Small laser high-temperature debugging table

Abstract

The utility model discloses a small-sized laser high-temperature debugging table, which comprises a working table main body, a heat dissipation structure and a heating mechanism, and is characterized in that a plurality of mounting holes are formed in the heating mechanism and are used for mounting and fixing a solid laser tube shell; the heating mechanism comprises a TEC element heat conduction plate installed at the top of the heat dissipation structure, a thermistor is embedded in the top of the heat conduction plate, and the TEC element, the heat dissipation structure and the thermistor are all connected with a TEC temperature control module and used for accurately controlling the heating temperature; according to the utility model, the design structure is reasonable, the bottom of the heat-conducting plate is heated through the TEC element, and the thermistor is embedded in the top surface of the heat-conducting plate and is used for monitoring the temperature of the top surface of the heat-conducting plate in real time, so that the TEC element and the heat dissipation mechanism can timely heat and cool the heat-conducting plate, the temperature is accurately controlled, and the service life of the heat-conducting plate is prolonged. The problems that an existing device is rough in temperature control, accurate temperature control within + / -1 DEG C is difficult to achieve, and then the regulation and control effect on a gain medium in a solid laser is affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser debugging equipment, in particular to a small laser high-temperature debugging platform. Background Technique

[0002] A solid-state laser is a type of laser that uses a solid material as the gain medium. Solid-state lasers are also widely used in many fields such as industry, medicine, and military. Among them, the gain medium is the core of the solid-state laser, and the laser is very sensitive to temperature changes. To maintain the stable performance of the laser and the stability of the fixed gain medium, it is necessary to accurately control the temperature of the solid gain medium during its manufacturing process.

[0003] At present, there is a lack of special equipment for high-temperature production debugging and testing of solid-state lasers in the market. The control of temperature in the debugging and performance testing of solid media in a high-temperature environment is relatively insufficient. Generally, heating is carried out through a heating plate, and then the heating temperature is detected by a sensor, and the temperature is controlled by means of wind or water-cooled heat dissipation. The heating of the heating plate mainly uses resistance heating to raise the temperature, and then cools down through a heat dissipation structure, resulting in relatively rough temperature control and it is difficult to achieve accurate temperature control within ±1°C, thus affecting the regulation effect on the gain medium in the solid-state laser. Content of the Utility Model

[0004] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a small laser high-temperature debugging platform.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A small laser high-temperature debugging platform includes a workbench main body. A support structure is arranged on the top of the workbench main body. A heat dissipation structure is arranged on one side of the support structure. A heating mechanism is arranged on the top of the heat dissipation structure. A number of mounting holes are opened on the heating mechanism for installing and fixing the solid laser tube shell.

[0007] The heating mechanism includes a TEC element installed on the top of the heat dissipation structure. A heat conduction plate is installed on the top of the TEC element. The mounting holes are opened on the heat conduction plate. A thermistor is embedded on the top of the heat conduction plate. The TEC element, the heat dissipation mechanism, and the thermistor are all connected to the TEC temperature control module for accurately controlling the heating temperature.

[0008] Further, the thermistor is a PTC thermistor for real-time monitoring of the heating temperature.

[0009] Further, a plurality of PTC thermistors are provided, and the plurality of PTC thermistors are distributed in a rectangular array on the top surface of the heat conducting plate. The distance between adjacent PTC thermistors is equal, and the distribution position of the PTC thermistors is offset from the mounting holes.

[0010] Further, the support structure includes two fixing plates, and the bottoms of the two fixing plates are both connected to the top of the workbench main body;

[0011] The heat dissipation mechanism includes a heat dissipation grid. The opposite sides of the heat dissipation grid are respectively connected to the two fixing plates. The top of the heat dissipation grid is connected to the bottom of the TEC element. A fan is arranged below the heat dissipation grid. The fan is installed on the top of the workbench main body, and the fan is connected to the TEC temperature control module for guiding the air flow around the heat dissipation grid to assist the heat dissipation grid in heat dissipation.

[0012] Further, a bracket is arranged on the top of the workbench main body. The bracket is connected to the workbench main body through a liftable structure, and the fan is installed on the bracket for adjusting the height of the fan up and down.

