Optical motor heat dissipation structure and optical motor

Abstract

The utility model relates to the technical field of photovoltaic equipment, and discloses an optical motor heat dissipation structure and an optical motor, the optical motor comprises a control box, a circuit board is arranged in the control box, a first heat dissipation element is arranged on the circuit board, the optical motor heat dissipation structure comprises an air channel, the air channel is arranged on the control box, and the air channel is provided with an air inlet and an air outlet which are communicated with the outside. The air inlet is suitable for airflow to flow into the air channel from the outside, the air outlet is suitable for airflow to flow out of the outside from the air channel, and the air channel is suitable for exchanging heat with the first heat dissipation element. According to the utility model, the first heat dissipation element exchanges heat with the air duct, so that the temperature of the first heat dissipation element is reduced, and the temperature in the air duct is increased. And when the airflow passes through the air duct, heat in the air duct is brought out, so that the temperature in the air duct is reduced, and heat exchange between the air duct and the first heat dissipation element is ensured. The heat dissipation elements on the circuit board are prevented from accumulating in the control box after dissipating heat, and the influence on working performance and even damage caused by over-high temperature of the circuit board are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic equipment, and particularly relates to a heat dissipation structure for a photoelectric machine and the photoelectric machine. Background Art

[0002] A photoelectric machine is a device that converts light energy into electrical energy and applies the electrical energy. It includes a photovoltaic panel and a control box installed on the back of the photovoltaic panel. In the control box, there are circuit boards such as a charge-discharge controller and an inverter, as well as a storage battery for storing electrical energy. The storage battery is connected to the photovoltaic panel through the charge-discharge controller. After the photovoltaic panel converts light energy into electrical energy, it charges the storage battery through the charge-discharge controller. When in use, the inverter can convert the direct current of the storage battery into alternating current for use. When the circuit boards such as the charge-discharge controller and the inverter are working, heat is easily accumulated, and when the temperature is too high, it directly affects the working performance and even causes damage.

[0003] In order to dissipate heat from the circuit boards such as the charge-discharge controller and the inverter, heat dissipation elements are often arranged on the circuit boards to conduct and dissipate the heat generated on the circuit boards. However, since the circuit boards are arranged in the control box, after the heat dissipation elements on the circuit boards dissipate heat, the heat still accumulates in the control box, still easily causing the temperature of the circuit boards to be too high, affecting the working performance and even causing damage. Summary of the Utility Model

[0004] In view of this, the utility model provides a heat dissipation structure for a photoelectric machine and the photoelectric machine to solve the problem that after the heat dissipation elements on the circuit boards dissipate heat, the heat still accumulates in the control box, still easily causing the temperature of the circuit boards to be too high, affecting the working performance and even causing damage.

[0005] In a first aspect, the utility model provides a heat dissipation structure for a photoelectric machine. The photoelectric machine includes a control box, and a circuit board is arranged in the control box. A first heat dissipation element is arranged on the circuit board. The heat dissipation structure for the photoelectric machine includes:

[0006] An air duct is arranged on the control box. The air duct is provided with an air inlet and an air outlet communicating with the outside. The air inlet is suitable for air flow to flow into the interior of the air duct from the outside, and the air outlet is suitable for air flow to flow out of the air duct and into the outside. The air duct is suitable for exchanging heat with the first heat dissipation element.

[0007] Beneficial effects: When the circuit board is working, heat is concentrated and conducted to the first heat dissipation element. The first heat dissipation element exchanges heat with the air duct, so that the temperature of the first heat dissipation element is reduced, and the temperature in the air duct is increased. When the air flow passes through the air duct, the heat in the air duct is taken out to the outside, thereby reducing the temperature in the air duct and ensuring the heat exchange between the air duct and the first heat dissipation element. It prevents the heat dissipation elements on the circuit board from accumulating heat in the control box after dissipating heat, and avoids the temperature of the circuit board being too high, affecting the working performance and even causing damage.

[0008] In an alternative embodiment, the circuit board is disposed outside the air duct, and the first heat dissipation element is connected to the outer side wall of the air duct.

[0009] Beneficial effects: The circuit board is disposed inside the control box and outside the air duct, which plays a role in waterproofing and dustproofing, avoiding damage to the circuit board caused by rain or dust, and optimizing the working environment of the circuit board. The heat on the first heat dissipation element is conducted to the side wall of the air duct, thereby exchanging heat with the air inside the air duct, causing the temperature of the first heat dissipation element to drop, preventing heat from accumulating inside the control box and leading to too high a temperature of the circuit board, which may affect the working performance or even cause damage.

