Heat dissipation device of erbium-doped optical fiber amplifier and optical device
By using a combination device of a thermal conduction frame, heat pipe and heat dissipation fin in the bait-doped fiber amplifier, the problems of large heat dissipation volume and low efficiency in the prior art are solved, and the effect of efficient heat dissipation in miniaturized equipment is achieved.
Patent Information
- Application Number
- CN202421738911.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-07-22
AI Technical Summary
The existing bait-doped fiber amplifiers have large heat dissipation technology, which cannot meet the needs of miniaturization of equipment, and it is difficult to achieve efficient heat dissipation without increasing too much volume.
A heat dissipation device including a thermal conduction frame, a heat pipe and a heat dissipation fin is used to conduct heat to the heat pipe through the thermal conduction frame, and the heat is conducted to other areas through the heat pipe, and finally the heat is lost through the heat dissipation fins.
It realizes efficient heat dissipation without adding too much volume, avoiding heat concentration, and through the cooperation of heat pipes and heat dissipation fins, it ensures continuous and efficient heat conduction, and reduces dependence on auxiliary devices such as fans.
Smart Images
Figure CN222940362U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication, in particular to a heat dissipation device and an optical device for an erbium-doped fiber amplifier. Background Art
[0002] An erbium-doped fiber amplifier (EDFA) is a device that uses erbium-doped fiber to amplify optical signals and is commonly used in optical communication systems and lasers. The erbium-doped fiber amplifier can also be used as an optical amplifier, which can amplify optical signals to enhance the signal intensity, enabling it to transmit longer distances or cover larger areas and has a wide range of applications in the field of optical communication.
[0003] When the erbium-doped fiber amplifier is in use, a large amount of heat will be generated. To ensure the stability of the erbium-doped fiber amplifier during use and extend its service life, it is necessary to dissipate heat from the erbium-doped fiber amplifier. The existing heat dissipation technology for erbium-doped fiber amplifiers usually adopts the heat dissipation method of aluminum or copper profiles plus fins. Some radiators also assemble fans on the fins for forced air cooling. However, these radiators are relatively large in volume and cannot meet the requirements of equipment miniaturization. Summary of the Utility Model
[0004] The technical problem to be solved by the embodiments of the utility model is to provide a heat dissipation device and an optical device for an erbium-doped fiber amplifier, which can achieve efficient heat dissipation without increasing too much volume and ensure the required heat dissipation demand.
[0005] The utility model discloses a heat dissipation device for an erbium-doped fiber amplifier, including: a heat conduction frame, a heat pipe, and heat dissipation fins. One side surface of the heat conduction frame is used to set the erbium-doped fiber amplifier. The heat pipe is arranged on the other side surface of the heat conduction frame, and the heat pipe and the erbium-doped fiber amplifier have an overlapping area in the orthographic projection on the heat conduction frame. The heat dissipation fins are arranged on the heat conduction frame, and the heat pipe is clamped between the heat conduction frame and the heat dissipation fins.
[0006] Optionally, a plurality of heat pipes are provided, and the plurality of heat pipes are arranged at intervals.
[0007] Optionally, the heat conduction frame is provided with grooves, and the heat pipes are arranged in the grooves.
[0008] Optionally, one side surface of the heat pipe is connected to the heat conduction frame by tin soldering, and the other side surface of the heat pipe is connected to the heat dissipation fins by tin soldering.
[0009] Optionally, the heat dissipation fins include a limiting strip and a plurality of L-shaped heat dissipation plates. One side edges of the plurality of L-shaped heat dissipation plates are arranged side by side to form a heat dissipation surface, and the other side edges of the plurality of L-shaped heat dissipation plates are respectively engaged with the limiting strip.
[0010] Optionally, a plurality of the limiting bars are arranged side by side, and a plurality of limiting grooves corresponding to the limiting bars one by one are arranged on the L-shaped heat dissipation plate, and the limiting bars are engaged in the limiting grooves.
[0011] Optionally, the shape of the heat pipe is linear or curved.
[0012] Optionally, the material of the heat conduction frame is aluminum alloy or copper alloy.
[0013] Optionally, the material of the heat dissipation fins is aluminum alloy or copper alloy.
[0014] The present utility model also discloses an optical device, including the heat dissipation device of the erbium-doped fiber amplifier as described in any one of the above.
