Chip moving and carrying mechanism

Abstract

The utility model belongs to the technical field of semiconductor chip bonding equipment, and particularly discloses a chip moving and carrying mechanism, which comprises a supporting seat, an X-axis moving mechanism, an X-axis moving mechanism and a chip carrying mechanism, and is characterized in that the supporting seat is provided with the X-axis moving mechanism capable of horizontally moving in the X-axis direction; the X-axis moving mechanism is installed on the base, the Y-axis moving mechanism is installed on the X-axis moving mechanism and horizontally moves in the Y-axis direction, and the Y-axis moving mechanism is provided with a Z-axis moving mechanism capable of moving in the Z-axis direction. The suction mechanism can accurately shift in the X-axis direction, the Y-axis direction and the Z-axis direction, and the position of the suction head can be accurately identified by using the LVDT displacement sensor, so that the suction mechanism can rapidly identify the position of the chip, and the requirement that two different types of chips can be attached to the same equipment can be met. The working efficiency of IGBT single-tube packaging and die bonding is improved, and the product quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor die bonding equipment, in particular to a chip moving and handling mechanism. Background Technique

[0002] The dual-chip IGBT package chip bonding process is a high-precision and high-efficiency semiconductor packaging technology, mainly used for simultaneously bonding two chips (IGBT chip and FRD chip) to a substrate, so a semiconductor die bonding equipment is required for die bonding operation.

[0003] Currently, for IGBT single-tube package die bonding on the market, usually two die bonding equipments are used to bond the IGBT chip and the FRD chip respectively. First, the IGBT chip is bonded on the first die bonding equipment. This equipment heats the frame and coats solder, and then accurately bonds the IGBT chip to the specified position. After the frame cools down, it enters the second die bonding equipment, repeating the steps of heating, coating solder and die bonding, this time for the bonding of the FRD chip.

[0004] However, die bonding through two multiple equipments requires two frame heatings and two equipment debuggings, etc., resulting in low work efficiency of IGBT single-tube package die bonding, and the quality of secondary bonding cannot be guaranteed. Therefore, we need to propose a chip moving and handling mechanism to solve the above existing problems, so that it can meet the requirement of bonding two different types of chips on the same equipment, improve the work efficiency of IGBT single-tube package die bonding, and improve the product quality. Content of the Utility Model

[0005] The purpose of the utility model is to provide a chip moving and handling mechanism, which can meet the requirement of bonding two different types of chips on the same equipment, improve the work efficiency of IGBT single-tube package die bonding, and improve the product quality, so as to solve the problems put forward in the background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A chip moving and handling mechanism, comprising: a support base, on which an X-axis moving mechanism capable of horizontally moving in the X-axis direction is installed; a Y-axis moving mechanism installed on the X-axis moving mechanism and performing horizontal movement in the Y-axis direction, and a Z-axis moving mechanism capable of moving in the Z-axis direction is installed on the Y-axis moving mechanism;

[0007] A pick-up mechanism installed on the Z-axis moving mechanism and capable of picking up chips. An LVDT displacement sensor is installed on the pick-up mechanism, and the X-axis moving mechanism, Y-axis moving mechanism, Z-axis moving mechanism, and pick-up mechanism are all connected to the control system of the die bonding equipment through an integrated wire harness. The LVDT displacement sensor can accurately identify the position of the suction head, so that the pick-up mechanism can quickly identify the position of the chip, facilitating the requirement of bonding two different types of chips on the same equipment.

[0008] Preferably, the support base includes a fixed substrate, a support column is fixed to the lower end of the fixed substrate, and a support plate for installing one end of the integrated wire harness is installed on one side of the support column.

[0009] Preferably, the support column includes a first column installed at both ends of the fixed substrate and a second column installed in the middle of the fixed substrate. Installation holes are provided on both the first column and the second column.