[0010] In an alternative embodiment, the first heat dissipation element is connected to the outer side wall of the air duct through a first heat-conducting medium.

[0011] Beneficial effects: The first heat dissipation element conducts heat to the side wall of the air duct through the first heat-conducting medium, with better heat conduction efficiency, which is more conducive to heat dissipation, reducing the heat dissipation from the first heat dissipation element to the inside of the control box, and reducing the accumulation of heat inside the control box.

[0012] In an alternative embodiment, a second heat dissipation element is disposed inside the air duct, and the second heat dissipation element is connected to the inner side wall of the air duct.

[0013] Beneficial effects: After the heat on the first heat dissipation element is conducted to the side wall of the air duct, it is then conducted to the second heat dissipation element, reducing the temperature of the side wall of the air duct, reducing the heat dissipated from the side wall of the air duct to the inside of the control box, and reducing the accumulation of heat inside the control box.

[0014] In an alternative embodiment, the second heat dissipation element is connected to the inner side wall of the air duct through a second heat-conducting medium.

[0015] Beneficial effects: The side wall of the air duct conducts heat to the second heat dissipation element through the second heat-conducting medium, with better heat conduction efficiency, which is more conducive to heat dissipation, reducing the heat dissipated from the side wall of the air duct to the inside of the control box, and reducing the accumulation of heat inside the control box.

[0016] In an alternative embodiment, an air inlet device is provided at the air inlet, and the air inlet device is adapted to blow air in the direction from the air inlet into the air duct.

[0017] Beneficial effects: The provision of the air inlet device assists in the air flow, increasing the flow velocity of the air inside the air duct, which is more conducive to heat dissipation.

[0018] In an alternative embodiment, an air outlet device is provided at the air outlet, and the air outlet device is adapted to blow air in the direction from the inside of the air duct to the air inlet.

[0019] Beneficial effects: The provision of the air outlet device assists the air flow, increases the flow rate of the air flow in the air duct, and is more conducive to the discharge of heat.

[0020] In an optional embodiment, the air inlet direction of the air inlet is the same as or set at 90° to the air outlet direction of the air outlet.

[0021] Beneficial effects: When the air inlet direction of the air inlet is the same as the air outlet direction of the air outlet, it makes the air flow more easily in the air duct, makes the air flow smoother, and is conducive to the discharge of heat. When the air inlet direction of the air inlet is at 90° to the air outlet direction of the air outlet, it increases the flow time of the air flow in the air duct, making the heat exchange between the air in the air duct and the first heat dissipation element more sufficient.

[0022] In a second aspect, the present utility model further provides an optoelectronic machine, including: an optoelectronic machine heat dissipation structure, which is set as any of the above-mentioned optoelectronic machine heat dissipation structures.

[0023] Beneficial effects: The beneficial effects generated by the optoelectronic machine are the same as those of the optoelectronic machine heat dissipation structure, so they will not be elaborated here. Description of the Drawings

[0024] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of an optoelectronic machine heat dissipation structure according to an embodiment of the present utility model;

[0026] Figure 2 It is Figure 1 a partial enlarged schematic diagram of A in

[0027] Figure 3 It is a schematic structural diagram of another optoelectronic machine heat dissipation structure according to an embodiment of the present utility model;

[0028] Figure 4 It is a schematic structural diagram of yet another optoelectronic machine heat dissipation structure according to an embodiment of the present utility model;

[0029] Figure 5 It is Figure 4 a partial enlarged schematic diagram of B in

[0030] Description of the reference numerals:

[0031] 1. Control box; 2. Circuit board; 3. First heat dissipation element; 4. Air duct; 5. Air inlet; 6. Air outlet; 7. Second heat dissipation element; 8. Air inlet device; 9. Air outlet device. Detailed implementation manners

[0032] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0033] The following will describe the embodiments of the present utility model in conjunction with Figures 1 to 5 , to describe the embodiments of the present utility model.

[0034] The optoelectromechanical machine includes a control box 1, a circuit board 2 is arranged in the control box 1, a first heat dissipation element 3 is arranged on the circuit board 2, and the heat generated when the circuit board 2 works is conducted to the first heat dissipation element 3. The first heat dissipation element 3 can be a heat dissipation fin.