[0015] Compared with the prior art, the beneficial effects of the heat dissipation device of the erbium-doped fiber amplifier and the optical device provided by the embodiments of the present utility model are as follows: by arranging the erbium-doped fiber amplifier and the heat pipe on the opposite side surfaces of the heat conduction frame, the heat generated during the operation of the erbium-doped fiber amplifier can be timely conducted to the heat conduction frame, and then the heat is conducted to other areas through the heat pipe arranged on the heat conduction frame to achieve heat dispersion, so as to make full use of the heat dissipation fins cooperating with the heat pipe to dissipate the heat of the heat pipe. The working fluid inside the heat pipe continuously undergoes the conversion between the evaporation and condensation states to ensure the continuous and high-efficiency heat conduction of the heat pipe. With the cooperation of the heat pipe and the heat dissipation fins, the heat generated by the erbium-doped fiber amplifier is prevented from concentrating at a certain place. While being dispersed by the heat pipe, the heat is dissipated through the heat dissipation fins. In this way, there is no need to use other auxiliary devices such as fans for forced air cooling, and high-efficiency heat dissipation can be achieved without increasing too much volume, ensuring the required heat dissipation demand. Description of the Drawings
[0016] The technical solutions of the present utility model will be further described in detail below in conjunction with the drawings. In the drawings:
[0017] Figure 1 is a schematic structural view of the heat dissipation device of the erbium-doped fiber amplifier provided by the embodiment of the present utility model;
[0018] Figure 2 is an exploded view of the heat dissipation device of the erbium-doped fiber amplifier provided by the embodiment of the present utility model;
[0019] Figure 3 is a schematic structural view of the L-shaped heat dissipation plate provided by the embodiment of the present utility model;
[0020] Figure 4 is Figure 3 a partial enlarged view of part A in
[0021] The reference numerals in the figures are as follows:
[0022] 100, heat dissipation device of erbium-doped fiber amplifier; 110, heat conduction frame; 112, groove; 120, heat pipe; 130, heat dissipation fin; 132, limiting strip; 134, L-shaped heat dissipation plate. Detailed implementation manners
[0023] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Now, in conjunction with the drawings, the preferred embodiments of the present invention will be described in detail.
[0024] As Figure 1 and Figure 2 shown, an embodiment of the present invention provides a heat dissipation device 100 of an erbium-doped fiber amplifier, including: a heat conduction frame 110, a heat pipe 120, and a heat dissipation fin 130. One side surface of the heat conduction frame 110 is used to arrange the erbium-doped fiber amplifier. The heat pipe 120 is arranged on the other side surface of the heat conduction frame 110, and there is an overlapping area between the heat pipe 120 and the erbium-doped fiber amplifier in the front projection on the heat conduction frame 110. The heat dissipation fin 130 is arranged on the heat conduction frame 110, and the heat pipe 120 is clamped between the heat conduction frame 110 and the heat dissipation fin 130.
[0025] Specifically, the heat conduction frame 110, as the seat body for installing the erbium-doped fiber amplifier, not only plays a role in supporting and fixing the erbium-doped fiber amplifier, but also plays a role in heat conduction, enabling the heat generated by the erbium-doped fiber amplifier to be conducted to the heat conduction frame 110 in time, and transmitted to the heat pipe 120 through the heat conduction frame 110. Finally, the heat is dissipated from the heat dissipation fin 130 to the external environment, so as to achieve the purpose of suppressing the temperature rise of the erbium-doped fiber amplifier.
[0026] Among them, the heat pipe 120 is a device that uses liquid circulation to transfer heat, usually composed of a sealed metal pipe and the working fluid (usually in liquid state) filled inside. The working fluid corresponding to the erbium-doped fiber amplifier inside the heat pipe 120 is heated and partially evaporated into a gaseous state after that, and then recondensed into a liquid state at the cold end of the heat pipe 120, and then flows back to the initial position. In this process, the heat pipe 120 transfers heat from one place to another place to achieve uniform distribution of heat or effective heat dissipation. Thus, the heat generated at the heat source is quickly conducted to the entire area of the heat dissipation fin 130 to improve the heat dissipation efficiency.
[0027] It should also be noted that there is an overlapping area between the heat pipe 120 and the erbium-doped fiber amplifier in the front projection on the heat conduction frame 110, which is beneficial to reducing the heat transfer path between the erbium-doped fiber amplifier and the heat pipe 120, enabling the heat generated by the erbium-doped fiber amplifier to be conducted to the heat pipe 120 in time, avoiding heat accumulation, and being beneficial to improving the heat dissipation efficiency.