[0013] Further, a through positioning hole is opened at the top of the heat dissipation grid, and a flow guiding mechanism is arranged inside the positioning hole. The flow guiding mechanism is used to control the direction of the air flow flowing upward through the positioning hole.

[0014] Further, the flow guiding mechanism includes a first communication pipe installed in the positioning hole. A telescopic hose is connected to the top of the first communication pipe, and a second communication pipe is connected to the top of the telescopic hose;

[0015] A limiting ring is arranged on the outer side of the second communication pipe. The pipe wall near the bottom of the second communication pipe is a spherical structure with a part of the spherical top cut off. The center of the spherical structure is located inside the limiting ring. The limiting ring is sleeved on the outer side of the spherical structure. The diameters of the top and bottom cross-sections of the limiting ring are both smaller than the spherical diameter of the spherical structure to prevent the limiting ring and the second communication pipe from detaching;

[0016] A control structure is arranged on the top of the heat dissipation grid and is arranged on the outer side of the top of the second communication pipe for adjusting the orientation of the top pipe orifice of the second communication pipe;

[0017] The control structure includes a control frame. The inner wall of the control frame is in contact with the outer wall of the second communication pipe. A horizontal driving structure is arranged on the top of the heat dissipation grid and is located on one side of the control frame for driving the control frame to move in a plane.

[0018] Further, the diameter of the top pipe orifice of the first connecting pipe is smaller than that of the bottom pipe orifice of the first connecting pipe, and the diameter of the first connecting pipe gradually increases from the top to the bottom pipe orifice.

[0019] Further, a carrier is provided on the top of the workbench main body.

[0020] Further, a foldable support handle is provided on the top of the workbench main body, and the top end of the support handle is connected to the magnifying glass lighting device.

[0021] Compared with the prior art, the small laser high-temperature debugging bench has the following beneficial effects:

[0022] In the present utility model, the TEC element heats at the bottom of the heat conduction plate, and a thermistor is inlaid on the top surface of the heat conduction plate for real-time monitoring of the temperature of the top surface of the heat conduction plate, so that the TEC element and the heat dissipation mechanism can heat up and cool down the heat conduction plate in a timely manner, and then accurately control the temperature, solving the problem that the existing device is relatively rough in temperature control and it is difficult to achieve precise temperature control within ±1°C, which in turn affects the regulation effect of the gain medium in the solid-state laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0024] Figure 2 is a three-dimensional structural schematic diagram of the fixing plate in the present utility model;

[0025] Figure 3 is a cross-sectional view of the heat conduction plate in the present utility model;

[0026] Figure 4 is a three-dimensional structural schematic diagram of the support handle in the present utility model;

[0027] Figure 5 is a cross-sectional view of the heat dissipation grid in the present utility model;

[0028] Figure 6 is a three-dimensional structural schematic diagram of the control box in the present utility model;

[0029] Figure 7 is a three-dimensional structural schematic diagram of the first connecting pipe in the present utility model.

[0030] In the figure: 1, workbench main body; 2, mounting hole; 3, heat conduction plate; 4, TEC element; 5, PTC thermistor; 6, fixing plate; 7, heat dissipation grid; 8, fan; 9, bracket; 10, magnifying glass lighting device; 11, first connecting pipe; 12, telescopic hose; 13, second connecting pipe; 14, limiting ring; 15, control box; 16, carrier; 17, support handle. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] As Figure 1-7 shown, the present utility model provides a technical solution: a high-temperature debugging platform for a small laser, including a workbench main body 1. A support structure is arranged on the top of the workbench main body 1. A heat dissipation structure is arranged on one side of the support structure. A heating mechanism is arranged on the top of the heat dissipation structure. A plurality of mounting holes 2 are opened in the heating mechanism for installing and fixing the shell of the solid-state laser. The heating mechanism includes a TEC element 4 installed on the top of the heat dissipation structure. A heat conduction plate 3 is installed on the top of the TEC element 4. The mounting holes 2 are opened in the heat conduction plate 3. A thermistor is embedded in the top of the heat conduction plate 3. The TEC element 4, the heat dissipation mechanism and the thermistor are all connected to the TEC temperature control module for precisely controlling the heating temperature. The thermistor is a PTC thermistor 5 for real-time monitoring of the heating temperature. When in use, the heat conduction plate 3 is a nickel-plated copper plate. A processor and a controller are also installed on the device and are connected to each component for controlling and coordinating the work of each component. First, the TEC temperature control module is set to the required temperature. Then, under the action of the TEC element 4, the heat conduction plate 3 is heated and raised in temperature. At the same time, the internal PTE thermistor is inside the heat conduction plate 3 to real-time monitor the temperature of the top surface of the heat conduction plate 3. Then, through the heat-sensitive characteristics of the PTE thermistor, the temperature difference is calculated in real time and fed back to the TEC temperature control module so that the heat conduction plate 3 is heated to the specified temperature. At the same time, the heat dissipation mechanism below is controlled to open to drive the surrounding air flow movement to prevent heat accumulation and further improve the accuracy of heating and temperature control of the heat conduction plate 3 to ensure that the top surface temperature of the heat conduction plate 3 is within the range of the set temperature ±1°C.

