Wafer fixing device and wafer processing equipment

Abstract

The utility model provides a wafer fixing device and wafer processing equipment, and the wafer fixing device comprises a seat plate; the outer ring seat is rotatably arranged on the seat plate; at least one inner ring seat is concentrically nested in the outer ring seat, the inner ring seats are detachably connected with the outer ring seat, and every two adjacent inner ring seats are detachably connected; the outer ring seat and the inner ring seat are used for assembling a wafer. According to the wafer fixing device, the detachable outer ring seat and the inner ring seat are matched for use, so that the wafer fixing device can meet the processing requirements of wafers with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer fixing device and a wafer processing equipment. Background Art

[0002] During the production and processing of wafers, it is necessary to fix and clamp them. The existing wafer fixing devices are difficult to be compatible with wafers of different sizes, and have poor versatility. Summary of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the first object of the utility model is to provide a wafer fixing device that can be compatible with wafers of different sizes.

[0004] The second object of the utility model is to provide a wafer processing equipment that can meet the processing requirements of wafers of different sizes.

[0005] The embodiments of the utility model are realized through the following technical solutions:

[0006] A wafer fixing device includes: a base plate; an outer ring base rotatably arranged on the base plate; an inner ring base, at least one inner ring base is concentrically nested in the outer ring base, the inner ring base is detachably connected to the outer ring base, and adjacent two inner ring bases are detachably connected; the outer ring base and the inner ring base are used for assembling wafers.

[0007] According to a preferred embodiment, the outer ring base includes an outer ring body, and an outer bearing surface is configured on the inner wall of the outer ring body for supporting the wafer; a weakening through groove is opened on the circumferential side wall of the outer ring body, the weakening through groove penetrates the circumferential side wall of the outer ring body in the radial direction of the outer ring body, the weakening through groove extends along the circumferential direction of the outer ring body, a first deformation groove is arranged on an axial end surface of the outer ring body, the first deformation groove penetrates the circumferential side wall of the outer ring body in the radial direction of the outer ring body, and the first deformation groove communicates with the weakening through groove; a tightening arm is defined and formed on the outer ring body by the first deformation groove and the weakening through groove, a first tightening ear and a second tightening ear are arranged on the outer ring body, the first tightening ear is on one side of the first deformation groove, the second tightening ear is on the other side of the first deformation groove, and at least one of the first tightening ear and the second tightening ear is on the tightening arm; the wafer fixing device further includes a tightening member arranged on the first tightening ear and the second tightening ear and acting on the two to make them approach or move away from each other.

[0008] According to a preferred embodiment, the tightening member is a bolt, the tightening member is assembled on the first tightening ear and is threadedly connected to the second tightening ear.

[0009] According to a preferred embodiment, the first deformation groove is located at one end of the weakening through groove in the circumferential direction of the outer ring body.

[0010] According to a preferred embodiment, the structure on the outer ring body except the tightening arm is defined as the ring main body, and the wall thickness of the tightening arm is less than that of the ring main body.

[0011] According to a preferred embodiment, a second deformation groove is provided at one end of the tightening arm away from the first deformation groove.

[0012] According to a preferred embodiment, the inner ring seat includes an inner ring body. An assembly surface adapted to the outer ring seat is provided on the end surface of the inner ring body, and the assembly surface abuts against the outer ring seat; an inner bearing surface is configured on the inner wall of the inner ring body for carrying a wafer.

[0013] According to a preferred embodiment, a third deformation groove is provided through the circumferential side wall of the inner ring body in the radial direction of the inner ring body.

[0014] According to a preferred embodiment, at least one fourth deformation groove is provided on the inner wall of the inner ring body in the radial direction of the inner ring body.

[0015] A wafer processing device includes a frame and the aforementioned wafer fixing device, and the seat plate is installed on the frame.

[0016] The technical solution of the embodiment of the present utility model has at least the following advantages and beneficial effects:

[0017] By using the detachable outer ring seat and inner ring seat in combination, the wafer fixing device of the present utility model can meet the processing requirements of wafers of different sizes. Description of the Drawings

[0018] In order to more clearly illustrate the technical solution of the embodiment of the present utility model, the drawings required to be used in the embodiment will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is a schematic three-dimensional structure diagram of the wafer fixing device provided by the embodiment of the present utility model;

[0020] Figure 2 It is an exploded structure diagram of the wafer fixing device provided by the embodiment of the present utility model;

[0021] Figure 3 It is a schematic three-dimensional structure diagram of the outer ring seat provided by the embodiment of the present utility model;

[0022] Figure 4 A schematic diagram of the front view structure of the outer ring seat provided in an embodiment of the utility model;

[0023] Figure 5 A schematic diagram of a first three-dimensional structure of an inner ring seat provided in an embodiment of the utility model;

[0024] Figure 6 This is a schematic diagram of the second three-dimensional structure of the inner ring seat provided in an embodiment of the utility model.