[0035] According to an embodiment of the present utility model, on the one hand, an optoelectromechanical machine heat dissipation structure is provided. The optoelectromechanical machine heat dissipation structure includes: an air duct 4. A cavity is opened in the control box 1, and an air inlet 5 and an air outlet 6 are opened on the side wall of the cavity, so as to form the air duct 4. After the air flow flows into the interior of the air duct 4 from the air inlet 5 of the air duct 4 from the outside, it then flows out to the outside from the interior of the air duct 4 through the air outlet 6 of the air duct 4. During this process, the air flow takes out the heat in the air duct 4 to the outside.

[0036] When the circuit board 2 works, the heat is concentrated and conducted to the first heat dissipation element 3. The first heat dissipation element 3 exchanges heat with the air duct 4, so that the temperature of the first heat dissipation element 3 is reduced, and the temperature in the air duct 4 is increased. When the air flow passes through the air duct 4, the heat in the air duct 4 is taken out to the outside, thereby reducing the temperature in the air duct 4 and ensuring the heat exchange between the air duct 4 and the first heat dissipation element 3. Such a setting prevents the heat dissipation element on the circuit board 2 from still accumulating in the control box 1 after dissipating heat, and avoids the circuit board 2 from being overheated and affecting the working performance or even causing damage.

[0037] In one embodiment, as Figure 3As shown, the circuit board 2 is disposed inside the air duct 4. When the circuit board 2 is operating, the generated heat is concentrated and conducted to the first heat dissipation element 3. Since the first heat dissipation element 3 is within the air duct 4, the first heat dissipation element 3 exchanges heat with the air inside the air duct 4, causing the temperature of the first heat dissipation element 3 to drop, preventing the circuit board 2 from overheating and affecting its working performance or even causing damage. The temperature of the air inside the air duct 4 rises, and the air flow enters from the air inlet 5 and exits from the air outlet 6, causing the air flow to pass through the air duct 4. When the air flow passes through the air duct 4, the heated air is carried out to prevent heat accumulation and avoid the circuit board 2 from overheating and affecting its working performance or even causing damage. The first heat dissipation element 3 directly contacts and exchanges heat with the air inside the air duct 4, with higher conduction efficiency and better heat dissipation effect.

[0038] In another embodiment, as Figure 4 and Figure 5 shown, the circuit board 2 is disposed inside the control box 1 and outside the air duct 4. The first heat dissipation element 3 is adhesively connected to the outer side wall of the air duct 4. When the circuit board 2 is operating, the heat is concentrated and conducted to the first heat dissipation element 3. Since the first heat dissipation element 3 is in contact with the outer side wall of the air duct 4, the heat on the first heat dissipation element 3 is conducted to the side wall of the air duct 4, thereby exchanging heat with the air inside the air duct 4, causing the temperature of the first heat dissipation element 3 to drop, preventing the circuit board 2 from overheating and affecting its working performance or even causing damage. The temperature of the air inside the air duct 4 rises, and the air flow enters from the air inlet 5 and exits from the air outlet 6, causing the air flow to pass through the air duct 4. When the air flow passes through the air duct 4, the heated air is carried out.

[0039] With such an arrangement, not only is the heat generated by the circuit board 2 prevented from accumulating inside the control box 1, but also the circuit board 2 is enclosed within the control box 1, providing a waterproof and dustproof function to avoid damage to the circuit board 2 caused by rain or dust, optimizing the working environment of the circuit board 2.

[0040] In a preferred embodiment, the first heat dissipation element 3 is connected to the outer side wall of the air duct 4 through a first heat conducting medium. The first heat conducting medium can be thermal grease or a heat conducting rubber strip.

[0041] When using thermal grease as the first heat conducting medium, first apply thermal grease to the portion of the outer side wall of the air duct 4 where it is connected to the first heat dissipation element 3, and then attach the first heat dissipation element 3 to the thermal grease, such that the thermal grease is located between the first heat dissipation element 3 and the outer side wall of the air duct 4.

[0042] When using a heat conducting rubber strip as the first heat conducting medium, first paste the heat conducting rubber strip to the portion of the outer side wall of the air duct 4 where it is connected to the first heat dissipation element 3, and then attach the first heat dissipation element 3 to the heat conducting rubber strip, such that the heat conducting rubber strip is located between the first heat dissipation element 3 and the outer side wall of the air duct 4.