[0010] Preferably, the X-axis moving mechanism includes first slide rails installed on both sides of the upper surface of the fixed substrate. A moving plate is slidably connected to the first slide rails, and a first linear motor for driving the moving plate to perform horizontal movement in the X-axis direction is installed on the upper surface of the fixed substrate.

[0011] Preferably, first sliders matching the first slide rails are fixed to both sides of the lower surface of the moving plate. The first sliders are slidably connected to the first slide rails. An installation plate is fixed to one end of the moving plate, and a connector for installing the other end of the integrated wire harness is installed on the installation plate.

[0012] Preferably, the Y-axis moving mechanism includes a bracket slidably installed on the upper surface of the moving plate. The bracket is driven by a second linear motor, and the second linear motor is installed on the upper surface of the moving plate. A first sensor reader head matching the second linear motor is installed on one side of the bracket.

[0013] Preferably, the Z-axis moving mechanism includes a connecting rod slidably installed on the other side of the bracket. A second slide rail for the connecting rod to slide is installed on the other side of the bracket. A third linear motor for driving the connecting rod to move is installed on one side of the second slide rail. A second sensor reader head matching the third linear motor is installed on the side of the bracket opposite to the first sensor reader head. The pick-up mechanism is installed at the other end of the connecting rod.

[0014] Preferably, the connecting rod is set as an ultra-light carbon fiber square tube. Installation square plates are fixed to both ends of the connecting rod, and threaded holes are provided on the installation square plates.

[0015] Preferably, the suction mechanism includes a fixing plate, on one side of which two elastic pieces are installed. A voice coil motor is installed between the two elastic pieces. The LVDT displacement sensor is installed on one side of the voice coil motor. A suction rod is installed above the voice coil motor. One end of the suction rod is connected to a gas treatment mechanism. A second gas switch is installed on one side of one of the elastic pieces.

[0016] Preferably, the gas treatment mechanism includes a gas filter installed on the lower surface of the mounting plate. One end of the gas filter is communicated with a gas flow sensor, and one end of the gas filter is communicated with a gas supply source through a gas pipe. The other end of the gas filter is communicated with one end of the suction rod through a first gas switch.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0018] 1. Through the cooperation of the X-axis moving mechanism, Y-axis moving mechanism, Z-axis moving mechanism and the suction mechanism, the suction mechanism can be accurately displaced in the X-axis direction, Y-axis direction and Z-axis direction. And the LVDT displacement sensor can accurately identify the position of the suction head, so that the suction mechanism can quickly identify the position of the chip, in order to meet the requirement of bonding two different types of chips on the same device, improve the working efficiency of IGBT single-tube packaging and die bonding, and improve the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of the present utility model;

[0020] Figure 2 is a schematic structural diagram of the Y-axis moving mechanism of the present utility model;

[0021] Figure 3 is a schematic installation structural diagram of the gas treatment mechanism of the present utility model;

[0022] Figure 4 is a schematic structural diagram of the suction mechanism of the present utility model.

[0023] In the figure: 1. First vertical column; 2. Fixed substrate; 3. First slide rail; 4. First linear motor; 5. Integrated wire harness; 6. Y-axis moving mechanism; 61. Moving plate; 62. Second linear motor; 63. First gas switch; 64. Gas filter; 65. Gas flow sensor; 66. Mounting plate; 67. Bracket; 68. First sensor reader head; 7. Chip suction mechanism; 71. Fixed plate; 72. Suction rod; 73. Belleville spring; 74. LVDT displacement sensor; 75. Voice coil motor; 76. Second gas switch; 8. Z-axis moving mechanism; 81. Connecting rod; 82. Third linear motor; 83. Second sensor reader head; 84. Tension spring; 85. Second slide rail; 9. Second vertical column; 10. First slider; 11. Support plate. Detailed implementation