[0028] The heat dissipation device 100 of the erbium-doped fiber amplifier provided by the embodiment of the present application arranges the erbium-doped fiber amplifier and the heat pipe 120 on opposite side surfaces of the heat conduction frame 110. When the erbium-doped fiber amplifier works, the generated heat can be timely conducted to the heat conduction frame 110, and then the heat is conducted to other areas through the heat pipe 120 arranged on the heat conduction frame 110 to achieve heat dispersion, so as to make full use of the heat dissipation fins 130 cooperating with the heat pipe 120 to dissipate the heat of the heat pipe 120. The working fluid inside the heat pipe 120 continuously undergoes the conversion between the evaporation and condensation states to ensure the continuous and high-efficiency heat conduction of the heat pipe 120. With the cooperation of the heat pipe 120 and the heat dissipation fins 130, the heat generated by the erbium-doped fiber amplifier is prevented from concentrating at a certain place. While being dispersed by the heat pipe 120, the heat is dissipated through the heat dissipation fins 130. In this way, there is no need to use other auxiliary devices such as fans for forced air cooling, and high-efficiency heat dissipation can be achieved without increasing too much volume, ensuring the required heat dissipation requirements.
[0029] As Figure 2 shown, a plurality of heat pipes 120 are provided, and the plurality of heat pipes 120 are arranged at intervals.
[0030] Specifically, in actual applications, a plurality of erbium-doped fiber amplifiers may be arranged. In order to avoid excessive concentration of heat sources at the positions where the erbium-doped fiber amplifiers are arranged, a corresponding plurality of heat pipes 120 are arranged to facilitate cooperation with the erbium-doped fiber amplifiers at different positions. In addition, the plurality of heat pipes 120 are arranged at intervals, which is beneficial to ensuring the uniformity of heat transfer, thereby improving the utilization rate of the heat dissipation fins 130 and further improving the heat dissipation efficiency.
[0031] As Figure 2 shown, a groove 112 is provided on the heat conduction frame 110, and the heat pipe 120 is arranged in the groove 112.
[0032] Specifically, through the groove 112 provided on the heat conduction frame 110, when the heat pipe 120 cooperates with the heat conduction frame 110, it can be accurately arranged at the corresponding position of the heat conduction frame 110, which is beneficial to reducing the positioning difficulty and improving the convenience during operation.
[0033] In an alternative embodiment of the present application, one side surface of the heat pipe 120 is connected to the heat conduction frame 110 by soldering, and the other side surface of the heat pipe 120 is connected to the heat dissipation fins 130 by soldering.
[0034] Specifically, one side of the heat pipe 120 is connected to the heat conduction frame 110 by soldering, which is beneficial to improving the tightness of the contact between one side of the heat pipe 120 and the heat conduction frame 110, avoiding gaps between the heat pipe 120 and the heat conduction frame 110, and being conducive to ensuring the stability and efficiency of heat conduction. Similarly, connecting the other side of the heat pipe 120 to the heat dissipation fins 130 by soldering is beneficial to improving the tightness of the contact between the other side of the heat pipe 120 and the heat dissipation fins 130, avoiding gaps between the heat pipe 120 and the heat dissipation fins 130, and being conducive to ensuring the stability and efficiency of heat conduction. In addition, the soldering connection can not only ensure the heat transfer efficiency but also play a connecting role, eliminating the need for additional fasteners for connection, which is beneficial to cost savings, reduction of the process flow, and improvement of the assembly efficiency.
[0035] As Figure 2 and Figure 3 shown, the heat dissipation fins 130 include a limiting strip 132 and a plurality of L-shaped heat dissipation plates 134. One side edges of the plurality of L-shaped heat dissipation plates 134 are arranged side by side to form a heat dissipation surface, and the other side edges of the plurality of L-shaped heat dissipation plates 134 are respectively engaged with the limiting strip 132.
[0036] Specifically, the limiting strip 132 serves to connect the plurality of L-shaped heat dissipation plates 134, facilitating the assembly of the plurality of L-shaped heat dissipation plates 134 together through the limiting strip 132. Compared with the conventional machining method by milling, it is beneficial to reduce the production cost, and different numbers of L-shaped heat dissipation plates 134 can be set according to actual needs for connection, making the overall environmental adaptability higher. The assembled heat dissipation fins 130 are in contact with the heat pipe 120 through the heat dissipation surface. There is a certain gap between one side edges of the L-shaped heat dissipation plates 134 to promote air flow and enhance the convective heat dissipation effect.
[0037] As Figure 2 , Figure 3 and Figure 4 shown, a plurality of limiting strips 132 are arranged side by side, and a plurality of limiting grooves corresponding to the limiting strips 132 one by one are provided on the L-shaped heat dissipation plates 134. The limiting strips 132 are engaged in the limiting grooves.