[0033] A plurality of PTC thermistors 5 are provided. The plurality of PTC thermistors 5 are evenly distributed in a rectangular array on the top surface of the heat conduction plate 3 at equal distances. The distance between adjacent PTC thermistors 5 is equal, and the distribution position of the PTC thermistors 5 is offset from the mounting holes 2. When in use, by evenly arranging a plurality of PTC thermistors 5 on the top surface of the heat conduction plate 3, it is convenient to monitor the temperature of the surface of the heat conduction plate 3, accurately monitor the heat distribution area, and then judge the heat receiving condition of the corresponding shell to improve the accuracy of heating control temperature.

[0034] The support structure includes two fixed plates 6, and the bottoms of the two fixed plates 6 are both connected to the top of the workbench main body 1; the heat dissipation mechanism includes a heat dissipation grid 7, and the opposite sides of the heat dissipation grid 7 are respectively connected to the two fixed plates 6. The top of the heat dissipation grid 7 is connected to the bottom of the TEC element 4. A fan 8 is arranged below the heat dissipation grid 7. The fan 8 is installed on the top of the workbench main body 1 and is connected to the TEC temperature control module to guide the air flow around the heat dissipation grid 7 and assist the heat dissipation grid 7 in heat dissipation; during use, the fan 8 is turned on while heating, and the fan 8 blows air upward to guide the surrounding air flow to prevent heat accumulation caused by overheating of the surrounding air flow.

[0035] A bracket 9 is arranged on the top of the workbench main body 1. The bracket 9 is connected to the workbench main body 1 through a liftable structure. The fan 8 is installed on the bracket 9 to adjust the height of the fan 8 up and down; during use, the driving structure adopts an electric push rod, which can also be connected to the TEC temperature control module to cooperate with the fan 8 to further improve the effect of air flow guidance. The bottom of the electric push rod is provided with a bottom plate, and the bottom plate is connected to the workbench main body 1. The electric push rod drives the bracket 9 to move up and down, thereby adjusting the distance between the fan 8 and the heat dissipation grid 7, and further improving the heat dissipation efficiency; a bracket 9 with a fixed height can also be adopted between the fan 8 and the workbench main body 1 to facilitate the fan 8 to guide the air flow above.