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figures 1-4 , the present invention provides a technical solution: a mobile chip handling mechanism, including: a support base, on which an X-axis moving mechanism capable of horizontally moving in the X-axis direction is installed; a Y-axis moving mechanism 6 installed on the X-axis moving mechanism and performing horizontal movement in the Y-axis direction, and a Z-axis moving mechanism 8 capable of moving in the Z-axis direction is installed on the Y-axis moving mechanism 6; a chip suction mechanism 7 installed on the Z-axis moving mechanism 8 and capable of sucking chips, and an LVDT displacement sensor 74 is installed on the chip suction mechanism 7, and the X-axis moving mechanism, the Y-axis moving mechanism 6, the Z-axis moving mechanism 8, and the chip suction mechanism 7 are all connected to the control system of the die bonding equipment through an integrated wire harness 5. The LVDT displacement sensor 74 can accurately identify the position of the suction head, so that the chip suction mechanism 7 can quickly identify the position of the chip, so as to meet the requirement of bonding two different types of chips on the same device.

[0026] The control system of the die bonding equipment can design reasonable control timing and logic according to the die bonding process flow, such as steps like the suction rod 72 moving above the chip, sucking the chip, moving to the target position and pasting, etc., to ensure the sequentiality and accuracy of the operation. A comprehensive exception handling mechanism is implemented in the software to anticipate and handle various possible abnormal situations, such as the suction rod 72 moving beyond the range, incorrect chip recognition, poor bonding, etc., and make timely responses and take measures. Through the control of the industrial camera recognition software, the first linear motor 4 and the second linear motor 62 start working from the starting point. After reaching the suction end position, the third linear motor 82 starts to suck the chip downward and then rises, and then transports back to the starting point to place the chip, performing reciprocating movements, so as to meet the working requirements of precisely sucking the chip in the X-axis direction, Y-axis direction, and Z-axis direction.

[0027] During use, the X-axis moving mechanism drives the Y-axis moving mechanism 6, Z-axis moving mechanism 8, and suction mechanism 7 to perform horizontal movement in the X direction simultaneously. The Y-axis moving mechanism 6 drives the Z-axis moving mechanism 8 and suction mechanism 7 to perform horizontal movement in the Y direction. The Z-axis moving mechanism 8 drives the suction mechanism 7 to perform horizontal movement in the Z-axis direction. Thus, the suction mechanism 7 can be precisely displaced in the X-axis direction, Y-axis direction, and Z-axis direction. And the LVDT displacement sensor 74 can precisely identify the position of the suction rod 72, so that the suction mechanism 7 can quickly identify the position of the chip, facilitating the need to bond two different types of chips on the same device, improving the working efficiency of IGBT single-tube packaging die bonding and enhancing the product quality.

[0028] The support base includes a fixed substrate 2. A support column is fixed to the lower end of the fixed substrate 2. A support plate 11 for installing one end of the integrated wire harness 5 is installed on one side of the support column. The X-axis moving mechanism, Y-axis moving mechanism 6, Z-axis moving mechanism 8, and suction mechanism 7 are supported by the fixed base to ensure that the suction mechanism 7 can smoothly perform horizontal movement in the X, Y, and Z directions.

[0029] The support column includes a first column 1 installed at both ends of the fixed substrate 2 and a second column 9 installed in the middle of the fixed substrate 2. Installation holes are provided on both the first column 1 and the second column 9, which facilitate the installation of the first column 1 and the second column 9 on the die bonding equipment to be installed. And the coordinated cooperation of the first column 1 and the second column 9 can ensure the stability of the fixed base.

[0030] The X-axis moving mechanism includes first slide rails 3 installed on both sides of the upper surface of the fixed base plate 2. A moving plate 61 is slidably connected to the first slide rails 3. A first linear motor 4 for driving the moving plate 61 to perform horizontal movement in the X-axis direction is installed on the upper surface of the fixed base plate 2. By using the first linear motor 4 to drive the moving plate 61 to perform horizontal movement in the X direction, it is convenient to adjust the position of the suction mechanism 7 in the X direction.

