Wafer overlay inspection machine

Abstract

The utility model belongs to the field of wafer production, and particularly relates to a wafer overlay inspection machine, which solves the problems that a wafer inspection machine in the patent is inconvenient to position a wafer, the inspection surface of the wafer is inconvenient to adjust, and the inspection efficiency of the wafer is reduced. The inspection machine comprises a bottom plate, a fixing frame is fixedly connected to the upper surface of the bottom plate, an inspection machine body is mounted in the fixing frame, a groove is formed in the upper surface of the bottom plate, a driving motor is mounted in the groove, a supporting plate is fixedly connected to the output end of the driving motor, a supporting plate is fixedly connected to the upper surface of the supporting plate, and symmetrical limiting plates are fixedly connected to the upper surface of the supporting plate. Through holes are formed in the side faces, close to each other, of the two limiting plates, electric push rods are installed on the side faces, away from each other, of the two limiting plates, positioning seats are fixedly connected to the output ends of the two electric push rods, and forward and reverse motors are installed on the side faces, close to each other, of the two positioning seats.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a wafer overlay inspection machine. Background Technique

[0002] A wafer is the basic material for manufacturing semiconductor chips. The most important raw material for semiconductor integrated circuits is silicon. Therefore, the corresponding one is a silicon wafer. The wafer laser marking positioning inspection device can accurately determine the marking position of the wafer, making the characters marked during the wafer marking process uniform, beautiful, without gaps and breaks.

[0003] In the prior art, the authorized announcement number is: CN213936121U, and the name is a wafer inspection machine, including a workbench. Side plates are arranged on both sides of the workbench. A horizontal sliding rod is arranged inside the side plates. A detection plate is slidably connected to the horizontal sliding rod. A vertical sliding rod is arranged at the top of the side plates. A detection rod is slidably connected to the vertical sliding rod. A detection lens and a dust suction pipe are arranged at the lower end of the detection rod. A vacuum pump is arranged at the bottom of the workbench. The vacuum pump is connected to the dust suction pipe in a through manner. A microscope lens is rotatably connected to the bottom of the detection lens. However, for the wafer inspection machine in the above patent, it is not convenient to position the wafer, nor is it convenient to adjust the inspection surface of the wafer, reducing the efficiency of wafer inspection. Therefore, we propose a wafer overlay inspection machine to solve the above problems. Content of the Utility Model

[0004] The utility model provides a wafer overlay inspection machine to solve the problems that the wafer inspection machine in the comparative patent is not convenient to position the wafer, nor is it convenient to adjust the inspection surface of the wafer, reducing the efficiency of wafer inspection.

[0005] To solve the above technical problems, a wafer overlay inspection machine provided by the utility model includes a bottom plate. A fixing frame is fixedly connected to the upper surface of the bottom plate. An inspection machine main body is installed inside the fixing frame. A groove is opened on the upper surface of the bottom plate. A driving motor is installed inside the groove. The output end of the driving motor is fixedly connected to a support plate. A support column is fixedly connected to the upper surface of the support plate. Symmetric limiting plates are fixedly connected to the upper surface of the support column. Through holes are opened on the side surfaces of the two limiting plates close to each other. Electric push rods are installed on the side surfaces of the two limiting plates far from each other. The output ends of the two electric push rods are fixedly connected to positioning seats. Reversible motors are installed on the side surfaces of the two positioning seats close to each other. The output ends of the two reversible motors are fixedly connected to positioning plates.

[0006] Preferably, equidistantly arranged buffer springs are fixedly connected to the side surfaces of the two positioning plates close to each other. The ends of the two groups of buffer springs close to each other are fixedly connected to positioning clamping plates. The positioning clamping plates are made of rubber fiber plates.

[0007] Preferably, symmetric dampers are fixedly connected to the mutually approaching side surfaces of the two positioning plates. The mutually approaching ends of the two groups of dampers are respectively fixedly connected to the mutually departing side surfaces of the two positioning clamping plates. The number of dampers is two.

[0008] Preferably, a protective pad is fixedly connected to the upper surface of the support plate. The thickness of the protective pad is at least one centimeter, and the protective pad is made of a sponge fiber pad.

[0009] Preferably, symmetric lamp holders are fixedly connected to the bottom surface of the fixing frame. Supplementary light lamps are installed at the bottom ends of the two lamp holders, and the number of the supplementary light lamps is at least two.

[0010] Preferably, a limiting groove is formed on the upper surface of the bottom plate, and a storage battery is installed inside the limiting groove. The storage battery is electrically connected to an electric mechanism through a wire.