[0025] Icons: 1. Seat plate; 11. Outer cover; 2. Outer ring seat; 21. Outer ring body; 211. Ring body; 22. Outer bearing surface; 23. First deformation groove; 24. Weakened through groove; 25. Tightening arm; 26. Second deformation groove; 27. First tightening ear; 28. Second tightening ear; 29. ​​Tightening piece; 3. Inner ring seat; 31. Inner ring body; 32. Assembly surface; 33. Inner bearing surface; 34. Third deformation groove; 35. Fourth deformation groove; 4. Wafer; 5. Support member; 6. Receiver ring; 7. Driven synchronous wheel; 8. Synchronous belt; 9. Active synchronous wheel. DETAILED DESCRIPTION

[0026] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0027] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0029] Please refer to Figures 1 to 6 A wafer fixing device comprises a seat plate 1, an outer ring seat 2 and an inner ring seat 3, wherein the outer ring seat 2 is rotatably arranged on the seat plate 1; at least one inner ring seat 3 is concentrically nested in the outer ring seat 2, the inner ring seat 3 is detachably connected to the outer ring seat 2, and two adjacent inner ring seats 3 are detachably connected to each other; the outer ring seat 2 and the inner ring seat 3 are used to assemble wafers. Figure 2As shown, the outer ring base 2 is applicable to the assembly of large-sized wafers, such as 8-inch or other-sized wafers, and the inner ring base 3 is applicable to the assembly of small-sized wafers, such as 6-inch or other-sized wafers. By using the detachable outer ring base 2 and inner ring base 3 in combination, the wafer fixing device can meet the processing requirements of wafers of different sizes. During use, rotate the ring base based on the specific wafer size. For example, when processing large-sized wafers, remove the inner ring base 3 and install the wafer on the outer ring base 2. When processing small-sized wafers, remove the other inner ring bases 3 within the corresponding inner ring base 3.

[0030] In this embodiment, as Figure 1 and Figure 2 shown, there is one inner ring base 3. In other embodiments, the inner ring base 3 can be two or more, and the corresponding wafer sizes gradually decrease radially inwards along the outer ring base 2.

[0031] As Figure 3 and Figure 4 shown, the outer ring base 2 includes an outer ring body 21. An outer bearing surface 22 is configured on the inner wall of the outer ring body 21 for supporting the wafer. A weakening through groove 24 is formed on the circumferential side wall of the outer ring body 21. The weakening through groove 24 penetrates the circumferential side wall of the outer ring body 21 in the radial direction of the outer ring body 21 and extends along the circumferential direction of the outer ring body 21. A first deformation groove 23 is provided on one axial end surface of the outer ring body 21. The first deformation groove 23 penetrates the circumferential side wall of the outer ring body 21 in the radial direction of the outer ring body 21 and communicates with the weakening through groove 24. A tightening arm 25 is defined on the outer ring body 21 by the first deformation groove 23 and the weakening through groove 24. A first tightening ear 27 and a second tightening ear 28 are provided on the outer ring body 21. The first tightening ear 27 is on one side of the first deformation groove 23, and the second tightening ear 28 is on the other side of the first deformation groove 23. At least one of the first tightening ear 27 and the second tightening ear 28 is located on the tightening arm 25. The wafer fixing device further includes a tightening member 29 disposed on the first tightening ear 27 and the second tightening ear 28, which acts on the two to make them approach or move away from each other. The tightening arm 25 defined by the first deformation groove 23 and the weakening through groove 24 has the ability to deform in the radial direction of the outer ring body 21. After the wafer is placed on the outer bearing surface 22, the tightening member 29 acts on the first tightening ear 27 and the second tightening ear 28 to make them approach each other, so that the tightening arm 25 moves radially inwards along the outer ring body 21 to clamp the wafer. Conversely, the tightening member 29 acts on the first tightening ear 27 and the second tightening ear 28 to make them move away from each other to loosen the wafer.

[0032] Optionally, the tightening member 29 is a bolt. The tightening member 29 is assembled on the first tightening ear 27 and is threadedly connected to the second tightening ear 28. The bolt structure is simple and convenient to adjust.