[0031] On both sides of the lower surface of the moving plate 61, first sliders 10 matching the first slide rails 3 are fixed. The first sliders 10 are slidably connected to the first slide rails 3. One end of the moving plate 61 is fixed with a mounting plate 66. A connector for installing the other end of the integrated wire harness 5 is installed on the mounting plate 66, which is convenient for connecting the X-axis moving mechanism, Y-axis moving mechanism 6, Z-axis moving mechanism 8 and suction mechanism 7 to the control system of the die bonding equipment, enabling it to control through the self-written software program of the control system of the die bonding equipment and automatically adjust the position.

[0032] The Y-axis moving mechanism 6 includes a bracket 67 slidably installed on the upper surface of the moving plate 61. The bracket 67 is driven by a second linear motor 62, and the second linear motor 62 is installed on the upper surface of the moving plate 61. A first sensor reader head 68 matching the second linear motor 62 is installed on one side of the bracket 67. By driving the bracket 67 to perform horizontal movement in the Y-axis direction on the moving plate 61 through the second linear motor 62, the position of the suction mechanism 7 in the Y direction is adjusted. The first sensor reader head 68 can accurately sense the moving position of the bracket 67.

[0033] The Z-axis moving mechanism 8 includes a connecting rod 81 slidably installed on the other side of the bracket 67. A second slide rail 85 for the connecting rod 81 to slide is installed on the other side of the bracket 67. A third linear motor 82 for driving the connecting rod 81 to move is installed on one side of the second slide rail 85. A second sensor reader head 83 matching the third linear motor 82 is installed on the side of the bracket 67 opposite to the first sensor reader head 68. The suction mechanism 7 is installed at the other end of the connecting rod 81. By driving the suction rod 72 to perform horizontal movement in the Z-axis direction through the third linear motor 82, different chips can be sucked.

[0034] The connecting rod 81 is set as an ultra-light carbon fiber square tube. Mounting square plates are fixed at both ends of the connecting rod 81, and threaded holes are opened on the mounting square plates, which is convenient for the installation of the connecting rod 81. At the same time, using the ultra-light carbon fiber square tube can effectively reduce the weight of the connecting rod 81 and improve the stability of the movement of the suction mechanism 7. A tension spring 84 for limiting the moving position of the connecting rod 81 is installed between one side of one of the mounting square plates and the second slide rail 85.

[0035] The suction mechanism 7 includes a fixing plate 71. On one side of the fixing plate 71, two elastic pieces 73 are installed. Between the two elastic pieces 73, a voice coil motor 75 is installed. The LVDT displacement sensor 74 is installed on one side of the voice coil motor 75. Above the voice coil motor 75, a suction rod 72 is installed. One end of the suction rod 72 is connected to a gas treatment mechanism. On one side of one of the elastic pieces 73, a second gas switch 76 is installed. The other end of the suction rod 72 is installed with a suction head for sucking the chip. By treating the gas source through the gas treatment mechanism, the influence of impurities on the gas pipeline transmission can be effectively avoided.

[0036] The gas treatment mechanism includes a gas filter 64 installed on the lower surface of the mounting plate 66. One end of the gas filter 64 is communicated with a gas flow sensor 65. And one end of the gas filter 64 is communicated with a gas supply source, such as an air pump, through a gas pipe. The other end of the gas filter 64 is communicated with one end of the suction rod 72 through a first gas switch 63. By the gas flow sensor 65, the gas flow transmitted by the suction mechanism 7 is monitored in real time to avoid damage to the sucked chip caused by excessive gas pressure. At the same time, the suction force for sucking the chip can also be controlled in real time.

[0037] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mobile chip transport mechanism, characterized in that: include: A support base, on which an X-axis moving mechanism capable of horizontal movement in the X-axis direction is installed; A Y-axis moving mechanism (6) installed on the X-axis moving mechanism and capable of horizontal movement in the Y-axis direction, wherein a Z-axis moving mechanism (8) capable of movement in the Z-axis direction is installed on the Y-axis moving mechanism (6); A suction mechanism (7) is installed on a Z-axis moving mechanism (8) and is capable of sucking chips. An LVDT displacement sensor (74) is installed on the suction mechanism (7). The X-axis moving mechanism, the Y-axis moving mechanism (6), the Z-axis moving mechanism (8) and the suction mechanism (7) are all connected to a control system of a chip bonding device via an integrated wiring harness (5). The LVDT displacement sensor (74) can accurately identify the position of the suction head, so that the suction mechanism (7) can quickly identify the position of the chip, so that the requirements of bonding two different types of chips can be met on the same device.