[0011] Preferably, symmetric support legs are fixedly connected to the bottom surface of the bottom plate. Anti-slip seats are fixedly connected to the bottom surfaces of the two support legs, and anti-slip patterns are formed on the bottom surfaces of the two anti-slip seats.

[0012] Compared with the related art, the present utility model has the following beneficial effects:

[0013] The present utility model can clamp and position a wafer by using an electric push rod and a positioning clamping plate, can drive the wafer to flip by using a positive and negative motor, which is convenient for a worker to adjust the inspection surface of the wafer. By the cooperation of a driving motor and a support plate, the support plate can be driven to rotate, which is convenient for the worker to adjust the angle of the wafer, improving the inspection efficiency of the wafer. Through the cooperation of a buffer spring and a positioning clamping plate, the wafer can be protected from being over-clamped. By using a damper, a certain resistance can be applied to the positioning clamping plate, improving the stability of the positioning clamping plate.

[0014] In order to make the above and other objects, features and advantages of the present utility model more obvious and understandable, the following specific preferred embodiments are given in conjunction with the accompanying drawings and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 FIG. is a schematic three-dimensional structure diagram of a wafer overlay inspection machine of the present utility model.

[0017] Figure 2 This is a cross-sectional view of the front view of the middle bottom plate of a wafer overlay inspection machine of the present utility model.

[0018] Figure 3 This is a top view of the middle support plate of a wafer overlay inspection machine of the present utility model.

[0019] Figure 4 This is a wafer overlay inspection machine of the present utility model Figure 3 Schematic enlarged view of the structure at A in the middle.

[0020] Reference numerals in the figure:

[0021] 1. Bottom plate; 2. Fixed frame; 3. Inspection machine main body; 4. Groove; 5. Driving motor; 6. Support plate; 7. Support plate; 8. Limiting plate; 9. Through hole; 10. Electric push rod; 11. Positioning seat; 12. Forward and reverse motor; 13. Positioning plate; 14. Protective pad; 15. Lamp holder; 16. Supplementary light; 17. Anti-slip seat; 18. Buffer spring; 19. Positioning clamp; 20. Damper; 21. Limiting groove; 22. Storage battery; 23. Support leg. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1-4 , a wafer overlay inspection machine, including a bottom plate 1, a fixed frame 2 is fixedly connected to the upper surface of the bottom plate 1, an inspection machine main body 3 is installed inside the fixed frame 2, a groove 4 is opened on the upper surface of the bottom plate 1, a driving motor 5 is installed inside the groove 4, the output end of the driving motor 5 is fixedly connected to a support plate 6, a support plate 7 is fixedly connected to the upper surface of the support plate 6, symmetrically arranged limiting plates 8 are fixedly connected to the upper surface of the support plate 7, through holes 9 are opened on the side surfaces of the two limiting plates 8 close to each other, electric push rods 10 are installed on the side surfaces of the two limiting plates 8 away from each other, the output ends of the two electric push rods 10 are fixedly connected to positioning seats 11, forward and reverse motors 12 are installed on the side surfaces of the two positioning seats 11 close to each other, the output ends of the two forward and reverse motors 12 are fixedly connected to positioning plates 13. The electric push rod 10 and the positioning clamp 19 can be used to clamp and position the wafer, the forward and reverse motor 12 can be used to drive the wafer to flip, which is convenient for the staff to adjust the surface of the wafer for inspection. The cooperation of the driving motor 5 and the support plate 6 can drive the support plate 7 to rotate, which is convenient for the staff to adjust the angle of the wafer and improve the inspection efficiency of the wafer.

[0024] On one side of the two positioning plates 13 close to each other, buffer springs 18 arranged at equal distances are fixedly connected. At one end of the two groups of buffer springs 18 close to each other, positioning clamping plates 19 are fixedly connected. On one side of the two positioning plates 13 close to each other, symmetric dampers 20 are fixedly connected. At one end of the two groups of dampers 20 close to each other, they are respectively fixedly connected to the side surfaces of the two positioning clamping plates 19 away from each other. Through the cooperation of the buffer springs 18 and the positioning clamping plates 19, the wafer can be protected to avoid excessive clamping of the wafer. By using the dampers 20, a certain resistance can be applied to the positioning clamping plates 19 to improve the stability of the positioning clamping plates 19.