[0036] A positioning hole is provided at the top of the heat dissipation grille 7, and a flow guiding mechanism is arranged inside the positioning hole. The flow guiding mechanism is used to control the direction of the air flow flowing upward through the positioning hole. The flow guiding mechanism includes a first connecting pipe 11 installed inside the positioning hole. The top of the first connecting pipe 11 is connected to a telescopic hose 12, and the top of the telescopic hose 12 is connected to a second connecting pipe 13. A limiting ring 14 is arranged on the outer side of the second connecting pipe 13. The pipe wall near the bottom of the second connecting pipe 13 is a spherical structure with a part of the spherical top cut off. The center of the spherical structure is located inside the limiting ring 14, and the center of the sphere is located in the three-dimensional space formed by the top and bottom of the limiting ring 14 and coincides with the axis of the limiting ring 14. Preferably, the center of the sphere can be set at the center position of the limiting ring 14. The limiting ring 14 is sleeved on the outer side of the spherical structure. The diameters of the top and bottom cross-sections of the limiting ring 14 are both smaller than the spherical diameter of the spherical structure to prevent the limiting ring 14 and the second connecting pipe 13 from detaching. A control structure is arranged on the top of the heat dissipation grille 7 and is located on the outer side of the top of the second connecting pipe 13 for adjusting the orientation of the top pipe orifice of the second connecting pipe 13. During use, a rubber ring is sleeved on the outer side of the spherical structure, and the rubber ring is embedded into the limiting ring 14. The inner walls of the limiting ring 14 and the rubber ring are both adapted to the spherical curved surface of the spherical structure and are in contact with the spherical surface, facilitating the partial angle adjustment of the second connecting pipe 13 through the spherical structure to control the angle of the blown air flow. The diameter of the top pipe orifice of the first connecting pipe 11 is smaller than the diameter of the bottom pipe orifice of the first connecting pipe 11, and the diameter of the pipe orifice of the first connecting pipe 11 gradually increases from top to bottom. The first connecting pipe 11 can be an inverted funnel shape or composed of a straight pipe and a reduced-diameter pipe. The inner diameter of the bottom of the reduced-diameter pipe is larger than the inner diameter of the top and gradually decreases from bottom to top, so as to increase the flow rate of the air flow after the air flow moves from a larger-diameter pipe to a smaller-diameter pipe, thereby improving the heat dissipation effect.

[0037] The control structure includes a control frame 15. The inner wall of the control frame 15 is in contact with the outer wall of the second connecting pipe 13. A horizontal driving structure is arranged on the top of the heat dissipation grille 7 and is located on one side of the control frame 15 for driving the control frame 15 to move in a plane. There are two groups of driving devices. Each group of driving devices includes two telescopic rods. One end of the first electric telescopic rod is installed on the top of the heat dissipation grille 7. The telescopic end of the first electric telescopic rod is connected to a first connecting plate. A second telescopic rod is fixedly connected to the first connecting plate. The telescopic end of the second telescopic rod is fixedly connected to a second connecting plate. One end of the second connecting plate is fixedly connected to the control frame 15. The telescopic directions of the first electric telescopic rod and the second electric telescopic rod are perpendicular, so as to drive the control frame 15 to move freely on the horizontal plane through the first electric telescopic rod and the second electric telescopic rod, and then move the top of the second connecting pipe 13 to adjust the orientation of the pipe orifice of the second connecting pipe 13. The two groups of driving devices can also be respectively connected to the TEC temperature control module for unified coordinated control.

[0038] A carrier frame 16 is provided on the top of the workbench main body 1; the bottom of the carrier frame 16 is connected to the workbench main body 1 by means of bolt fixation. An elevating mechanism with adjustable height can be provided at the bottom of the carrier frame 16 so as to adjust the top of the carrier frame 16 to an appropriate height, facilitating the operator to finely adjust the fixed gain medium inside the laser tube shell on the carrier frame 16, facilitating the stability of the operator's hand and ensuring that the operator will not be scalded by the high temperature of the heat conducting plate 3.

[0039] A foldable support handle 17 is provided on the top of the workbench main body 1, and the top end of the support handle 17 is connected to a magnifying glass lighting device 10; the principle of the magnifying glass lighting device 10 can refer to the magnifying glass lighting device 10 with the publication number of CN2398646Y. When in use, the magnifying glass lighting device 10 is on one side of the carrier frame 16. When personnel are debugging the solid gain medium, the relative position of the solid gain medium can be clearly seen through the magnifying glass. When the operator does not need the magnifying glass lighting device 10, it can be folded through the handle and the magnifying glass lighting device 10 can be moved away to facilitate other operations.

Claims

1. A small laser high temperature debugging platform, comprising a workbench body (1), a support structure is arranged on the top of the workbench body (1), a heat dissipation structure is arranged on one side of the support structure, and is characterized in that: A heating mechanism is arranged on the top of the heat dissipation structure, and a plurality of mounting holes (2) are provided on the heating mechanism for mounting and fixing the solid laser tube shell; The heating mechanism comprises a TEC element (4) mounted on the top of the heat dissipation structure, a heat conducting plate (3) is mounted on the top of the TEC element (4), the mounting hole (2) is provided on the heat conducting plate (3), a thermistor is embedded on the top of the heat conducting plate (3), and the TEC element (4), the heat dissipation mechanism and the thermistor are all connected to a TEC temperature control module for accurately controlling the heating temperature.