2. A chip moving and transporting mechanism according to claim 1, characterized in that: The support seat comprises a fixed base plate (2), a support column is fixed at the lower end of the fixed base plate (2), and a support plate (11) for mounting one end of the integrated wiring harness (5) is installed on one side of the support column.

3. A chip moving and transporting mechanism according to claim 2, characterized in that: The supporting columns comprise a first column (1) mounted at both ends of a fixed base plate (2) and a second column (9) mounted in the middle of the fixed base plate (2); both the first column (1) and the second column (9) are provided with mounting holes.

4. A chip moving and transporting mechanism according to claim 3, characterized in that: The X-axis moving mechanism comprises first slide rails (3) mounted on both sides of the upper surface of a fixed base plate (2), a moving plate (61) being slidably connected to the first slide rails (3), and a first linear motor (4) for driving the moving plate (61) to perform X-axis horizontal movement is mounted on the upper surface of the fixed base plate (2).

5. The chip moving and transporting mechanism according to claim 4, characterized in that: First sliders (10) matching the first slide rail (3) are fixed on both sides of the lower surface of the movable plate (61), and the first slider (10) is slidably connected to the first slide rail (3). A mounting plate (66) is fixed at one end of the movable plate (61), and a connector for mounting the other end of the integrated wiring harness (5) is installed on the mounting plate (66).

6. The chip moving and transporting mechanism according to claim 5, characterized in that: The Y-axis moving mechanism (6) includes a bracket (67) slidably mounted on the upper surface of a moving plate (61), the bracket (67) is driven by a second linear motor (62), and the second linear motor (62) is mounted on the upper surface of the moving plate (61), and a first sensor reader (68) matching the second linear motor (62) is mounted on one side of the bracket (67).

7. The chip moving and transporting mechanism according to claim 6, characterized in that: The Z-axis moving mechanism (8) includes a connecting rod (81) slidably mounted on the other side of the bracket (67); a second slide rail (85) for sliding the connecting rod (81) is mounted on the other side of the bracket (67); a third linear motor (82) for driving the connecting rod (81) to move is mounted on one side of the second slide rail (85); a second sensor reader (83) matching the third linear motor (82) is mounted on the side of the bracket (67) opposite to the first sensor reader (68); and the suction mechanism (7) is mounted on the other end of the connecting rod (81).

8. The chip moving and transporting mechanism according to claim 7, characterized in that: The connecting rod (81) is configured as an ultralight carbon fiber square tube, and both ends of the connecting rod (81) are fixed with mounting square plates, and the mounting square plates are provided with threaded holes.

9. The chip moving and transporting mechanism according to claim 8, characterized in that: The suction mechanism (7) comprises a fixing plate (71), two spring sheets (73) are installed on one side of the fixing plate (71), a voice coil motor (75) is installed between the two spring sheets (73), the LVDT displacement sensor (74) is installed on one side of the voice coil motor (75), a suction rod (72) is installed above the voice coil motor (75), one end of the suction rod (72) is connected to a gas processing mechanism, and a second gas switch (76) is installed on one side of one of the spring sheets (73).

10. The chip moving and transporting mechanism according to claim 9, characterized in that: The gas processing mechanism includes a gas filter (64) installed on the lower surface of the mounting plate (66), one end of the gas filter (64) is connected to a gas flow sensor (65), and one end of the gas filter (64) is connected to a gas supply source through an air pipe, and the other end of the gas filter (64) is connected to one end of a suction rod (72) through a first gas switch (63).

Images