[0033] In other embodiments, the tightening member 29 can also be a pneumatic finger, with one finger mounted on the first tightening ear 27 and the other finger mounted on the second tightening ear 28.

[0034] In this embodiment, the outer ring seat 2 is made of a metal material, including but not limited to aluminum, aluminum alloy, or steel. The outer ring seat 2 made of a metal material has high strength and can also endow the tightening arm 25 with a certain elastic deformation ability.

[0035] As Figure 3 shown, the first deformation groove 23 is located at one end of the weakening through groove 24 in the circumferential direction of the outer ring body 21. Define the structure on the outer ring body 21 other than the tightening arm 25 as the ring main body 211. With such a setting, the tightening arm 25 is on one side of the first deformation groove 23. This can make the first tightening ear 27 on the ring main body 211. When the tightening member 29 acts, the first tightening ear 27 is stationary relative to the ring main body 211, and only the second tightening ear 28 on the tightening arm 25 moves, thereby improving the fixing accuracy of the wafer on the outer ring seat 2.

[0036] Of course, in other embodiments, the first deformation groove 23 is located within the area of the weakening through groove 24 in the circumferential direction of the outer ring body 21. In this way, the tightening arm 25 can be divided into two, and the two tightening arms 25 are respectively on both sides of the first deformation groove 23.

[0037] The wall thickness of the tightening arm 25 is smaller than that of the ring main body 211. This can improve the elastic deformation ability of the tightening arm 25.

[0038] As Figure 3 shown, a second deformation groove 26 is provided at one end of the tightening arm 25 away from the first deformation groove 23. Preferably, the second deformation groove 26 is provided on the inner side of the tightening arm 25. The second deformation groove 26 is a U-shaped groove. The second deformation groove 26 is used to thin the wall thickness of the tightening arm 25 at the second deformation groove 26, further improving the elastic deformation ability of the tightening wall.

[0039] As Figure 2 、 Figure 5 and Figure 6 shown, the inner ring seat 3 includes an inner ring body 31. An assembly surface 32 adapted to the outer ring seat 2 is provided on the end surface of the inner ring body 31, and the assembly surface 32 overlaps the outer ring seat 2; an inner bearing surface 33 is configured on the inner wall of the inner ring body 31 for bearing the wafer 4. In this embodiment, the assembly surface 32 overlaps the outer bearing surface 22, and the outer ring seat 2 and the inner ring seat 3 are connected by bolts. When multiple inner ring seats 3 are nested, for two adjacent inner ring seats 3, the assembly surface 32 of the inner inner ring seat 3 overlaps the inner bearing surface 33 of the outer inner ring seat 3.

[0040] In this embodiment, a third deformation groove 34 is provided on the peripheral side wall of the inner ring body 31 and penetrates the inner ring body 31 in the radial direction. The third deformation groove 34 is provided corresponding to the first deformation groove 23. When in use, when the tightening arm 25 contracts inwardly, the outer ring body 21 acts on the inner ring body 31 so that the inner ring body 31 contracts and deforms inwardly to clamp the wafer 4 assembled on the inner ring body 31. The third deformation groove 34 here provides the inner ring body 31 with the condition of deforming inwardly.

[0041] In this embodiment, the inner ring seat 3 is made of metal material, including but not limited to aluminum, aluminum alloy or steel.

[0042] In this embodiment, at least one fourth deformation groove 35 is provided on the inner wall of the inner ring body 31 along the radial direction of the inner ring body 31. Figure 1 and Figure 5 , Figure 6 As shown, the fourth deformation groove 35 here is convenient for disassembling and assembling the wafer 4 on the inner ring seat 3, and can also improve the elastic deformation capacity of the inner ring body 31. Preferably, the fourth deformation groove 35 is a U-shaped groove. Optionally, there are three fourth deformation grooves 35, and the three fourth deformation grooves 35 are evenly distributed in the circumference of the inner ring body 31. So that the deformation capacity of each region of the inner ring body 31 in its circumference tends to be consistent.

[0043] like Figure 2 As shown, a support member 5 is provided on the seat plate 1, a driven synchronous wheel 7 is coaxially mounted on the outer ring seat 2, a receiving ring 6 is coaxially arranged on the driven synchronous wheel 7, a V-shaped groove is provided on the peripheral outer wall of the receiving ring 6, and the support member 5 is rollingly assembled in the V-shaped groove. The support member 5 here is a bearing, and its outer ring is provided with a V-shaped protrusion adapted to the V-shaped groove, which is used to support the receiving ring 6 in the longitudinal direction to realize the rotation of the outer ring seat 2, thereby realizing the angle adjustment of the fixedly installed wafer.