[0025] A protective pad 14 is fixedly connected to the upper surface of the support plate 7. The thickness of the protective pad 14 is at least one centimeter. Symmetric lamp holders 15 are fixedly connected to the bottom surface of the fixing frame 2. At the bottom ends of the two lamp holders 15, supplementary light lamps 16 are installed. A limiting groove 21 is opened on the upper surface of the bottom plate 1. A storage battery 22 is installed inside the limiting groove 21. Symmetric support legs 23 are fixedly connected to the bottom surface of the bottom plate 1. Anti-slip seats 17 are fixedly connected to the bottom surfaces of the two support legs 23. Through the cooperation of the support legs 23 and the anti-slip seats 17, the device can be stably placed to prevent the device from sliding. By using the protective pad 14, the wafer can be protected. By using the cooperation of the lamp holders 15 and the supplementary light lamps 16, the wafer can be supplemented with light for illumination. The device can be powered by the storage battery 22.

[0026] The specific implementation process of the present utility model is as follows: When in use, first connect the device to the corresponding power supply, then fully charge the storage battery 22, and then through the cooperation of the support legs 23 and the anti-slip seats 17, place the device stably in a suitable position. Then place the wafer to be inspected between the two positioning clamping plates 19, and then use the electric push rod 10 and the positioning clamping plates 19 to clamp and position the wafer. Then use the forward and reverse motor 12 to drive the wafer to flip, which is convenient for the staff to adjust the inspection surface of the wafer. Then use the cooperation of the driving motor 5 and the support plate 6 to drive the support plate 7 to rotate, which is convenient for the staff to adjust the angle of the wafer and improve the inspection efficiency of the wafer.

[0027] The above are only the embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent structural or equivalent process transformations made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, are similarly included in the patent protection scope of the present utility model. In addition, it should be understood that although this specification is described according to the implementation manners, not every implementation manner only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementation manners that can be understood by those skilled in the art.

Claims

1. A wafer overlay inspection machine, comprising a base plate (1), characterized in that: The upper surface of the base plate (1) is fixedly connected to a fixing frame (2), an inspection machine body (3) is installed inside the fixing frame (2), a groove (4) is provided on the upper surface of the base plate (1), a driving motor (5) is installed inside the groove (4), an output end of the driving motor (5) is fixedly connected to a support plate (6), an upper surface of the support plate (6) is fixedly connected to a support plate (7), an upper surface of the support plate (7) is fixedly connected to a symmetrical limiting plate (8), a through hole (9) is provided on the side of the two limiting plates (8) close to each other, an electric push rod (10) is installed on the side of the two limiting plates (8) away from each other, the output ends of the two electric push rods (10) are fixedly connected to a positioning seat (11), a forward and reverse motor (12) is installed on the side of the two positioning seats (11) close to each other, and the output ends of the two forward and reverse motors (12) are fixedly connected to a positioning plate (13).

2. A wafer overlay inspection machine according to claim 1, characterized in that: The side surfaces of the two positioning plates (13) close to each other are fixedly connected with buffer springs (18) arranged at equal distances, and the ends of the two groups of buffer springs (18) close to each other are fixedly connected with positioning clamps (19), and the positioning clamps (19) are made of rubber fiberboard.

3. A wafer overlay inspection machine according to claim 2, characterized in that: The sides of the two positioning plates (13) that are close to each other are fixedly connected with symmetrical dampers (20), and the ends of the two groups of dampers (20) that are close to each other are respectively fixedly connected to the sides of the two positioning clamps (19) that are away from each other. The number of the dampers (20) is two.

4. The wafer overlay inspection machine according to claim 1, characterized in that: A protective pad (14) is fixedly connected to the upper surface of the support plate (7); the thickness of the protective pad (14) is at least one centimeter, and the protective pad (14) is a sponge fiber pad.

5. The wafer overlay inspection machine according to claim 1, characterized in that: The bottom surface of the fixing frame (2) is fixedly connected with symmetrical lamp holders (15), and the bottom ends of the two lamp holders (15) are both equipped with fill lights (16), and the number of the fill lights (16) is at least two.

6. The wafer overlay inspection machine according to claim 1, characterized in that: A limiting groove (21) is provided on the upper surface of the bottom plate (1), a storage battery (22) is installed inside the limiting groove (21), and the storage battery (22) is electrically connected to an electrical mechanism via a wire.

7. The wafer overlay inspection machine according to claim 1, characterized in that: The bottom surface of the bottom plate (1) is fixedly connected to symmetrical support legs (23), the bottom surfaces of the two support legs (23) are fixedly connected to anti-slip seats (17), and the bottom surfaces of the two anti-slip seats (17) are provided with anti-slip grooves.

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