[0043] When the circuit board 2 is working, heat is concentrated and conducted to the first heat dissipation element 3. The first heat dissipation element 3 conducts the heat to the side wall of the air duct 4 through the first heat conduction medium, with better heat conduction efficiency, which is more conducive to the dissipation of heat, reduces the heat dissipation of the first heat dissipation element 3 into the control box 1, and reduces the accumulation of heat inside the control box 1.

[0044] In a preferred embodiment, as Figure 1 and Figure 2 shown, a second heat dissipation element 7 is arranged in the air duct 4, and the second heat dissipation element 7 is connected to the inner side wall of the air duct 4. The second heat dissipation element 7 can be a heat dissipation fin, and the second heat dissipation element 7 is connected inside the cavity of the air duct 4, so that the second heat dissipation element 7 is connected to the inner side wall of the air duct 4.

[0045] When the circuit board 2 is working, heat is concentrated and conducted to the first heat dissipation element 3. Since the first heat dissipation element 3 is attached to the outer side wall of the air duct 4, the heat on the first heat dissipation element 3 is conducted to the side wall of the air duct 4. Since the second heat dissipation element 7 is connected to the inner side wall of the air duct 4, the heat on the first heat dissipation element 3 continues to be conducted to the second heat dissipation element 7 after being conducted to the side wall of the air duct 4. This makes the temperature of the first heat dissipation element 3 drop, preventing the circuit board 2 from being affected by excessive temperature and even damaged in terms of working performance. The second heat dissipation element 7 exchanges heat with the air inside the air duct 4, and the air flow flows in from the air inlet 5 and flows out from the air outlet 6, so that the air flow passes through the air duct 4. When the air flow passes through the air duct 4, the heated air is carried out.

[0046] With such an arrangement, the heat on the first heat dissipation element 3 is conducted to the second heat dissipation element 7 after being conducted to the side wall of the air duct 4, reducing the temperature of the side wall of the air duct 4, reducing the heat dissipated from the side wall of the air duct 4 into the control box 1, and reducing the accumulation of heat inside the control box 1.

[0047] In a preferred embodiment, the second heat dissipation element 7 is connected to the inner side wall of the air duct 4 through a second heat conduction medium. The second heat conduction medium can be thermal grease or a heat conduction rubber strip.

[0048] When using thermal grease as the second heat conduction medium, first apply thermal grease to the part of the inner side wall of the air duct 4 that is connected to the second heat dissipation element 7, and then attach the second heat dissipation element 7 to the thermal grease, so that the thermal grease is located between the second heat dissipation element 7 and the inner side wall of the air duct 4.

[0049] When using a heat conduction rubber strip as the second heat conduction medium, first paste the heat conduction rubber strip on the part of the inner side wall of the air duct 4 that is connected to the second heat dissipation element 7, and then attach the second heat dissipation element 7 to the heat conduction rubber strip, so that the heat conduction rubber strip is located between the second heat dissipation element 7 and the inner side wall of the air duct 4.

[0050] The side wall of the air duct 4 conducts heat to the second heat dissipation element 7 through the second heat conduction medium, with better heat conduction efficiency, which is more conducive to heat dissipation, reduces the heat dissipated from the side wall of the air duct 4 into the control box 1, and reduces the accumulation of heat inside the control box 1.

[0051] In a preferred embodiment, as Figure 1 , Figure 3 and Figure 4 shown, an air inlet device 8 is arranged in the cavity of the air duct 4. The air inlet device 8 can be a fan, and the number of the air inlet devices 8 can be set according to the blowing area and air volume requirements. The air inlet device 8 is arranged at the air inlet 5, that is, at a position close to the air inlet 5. The air outlet surface of the air inlet device 8 faces away from the air inlet 5, so that the air inlet device 8 blows air in the direction from the air inlet 5 into the air duct 4, guiding the air flow to flow out of the interior of the air duct 4 through the air inlet 5 and out of the air duct 4 through the air outlet 6. When the air flow passes through the air duct 4, it takes away the hot air in the air duct 4. The arrangement of the air inlet device 8 assists the air flow and increases the flow velocity of the air flow in the air duct 4, which is more conducive to heat discharge.