[0044] Furthermore, a driving synchronous wheel 9 is mounted on the seat plate 1 , and the driving synchronous wheel 9 is connected to the driven synchronous wheel 7 via a synchronous belt 8 . A motor is arranged on the seat plate 1 to drive the driving synchronous wheel 9 to rotate.

[0045] The seat plate 1 is equipped with an outer cover 11 for shielding the active synchronous wheel 9 and part of the synchronous belt 8 to improve safety.

[0046] This embodiment also provides a wafer processing device, including a frame and the aforementioned wafer fixing device, and the base plate 1 is installed on the frame. Based on the aforementioned wafer fixing device, the processing device can adapt to the processing requirements of wafers of different sizes.

[0047] The technical means disclosed by the solution of the present utility model are not limited to the technical means disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present utility model.

Claims

1. A wafer fixing device, characterized in that: include: Seat plate (1); An outer ring seat (2) is rotatably arranged on the seat plate (1); An inner ring seat (3), at least one inner ring seat (3) is concentrically nested in the outer ring seat (2), the inner ring seat (3) and the outer ring seat (2) are detachably connected, and two adjacent inner ring seats (3) are detachably connected to each other; The outer ring seat (2) and the inner ring seat (3) are used for assembling wafers.

2. The wafer fixing device according to claim 1, characterized in that: The outer ring seat (2) comprises an outer ring body (21), and an outer bearing surface (22) is arranged on the inner wall of the outer ring body (21) for supporting the wafer; A weakened through groove (24) is provided on the circumferential side wall of the outer ring body (21), and the weakened through groove (24) penetrates the circumferential side wall of the outer ring body (21) in the radial direction of the outer ring body (21), and the weakened through groove (24) extends along the circumferential direction of the outer ring body (21); a first deformation groove (23) is provided on an axial end face of the outer ring body (21), and the first deformation groove (23) penetrates the circumferential side wall of the outer ring body (21) in the radial direction of the outer ring body (21), and the first deformation groove (23) is connected to the weakened through groove (24); The outer ring body (21) is defined by the first deformation groove (23) and the weakened through groove (24) to form a tightening arm (25); the outer ring body (21) is provided with a first tightening ear (27) and a second tightening ear (28); the first tightening ear (27) is located on one side of the first deformation groove (23), the second tightening ear (28) is located on the other side of the first deformation groove (23), and at least one of the first tightening ear (27) and the second tightening ear (28) is located on the tightening arm (25); The wafer fixing device also includes a tightening member (29) which is arranged on the first tightening ear (27) and the second tightening ear (28) and acts on the two to make the two move closer to or farther away from each other.

3. The wafer fixing device according to claim 2, characterized in that: The tightening piece (29) is a bolt, which is assembled on the first tightening ear (27) and is threadedly connected to the second tightening ear (28).

4. The wafer fixing device according to claim 2, characterized in that: The first deformation groove (23) is located at one end of the weakened through groove (24) in the circumferential direction of the outer ring body (21).

5. The wafer fixing device according to claim 2, characterized in that: The structure on the outer ring body (21) other than the tightening arm (25) is defined as a ring body (211), and the wall thickness of the tightening arm (25) is smaller than the wall thickness of the ring body (211).

6. The wafer fixing device according to claim 2, characterized in that: A second deformation groove (26) is provided at one end of the tightening arm (25) away from the first deformation groove (23).

7. The wafer fixing device according to claim 1, characterized in that: The inner ring seat (3) comprises an inner ring body (31), the end surface of the inner ring body (31) is provided with a mounting surface (32) adapted to the outer ring seat (2), and the mounting surface (32) overlaps the outer ring seat (2); An inner bearing surface (33) is arranged on the inner wall of the inner ring body (31) for bearing wafers.

8. The wafer fixing device according to claim 7, characterized in that: A third deformation groove (34) is provided on the peripheral side wall of the inner ring body (31) and penetrates the inner ring body (31) in the radial direction.

9. The wafer fixing device according to claim 7, characterized in that: At least one fourth deformation groove (35) is provided on the inner wall of the inner ring body (31) along the radial direction of the inner ring body (31).

10. A wafer processing equipment, characterized in that: It comprises a frame and a wafer fixing device as described in any one of claims 1 to 9, wherein the base plate (1) is mounted on the frame.

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