 206 and the limit block 208 is conveniently adjusted by the forward and reverse rotation of the output shaft of the drive motor 202.
[0026] The connecting rods 2010 are rotationally arranged in a circular array on the top of the workbench 1, and the connecting rods 2010 are located between the first mounting ring 204 and the second mounting ring 205. The first gear 207 and the second gear 209 are arranged in a circular array on the side wall of the connecting rod 2010. The first gear 207 is located on the top of the second gear 209. The first gear 207 is fixedly connected to the connecting rod 2010. The outer wall of the first gear 207 meshes with the side wall of the rack 206, and the outer wall of the second gear 209 meshes with the upper inner wall of the gear ring 201, which is convenient for driving the gear ring 201 and the rack 206 and convenient for actual use.
[0027] The first sliding groove 2014 is opened on the inner wall of the first mounting ring 204. The first sliding block 2011 is placed inside the first sliding groove 2014. The side of the first sliding block 2011 away from the first sliding groove 2014 is fixedly connected to the outer wall of the gear ring 201. Both the first sliding block 2011 and the first sliding groove 2014 are circularly designed to limit the gear ring 201 and facilitate the rotation of the gear ring 201 along the inner wall of the first mounting ring 204.
[0028] The through grooves 2012 are opened in a circular array on the tops of the first mounting ring 204 and the second mounting ring 205. The second sliding grooves 2013 are opened in a circular array on the bottom inner walls of the through grooves 2012. Second sliding blocks are placed inside the second sliding grooves 2013. The tops of the second sliding blocks are respectively fixedly connected to the bottom of the rack 206 to limit the rack 206 and ensure the stability of the movement of the rack 206.
[0029] The third sliding grooves 4 arranged in a circular array are opened on the top of the workbench 1. Third sliding blocks are placed inside the third sliding grooves 4. The tops of the third sliding blocks are respectively fixedly connected to the bottoms of the limiting blocks 208 to limit the limiting blocks 208 and ensure the stability of the movement of the limiting blocks 208.
[0030] The bottom of the crystal disk 3 is provided with a groove 5. The limiting blocks 208 are all arc-shaped. The side of the limiting block 208 away from the rack 206 is adapted to the inner side wall of the groove 5, which is convenient for the limiting and clamping of the limiting block 208.
[0031] It should be understood that the above specific embodiments of the present invention are only used for exemplary illustration or explanation of the principle of the present invention, and do not constitute a limitation to the present invention. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications falling within the scope and boundary of the appended claims, or equivalent forms of such scope and boundary.
Claims
1. A die bonding fixture for a die bonding machine, comprising a workbench (1), characterized in that: A clamping assembly (2) is arranged on the top of the workbench (1), and a wafer disk (3) is arranged on the outer side of the clamping assembly (2); The clamping assembly (2) comprises a gear ring (201), a drive motor (202), a toothed disc (203), a first mounting ring (204), a second mounting ring (205), a rack (206), a second gear (209), a third gear, a stop block (208), a connecting rod (2010), a first slide groove (2014), a first slider (2011), a through groove (2012), and a second slide groove (2013); the first mounting ring (204) and the second mounting ring (205) are both fixedly arranged on the top of the workbench (1), and the first mounting ring (204) is located on the outer wall of the second mounting ring (205); the outer wall of the gear ring (201) and the first mounting ring (205) are connected to each other. The output shaft of the driving motor (202) is transmission-connected to the lower end of the inner wall of the gear ring (201); the upper end of the inner wall of the gear ring (201) is transmission-connected to the rack (206); the bottom of the rack (206) is slidingly connected to the top of the first mounting ring (204) and the second mounting ring (205); the racks (206) are arranged in a circular array; the ends of the racks (206) that are away from each other extend outside the first mounting ring (204); the limit blocks (208) are fixedly arranged in a circular array at the ends of the racks (206) outside the first mounting ring (204); and the bottom of the limit blocks (208) is slidingly connected to the top of the workbench (1).
2. The die bonding fixture of a die bonding machine according to claim 1, characterized in that: The top of the workbench (1) is provided with a mounting groove, the drive motor (202) is fixedly arranged in the mounting groove, the output shaft of the drive motor (202) is fixedly provided with a rotating shaft extending outside the mounting groove, the side wall of one end of the rotating shaft located outside the mounting groove is fixedly connected to the inner wall of the toothed disc (203), the outer wall of the toothed disc (203) is meshed with the lower end of the inner wall of the gear ring (201), the drive motor (202) is connected to the controller via a wire, and the side wall of the rotating shaft is rotatably connected to the inner wall of the mounting groove.
3. The die bonding fixture of a die bonding machine according to claim 1, characterized in that: The connecting rod (2010) is rotatably arranged on the top of the workbench (1) in an annular array, and the connecting rod (2010) is located between the first mounting ring (204) and the second mounting ring (205). The first gear (207) and the second gear (209) are arranged on the side wall of the connecting rod (2010) in an annular array. The first gear (207) is fixedly connected to the connecting rod (2010), and the first gear (207) is located on the top of the second gear (209). The outer wall of the first gear (207) is meshed with the side wall of the rack (206), and the outer wall of the second gear (209) is meshed with the upper end of the inner wall of the ring gear (201).
4. The die bonding fixture of a die bonding machine according to claim 1, characterized in that: The first slide groove (2014) is provided on the inner wall of the first mounting ring (204), a first slider (2011) is placed inside the first slide groove (2014), a side of the first slider (2011) away from the first slide groove (2014) is fixedly connected to the outer wall of the gear ring (201), and the first slider (2011) and the first slide groove (2014) are both annular in design.
5. The die bonding fixture of a die bonding machine according to claim 1, characterized in that: The through grooves (2012) are arranged in a circular array on the top of the first mounting ring (204) and the second mounting ring (205); the second slide grooves (2013) are arranged in a circular array on the bottom inner wall of the through grooves (2012); second slide blocks are placed inside the second slide grooves (2013); and the tops of the second slide blocks are fixedly connected to the bottoms of the racks (206).
6. The die bonding fixture of a die bonding machine according to claim 1, characterized in that: The top of the workbench (1) is provided with third slide grooves (4) arranged in a circular array, and third sliding blocks are placed inside the third slide grooves (4), and the tops of the third sliding blocks are fixedly connected to the bottoms of the limit blocks (208).
7. The die bonding fixture of a die bonding machine according to claim 1, characterized in that: A groove (5) is provided at the bottom of the wafer disc (3), and the limit blocks (208) are all designed to be arc-shaped, and the side of the limit blocks (208) away from the rack (206) is adapted to the inner side wall of the groove (5).
Citation Information
Patent Citations
Die bonder die bonding clamp
CN115642119A