[0038] Specifically, arranging the limiting strips 132 side by side in plurality is beneficial to ensuring the stability of the connection between the L-shaped heat dissipation plates 134 and the limiting strips 132. During connection, only a limiting groove needs to be opened on the corresponding side edge of the L-shaped heat dissipation plate 134 and the limiting groove is engaged with the limiting strip 132.
[0039] In an alternative embodiment of the present application, the shape of the heat pipe 120 is linear or curved.
[0040] Specifically, in practical applications, according to the installation position of the erbium-doped fiber amplifier, the shape, size or internal space structure of the heat pipe 120 can be flexibly set, and the placement position of the heat pipe 120 can be reasonably planned to improve the heat conduction effect and thus enhance the overall heat dissipation capacity.
[0041] In an alternative embodiment of the present application, the material of the heat conduction frame 110 is aluminum alloy or copper alloy.
[0042] Specifically, the heat conduction frame 110 can be directly made of aluminum alloy or copper alloy that is widely used in the market, so as to utilize its own structural strength and high heat conduction rate to meet the actual production application requirements.
[0043] In an alternative embodiment of the present application, the material of the heat dissipation fins 130 is aluminum alloy or copper alloy. Similarly, the heat dissipation fins 130 can be directly made of aluminum alloy or copper alloy that is widely used in the market, so as to utilize its own structural strength and high heat conduction rate to meet the actual production application requirements.
[0044] The present utility model also discloses an optical device, including the heat dissipation device 100 of the erbium-doped fiber amplifier in the foregoing embodiment. This optical device has the same structure and beneficial effects as the heat dissipation device 100 of the erbium-doped fiber amplifier in the foregoing embodiment. The structure and beneficial effects of the heat dissipation device 100 of the erbium-doped fiber amplifier have been described in detail in the foregoing embodiment and will not be repeated here.
[0045] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them. For those skilled in the art, the technical solutions recorded in the above embodiments can be modified, or some of the technical features can be equivalently replaced; and all such modifications and replacements should fall within the protection scope of the appended claims of the present utility model.
Claims
1. A heat dissipation device for an erbium-doped optical fiber amplifier, characterized in that: include: A heat-conducting frame, a heat pipe and heat-dissipating fins, wherein one side of the heat-conducting frame is used to set an erbium-doped fiber amplifier, the heat pipe is set on the other side of the heat-conducting frame, and the heat pipe and the erbium-doped fiber amplifier have an overlapping area on the orthographic projection of the heat-conducting frame, the heat-dissipating fins are set on the heat-conducting frame, and the heat pipe is clamped between the heat-conducting frame and the heat-dissipating fins.
2. The heat dissipation device of the erbium-doped optical fiber amplifier according to claim 1, characterized in that: The heat pipes are arranged in plurality, and the plurality of heat pipes are arranged at intervals.
3. The heat dissipation device of the erbium-doped optical fiber amplifier according to claim 2, characterized in that: The heat conducting frame is provided with a groove, and the heat pipe is arranged in the groove.
4. The heat dissipation device of the erbium-doped optical fiber amplifier according to claim 3, characterized in that: One side of the heat pipe is connected to the heat conducting frame by tin welding, and the other side of the heat pipe is connected to the heat dissipation fin by tin welding.
5. The heat dissipation device for an erbium-doped optical fiber amplifier according to any one of claims 1 to 4, characterized in that: The heat dissipation fins include a limiting strip and a plurality of L-shaped heat dissipation plates. One side edge of the plurality of L-shaped heat dissipation plates are arranged side by side to form a heat dissipation surface, and the other side edges of the plurality of L-shaped heat dissipation plates are respectively engaged with the limiting strips.
6. The heat dissipation device of the erbium-doped optical fiber amplifier according to claim 5, characterized in that: A plurality of the limiting strips are arranged side by side, and a plurality of limiting grooves corresponding to the limiting strips are arranged on the L-shaped heat sink, and the limiting strips are engaged in the limiting grooves.
7. The heat dissipation device for an erbium-doped optical fiber amplifier according to any one of claims 1 to 4, characterized in that: The shape of the heat pipe is straight or curved.
8. The heat dissipation device for an erbium-doped optical fiber amplifier according to any one of claims 1 to 4, characterized in that: The material of the heat conducting frame is aluminum alloy or copper alloy.
9. The heat dissipation device for an erbium-doped optical fiber amplifier according to any one of claims 1 to 4, characterized in that: The material of the heat dissipation fins is aluminum alloy or copper alloy.
10. An optical device, characterized in that: A heat dissipation device for an erbium-doped optical fiber amplifier comprising the heat dissipation device of any one of claims 1 to 9.