2. The small laser high temperature debugging platform according to claim 1, characterized in that: The thermistor is a PTC thermistor (5) and is used to monitor the heating temperature in real time.

3. The small laser high temperature debugging platform according to claim 2 is characterized in that: A plurality of the PTC thermistors (5) are provided, and the plurality of the PTC thermistors (5) are distributed in a rectangular array on the top surface of the heat conducting plate (3), adjacent PTC thermistors (5) are equidistant, and the distribution positions of the PTC thermistors (5) are staggered with the mounting holes (2).

4. The small laser high temperature debugging platform according to claim 1, characterized in that: The supporting structure comprises two fixing plates (6), the bottoms of the two fixing plates (6) are connected to the top of the workbench body (1); The heat dissipation mechanism comprises a heat dissipation grille (7), the two opposite sides of the heat dissipation grille (7) are respectively connected to the two fixing plates (6), the top of the heat dissipation grille (7) is connected to the bottom of the TEC element (4), a fan (8) is arranged below the heat dissipation grille (7), the fan (8) is installed on the top of the workbench body (1), and the fan (8) is connected to the TEC temperature control module for guiding the airflow around the heat dissipation grille (7) to assist the heat dissipation of the heat dissipation grille (7).

5. The small laser high temperature debugging platform according to claim 4, characterized in that: A bracket (9) is provided on the top of the workbench body (1); the bracket (9) is connected to the workbench body (1) via a liftable structure; the fan (8) is mounted on the bracket (9) for adjusting the height of the fan (8) up and down.

6. The small laser high temperature debugging platform according to claim 4, characterized in that: A through positioning hole is provided on the top of the heat dissipation grille (7), and a flow guiding mechanism is arranged inside the positioning hole. The flow guiding mechanism is used to control the direction of the airflow flowing upward through the positioning hole.

7. The small laser high temperature debugging platform according to claim 6, characterized in that: The flow guiding mechanism comprises a first connecting pipe (11), the first connecting pipe (11) is installed in the positioning hole, the top of the first connecting pipe (11) is connected to a telescopic hose (12), and the top of the telescopic hose (12) is connected to a second connecting pipe (13); A limiting ring (14) is arranged on the outer side of the second connecting tube (13); the tube wall of the second connecting tube (13) close to the bottom is a spherical structure with a portion of the spherical top cut off; the center of the spherical structure is located on the inner side of the limiting ring (14); the limiting ring (14) is sleeved on the outer side of the spherical structure; the diameters of the top and bottom sections of the limiting ring (14) are both smaller than the spherical diameter of the spherical structure, so as to prevent the limiting ring (14) and the second connecting tube (13) from being separated; A control structure is provided on the top of the heat sink (7), and the control structure is arranged on the outside of the top of the second connecting pipe (13) and is used to adjust the direction of the top pipe opening of the second connecting pipe (13); The control structure comprises a control frame (15), the inner wall of the control frame (15) is in contact with the outer wall of the second connecting pipe (13), and a horizontal driving structure is arranged on the top of the heat dissipation grille (7), and the horizontal driving structure is located on one side of the control frame (15) and is used to drive the control frame (15) to move in a plane.

8. The small laser high temperature debugging platform according to claim 7, characterized in that: The diameter of the top pipe opening of the first connecting pipe (11) is smaller than the diameter of the bottom pipe opening of the first connecting pipe (11), and the diameter of the pipe opening of the first connecting pipe (11) gradually increases from the top to the bottom.

9. The small laser high temperature debugging platform according to claim 1, characterized in that: A bearing frame (16) is arranged on the top of the workbench body (1).

10. The small laser high temperature debugging platform according to claim 1, characterized in that: A foldable support handle (17) is provided on the top of the workbench body (1), and the top end of the support handle (17) is connected to a magnifying glass lighting device (10).

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