[0052] In a preferred embodiment, as Figure 1 , Figure 3 and Figure 4 shown, an air outlet device 9 is arranged at the air outlet 6. The air outlet device 9 can be a fan, and the number of the air outlet devices 9 can be set according to the blowing area and air volume requirements. The air outlet device 9 is arranged at the air outlet 6, that is, at a position close to the air outlet 6. The air outlet surface of the air outlet device 9 is close to the air outlet 6, so that the air outlet device 9 blows air in the direction from the interior of the air duct 4 towards the air inlet 5, guiding the air flow to flow out of the air duct 4 through the air outlet 6, and at the same time guiding the air flow to flow into the air duct 4 through the air inlet 5. When the air flow passes through the air duct 4, it takes away the hot air in the air duct 4. The arrangement of the air outlet device 9 assists the air flow and increases the flow velocity of the air flow in the air duct 4, which is more conducive to heat discharge.

[0053] Among them, the air inlet device 8 and the air outlet device 9 can be used in combination, further increasing the flow velocity of the air flow in the air duct 4, which is more conducive to heat discharge.

[0054] In a preferred embodiment, as Figure 1 and Figure 3 shown, the air inlet direction of the air inlet 5 and the air outlet direction of the air outlet 6 are the same or set at 90°. When the air inlet direction of the air inlet 5 and the air outlet direction of the air outlet 6 are the same, it makes the air flow easier to flow in the air duct 4, makes the air flow smoother, and is conducive to heat discharge.

[0055] When the air inlet direction of the air inlet 5 and the air outlet direction of the air outlet 6 are at 90°, the flow time of the air flow in the air duct 4 is increased, making the heat exchange between the air in the air duct 4 and the first heat dissipation element 3 more sufficient.

[0056] According to an embodiment of the present utility model, on the other hand, an optoelectromechanical machine is further provided, including: an optoelectromechanical machine heat dissipation structure, wherein the optoelectromechanical machine heat dissipation structure can be the optoelectromechanical machine heat dissipation structure described in any of the above embodiments.

[0057] Although the embodiments of the present utility model have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present utility model, and such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A heat dissipation structure for an optoelectronic machine, characterized in that: The photoelectric motor comprises a control box (1), a circuit board (2) is arranged in the control box (1), a first heat dissipation element (3) is arranged on the circuit board (2), and the heat dissipation structure of the photoelectric motor comprises: An air duct (4) is arranged on the control box (1), and the air duct (4) is provided with an air inlet (5) and an air outlet (6) connected to the outside world. The air inlet (5) is suitable for airflow to flow from the outside world into the inside of the air duct (4), and the air outlet (6) is suitable for airflow to flow from the inside of the air duct (4) to the outside world. The air duct (4) is suitable for exchanging heat with the first heat dissipation element (3).

2. The heat dissipation structure of the optoelectronic machine according to claim 1, characterized in that: The circuit board (2) is arranged on the outside of the air duct (4), and the first heat dissipation element (3) is connected to the outer side wall of the air duct (4).

3. The heat dissipation structure of the optoelectronic machine according to claim 2, characterized in that: The first heat dissipation element (3) is connected to the outer side wall of the air duct (4) via a first heat-conducting medium.

4. The heat dissipation structure of the optoelectronic machine according to claim 2 or 3, characterized in that: A second heat dissipation element (7) is arranged in the air duct (4), and the second heat dissipation element (7) is connected to the inner side wall of the air duct (4).

5. The heat dissipation structure of the optoelectronic machine according to claim 4, characterized in that: The second heat dissipation element (7) is connected to the inner wall of the air duct (4) via a second heat-conducting medium.

6. The heat dissipation structure of the optoelectronic machine according to claim 1, characterized in that: An air inlet device (8) is provided at the air inlet (5), and the air inlet device (8) is suitable for blowing air in a direction from the air inlet (5) toward the inside of the air duct (4).

7. The heat dissipation structure of the optoelectronic machine according to claim 1 or 6, characterized in that: An air outlet device (9) is provided at the air outlet (6), and the air outlet device (9) is suitable for blowing air in the direction of the air inlet (5) inside the air duct (4).

8. The heat dissipation structure of the optoelectronic machine according to claim 1, characterized in that: The air inlet direction of the air inlet (5) is the same as the air outlet direction of the air outlet (6) or is arranged at 90°.

9. The heat dissipation structure of the optoelectronic machine according to claim 1, characterized in that: The circuit board (2) is arranged in the air duct (4).

10. A photoelectric machine, characterized in that: include: The photoelectric motor heat dissipation structure is configured as the photoelectric motor heat dissipation structure according to any one of claims 1 to 9.

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